Heteroepitaxial growth of thick α-Ga_2O_3 film on sapphire(0001)by MIST-CVD technique

The 8 μm thick single-crystalline α-Ga2O3 epilayers have been heteroepitaxially grown on sapphire(0001) substrates via mist chemical vapor deposition technique. High resolution X-ray diffraction measurements show that the full-widths-at-halfmaximum(FWHM) of rocking curves for the(0006) and(10-14) planes are 0.024° and 0.24°, and the corresponding densities of screw and edge dislocations are 2.24 × 106 and 1.63 × 109 cm-2, respectively, indicative of high single crystallinity. The out-ofplane and in-plane epitaxial relationships are [0001] α-Ga2O3//[0001] α-Al2O3 and [11-20] α-Ga2O3//[11-20] α-Al2O3, respectively.The lateral domain size is in micron scale and the indirect bandgap is determined as 5.03 eV by transmittance spectra. Raman measurement indicates that the lattice-mismatch induced compressive residual strain cannot be ruled out despite the large thickness of the α-Ga2O3 epilayer. The achieved high quality α-Ga2O3 may provide an alternative material platform for developing high performance power devices and solar-blind photodetectors.     

Sb_2O_3掺杂Pb(Zn_(1/3)Nb_(2/3))_0.20(Zr_(0.50)Ti_(0.50))_(0.80)O_3-0.5%MnO_2压电陶瓷性能

采用二步合成法制备了掺杂z%Sb_2O_3的Pb(Zn_(1/3)Nb_(2/3))_0.20(Zr_(0.50)Ti_(0.50))_(0.80)O_3-0.5%MnO_2(PZNTM)压电陶瓷(Sb_2O_3的质量分数为z=0、0.1、0.3、0.5、 0.7、0.9).探讨了不同剂量Sb_2O_3掺杂对陶瓷试样的相结构和机电性能的影响.结果表明,在1 150 ℃下烧结3 h,得到处在准同型相界附近的纯钙钛矿结构的陶瓷;随着Sb_2O_3掺杂量的增加,试样的压电常数d_(33)和机电耦合系数k_p先增大后减小,而介电损耗tan δ持续上升,机械品质因数Q_m则持续下降.当z＝0.3时,压电陶瓷的性能得到优化,d_(33)和k_p均达到最大值,分别为302 pC/N和0.60,而tan δ较小、Q_m较大,分别为0.006和880.     

Effect of Mn and Nb Doped BaTiO3 in the Dielectric Properties in the Ba(Mn1/2Nb1/2)xTi1−xO3

Polycrystalline samples of BaTi_1?x (Mn_0.5Nb_0.5) _x O₃ with x = 0.025, 0.05, 0.075, 0.1, 0.125, 0.15, and 0.175 have been synthesized by the high-temperature solid-state reaction technique. The effects of cationic substitution of manganese and niobium for titanium at B sites of the BaTiO₃ perovskite lattice on symmetry and dielectric properties were investigated. X-ray diffraction at room temperature and dielectric permittivity in the temperature range from 85 K to 500 K and frequency range from 100 Hz to 2 × 10⁵ Hz were studied. The evolution from a normal ferroelectric to a relaxor ferroelectric is emphasized. T _C or T _m decreases when both manganese and niobium are introduced into the lattice of BaTiO₃. High dielectric constant of around 9000 at T _C = 280 K was found for Ba Ti_0.925(Mn_0.5Nb_0.5)_0.075O₃ ceramic. A relaxor ferroelectric with ΔT _m = 60 K and $ \varepsilon_{\rm{r}}^{\prime } $ of about 3500 at 10 kHz with T _m = 150 K was found for the BaTi_0.85(Mn_0.5Nb_0.5)_0.15O₃ sample.     

Effect of Fe doping on structural and magnetic properties of La2/3Ca1/3Mn1−yFeyO3 (y=0–0.03) thin films

We have characterized the magnetic and structural properties of pure and ⁵⁷Fe-doped La_2/3Ca_1/3MnO₃ thin films and targets, substituted with 1% and 3% of ⁵⁷Fe on the Mn site. The films were prepared via high O₂-pressure (500 mTorr) by DC magnetron sputtering on (1 0 0) SrTiO₃ and (1 0 0) LaAlO₃ single-crystal substrates. Mössbauer spectra measured at room temperature confirm the presence of Fe³⁺ with octahedral coordination, thus indicating that Fe is incorporated into the structure by substituting Mn. Structural analysis by X-ray diffraction (XRD) shows that the films are single phase and c-axis oriented and that the Fe doping gives rise to a relaxation of the epitaxial strain. Interestingly, the Curie temperature and the magnetoresistance (MR) show a non-monotonic behavior with Fe doping. This indicates that initially the strain relaxation induced by the Fe doping is more important than the reduction of ferromagnetic coupling due to the Fe incorporation.     

Epitaxial growth of (2¯01) β-Ga2O3 on (0001) sapphire substrates by halide vapour phase epitaxy

We report on Ga₂O₃ deposition on c-plane sapphire substrates by hydride vapour phase epitaxy using metallic gallium, hydrogen chloride and dry air as precursors. High deposition rate up to 250 µm/h has been realized. As confirmed by X-ray diffraction and micro-Raman measurements, produced films consisted of pure monoclinic β-Ga₂O₃ phase and were (−201) oriented. The full width at half maximum (FWHM) for (−201) rocking curve was decreasing with increasing GaCl flow. The narrowest FWHM of 20 arcmin has been detected.     

Room temperature oxidation of Cu3Ge and Cu3(Si1−xGex) on Si1−xGex

Room temperature oxidation of Cu₃(Si_1−xGe_x) and Cu₃Ge films grown on Si_1−xGe_x at a temperature of 200–400°C was studied using transmission electron microscopy (TEM) in conjunction with energy dispersive spectrometry (EDS). For Cu₃(Si_1−xGe_x) and Cu₃Ge films grown at 200°C and then exposed to air, room temperature oxidation occurred. The Cu₃Ge film was superior to the Cu₃(Si_1−xGe_x) film in reducing the oxidation rate because of its higher Ge concentration. Annealing at higher temperatures such as 400°C resulted in Ge segregation out of the Cu₃(Si_1−xGe_x) film or Si diffusion from the Si_1−xGe_x substrate into the Cu₃Ge overlayer, and hence enhanced the oxidation rate of Cu₃(Si_1−xGe_x) and Cu₃Ge films. The present study shows that upon exposure to air even the Cu₃Ge film grown on Si_1−xGe_x is subject to room-temperature oxidation, revealing that the use of Cu₃Ge contacts on Si_1−xGe_x may be limited by some strict conditions.     

MnO2对Pb(Ni1/3 Nb2/3)O3基复相陶瓷介电性能的影响

研究了少量MnO2添加对Pb(Ni1/3Nb2/3)O3基复相陶瓷的介电常数温度特性和频率特性、介质损耗及电阻率的影响。结果表明,少量MnO2的加入,改善了复相陶瓷的介温特性和频率特性,降低了介电常数;同时降低了介质损耗,特别是低频高温下的介质损耗,提高了电阻率。对MnO2在复相陶瓷中所起的作用进行了分析。     

Defect Structure of MOCVD Grown Epitaxial (0001) GaN/Al_2O_3

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在复合衬底γ-Al2O3/Si(001)上生长GaN

采用分子束外延(MBE)生长方法,使用γ-Al2O3材料作为新型过渡层,在Si(∞1)衬底上获得了没有裂纹的GaN外延层,实验结果表明使用γ-Al2O3过渡层有效地缓解了外延层中的应力.通过生长并测试分析几种不同结构的外延材料,研究了复合衬底γ-Al2O3/Si(001)生长GaN情况,得到了六方相GaN单晶材料,实现了GaN c面生长.预铺薄层Al及高温AlN层可以提高GaN晶体质量,低温AlN缓冲层可以改善GaN表面的粗糙度.为解决Si(001)衬底上GaN的生长问题提供了有益的探索.     

在复合衬底γ-Al2O3/Si(001)上生长GaN

采用分子束外延(MBE)生长方法,使用γ-Al2O3材料作为新型过渡层,在Si(∞1)衬底上获得了没有裂纹的GaN外延层,实验结果表明使用γ-Al2O3过渡层有效地缓解了外延层中的应力.通过生长并测试分析几种不同结构的外延材料,研究了复合衬底γ-Al2O3/Si(001)生长GaN情况,得到了六方相GaN单晶材料,实现了GaN c面生长.预铺薄层Al及高温AlN层可以提高GaN晶体质量,低温AlN缓冲层可以改善GaN表面的粗糙度.为解决Si(001)衬底上GaN的生长问题提供了有益的探索.     

弛豫型铁电陶瓷(1-x)Pb(Sc1/2Ta1/2)O3-xPbTiO3研究进展

钽钪酸铅陶瓷具有优良的介电、压电和铁电性能,但烧成温度高、居里点较低。为降低钽钪酸铅陶瓷的烧结温度并提高其居里点,人们合成了钽钪酸铅-钛酸铅(简称PSTT)材料体系。该文综述了弛豫型铁电陶瓷PSTT体系在相图与结构、制备和性能等方面的研究进展,探索了一种合成PSTT陶瓷新工艺,介绍了PSTT材料体系的重要应用领域。     

Photosensitivity of thin-film structures based on (CuInSe2)x(2ZnSe)1−x solid solutions

Polycrystalline (CuInSe₂)_x(2ZnSe)_1−x films (x=0.6–1.0) with p-type conductivity and a thickness of 0.5–0.9 μm were obtained by pulsed laser evaporation. It is shown that a chalcopyrite-sphalerite transition occurs in the above system for x=0.7. The obtained films were used to fabricate the photosensitive structure of the In/p-(CuInSe₂)_x(2ZnSe)_1−x and InSe(GaSe)/(CuInSe₂)_x(2ZnSe)_1−x types. Spectral dependences of photovoltaic-conversion quantum efficiency were studied, and the photosensitivity of the structures in relation to the type of energy barrier and the composition was analyzed. It is concluded that the structures under consideration can be used as broadband photovoltaic converters. __________ Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 34, No. 5, 2000, pp. 576–581. Original Russian Text Copyright ? 2000 by V. Rud’, Yu. Rud’, Bekimbetov, Gremenok, Bodnar’, Rusak.     

Effects of annealing technique and TiO2 seed layer on the phase composition of 0.7Pb(Mg1/3Nb2/3)O3–0.3PbTiO3 film

The lead magnesium niobate–lead titanate (PMN–PT) thin films with and without the TiO₂ seed layer were prepared by a pulsed laser deposition (PLD) deposited on Pt/Ti/SiO₂/Si substrates. The films were treated by two-step annealing and normal annealing with rapid thermal annealing (RTA). The effects of two-step annealing and the TiO₂ seed layer on the phase composition of PMN–PT films were studied. The results show that the PMN–PT film with TiO₂ seed layer can gain a pure perovskite phase with a high (1 0 0) preferential orientation after the two-step annealing technique.     

Nanostructuring and Thermoelectric Characterization of (GaSb)3(1−x)(Ga2Te3) x

GaSb is a promising thermoelectric material that exhibits good electrical properties. However, it has a high lattice thermal conductivity (κ _lat). Nanostructured bulk materials have been attracting interest because they effectively scatter phonons, significantly reducing κ _lat. AgPb _m SbTe _m+2 (LAST-m) compounds have recently been reported to have low κ _lat. These compounds have a NaCl structure, similar to that of binary PbTe, where Ag and Sb occupy the Pb site. In these compounds, two divalent Pb atoms are replaced with a monovalent Ag atom and a trivalent Sb atom to maintain charge compensation. In the present study, we reduced κ _lat of GaSb by applying the same principle as in LAST-m. Specifically, we substituted Te for Sb and generated vacancies at the Ga site to maintain charge compensation. This produced compounds with chemical compositions of (GaSb)_3(1?x)(Ga₂Te₃) _x (x = 0, 0.05, 0.10, and 0.25), where GaSb and Ga₂Te₃ both have the zincblende crystal structure. We employed two different annealing conditions: annealing at 833 K followed by quenching, and annealing at 833 K followed by cooling to room temperature over 3 days. The former annealed samples with compositions of x = 0.05 and 0.10 had nanoscale Ga-rich precipitates and exhibited a large reduction in κ _lat.     

GaN/GaAs(001)与GaN/Al2O3(0001)外延层光辅助湿法腐蚀行为的比较

研究了用金属有机物气相外延(MOVPE)方法在GaAs(001)衬底上生长的立方相GaN(c-GaN)外延层的光辅助湿法腐蚀特性,并和生长在蓝宝石(0001)衬底上的六方相GaN(h-GaN) 外延层的光辅助湿法腐蚀特性进行了比较.实验发现c-GaN膜的暗态电流和光电流的变化不同于h-GaN膜的腐蚀电流的变化规律.对引起上述差异的原因进行了简单的讨论.     

Ba(B'1/3 Ta2/3)O3微波介质陶瓷的研究进展

微波介质陶瓷是制作微波器件的关键材料。具有复合钙钛矿结构的Ba(B'_1/3 Ta_2/3)O₃(B'=Mg、Zn)型微波介质陶瓷在微波毫米波频率下具有较高的品质因数,是现代微波通信技术中被广泛应用的微波陶瓷材料。文中介绍了近年来此类微波介质陶瓷的发展与研究现状。     

GaN/GaAs(001)与GaN/Al2O3(0001)外延层光辅助湿法腐蚀行为的比较

研究了用金属有机物气相外延(MOVPE)方法在GaAs(001)衬底上生长的立方相GaN(c-GaN)外延层的光辅助湿法腐蚀特性,并和生长在蓝宝石(0001)衬底上的六方相GaN(h-GaN) 外延层的光辅助湿法腐蚀特性进行了比较.实验发现c-GaN膜的暗态电流和光电流的变化不同于h-GaN膜的腐蚀电流的变化规律.对引起上述差异的原因进行了简单的讨论.     

Effect of Surface Preparation on Mechanical Properties of Ni Contacts on Polycrystalline (Bi1?x Sb x )2(Te1?y Se y )3 Alloys

We present a comparison of different surface preparation techniques for hot-extruded (Bi_1?x Sb _x )₂(Te_1?y Se _y )₃ alloys prior to Ni plating and their consequences on adhesion. The surface preparation is carried out by a relatively fast and well-controlled electrochemical etching procedure that provides morphologies with homogeneous flat surfaces on a scale of tens of micrometers. This procedure is not optimal for Ni metallization since it does not ensure enough roughness on the surface. Applying wet chemical etching with hypochlorite and nitric acid after the electrochemical etching changes the morphology, and the surface roughness increases, as evidenced by scanning electron microscopy and atomic force microscopy. Tensile tests carried out on n-type and p-type 1-mm-thick specimens, covered with a 12-??m Ni layer followed by Sn-Pb soldered joints, confirm a significant improvement in the ultimate adhesion strength, with fracture occurring within the thermoelectric material. Use of this two-step surface treatment, after slicing and prior to metallization, leads to maximum adhesion strength of around 38?MPa for either type of thermoelectric material. These results are consistent with the morphological changes observed by scanning electron microscopy on the surface after chemical etching.     

Performance of a Thermoelectric Module Based on n-Type (La0.12Sr0.88)0.95TiO3−δ and p-Type Ca3Co4−xO9+δ

Here, we present the performance of a thermoelectric (TE) module consisting of n-type (La_0.12Sr_0.88)_0.95TiO₃ and p-type Ca₃Co_4?xO_9+δ materials. The main challenge in this investigation was operating the TE module in different atmospheric conditions, since n-type has optimum TE performance at reducing conditions, while p-type has optimum at oxidizing conditions. The TE module was exposed to two different atmospheres and demonstrated higher stability in N₂ atmosphere than in air. The maximum electrical power output decreased after 40 h when the hot side was exposed to N₂ at 600°C, while only 1 h at 400°C in ambient air was enough to oxidize (La_0.12Sr_0.88)_0.95TiO₃ followed by a reduced electrical power output. The module generated maximum electrical power of 0.9 mW (～?4.7 mW/cm²) at 600°C hot side and δT?～?570 K in N₂, and 0.15 mW (～?0.8 mW/cm²) at 400°C hot side and δT?～?370 K in air. A stability limit of Ca₃Co_3.93O_9+δ at ～?700°C in N₂ was determined by in situ high-temperature x-ray diffraction.