甚短距离并行光传输模块研究

提出了一种满足光互联论坛(OIF)标准的10 Gbps甚短距离光传输模块设计方案,该甚短距离(VSR)传输模块主要由高速并行光收发器模块和超大规模接口适配电路组成.讨论了基于面发射激光(VCSEL)的并行光收发器模块结构及高密度光纤阵列耦合封装技术,采用可编程逻辑器件芯片设计了接口适配电路.     

40 Gbit/s多路并行光收发模块的研制

基于VCSEL激光器阵列和PIN探测器阵列,设计和制作了40Gbit/s甚短距离的4通道发射4通道接收并行光收发模块.通过高速电路信号仿真设计,解决了信号完整性、串扰和电磁兼容等问题;通过键合金丝长度设计增加了通道带宽.光模块单通道传输速率可达到5 Gbit/s,8通道并行总传输速率达到40Gbit/s,实现了并行光收发模块高速率、高密度、高可靠性以及小体积设计,为甚短距离高速数据处理和传输提供了高可靠的多路数据链接.     

基于VSR技术的路由器互连

利用甚短距离(VSR)并行光传输技术取代传统的电互连技术,用以构建路由器之间的互连。该方案符合OC-192/STM-64格式,具有构建方便、传输速率高和成本低等优点。通过VSR转换芯片模块逻辑功能的实现,以及与之相配套的VCSEL/MSM-CMOS光电集成芯片转换模块和1×12的光纤列阵接口器件,可以很好地完成路由器之间的互连。     

光纤通信模块中的厚膜电路与LTCC陶瓷技术

新一代光纤通信模块的封装需要提高机械，热性能和环境稳定性的综合能力以集成电子和光学的功能。这些推动着光电市场快速发展，同时也大幅度降低系统成本。已在高可靠军事领域，以及商业汽车和无线通讯领域应用成功的厚膜电路和低温共烧陶瓷（LTCC）具有上述所需特性。本文综述了厚膜电路和LTCC技术在封装和互连材料上针对光纤电路和模块需求的特性。     

30Gbit/s并行光接收模块

报道了一种基于CMOS工艺接收电路芯片和GaAs工艺1×12光电探测器阵列的30Gbit/s并行光接收模块.该模块采用并行光通信方案,利用中高速光电子器件实现信号的高速传输.直接使用未经封装的接收电路裸片和光探测器裸片,采用电路板上芯片技术封装制作模块,并通过倒装焊的方式实现了探测器阵列与列阵光纤的精确对准并形成了可插拔的光接口.测试结果表明模块的接收能力可以达到30Gbit/s.误码率小于10-13时,接收模块的灵敏度可以达到-13.6dBm.     

30Gbit/s Parallel Optical Receiver Module

报道了一种基于CMOS工艺接收电路芯片和GaAs工艺1×12光电探测器阵列的30Gbit/s并行光接收模块.该模块采用并行光通信方案,利用中高速光电子器件实现信号的高速传输.直接使用未经封装的接收电路裸片和光探测器裸片,采用电路板上芯片技术封装制作模块,并通过倒装焊的方式实现了探测器阵列与列阵光纤的精确对准并形成了可插拔的光接口.测试结果表明模块的接收能力可以达到30Gbit/s.误码率小于10-13时,接收模块的灵敏度可以达到-13.6dBm.     

挑战21世纪封装业的光电子封装

光电子技术是连接光学元器件与电子电路的单元。光电子封装是把经过组装和电互连的光电器件芯片与相关的功能器件和电路等集成在一个特制的管壳内，通过管壳内部的光学系统与外部实现光连接，其封装和装配包括有源及无源元件、模块、板与子系统等级别。光电子封装是继微电子封装之后的一项迅猛发展起来综合高科技产业。本文通过光电子封装的设计要求探讨了光电子封装的工艺与材料，并描述了光电子器件在高速宽带网络和无线通讯技术的显著优势。最后提出了目前光电子封装存在的问题与未来的挑战。     

挑战21世纪封装业的光电子封装

光电子技术是连接光学元器件与电子电路的单元。光电子封装是把经过组装和电互连的光电器件芯片与相关的功能器件和电路等集成在一个特制的管壳内，通过管壳内部的光学系统与外部实现光连接，其封装和装配包括有源及无源元件、模块，板与子系统等级别，光电子封装是继微电子封装之后的一项迅猛发展起来综合高科技产业，本文通过光电子封装的设计要求探讨了光电子封装的工艺与材料，并描述了光电子器件在高速宽带网络和无线通讯技术的显著优势，最后提出了目前光电子封装存在的问题与未来的挑战。     

Zarlink公司推出先进的短距离光纤模块

日前,Zarlink公司推出了用于满足大规模计算和通信系统中新兴的短距离光学互连需求的623系列并行光纤模块。此模块可为中心局内的网络设备内/间提供短距离及中距离互连。623系列光纤模块结合Zarlink公司垂直腔表面发射激光器(VCSEL)和专利的Smarc OSA封装技术,具有优良的性能价格比。 Zarlink预计超短距离并行光纤市     

10Gbit／sX4小型可插拔并行光收发模块的研制

研制了一款基于系统级封装技术的低成本、收发一体和可带电热插拔的4通道小型可插拔（QSFP）光模块,采用850nm垂直腔面发射激光器（VCSEL）阵列及其驱动器作为发射端,光电探测器（PD）阵列及其跨阻放大器（TIA）作为接收端,通过光路无源对准,实现了低成本光互连。高速度、高密度封装下的瞬态同步开关噪声、芯片间电磁干扰...     

Advanced optical interconnection technology in switching equipment

Demands for increased interconnection density and higher bandwidth, coupled with stringent cost constraints of advanced wide bandwidth telecommunication switching equipment, are exhausting conventional electrical interconnection capabilities. The requirement for greater interconnection capabilities, spawned in part by the advances in integrated circuit technologies and the need for enhanced digital services, dictate that technology advancement must occur in traditional electronic packaging and/or interconnection techniques. The resolution of these technological needs is paramount for the successful competitive introduction of these systems. Presently, a “bottle-neck” occurs at the board-to-board level of the interconnection hierarchy. Therefore, an opportunity exists for the development of new optical interconnection techniques which can be incorporated into system designs beginning at this interconnection level and beyond. The strategic insertion of optical interconnection technology into these electronic processing systems not only meets projected performance requirements, but potentially offers them at a competitive cost. This paper describes some of the new optical strategies switching equipment designers are incorporating into today's products. These strategies range from optical data links to an implementation of a flexible optical backplane called OptiFlex     

Modellierungs- und Simulationsverfahren für die optische Verbindungstechnik auf elektrischen Leiterplatten

Optical interconnection technology on the printed circuit board level is a key technology for future microelectronic equipment. The consideration of functional, technological, and economical requirements results in a hybrid solution, where electrical and optical interconnects are integrated into one substrate called electrical optical printed circuit board. The significant part of the entire design process for electrical optical printed circuit boards is marked by the design supporting modelling and simulation of optical interconnects. Based on an abstract model for an entire optical interconnect a simulation model for optical multimode-waveguides is presented, taking into account all significant waveguide properties. Apart from that, the modeling of active components (laser- and photo-diodes) is addressed.     

Two-Dimensional Optical Interconnection Based on Two-Layered Optical Printed Circuit Board

The demonstration of an optical platform based on an optical printed circuit board (OPCB) was shown for two-dimensional (2-D) chip-to-chip optical interconnection. The optical platform was designed for 96 Gb/s total throughput which was 2 layers times 4 channels times 4 parallel links times 3 Gb/s/ch and using a passive assembly technology. We fabricated three main components for the 2-D optical interconnection; two-layered six-channel fiber- and connector-embedded OPCB, two-layered six-channel 90deg-bent fiber connectors, and 2-D optical transmitter/receiver (Tx/Rx) modules. The total optical loss from the Tx to the Rx was measured to approximately be -5.3 dB. The optical interconnection using an optical platform was successfully achieved with 3-Gb/s/ch data transmission     

A high-performance hybrid electrical-optical interconnectiontechnology for high-speed electronic systems

A new and innovative interconnection technology applicable for printed circuit boards is presented. This technology is widely compatible with the existing design and manufacturing processes and technologies for conventional multilayer pc boards and it combines electrical and optical interconnects on pc board level. It provides the potential for on-board bandwidth of several Gb/s and closes the bottleneck caused by the limited performance of electrical interconnection technology. After giving an overview on the most important basic technologies and first available results and engineering samples, the focus of this paper is on the development of appropriate modeling methodologies and simulation algorithms necessary for designing and optimizing optical on-board interconnects within the conventional electrical pc board environment     

Guided-wave optical chip-to-chip interconnections

An optical interconnection technique using a high-silica guided-wave optical circuit composed of channel waveguides and a mixer is proposed for LSI interchip communications. An experimental 4-chip interconnection circuit has 1 Gbit/s transmission capacity performance with an optical power margin of 3 dB.     

单方向分离式母板互联设计技术

针对电路模块的功能扩展带来的模块对外接口不足的问题,通过对分离式母板互联技术研究,确定了结构上分离的母板互联形式,主要对单方向分离互联母板互联设计、结构设计、印制板设计、可靠性设计等设计技术展开探讨,从一个角度解决了传统母板限制电路模块功能扩展带来的互联问题,实现了电路模块功能的有效扩展。     

TORUS: terabit-per-second ATM switching system architecture basedon distributed internal speed-up ATM switch

A high-speed and distributed ATM switch architecture, called the TORUS switch, is proposed with the aim of achieving a terabit-per-second ATM switching system. The switch is a distributed and scalable internal speed-up crossbar-type ATM switch with cylindrical structure. The self-bit-synchronization technique and optical interconnection technology are combined to achieve gigabit-rate cell transmission, where high-density implementation technologies such as multichip module technology are not required at all. Also, distributed contention control based on the fixed output-precedence scheme is newly adopted. This control is very suitable for high-speed devices because its circuit is achieved with only one gate in each crosspoint. A TORUS switch is fabricated as a 4×2 switch module using optical interconnection technology and very high-speed crosspoint LSIs, constructed using an advanced Si-bipolar process. Measured results confirm that the TORUS switch can be used to realize an expandable terabit-rate ATM switch     

光互连与面发射激光二极管

为克服光通信、电子计算技术等的速度限制,采用光互连是一种有效途径。光互连也是光计算机的基本技术。文中对光互连技术进行了分析,并介绍了一种有利于光互连的最理想光源——面发射激光二极管。     

电气互联技术的现状及发展趋势

简要介绍了国外电气互联技术的现状，从电路可制造性设计、堆叠装配、FPC组装设计与工艺、PCB可制造性分析及虚拟设计技术、微波电路互联结构及绿色清洗技术等7个方面分析了电气互联先进制造技术的发展方向。     

OE MCM的自由空间光互连结构及其设计

现代集成电路系统采用的互连技术中,电互连和光互连各有优缺点,ＯＥＭＣＭ可以根据实际情况将二者的特点结合起来。目前国际上流行的自由空间光互连技术已经应用于异步传输模式和并行处理计算机结构中。着重介绍采用自由空间光互连ＯＥ ＭＣＭ的结构和设计考虑。