316L不锈钢、690合金在氢氧化钠溶液中的电化学性能

采用动电位极化、电化学阻抗和电容测量等方法研究了316L、690合金在NaOH溶液中的电化学行为及生成钝化膜的半导体性质.在NaOH溶液中,316L不锈钢存在明显的钝化区间;316L不锈钢、690合金在NaOH溶液中电化学阻抗谱的阻抗模值相近.动电位电化学阻抗谱(DEIS)表明,随扫描电位正移,钝化膜的阻抗在测试溶液中...     

成膜电位对316L不锈钢在硼酸溶液中电化学行为的影响

采用动电位极化和电化学阻抗方法研究了316L不锈钢在硼酸溶液中钝化膜的电化学性能,并通过MottSchottky曲线考察了不同成膜电位下钝化膜的半导体性质。结果表明,316L不锈钢在-0.1~0.5 V发生了明显的钝化现象,在0.3 V成膜电位下形成的钝化膜更加致密和稳定。Mott-Schottky曲线结果表明,成膜电位对于316L不锈钢钝化膜的半导体特征性质没有根本影响,在钝化区间内钝化膜呈p型半导体特征,在0.3 V时受主密度最小。     

成膜电位对X70管线钢在NaHCO_3溶液中钝化膜电化学性能的影响

采用动电位极化、电化学阻抗和电容测量等方法研究了X70管线钢在0.5 mol·L~(-1) NaHCO_3溶液中的电化学行为及生成钝化膜的电化学性能。极化曲线结果表明,X70钢在该溶液中有着明显的钝化行为;电化学阻抗表明,随着成膜电位正移,X70钢表面形成的钝化膜更加致密,均匀性更好;电容测量表明,X70钢在不同成膜电位下形成的钝化膜在-0.20～0.80 V扫描范围内为n型半导体,并且随着成膜电位的正移,空间电荷层更厚,施主密度逐渐减小,耐蚀性更好。     

静水压力对X100钢在NaHCO_3+NaCl溶液中电化学行为的影响

采用动电位极化、电化学阻抗谱和Mott-Schottky等电化学测量方法研究了静水压力对X100管线钢在0.5 mol/L Na HCO3+0.03 mol/L Na Cl溶液中的电化学腐蚀行为的影响。结果表明:随静水压力增加,X100钢表面点蚀坑数量和面积增加;静水压力增加使溶液离子的活性增加,促进Cl-在钝化膜中的吸附,腐蚀反应的速率加快,腐蚀电流密度增加。静水压力增加使钝化膜组成由低压时的氧化物或氢氧化物转变为高压时的碳酸盐,导致耐蚀性降低,而点蚀形核几率增加。X100管线钢钝化膜具有n型半导体性质,随静水压力的增加,钝化膜内Cl-的增多使晶格缺陷增多,促进了氧化膜的破裂。     

钛钼合金电极在酸性介质中的电化学研究

采用交流阻抗和光电化学等测量方法研究了钛钼合金电极在0.2mol.L-1硫酸和0.2mol.L-1盐酸溶液中的电化学行为。交流阻抗测试结果表明,随着形成钝化膜的极化电位的增加,合金电极的阻抗增大,Mo在合金中的含量达到20%时,电极的阻抗模值|Z|0.05达到最大值;光电流循环伏安测量结果表明合金电极在阳极极化过程中显示阳极光电流,光电流iph随阳极极化电位增大而增加,表明电极表面膜呈n型半导体性质。     

pH对316L不锈钢电化学性能的影响

采用动电位极化、电化学阻抗谱和Mott-Schottky曲线研究了316L不锈钢在硫酸溶液和氢氧化钠溶液中的电化学行为。结果表明,316L不锈钢在硫酸溶液和氢氧化钠溶液中钝化区间分别为0.1～0.9V和-0.25～0.7V;316L不锈钢在氢氧化钠溶液中的阻抗模值较大。随扫描电位正移,硫酸溶液与氢氧化钠溶液中的动电位电化学阻抗谱变化趋势差异明显;0.1V条件下形成钝化膜的Mott-Schottky曲线证明钝化膜由p型和n型两种氧化物组成。     

温度对X70钢在高pH值溶液中腐蚀行为的影响

采用动电位极化、电化学阻抗谱技术、Mott-Schottky等测试方法,研究了温度对X70钢在高pH值溶液 (0.5 mol/L Na₂CO₃+0.5 mol/L NaHCO₃) 中钝化膜性能和电化学腐蚀行为的影响。结果表明：随着温度升高,X70管线钢的点蚀电位降低,维钝电流密度和钝化膜的极化电阻减小。在实验温度范围内,钝化膜为Fe₂O₃和Fe₃O₄的混合物,半导体类型为n型半导体,且不随温度升高而改变。但是随着温度的升高,钝化膜缺陷密度增加,膜厚度减小,腐蚀倾向增大。因此,温度升高会降低钝化膜的稳定性,导致其保护作用下降。     

碱性介质温度对N80油管钢钝化膜的影响

通过动电位极化、电化学阻抗谱等测试方法,研究了不同温度下N80油管在碱性缓冲液(0.5mol/L NaHCO_3+0.5mol/L Na_2CO_3)中生成的钝化膜的电化学性能,并用Mott-Schottky曲线分析了钝化膜的半导体性能。结果表明:随着温度升高,钝化区间减小,维钝电流密度增加,体系阻抗减小,N80钢钝化膜的稳定性变差,对基体的保护作用减弱;N80钢钝化膜半导体类型为N型半导体,升高温度后,平带电位升高,钝化膜电阻和传递电阻减小,这是因为升温导致氧空位缺陷增多,施主密度增大。     

纳米晶Ta_2N涂层在模拟人体环境中的耐蚀性能研究

为了改善植入钛合金材料在人体环境中耐蚀性能,采用双阴极等离子反应溅射沉积方法,在医用Ti-6Al-4V钛合金表面制备了厚度为40 mm、平均晶粒尺寸为12.8 nm的Ta_2N纳米晶涂层。采用纳米压入仪、Vikers压痕仪和划痕仪考察了Ta_2N纳米晶涂层的硬度、弹性模量、韧性以及涂层与基体间的结合力。结果表明,Ta_2N涂层的硬度和弹性模量分别为(32.1±1.6)GPa和(294.8±4.2)GPa,涂层与基体的结合力为56 N;在压入载荷为0.49~9.8 N下,Vikers压痕表面以及横断面均未观察到微裂纹,反映其具有较高的压痕韧性。采用动电位极化、电化学阻抗谱、恒电位极化和电容测量(Mott-Schottky)等多种电化学表征技术,对Ta_2N涂层在Ringer's生理溶液中的电化学腐蚀行为进行了深入研究,并从钝化膜组成、致密性和半导体特性3个方面探讨了涂层的腐蚀防护机理。结果表明,在Ringer's生理溶液中,Ta_2N涂层表面形成的钝化膜更加致密,其腐蚀抗力明显优于Ti-6Al-4V合金。XPS分析结果表明,在较低的极化电位下,Ta_2N涂层的钝化膜主要由TaO_xN_y构成,随着外加极化电位的升高,其进一步氧化形成Ta_2O_5;电容测试结果表明,Ta_2N涂层表面所生成的钝化膜具有n型半导体特征,其施主浓度和载流子扩散系数明显低于Ti-6Al-4V合金表面生成的钝化膜。     

纳米Fe-10Cr涂层电化学腐蚀行为影响研究Ⅱ.点蚀性能

利用动电位极化曲线、电化学阻抗谱图（EIS）和Mott-Schottky分析等电化学测试手段．探讨了Fe—10Cr纳米涂层在0.05mol／L H2SO4＋0.5mol／LNaCl溶液中的腐蚀行为．研究表明，与铸态合金相比，溅射纳米涂层表面钝化膜的化学稳定性和再钝化性能明显提高；二者的钝化膜均具有p型半导体结构特征．但溅射纳米涂层表面钝化膜的载流子密度和平带电位都比较低，导致钝化膜中金属离子的传输速度较低，纳米橡层表面钝化膜的化学稳定性增强。     

恒压阳极氧化对镁合金氧化膜的影响

    研究了恒压条件下,电压对阳极氧化膜性能的影响.结果表明:恒压10V的阳极氧化,阳极表面没有电火花的产生,类似于普通的阳极氧化;而恒压15、20、25 V的阳极氧化,阳极表面有电火花产生,是微火花放电阶段;恒压10、15、20、25 V制得的阳极氧化膜主要成分是MgO,同时含有Al₂O₃以及Na4(AlSiO₄)₃(OH)、Al₂SiO₅、SiO₂等;从10 V到20 V,随着电压的提高,试样耐蚀性提高;25 V时电火花的强度较大,放电气孔平均孔径较大,降低了有效厚度,耐蚀性下降.     

铝阳极氧化膜绿色封闭工艺

探索了新的不含有害物质的铝合金阳极氧化膜绿色封闭技术;新方法使用了铈盐化学处理和钼盐溶液电化学处理相结合的工艺。对比了不同封闭方法对L3铝合金阳极氧化膜在NaCl溶液中耐蚀性的影响,包括氟化镍封闭,重铬酸钾封闭和铈-钼盐封闭。利用动电位极化法研究了封闭后阳极氧化膜的腐蚀行为。利用扫描电子显微镜(SEM)观察了封闭后阳极氧化膜的表面形貌和成分。结果表明铈-钼盐封闭工艺可以为铝合金阳极氧化膜在NaCl溶液中提供较高的耐蚀性。     

Discontinuities in the porous anodic film formed on AA2099-T8 aluminium alloy

The anodizing behaviour of constituent particles (Al–Fe–Mn–Cu) and dispersoids (Al–Cu–Mn–Li and β′(Al₃Zr)) in AA2099-T8 has been investigated. Low-copper-containing Al–Fe–Mn–Cu particles anodized more slowly than the alloy matrix, forming a highly porous anodic oxide film. Medium- and high-copper-containing Al–Fe–Mn–Cu particles were rapidly dissolved, resulting in defects in the anodic film. The anodizing of Al–Cu–Mn–Li dispersoids is slightly slower than the alloy matrix, forming a less regular anodic oxide film. β′(Al₃Zr) dispersoids anodized at a similar rate to the alloy matrix. Further, the potential impact of the discontinuities in the resultant anodic films on the performance of the filmed alloy is discussed.     

Influence of copper on the morphology of porous anodic alumina

Sputtering-deposited Al-Cu alloy layers and an Al-Cu/Al bi-layer are used to investigate the influences of copper on the morphology of porous anodic alumina films formed galvanostatically in either sulphuric or phosphoric acid electrolyte. The results reveal development of an irregular morphology of pores during anodizing of the alloy layers, contrasting with the linear porosity of films formed on aluminium. Further, the rates of film growth and alloy consumption are relatively low, since oxygen is generated following enrichment of copper in the alloy and incorporation of copper species into the anodic film. The linear morphology is re-established following depletion of the copper in the bi-layer and at the same time, film growth accelerates as oxygen evolution diminishes. The irregular pore morphology is considered to arise from stress-driven pore development influenced by effects of oxygen bubbles within the anodic alumina.     

Growth of anodic oxide films on AC2A alloy in sulphuric acid solution

Growth behaviour of anodic oxide films on AC2A Al cast alloy was investigated in sulphuric acid solution using SEM, optical microscope (OM) and confocal scanning laser microscope (CSLM) and energy dispersive spectroscopy (EDS). The AC2A alloy contains three different types of second-phase particles: Al–Cu, Al–Cu–Fe–Si and Al–Si particles. The growth of anodic oxide films was critically retarded by the presence of non-reactive particles of Al–Si, while little effect was observed by the presence of active particles of Al–Cu and Al–Cu–Fe–Si. The most severe retardation effect on the growth of anodic films on AC2A alloy resulted from agglomerated Al–Si particles.     

Crystallization of anodic titania on titanium and its alloys

Crystallization of amorphous anodic films grown at constant current density on sputtering-deposited titanium, and Ti-Si and Ti-Al alloys, in ammonium pentaborate electrolyte, has been examined directly by transmission electron microscopy. In the case of titanium, anatase develops at relatively low voltage in the inner film region, formed by inward migration of oxygen species. In contrast, the outer film region, formed at the film/electrolyte interface, is composed of amorphous oxide only. Oxide crystals are particularly found near the plane, separating the two regions, which is located at a depth of 35-38% of the film thickness. Oxide zones, of size ∼ 1 nm, with a relatively ordered structure, developed at the metal/film interface, are considered to lead to transformation of the inner region structure. The incorporation into the film of either aluminium or silicon species suppresses the formation of crystalline oxide to much increased voltages. However, eventually nanocrystals form at ∼40% of the film thickness, probably originating from pre-cursor nuclei in the air-formed on the as-deposited alloy.     

SP700 钛合金的热处理 / 阳极氧化工艺研究

目的采用电化学阳极氧化法,在SP700钛合金的表面制备多孔结构的氧化膜。方法利用Autolab PGSTAT30型电化学工作站,采用三电极体系,辅助阴极为石墨电极,参比电极为饱和甘汞电极,工作电极为试样,测定试样的动态极化曲线和阳极氧化I-t曲线。利用扫描电子显微镜观察阳极氧化表面多孔氧化膜的微观形貌,分析热处理工艺、阳极氧化电压、电解液成分等参数对SP700钛合金阳极氧化行为的影响规律。结果钛合金材料经固溶时效处理后,α相和β相的相对含量发生了变化,从而使氧离子对电化学反应界面的内应力发生变化,使得表层氧化膜更加平整,耐腐蚀性提高。F-是阳极氧化膜上纳米孔形成的必要条件,随着F-浓度的增加,阳极氧化膜表面纳米孔的密集程度增加,孔径减小,氧化膜厚度增加。在一定范围内,随着阳极氧化电压的增大,氧化膜增厚,但电压过高会破坏氧化膜的稳定性。结论用电化学阳极氧化法处理钛合金表面,得到了多孔结构的氧化膜,获得了理想的耐腐蚀性能。固溶时效处理后,钛合金的耐腐蚀性提高。     

三种无铬封闭方法对铝合金阳极氧化膜耐蚀性的影响

研究了沸水封闭、醋酸镍封闭和电压加载下己二酸铵封闭对LY12铝合金阳极氧化膜耐蚀性的影响。通过场发射扫描电镜（FE-SEM）和电化学阻抗谱（EIS）对三种无铬封闭方法处理后铝合金阳极氧化膜的表面微观形貌和耐蚀性进行了研究。结果表明：封闭处理可以有效地闭合阳极氧化膜的微孔,提高氧化膜耐腐蚀性能。电压加载下己二酸铵封闭可以有效缓解氧化膜的腐蚀。三种无铬封闭方法处理后的氧化膜耐腐蚀性能从小到大依次为：沸水封闭,醋酸镍封闭,电压加载下己二酸铵封闭。     

Preparation of hydrophobic anodic film on AZ91D magnesium alloy in silicate solution containing silica sol

Anodic films were prepared on the AZ91D magnesium alloy in the electrolyte of 1.0 M Na₂SiO₃ with and without the addition of silica sol under the constant current density of 20 mA/cm² at 60 °C. The anodic films were characterized by scanning electron microscopy (SEM) and X-ray diffraction (XRD). The results showed that the two main constituents of the anodic films were silicon and oxygen. However, no crystal compound including either silicon or oxygen could be detected by the XRD patterns. The addition of 10 vol.% silica sol increased the thickness of the anodic film and improved the roughness of the film surface. Furthermore, such anodic film revealed some hydrophobic property, which was not observed on the anodic film formed in the base electrolyte without addition of silica sol. And the electrochemical impedance spectroscopy (EIS) results showed that the addition of 10 vol.% silica sol improved the corrosion resistance of the anodic film for the AZ91D Mg alloy obviously.     

Anodic oxidation of Al–Ag alloys

The anodic oxidation of solution-treated and quenched Al–Ag alloys containing 0.3, 0.6, 0.9 and 1.2 at.%Ag, is examined in ammonium pentaborate electrolyte, which leads to growth of barrier-type anodic films. Enrichments of silver, 3.1×10¹⁵ Ag atoms cm⁻², are developed in the alloys immediately beneath the amorphous alumina films, with the level of enrichment not depending significantly upon the composition of the bulk alloy. The enrichment is relatively low due to clustering of silver atoms in the bulk alloy, which reduces the concentration of silver that is available to enrich from solid solution. Silver species are incorporated into the anodic film, where they migrate outward faster than Al³⁺ ions.