应变超晶格(ZnS)1/(ZnSe)1的光学性质

用linear mufin tin orbital能带方法，计算Si衬底上（ZnS）_n/（ZnSe）_n（001）超晶格的能带结构，计算中采用外加调整势进行带隙修正．在得到较准确的能带结构和波函数的基础上，计算该超晶格系统的光学介电函数虚部ε₂（ω）．结果表明，该超晶格系统的光学性质结合了ZnS和ZnSe体材料光学性质的特点，在相当宽的能量范围内有较好的光谱响应．并且该超晶格系统是直接带隙材料，在光电器件应用中有很大潜力． 关键词：     

紫外臭氧处理超薄银修饰ITO电极的高效柔性有机太阳能电池

以紫外臭氧处理超薄Ag复合MoO₃或PEDOT：PSS修饰ITO电极的高效柔性有机太阳能电池。通过优化紫外臭氧处理Ag薄膜的时间,提高了以P3HT：PCBM为有源层的器件的功率转换效率,从1.68%（未经过紫外臭氧处理）提高到2.57%（紫外臭氧处理Ag 1 min）。提高的原因推测是紫外臭氧处理形成了AgO_x薄膜,提高了电荷提取并使器件具有高光学透明度、低串联电阻和优异的表面功函数等一些性能。并且,紫外臭氧处理Ag薄膜与MoO₃或者PEDOT：PSS复合修饰ITO的器件效率分别得到提高,Ag薄膜与MoO₃复合修饰ITO的器件效率从2.02%（PET/ITO/MoO₃）提高到2.97%（PET/ITO/AgO_x/MoO₃）,Ag薄膜与PEDOT：PSS复合修饰ITO的器件效率从2.01%（PET/ITO/PEDOT：PSS）提高到2.93%（PET/ITO/AgO_x/PEDOT：PSS）。此外,以PBDTTT-EFT：PC₇₁BM为有源层的柔性聚合物太阳能电池效率可达6.21%。基于ITO的柔性光电器件效率的提高主要归于ITO被Ag/PEDOT：PSS或Ag/MoO₃修饰后功函数的提高。     

TiO2光学间隔层增强聚合物太阳能电池光吸收的分析

基于共轭聚合物给体材料聚3-己基噻吩（P3HT）和富勒烯衍生物受体材料（6,6）-苯基-C61（PCBM）共混的体异质结结构的聚合物太阳能电池因其空穴载流子迁移率低而限制了P3HT:PCBM功能层厚度,从而影响了器件对入射光的吸收、在聚合物功能层和反射电极间插入TiO₂光学间隔层可以使器件内电场重新分布并改善器件的光吸收.基于薄膜传递矩阵法计算了不同的P3HT:PCBM功能层厚度和TiO₂插入层厚度的器件内光电场和光吸收.理论分析证明:器件结构为铟锡氧化物（ITO）（100 nm）/聚3,4-乙撑二氧噻吩/聚苯乙烯磺酸盐PEDOT:PSS（40 nm）/P3HT:PCBM/TiO₂/LiF（1 nm）/Al（120 nm）时,插入10 nm厚的TiO₂膜层可以使器件的聚合物功能层厚度在减薄25 nm的同时增加16.3%的光子吸收数,并且不明显降低功能层的激子分离概率,即功能层和TiO₂光学间隔层厚度分别约为75和10 nm时的器件性能为宜,此结果通过器件性能实验得以证实.     

中间层对三原色白光OLED的影响

基于ITO/NPB/TCTA/Ir（MDQ）₂（acac）：TCTA/FIrpic：TmPyPb/Ir（ppy）₃：TmPyPb/TmPyPb/LiF/Al结构的三原色白光器件,通过分别在蓝光与红光、绿光发光层界面处插入2 nm TCTA与2 nm TmPyPb中间层,研究了中间层的有无对器件性能的影响。结果表明,中间层的引入可以调整激子的分布,影响能量转移。具有双中间层的器件实现了高质量的白光发射,最大发光效率达到22.56 cd/A。     

2: 17型结构Gd-Fe-Co-Ga化合物的结构与磁性

用电弧熔炼的方法制备了Gd₂（Fe_1-xCo_x）₁₅Ga₂（0≤x≤1.0）和Gd₂（Fe_0.8Co_0.2）_17-yGa_y（0≤y≤8）化合物，通过Ｘ射线衍射和磁性测量手段研究了它们的结构和磁性．实验结果表明它们都是2∶17型结构的单相化合物．Gd₂（Fe_{1 关键词：}     

(Ba_(1-x)K_x)BiO_3电子结构与超导电性

用第一原理的ＬＤＦ-ＬＭＴＯ-ＡＳＡ超元胞法，模拟由Ｘ射线吸收谱精细结构测定的ＢａＢｉＯ_３中，Ｂｉ有两种价态Ｂｉ^３＋和Ｂｉ^5＋及与之相应的两种不同键长的Ｂｉ—Ｏ八面体，以及Ｋ掺杂对晶体结构的影响．计算了Ｂａ₄Ｂｉ₄Ｏ₁₂，（Ｂａ_３Ｋ）Ｂｉ₄Ｏ₁₂，（ＢａＫ）Ｂｉ₂Ｏ₆，（ＢａＫ_３）Ｂｉ₄Ｏ₁₂，Ｋ₂Ｂｉ₂Ｏ₆（简记为（４０４），（３１４），（１１２），（１３４），（０２２））五种“样本”的电子结构．结果表明，（４０４）和（３１４）分别为Ｅ_g＝１.６ｅＶ及Ｅ_g＝１.５ｅＶ的半导体，其它“样本”为金属．总能的分析表明（１３４）是不稳定的，故溶解极限为ｘ＝０.５．以“取样”方式按伯努利分布确定任意组分各“样本”的概率，进而计算了（Ｂａ_1-xＫ_x）ＢｉＯ_３电子结构随组分的变化．最后用逾渗模型说明了超导转变温度Ｔ_c在ｘ＝０．２５附近的突变 关键词：     

PTCDI-C8作为阴极修饰层提高钙钛矿太阳能电池的性能

采用N,N'-二正辛烷基-3,4,9,10-苝四甲酰二亚胺（PTCDI-C₈）对钙钛矿电池电子传输层（PCBM）进行界面修饰以减少PCBM与Al电极之间的漏电流,提高阴极的电子收集效率。通过调节PTCDI-C₈薄膜的厚度优化界面接触和电子传输性能。实验结果表明：当PTCDI-C₈薄膜的厚度为20 nm时得到的器件性能最优。光电转换效率（PCE）由5.26%提高到了8.65%,开路电压（V_oc）为0.92 V,短路电流（J_sc）为15.68 mA/cm²,填充因子（FF）为60%。PTCDI-C₈能够有效阻挡空穴向阴极传输,同时PTCDI-C₈具有较高的电子迁移率以及较高的稳定性,在增加电子传输的同时,可减少环境对PCBM的侵蚀,提高了器件的稳定性。     

功能层厚度对叠层有机电致发光器件出光性能影响的数值研究

功能层厚度是影响有机电致发光器件出光效率的主要因素之一,故获得不同功能层厚度对器件出光特性的影响规律是制备高性能器件的重要基础. 本文基于薄膜光学原理、电偶极子辐射理论及Fabry-Pérot微腔原理,建立了结构为glass/ITO/N,N0-bis（naphthalen-1-yl）-N,N0-bis（phenyl）-benzidine（NPB）/tris（8-hydroxyquinoline）aluminum（Alq₃）/molybdenum trioxide（MoO₃）/NPB/Alq₃/Al的叠层有机电致发光器件的光学模型,系统地研究了各个功能层厚度对叠层有机电致发光器件出光强度的影响,得到了功能层厚度对器件出光强度影响的规律. 该模型的建立与所获得的结果可对深入了解叠层有机电致发光器件的工作机理以及制备高性能的器件提供一定的帮助. 关键词： 叠层有机发光器件 出光特性 厚度 数值研究     

超低效率滚降顶发射白光有机电致发光器件

利用Ag/tris-（8-hydroxyquinoline） aluminum（Alq₃）/Ag/Alq₃/Ag这一金属/有机半导体多层结构作为阳极,实现了超低效率滚降的顶发射白光器件。在该器件中,我们在蓝光和橙光发光单元之间引入一个薄的4,4′-bis（9-carbazolyl）-2,2′-biphenyl（CBP）层,从而减少橙光发光层与蓝光发光层的Dexter能量传递,用以改善白光器件发光光谱及效率。通过优化微腔设计,实现了对橙光磷光材料发射的调控。最终,我们获得了在60 000 cd/m²亮度下效率滚降仅为17%的顶发射白光器件。在效率方面,虽然顶发射白光器件与底发射白光器件不相上下,但由于微腔效应的存在,顶发射白光器件的效率滚降却远低于底发射白光器件的效率滚降。     

金属纳米颗粒的导入对顶发射OLED光取出影响的FDTD模拟与研究

由于有机发光二极管（OLED）中存在金属阴极和有机层界面,故部分光子会转化为表面等离子激元沿金属表面传播耗散掉。同时,金属阴极自身也会吸收部分光能量。这两种情况均会导致器件出光率降低。分析了在结构为Ag （100 nm）/MoO₃（5 nm）/NPB （35 nm）/EML （20 nm）/Alq₃（40 nm）/Al （20 nm）/MoO₃（50 nm）的器件内部引入银纳米颗粒（Ag NPs）或者金纳米颗粒（Au NPs）后器件出光效率的变化。同时,改变金属纳米颗粒的位置以观察其对出光效率的影响。利用有限差分时域法对无金属纳米颗粒的器件和金属纳米颗粒位于器件不同位置时的出光效率进行了模拟计算。结果显示,Ag NPs或者Au NPs都可以提高器件出光效率且Ag NPs优于Au NPs。在468 nm波长下,Ag NPs位于Al阴极表面、电子传输层（ETL）中间和Ag表面时器件的透光率分别是51.1%,50.5%和45.5%,而未掺杂Ag NPs的参考器件的透光率仅为43.3%。     

Characterization of limited-diffusion-volume HgCdTe/CdTe photodiodes

Thin epitaxial HgCdTe/CdTe photodiodes are shown to have lower dark current noise than similar thick devices. This is explained by the limited-diffusion-volume model which requires a thin diode and a low surface recombination rate. Electron beam induced current is used for characterizing minority electrons distribution; the characteristic interface recombinations(L/D) has been found to be equal to 0.05 at 80 and 210 K.R ₀ A measurements give values consistent with this model.     

Atomic layer deposited HfO2 based metal insulator semiconductor GaN ultraviolet photodetectors

A report on GaN based metal insulator semiconductor (MIS) ultraviolet (UV) photodetectors (PDs) with atomic layer deposited (ALD) 5-nm-thick HfO₂ insulating layer is presented. Very low dark current of 2.24 × 10⁻¹¹ A and increased photo to dark current contrast ratio was achieved at 10 V. It was found that the dark current was drastically reduced by seven orders of magnitude at 10 V compared to samples without HfO₂ insulating layer. The observed decrease in dark current is attributed to the large barrier height which is due to introduction of HfO₂ insulating layer and the calculated barrier height was obtained as 0.95 eV. The peak responsivity of HfO₂ inserted device was 0.44 mA/W at bias voltage of 15 V.     

A study of the dark currents of InSb charge injection devices

The dark currents of InSb metal-insulator-semiconductor (MIS) charge injection devices (CIDs) in the temperature range 30 to 120K are studied. It is found that a thermal-generating process dominates the dark current in the high temperature region. When the device is under small bias voltage, a bump in the trap emission current appears below 70K. This current is due to carrier capture and emission processes of a hole trap state located in the bulk material, and the measured activation energy is 50meV. For larger bias conditions, the band-to-band tunnelling current gradually overcomes the trap emission current. It smears out the bump in the trap emission current, and shows a slightly temperature-dependent behaviour in the plot. The effects of field electrodes are also studied. It is found from experimental results that the edge of the electric field around the device periphery plays an important role in the band-to-band tunnelling process, and a field electrode with suitable bias can improve the dark current response drastically.     

Conduction mechanism of metal-TiO2–Si structures

The conduction model has been proposed for the metal-TiO₂–Si (MIS) structures. Rutile films have been prepared on Si substrates by magnetron sputtering of TiO₂ target and annealing in the air at temperatures T?=?800 and 1050 K. The current-voltage (CVC) and capacitance-voltage characteristics of the structures have been measured over the range of T?=?283–363 K. At positive potentials on the gate, the conductivity of the MIS structures is determined by the space charge-limited current in the dielectric layer.     

Tunneling induced electron transfer in SiNx/AlGaN/GaN based metal-insulator-semiconductor structures

Tunneling induced electron transfer in SiN_x/Al_0.22Ga_0.78N/GaN based metal-insulator-semiconductor (MIS) structures has been investigated by means of capacitance-voltage (C-V) measurements at various temperatures. Large clock-wise hysteresis window in C-V profiles indicates the injection of electrons from the two-dimensional electron gas (2DEG) channel to the SiN_x layer. Depletion of the 2DEG at positive bias in the negative sweeping direction indicates that the charges injected have a long decay time, which was also observed in the recovery process of the capacitance after injection. The tunneling induced electron transfer effect in SiN_x/Al_0.22Ga_0.78N/GaN based MIS structure opens up a way to design Al_xGa_1−xN/GaN based variable capacitors and memory devices.     

Dark currents of GaAs/AlGaAs quantum-well infrared photodetectors

We study the dark current of the GaAs/AlGaAs quantum-well infrared photodetector (QWIP) by assuming a drift-diffusion carrier transport in the barriers where the electric fields are obtained by the current continuity condition and the self-consistent energy band structure. It has been shown that due to the current continuity condition, the dark currents across the QWIP devices are determined by the thermionic emission from the emitter to the multiple quantum well (MQW) region. The self-consistent calculation of the Schrödinger and Poisson equations shows a weak electric field in the barrier region connecting to the emitter (much smaller than the average field across the QWIP at low bias) due to the accumulation of carriers in the triangle quantum well formed at the emitter-MQW interface, which results in a very small dark current at low bias. The numerical results explain well our experimental observation.     

Properties of superconducting Nb/Al/Nb/Al?AlOx?Al?AlOx?Al/Nb/Al/Nb tunnel junctions

Modified geometry (MG) devices, Nb/Al/Nb/Al−AlO_x−Al−AlO_x−Al/Nb/Al/Nb, have been fabricated and investigated in comparison with the basic geometry (BG) double-barrier Nb/Al−AlO_x−Al−AlO_x−Al/Nb devices. The enhancement of the critical temperature in the Al film is found to be weaker for the MG devices as compared with the BG devices at temperatures nearT=4.2 K but stronger at lowT. Indication of an enhancement of dc Josephson critical current density,j _c , at bias voltageV≠0 as compared withj _c (V=0) has been observed in the MG devices for the first time.     

High power photoconductive switches of 4H SiC with Si3N4 passivation and n -GaN subcontact

The effect of a Si₃N₄ passivation layer on the breakdown voltage in 4H SiC high power photoconductive semiconductor switching devices has been investigated. An n⁺-GaN epitaxial layer was also used for these devices as a subcontact layer, which was between the contact metal and the high resistivity SiC bulk, to improve the ohmic contact and mitigate current spreading: the GaN subcontact layer protects the contact from damage occurring at high power levels. The Si₃N₄ passivation layer was grown by ultrahigh vacuum plasma enhanced chemical vapor deposition. By using the Si₃N₄ passivation, the dark leakage current of the devices was suppressed effectively and decreased by one order of magnitude, and the breakdown voltage of the switching devices was improved significantly from 2.9 to 5 kV without degrading the high photocurrent.     

Ultraviolet light emissions from N2 microplasma electrically induced by metal-insulator-semiconductor devices

Various metal-insulator-semiconductor (MIS) devices in the form of Au/SiO_x(x<2)/Si, Au/AlO_y(y<1.5)/Si, Au/SiO_x/ZnO and Au/AlO_y/ZnO have been fabricated. For each device, once a sufficiently high positive voltage is applied on the Au electrode, the same ultraviolet (UV) emission with a spectrum featuring several specific peaks is detected. Interestingly, such UV emissions related to the MIS devices originate from the external N₂ microplasma. It is believed that at the high enough positive voltages the highly energetic electrons emitted out of the Au electrode activate the air to generate the N₂ microplasma.     

Energy levels of n-channel accumulation layer on InP surface

Electronic structure of the low lying quantized subbands is calculated for the electron accumulation layer on InP (100) system in a metal-insulator-semiconductor (MIS) structure. Hartree self-consistent technique at an arbitrary temperature has been used, neglecting many-body effects. In contrast to Si MIS system, a second subband is found to be populated even at low temperatures and moderate densities. Excitation energy, E₁₀, is found to be about 30–40 meV in the temperature range 0–300 K at an electron density of 10¹² cm^?2.