电子束蒸发WO3气敏薄膜

介绍了用电子束蒸发制作ＷＯ３气敏薄膜、溅射掺Ａｕ、膜的后退火等工艺，着重讨论了ＷＯ３膜的稳定化过程。     

电化学还原方法制备锆钛酸铅薄膜的研究

以Ｐｂ（ＮＯ３）２，ＴｉＣｌ３和ＺｒＯＣｌ２为电解质，就利用电化学还原法及退火晶化处理在不锈钢基底上制备钙钛型ＰＺＴ薄膜进行了研究。结果表明：在一定条件下，淀积在基底上的膜层，其组份比与电解液的组分摩尔浓度，还原电流密度和还原时间存在某种确定的关系，通过调整电解液中组份的摩尔浓度，选择合适的还原电流密度和还原时间，可以控制膜层的组份比，再经过退火处理制备出所需化学配比的钙钛矿结构ＰＺＴ薄膜。     

多离子束反应溅射室温沉积PbTiO3薄膜的结晶性能

为了将铁电薄腊民半导体器件集成，发展了铁电薄膜制备技术。快速退火（ＲＴＰ）由于可以降低铁电薄膜的制备温度、改善铁电薄膜与半导体器件瘘容性质，因而倍受人们的关注。用多了子束反应共溅射装置在室温下制备了ＰｂＴｉＯ３薄膜，样品经ＲＴＰ装置作退火处理，发现ＰｂＴｉＯ３薄膜可以在多晶或非晶层上生长，经ＲＴＰ处理的ＰｂＴＩＯ３薄膜呈现「１１０」和「１００」择优取向。     

脉冲电沉积法制备掺钴WO3薄膜

利用脉冲电沉积法制备了掺钴氧化钨电致变色薄膜,并探讨了该方法的机理。利用后续退火处理使之结晶。测定了掺钴和不掺钴ＷＯ_３薄膜的结构特性、电化学特性及透射光谱,并研究了金属钻的掺杂对这些特性的影响。     

电沉积三氧化钨薄膜电致变色及其光电化学性能

电沉积ＷＯ３薄膜显示出可逆光致变色及电致变色行为（在红外区域附近具有蓝色光吸收）。通过Ｘ射线光电子能谱（ＸＰＳ），对ＷＯ３薄膜在不同呈色水平上的Ｗ４ｆ核能级作了观察研究，可见Ｗ４ｆ核能级在ＷＯ３膜显色后变宽，光电化学测定表明ＷＯ３薄膜具有低光电转换效率。     

钛酸铋薄膜的室温脉冲激光沉积研究

在室温下,采用脉冲激光沉积（ＰＬＤ）技术在７．６２ｃｍＰｔ／Ｔｉ／ＳｉＯ２／Ｓｉ（１００）衬底上制备了钛酸铋（Ｂｉ４Ｔｉ３Ｏ１２）薄膜。Ｂｉ４Ｔｉ３Ｏ１２薄膜的厚度和组分均匀性采用卢瑟福背散射（ＲＢＳ）和扩展电阻技术（ＳＲＰ）来分析、表征;采用Ｘ射线衍射（ＸＲＤ）技术研究了薄膜的退火特性。研究发现单独用常规退火或快速退火热处理的Ｂｉ４Ｔｉ３Ｏ１２薄膜中较容易出现Ｂｉ２Ｔｉ２Ｏ７杂相;而采用常规退火和快速退火相结合的方法,较好地解决了杂相出现的问题,得到相结构和结晶性完好的Ｂｉ４Ｔｉ３Ｏ１２薄膜。透射电子显微镜实验和扩展电阻实验表明,室温下制备的Ｂｉ４Ｔｉ３Ｏ１２薄膜具有良好的表面和界面特性。     

反应蒸发沉积NiOx薄膜的电致变色性能

利用ＷＯ３和ＮｉＯ的互补显色可以大大提高电致变我玻璃的变色效率。有关ＷＯ３薄膜的制备方法及其性能已有许多文献作了报道。已报道了ＮｉＯｘ薄膜常用金属镍的射频反应溅射或电子束反应蒸发方法制备。     

电子束蒸发制备MoO3薄膜及其电致变色特性

在三种条件下采用电子束蒸发方法制备钼氧化物薄膜。从烧结靶淀积出的薄膜为多晶状态；从粉末压结靶淀积出非晶态薄膜。在ＬｉＣｌＯ４－ＰＣ电解质中测试各种薄膜的循环伏安特性和阶跃电压下的电流响应和光透射响应，表明２．５×１０＾－２Ｐａ氧分压下压结靶淀积的薄膜具有较好的电色性能；ＸＰＳ分析该种薄膜为ＭｏＯ３组份，Ｌｉ＾＋注入使Ｍｏ３ｄ和Ｏ１ａ的结合能降低。     

WO3薄膜的后氧处理及其红外反射率研究

本文采用“改进电沉积法”制备ＷＯ３薄膜,并研究了该薄膜的后氧处理方法,以及后氧处理条件对薄膜的电化学特性,尤其是红外反射率的影响。结果表明,经该方法处理过的薄膜,其红外反射率调制能力提高８％。     

高导电性BaRuO_3薄膜及其脉冲激光沉积

钌酸盐是典型的ＡＢＯ３型过渡金属氧化物，具有金属导电性，其薄膜可作为电极材料用于集成铁电等器件中。分析了ＢａＲｕＯ３的钙钛矿晶体结构和导电机制，并利用ＡｒＦ准分子脉冲激光沉积（ＰＬＤ）技术，结合后续退火处理，在Ｓｉ（１００）衬底上生长出具有（１１０）取向、室温电阻率约１０－２～１０－３Ω·ｃｍ的ＢａＲｕＯ３高导电性薄膜，俄歇能谱（ＡＥＳ）和Ｒｕｔｈｅｒｆｏｒｄ背散射谱（ＲＢＳ）分析表明：薄膜ＢａＲｕＯ３的纯度高、成分均匀性好，ＢａＲｕＯ３／Ｓｉ界面存在扩散过渡层。     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Nanoimprint Lithography -A Next Generation High Volume Lithography Technique

IntroductionNanoimprint Lithography is a well-acknowl-edged low cost, high resolution, large area pattern-ing process. It includes the most promising methods,high-pressure hot embossing lithography (HEL) [2],UV-cured imprinting (UV-NIL) [3] and micro contactprinting (m-CP, MCP) [4]. Curing of the imprintedstructures is either done by subsequent UV-lightexposure in the case of UV-NIL or by cooling downbelow the glass transition temperature of the ther-moplastic material in case of HEL…     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

Influence of PVK ： NPB hole transporting layer on the characteristics of organic light-emitting devices

A doping system consisting of NPB and PVK is employed as a composite hole transporting layer （CHTL）. By adjusting the component ratio of the doping system, a series of devices with different concentration proportion of PVK ： NPB are constracted. The result shows that doping concentration of NPB enhances the competence of hole transporting ability, and modifies the recombination region of charge as well as affects the surface morphology of doped film. Optimum device with a maximum brightness of 7852 cd/m^2 and a power efficiency of 1.75 lm/W has been obtained by choosing a concentration proportion of PVK ： NPB at 1：3.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.     

Analysis of error performance on Turbo coded FDPIM

Due to variable symbol length of digital pulse interval modulation（DPIM）, it is difficult to analyze the error performances of Turbo coded DPIM. To solve this problem, a fixed-length digital pulse interval modulation（FDPIM） method is provided. The FDPIM modulation structure is introduced. The packet error rates of uncoded FDPIM are analyzed and compared with that of DPIM. Bit error rates of Turbo coded FDPIM are simulated based on three kinds of analytical models under weak turbulence channel. The results show that packet error rate of uncoded FDPIM is inferior to that of uncoded DPIM. However, FDPIM is easy to be implemented and easy to be combined, with Turbo code for soft-decision because of its fixed length. Besides, the introduction of Turbo code in this modulation can decrease the average power about 10 dBm, which means that it can improve the error performance of the system effectively.     

A method for calculating the center position of collimated light

It is a key problem to accurately calculate beam spots＇ center of measuring the warp by using a collimated laser. A new method, named double geometrical center method （DGCM）, is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device （CCD） is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What＇s more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.