UV/heat dual‐curable adhesive tapes for fabricating stacked packages of semiconductors

To facilitate the fabrication of a reliable stacked package for a semiconductor, UV/heat dual curing of adhesives was investigated. The formulated adhesives contained acrylic monomer and epoxy resins. First, UV curing was conducted on the acrylic monomer, followed by heat curing. It was found that UV‐curable acrylic monomers affected the adhesive's properties, e.g., adhesion, water absorption, and viscoelasticity. As the acrylic monomer, neopentylglycol diacrylate (NPGDA), trimethylolpropane triacrylate (TMPTA), dipentaerythritol hexaacrylate (DPHA), and tricyclodecanedimethanol acrylate (TCDDA) were used to investigate the effect of functional group numbers and structure. As a result, an acrylic monomer that has two functional groups with a rigid moiety (TCDDA) showed acceptable properties as adhesives for the fabrication, and thus a UV/heat‐curing adhesive has been successfully developed. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Enhanced Charpy impact strength of epoxy resin modified with vinyl‐terminated polydimethylsiloxane

This article deals with enhancement of the toughness of epoxy resin (ER) based on diglycidyl ether bisfenol A by either polydimethylsiloxane (PDMS) or vinyl‐terminated polydimethylsiloxane (VT‐PDMS). To improve the compatibility of these two phases, dicumylperoxide (DCP) was used as a compatibilizer. It was established that only specific composition of the components can lead to enhancement of ER toughness without significant reduction of storage modulus, T_g, and interphase adhesion. The highest impact strength was recorded for ER with VT‐PDMS (10 wt %) and DCP (2 wt %) due to increased interfacial compatibility between two phases, which was proved by ¹H NMR and dielectric spectroscopy. Critical ductile brittle transition occurring between 10 and 15 wt % of rubber was observed by both morphological and dynamic mechanical analysis studies. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 45720.     

Adhesive properties of epoxy resin modified by end‐functionalized liquid polybutadiene

Adhesive properties of epoxy resin networks modified with different functionalized liquid polybutadiene were evaluated by using aluminum adherent. The end‐functionalized polybutadiene rubbers were hydroxyl‐ (HTPB), carboxyl‐ (CTPB), and isocyanate‐terminated polybutadiene (NCOTPB). The adhesive properties depend upon the morphology and the degree of interaction between the rubber–epoxy system. The most effective adhesive for Al–Al joint in both butt and single‐lap shear testing was epoxy resin–NCOTPB system. This system presents stronger rubber–epoxy interactions and a higher degree of rubber particle dispersion with particle size diameter in the nanoscale range. These characteristics were not important for improving the toughness of the bulk network but are fundamental for the improvement of adhesive strength. The effect of the pretreatment of the aluminum surface on the roughness was also evaluated by using profilometry analysis. The type of failure was also investigated by analyzing the adhered surfaces after fracture by scanning electron microscopy and profilometry. A proportion of cohesion failure higher than 90% was observed in all systems. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 93: 2370–2378, 2004     

TTT‐diagram for epoxy film adhesives using quasi‐isothermal scans with initial fast ramps

The characterization of film adhesives is challenging because they required freezer storage, contain an inseparable filler—thermoplastic knit or fiber‐reinforcement, and are heat activated systems with a pre‐cure and unknown chemistry. A testing protocol that eliminates these sources of error is proposed. This study presents a method to generate time–temperature‐transformation (TTT) diagrams of epoxy film adhesives via differential scanning calorimetry (DSC). Non‐isothermal and isothermal DSC scans are used to capture the reaction and the glass transition temperature. The use of an initial fast ramp—up to 500 K/min—in the isothermal scans is explored for the first time. This technique shows the potential to produce a quasi‐isothermal cycle, eliminating the loss of data in the initial stage of the reaction. The total heat released, the activation energy, and the fractional kinetic parameter, are estimated via model‐free methods. The Kamal–Sourour model and the formal kinetic model are fit to model the rate of cure. The simplest model that accurately captures the reaction, a parallel two‐step model, A , is outlined. The glass transition temperature is modeled via DiBenedetto's equation to include the diffusion‐controlled mechanism. The TTT‐diagrams of two commercial adhesives, DA 408 and DA 409, are shown with an analysis of processing optimization. The use of quasi‐isothermal scans with initial fast ramps combined with the correction for filler, moisture, and pre‐curing history can be applied to characterize fast curing thermosets, complex B‐stage resins, and thermosetting composites. The modeling results can also be used in numerical studies of residual stresses and dimensional stability in the manufacturing of thermosetting composites. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 45791.     

Liquid crystalline epoxy resin modified cyanate ester/epoxy resin systems

Liquid crystalline epoxy resin (LCE) modify cyanate ester/epoxy resin blend systems were studied by scanning electron microscope, polarizing optical microscope, thermogravimetric analyzer, differential scanning calorimetry, thermal mechanical analysis, and rheometers. With the addition of LCE resin, the blends showed both an enhanced curing rate and increased glass transition temperature of cured samples. The phase structures of the blends changed from homogenous to liquid crystalline phase when the content of LCE was increased. At the same time, the mechanical properties were also improved and thermal expansion coefficients were lowed down. The thermal degradation temperatures showed little differences, while the residue char yields were slightly increased with the addition of LCE. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Preparation and properties of heat and ultraviolet‐induced bonding and debonding epoxy/epoxy acrylate adhesives

Heat and ultraviolet (UV)‐induced bonding and debonding (BDB) adhesives were designed and prepared through blending an epoxy resin, diglycidyl ether of bisphenol A (DGEBA) with an epoxy acrylate resin, bisphenol‐A epoxy acrylate resin (BEA). The variation of the chemical structure of DGEBA and BEA in the sequential heat‐ and UV‐curing processes was characterized by Fourier transform infrared spectroscopy (FTIR). The FTIR results indicate that DGEBA and BEA successfully took part in both the heat‐curing and UV‐curing processes. The effects of the mass ratio of BEA to DGEBA, amount of heat‐curing agent, type of diluents, and UV irradiation time on the BDB properties of BDB adhesive were systematically investigated. The results show that the bonding strength increases with the decrease of the mass ratio of BEA to DGEBA and with the increase of the amount of heat‐curing agent in a certain range. The debonding strength decreases with the increase of the mass ratio of BEA to DGEBA. The mass ratio of BEA to DGEBA was set at 10 to ensure the ratio of the bonding strength to debonding strength greater than 10 times. The debonding strength of BDB adhesives also depends on the UV irradiation time, decreasing with the increase of UV irradiation time in a certain range. Based on the FTIR results and the dependence of the bonding and deboning strengths on the reaction conditions, a possible BDB mechanism of BDB adhesive was proposed. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46435.     

Polyurethane‐modified epoxy resin: Solventless preparation and properties

A polyurethane‐modified epoxy resin system with potential as an underfill material in electronic packaging and its preparation procedure were studied. The procedure enabled the practical incorporation of an aliphatic polyurethane precursor, synthesized from poly(ethylene glycol) and hexamethylene diisocyanate without a solvent, as a precrosslinking agent into a conventional epoxy resin. With a stoichiometric quantity of the polyurethane precursor added to the epoxy (ca. 5 phr), the polyurethane‐modified epoxy resin, mixed with methylene dianiline, exhibited a 36% reduction in the contact angle with the epoxy–amine surface, a 31% reduction in the cure onset temperature versus the control epoxy system, and a viscosity within the processable range. The resultant amine‐cured thermosets, meanwhile, exhibited enhanced thermal stability, flexural strength, storage modulus, and adhesion strength at the expense of a 5% increase in the coefficient of thermal expansion. Exceeding the stoichiometric quantity of the polyurethane precursor, however, reduced the thermal stability and modulus but further increased the coefficient of thermal expansion. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Dual‐curable unsaturated polyester inorganic/organic hybrid films

An unsaturated polyester, based on maleic anhydride, 1,6‐hexanediol, and trimethylol propane, was formulated with tetraethylorthosilicate (TEOS) oligomers and a coupling agent to prepare inorganic/organic hybrid films. TEOS oligomers were prepared through the hydrolysis and condensation of TEOS with water, and 3‐(triethoxysilyl)propylisocyanate was used as the coupling agent between the organic and inorganic phases. The hybrid materials were cured by moisture via sol–gel chemistry and by the UV curing of unsaturated polyesters. To compare the properties of the moisture‐cured inorganic/organic hybrid films, a conventional 2K polyurethane system was also prepared. The tensile, adhesion, abrasion, and fracture toughness properties were investigated as functions of the coupling agent and relative amount of UV cure versus thermal cure. Although no difference could be observed in the tensile properties, the abrasion resistance, fracture toughness, and adhesion were enhanced by the incorporation of TEOS oligomers into polyurethane films. Also, the abrasion resistance, fracture toughness, and tensile properties were increased with both moisture and UV exposure. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 99: 115–126, 2006     

Effects of in situ esterification on the performance of carboxyl functionalized rubber‐modified epoxy film adhesives

Epoxy‐based film adhesive formulations were developed with 10 wt % solid carboxyl functional rubber. Due to the high rubber content and resulting viscosity restrictions, the rubber could not be prereacted with the epoxy before hot‐melt filming. Therefore, an esterification catalyst was used to perform this reaction in situ before the epoxy curing reactions. The performance of this adhesive system is compared to that of one without the esterification catalyst. A significant difference in the flow characteristics was observed with incorporation of the esterification catalyst, but only small variations in mechanical performance were found. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 728–734, 2000     

Morphology and mechanical properties of dual‐curable epoxyacrylate hybrid composites

A dual‐curable epoxyacrylate (EA) oligomer with one epoxide group and one vinyl group at each end was synthesized for the application as adhesive sealant in the liquid crystal display panels. However, after UV and thermal cure, the EA resin was brittle with a poor resistance to crack initiation and propagation. Liquid rubbers with different functional end groups were thus tried as toughening agents for the EA resin. Among all the rubber‐toughened EAs, the EA‐V5A5 added with vinyl‐terminated and amino‐terminated butadiene‐acrylonitrile copolymers (VTBN and ATBN) each at 5 phr had the highest fracture toughness, tensile strength, and elongation at break but a lower initial modulus. To raise the modulus, submicron‐sized silica particles (∼170 nm) with surface vinyl functional groups were further added to the EA‐V5A5 to prepare the hybrid composites. Because of interfacial chemical bonding provided by the surface vinyl functional groups, both modulus and fracture toughness were increased by adding silica particles, without any appreciable decrease in extensibility. For the hybrid composite at 20 phr silica particles, the initial modulus, fracture toughness, and fracture energy were raised by 10.3, 100, and 267%, respectively, when compared to the neat epoxyacrylate. Owing to their strong interfacial bonding, the increase of fracture toughness was mainly due to the crack deflection and bifurcation on silica particles, in addition to the rubber particle bridging and tearing as evidenced by SEM pictures on the fracture surface. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41820.     

Self‐healing Ag/epoxy electrically conductive adhesive using encapsulated epoxy‐amine healing chemistry

In this study, a dual‐microcapsule epoxy‐amine self‐healing concept is used for electrically conductive adhesives (ECAs). It provides the ECA samples with the ability to recover mechanical and electrical properties automatically. Epoxy and amine microcapsules were prepared and incorporated into silver/epoxy ECAs. The healing efficiency and bulk resistivity of the undamaged, damaged, and healed specimens were measured, respectively. The optimal loading of the epoxy and amine microcapsules is 6 wt % (weight ratio 1.05), and the bulk resistivity of the healed specimens is 3.4 × 10^?3 Ω cm. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41483.     

Preparation and cured properties of diallyl phthalate resin modified with epoxy resin and allyl ester compound having carboxylic acid

An epoxy resin was blended with a diallyl phthalate resin to improve the adhesive properties and the fracture toughness. A compatibilizer was used to reduce the decrease in heat resistance. An allyl ester compound [1,4‐diallyloxycarbonyl‐2,5‐benzenedicarboxylic acid (DAPY)], which reacted with the diallyl phthalate resin and epoxy resin to have allyl groups and carboxylic acids on the end of the molecular chain, was synthesized as a compatibilizer by the reaction of pyromellitic dianhydride with allyl alcohol. These blends were cured with dicumyl peroxide and triethylamine. By modification with the epoxy resin and DAPY, the lap shear adhesive strength to steel increased up to about 3 times that of the diallyl phthalate resin. These results suggest that the secondary hydroxyl group generated by the addition reaction of the epoxy resin and DAPY and the secondary hydroxyl group existing in the molecular chain of the epoxy resin formed hydrogen bonds with the hydroxyl group of water existing on a metal surface, and as a result, the adhesive strength to metal such as steel increased. The fracture toughness of the diallyl phthalate resin was increased by modification with the epoxy resin. The reason for this result was that the flexibility increased because the crosslinking density became small by modification with the epoxy resin. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

The flame retardant group‐synergistic‐effect of a phosphaphenanthrene and triazine double‐group compound in epoxy resin

A flame retardant tri‐(phosphaphenanthrene‐(hydroxyl‐methylene)‐phenoxyl)‐1, 3, 5‐triazine (Trif‐DOPO) and its control samples are incorporated into diglycidyl ether of bisphenol‐A (DGEBA) and 4, 4′‐diamino‐diphenyl sulfone (DDS) to prepare flame retardant thermosets, respectively. According to the results of limited oxygen index (LOI), UL94 vertical burning test and cone calorimeter test, the Trif‐DOPO/DGEBA/DDS thermoset with 1.2 wt % phosphorus possesses the LOI value of 36% and UL94 V‐0 flammability rating, and Trif‐DOPO can decrease the peak of heat release rate (pk‐HRR) and reduce the total heat release (THR) of thermosets. All these prove better flame retardant performance of Trif‐DOPO than that of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide(DOPO). The residue photos of thermosets after cone calorimetry test disclose that Trif‐DOPO can promote the formation of thick and tough melting char layer for combined action of the flame retardant groups of Trif‐DOPO. The results from thermo gravimetric analysis (TGA) and pyrolysis‐gas chromatography‐mass spectrometry(Py‐GC/MS) show that the groups in Trif‐DOPO can be decomposed and produce PO₂ fragments, phosphaphenanthrene and phenoxy fragments, which can jointly quench the free radical chain reaction during combustion. Therefore, the excellent flame retardancy of Trif‐DOPO is attributed to its flame retardant group‐synergic‐effect. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 39709.     

Quasi‐isothermal DSC testing of epoxy adhesives using initial fast heating rates

Three major factors decrease the accuracy of the cure measurement in standard‐isothermal testing using differential scanning calorimetry (DSC). First, cure occurs during the heating step. Second, data are lost during the stabilization period between the dynamic and isothermal step. Third, the baseline selection requires a modification to the protocol. An alternative, which is explored in this study, is the use of fast ramps, which decrease the heating time, but this has been avoided due to overshoot that occurs between the dynamic and isothermal step, which is troublesome for systems with autocatalytic kinetics. By mitigating these factors, a quasi‐isothermal protocol was developed. Therefore, more complete cure kinetics were captured with the implementation of fast DSC to decrease the ramp time and through the optimization of furnace parameters to decrease stabilization time and temperature overshoot. The data suggested this quasi‐isothermal analysis more accurately measured the isothermal curing kinetics of a commercial epoxy adhesive at 110, 115, and 120 °C for fast ramps of 175, 350, and 500 K/min compared to the traditional ramp of 5 K/min. The enthalpy spike at the dynamic to isothermal transition remains an issue; however, an empirical shift can be used to compensate for the enthalpy signal lag. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 45425.     

Nano‐alumina modified epoxy based film adhesives

Epoxy based film adhesives were developed that contained nano‐sized alumina particles of different size and shape. These nano‐scale materials were incorporated at 5 and 10 weight percent into an adhesive formulation that was filmed on polyester random mat scrim. Films were applied to composite substrates for fracture testing and aluminum substrates for lap shear and peel testing. Scanning electron microscopy was used to characterize the surfaces of both the aluminum and composite specimens. Results from the bonded aluminum samples showed that in almost all cases the additives increased the peel and shear strength of the adhesives. Composite samples yielded results that were less clear, but still demonstrated that nano‐scale additives can increase the fracture toughness of a thermosetting adhesive.     

Thermal and mechanical properties of tetra‐functional mesogenic type epoxy resin cured with aromatic amine

A novel tetra‐functional epoxy monomer with mesogenic groups was synthesized and characterized by ¹H‐NMR and FTIR. The synthesized epoxy monomer was cured with aromatic amine to improve the thermal property of epoxy/amine cured system. The glass transition temperature (T_g) and coefficient of thermal expansion (CTE) of the cured system were investigated by dynamic mechanical analysis and thermal mechanical analysis. The properties of the cured system were compared with the conventional bisphenol‐A type epoxy and mesogenic type epoxy system. The storage modulus of the tetra‐functional mesogenic epoxy cured systems showed the value of 0.96 GPa at 250 °C, and T_g‐less behavior was clearly observed. The cured system also showed a low CTE at temperatures above 150 °C without incorporation of inorganic components. These phenomena were achieved by suppression of the thermal motion of network chains by introduction of both mesogenic groups and branched structure to increase the cross linking density. The temperature dependency of the tensile property and thermal conductivity of the cured system was also investigated. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46181.     

Thermal and mechanical properties of epoxy resin reinforced with modified iron oxide nanoparticles

Epoxy polymers, having good mechanical properties and thermal stability, are often used for engineering applications. Their properties can be further enhanced by the addition of iron oxide (Fe₃O₄) nanoparticles (NPs) as fillers to the resin. In this study, pristine Fe₃O₄ NPs were functionalized with polydopamine (PDA), (3-glycidoxypropyl)trimethoxysilane (GPTMS), and (3-aminopropyl)trimethoxysilane (APTES). X-ray diffraction and scanning electron microscopy (SEM) were used to study any changes in the crystal structure and size of the NPs while Fourier-Transform Infrared Spectroscopy (FTIR) and Thermogravimetric Analysis (TGA) were used to ensure the presence of functional groups on the surface. The mechanical properties of the Fe₃O₄-based nanocomposites generally improved except when reinforced with Fe₃O₄/PDA. The maximum improvement in tensile strength (∼34%) and fracture toughness (∼13%) were observed for pristine Fe₃O₄-based nanocomposites. Dynamic mechanical analysis (DMA) showed that the use of any of the treated NPs improved the material's initial storage modulus and had a substantial impact on its dissipation potential. Also, it was observed that the glass transition temperature measurements by DMA and differential scanning calorimetry were below that of pure epoxy. SEM of the cracked surfaces shows that the incorporation of any NPs leads to an enhancement in its thermal and mechanical properties.     

Thermally curable adhesive tapes with complex catalyst system for fabricating semiconductor packages

Thermal curing of adhesive films was investigated to facilitate the fabrication of a reliable bonding for semiconductors. The formulated adhesive films contained acrylic polymer, epoxy resins, phenol resin, and an imidazole derivative that was the catalyst for curing the epoxy resins with phenol resin. The solubility, thermally latent characteristics, mechanical and adhesive properties of 2‐methylimidazole/boron trifluoride (2MZ/BF3), and 2MZ/aluminum trisacetylacetonate (AlAC) were investigated. It was found that 2MZ/BF3 and 2MZ/AlAC had excellent solubility in adhesive materials and they had excellent latent characteristics as thermal curing catalysts for epoxy resins, whereas conventional catalysts (2MZ and 2‐phenyl‐4, 5‐dihydroxymethylimidazole (2PHZ)) could not achieve both excellent solubility and thermally latent characteristics. The mechanical and adhesive properties of the post‐thermal‐cured adhesive film that contained 2MZ/BF3 or 2MZ/AlAC were comparable to those of the post‐thermal‐cured adhesive films that contained conventional catalysts. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Fracture toughness of bisphenol A‐type epoxy resin

The relationship between the postcuring conditions and the fracture toughness of a bisphenol A‐type epoxy resin cured with acid anhydride was investigated. The glass transition temperature and fragility parameter, derived from the thermo‐viscoelasticity, were used to characterize the epoxy resin postcured under various conditions. Relationship between these two parameters and the fracture toughness was then investigated, based on the fractography results of a microscopic roughness examination of a fractured surface. The values of the glass transition temperature and fragility greatly depended on the postcuring conditions. The glass transition temperature was approximately 400 K when the crosslinking reaction was saturated. The fragility was independent of the saturation of the reaction and varied between 50 and 180. The results of the fracture test and fractography examination showed that there was no direct correlation between the glass transition temperature, the fracture toughness, and the roughness. On the other hand, there was a correlation between the fragility, fracture toughness, and roughness when the glass transition temperature saturated (at 400 K). As the fragility decreased from 180 to 50, the fracture toughness increased from 0.6 to 1.1 MPa · m^1/2 at the same glass transition temperature. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 10: 2266–2271, 2002     

Urea formaldehyde resin with low formaldehyde content modified by phenol formaldehyde intermediates and properties of its bamboo particleboards

Phenol formaldehyde reaction solution (PFS) was used to synthesize urea–formaldehyde resins (PFSUF resins) with low formaldehyde content. In addition, the prepared PFSUF resins were used as adhesives to bond bamboo particleboards. Mechanical properties, fracture morphology, water absorption ratio, and dimensional stability of bamboo particleboards have been studied by tensile tests, SEM tests, water absorption analysis, and swelling ratio analysis, respectively. The results demonstrate that the main ingredient of PFS is phenol formaldehyde intermediate 2,4,6‐trimethylolphenate and proper amount of PFS can be used to reduce the formaldehyde content of UF resins effectively. The results also show that bamboo particleboards bonded with PFSUF resins exhibit better mechanical properties, water resistance, and dimensional stability than that bonded with pure UF resin. However, the results of TG and mechanical properties analysis exhibit that alternative curing agents to ammonium chloride should be studied to improve the curing properties of the PFSUF resins with low formaldehyde content. Taken together, this work provides a method of preparing environment‐friendly PFSUF resins with low phenol and low formaldehyde content and the prepared resins have potential application in wood industry. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42280.