导热高分子材料的研究开发现状

综述了近几年来导热高分子材料主要是导热塑料、导热橡胶领域内的研究开发进展。简单阐述了导热高分子材料的导热机理及导热理论模型,在此基础上探讨了优化导热高分子材料综合性能的途径。     

导热高分子材料的研究与应用

随着技术的发展,使得导热高分子材料的性能和产量提升,为其在电子技术领域应用提供了良好条件。导热高分子材料优异的性能,满足了微型电子设备的散热问题,最大程度保障电子元器件的使用寿命。首先简要介绍了导热高分子材料的导热机理,以及导热高分子材料应用范围,最后提出导热高分子材料的性能强化措施。     

试论导热高分子材料的实践应用

随着现代工业和材料科学的不断发展,对导热高分子材料提出了更高的要求。从导热高分子材料概述入手,探讨导热高分子材料的实践应用,以供参考。     

填充型导热高分子复合材料研究进展

综述了国内外导热绝缘填料、导热非绝缘填料和混杂填料填充的导热高分子材料的研究进展.简要地介绍了导热高分子材料的导热机理.分析了导热高分子复合材料目前存在的一些问题,并对其研究方向给出了一些建议.     

导热高分子复合材料研究进展

在介绍金属材料、无机非金属材料以及高分子材料导热机理的基础上,介绍了导热填料填充高分子复合材料的导热网链机理和热弹性组合机理2种导热机理,该理论可以解释导热高分子复合材料导热过程中不同的现象和规律;归纳了适用于粒子、纤维等填充的聚合物基复合材料的各种导热模型;讨论了树脂基体、导热填料和温度对于高分子复合材料热导率的影响...     

填充型导热绝缘高分子材料的研究进展

本文介绍了填充型导热绝缘高分子材料的导热机理,讨论了影响填充型导热绝缘高分子材料导热性能的主要因素,展望了导热绝缘高分子材料的发展方向。     

填充型导热高分子研究进展

总结了导热高分子复合材料的导热理论研究,综述了近年来国内外几种常用的提高填充型导热高分子材料导热性能的方法,并对未来研究及发展方向进行了展望。     

导热高分子材料的研究和开发进展

概述了导热高分子材料的应用开发背景,描述了近几年来导热塑料和橡胶的研究开发进展及对填充剂使用提出的要求。介绍了导热高分子材料理论研究和导热高分子材料的导热性能理论预测领域的最新成果。     

LED用导热塑料

综述了近年来国内外导热高分子材料在发光二极管(LED)中的研究和应用.列举了LED用导热塑料主要公司和牌号.论述了导热塑料取代金属部件用作LED灯外壳和热沉以及降低LED模块热阻方面的现状.提出LED热管理应用中提高导热高分子材料综合性能是今后的发展趋势.     

导热高分子复合材料的研究进展

随着电子信息技术的快速发展,电子设备的散热问题面临严峻的挑战,亟须研发高性能导热复合材料。高分子复合材料因其轻质、高强度和良好的柔韧性,在导热材料领域得到了广泛应用。简要介绍了导热高分子复合材料的导热机理、导热填料以及影响导热率的因素。综述了通过表面功能化、杂化粒子、填料取向和构建3D互联骨架结构等方法提高复合材料导热性能的研究现状。总结了导热材料当前面临的问题,并对未来导热高分子复合材料的发展方向进行了展望。     

绝缘导热高分子复合材料研究

介绍了导热绝缘高分子复合材料的导热性能、导热机理,综述了各类导热绝缘高分子如复合型导热塑料、橡胶、胶粘剂、涂层等的研究,并展望了其应用前景及未来发展方向.     

Thermal conductivity of carbon nanotubes and their polymer nanocomposites: A review

Thermally conductive polymer composites offer new possibilities for replacing metal parts in several applications, including power electronics, electric motors and generators, heat exchangers, etc., thanks to the polymer advantages such as light weight, corrosion resistance and ease of processing. Current interest to improve the thermal conductivity of polymers is focused on the selective addition of nanofillers with high thermal conductivity. Unusually high thermal conductivity makes carbon nanotube (CNT) the best promising candidate material for thermally conductive composites. However, the thermal conductivities of polymer/CNT nanocomposites are relatively low compared with expectations from the intrinsic thermal conductivity of CNTs. The challenge primarily comes from the large interfacial thermal resistance between the CNT and the surrounding polymer matrix, which hinders the transfer of phonon dominating heat conduction in polymer and CNT.This article reviews the status of worldwide research in the thermal conductivity of CNTs and their polymer nanocomposites. The dependence of thermal conductivity of nanotubes on the atomic structure, the tube size, the morphology, the defect and the purification is reviewed. The roles of particle/polymer and particle/particle interfaces on the thermal conductivity of polymer/CNT nanocomposites are discussed in detail, as well as the relationship between the thermal conductivity and the micro- and nano-structure of the composites.     

Comparison of the thermally stable conducting polymers PEDOT, PANi, and PPy using sulfonated poly(imide) templates

We showed that it is possible to use sulfonated poly(amic acid)s (SPAA) to template polymerize 3,4-ethylenedioxythiophene (EDOT) to PEDOT, resulting in an aqueous dispersion of conducting polymer. This study compares PEDOT with poly(aniline) (PANi) and poly(pyrrole) PPy using the same and another, more rigid, poly(amic acid) template. A variety of system parameters, including reaction time, conductivity, and overall thermal stability, were noted to change systematically depending on the systems chosen. PANi-SPAA takes less than one tenth of the reaction time of PEDOT-SPAA (12 h versus 7 days), and results in higher conductivities at room temperature (ca. 10 S/cm). However, it is not as thermally stable as the PEDOT-SPAA system; conductivity is not measureable after annealing at 300 °C. PPy-SPAA was found to be more thermally stable than PANi-SPAA (less mass lost at 300 °C), but it was still more conductive than un-doped PEDOT-SPAA by a factor of 1000 (ca. 1.0 S/cm).     

石墨烯导热高分子复合材料的制备、性能与机理

石墨烯是一种具有超大的比表面积、良好的热和化学稳定性、超高的热导率以及易于化学修饰的蜂窝状单层碳材料,已作为填料广泛应用于导热高分子复合材料领域。近年来石墨烯导热高分子材料的研究重点是改善石墨烯在聚合物基体中的界面相容性和分散性能。阐述了近年来石墨烯导热高分子复合材料的制备方法及其热性能,并重点对石墨烯导热高分子复合材料的导热机理进行综述,同时结合研究现状对石墨烯导热高分子复合材料的研究方向进行展望。     

Enhanced thermal performance of hybrid interface materials supported by 3D thermally conductive SiC framework

The rapid development of microelectronic integration technology is placing increasing demands on the safety performance of electronic devices. Excellent thermal interface materials (TIM) facilitate the dissipation of heat from electronic components, which ensures the safety of electronic equipment. In this work, a three-dimensional (3D) thermally conductive framework is constructed from carbon fibers to form silicon carbide (SiC) in situ. This is followed by vacuum impregnation with paraffin wax (PW) to produce phase change composites (PCCs). The results show that the SiC-based 3D thermally conductive framework has a hierarchical porous network structure, and the PCC indicates enhanced thermal conductivity and good anti-leakage properties. The thermal conductivity of PW @ CF1–Si1-1550 is 0.81 W K⁻¹m⁻¹, which is 4 times that of PW. In addition, the PCC also shows good thermal cycling properties, high thermal storage capacity (179.06 Jg^-1), and good insulation properties. The PCC as described in this paper as TIM have considerable application potential in thermal management.     

Recent Progress on Fabrication and Performance of Polymer Composites with Highly Thermal Conductivity

The rise of miniaturized, integrated, and functional electronic devices has intensified the need for heat dissipation. To address this challenge, it is necessary to develop novel thermally conductive polymer composites as packaging materials. In this paper, a number of factors for the construction and design of thermally conductive polymers are concluded. Special attention is focused on the analysis and comparison of the thermally conductive composites prepared by various fillers or strategies to provide guidelines and references for future design of composite materials. The current commonly used preparation strategies of thermally conductive polymer are summarized, such as using a variety of fillers, vacuum filtration, template method, and so on. The challenges of thermally conductive polymer composites are finally sketched. This review can inspire the design of polymer composites with brilliant thermal conductivity.     

Fabrication and characterization of aluminum nitride thick film coated on aluminum substrate for heat dissipation

For effective heat dissipation in high-power LED applications, aluminum nitride (AlN) thick films as thermally conductive dielectric layers were developed, which were deposited on an Al substrate by aerosol deposition (AD). The aerosol-deposited AlN thick films on Al substrates have advantages over conventional polymer-based dielectric substrates or ceramic substrate mounted heatsink systems including an epoxy adhesive, such as excellent heat dissipation capacity and low thermal resistance. AD is an effective method to fabricate high-quality AlN thick film without the Al₂O₃ phase because the film is formed at room temperature. Highly dense and well-adhered, pure AlN thick films with thicknesses up to 30 µm were deposited on an Al substrate. AlN-Al₂O₃ and AlN-polyvinylidene fluoride (PVDF) composite films were also deposited on an Al substrate in order to investigate the effect of Al₂O₃ and polymer on the microstructure and thermal properties. Among the films, pure AlN thick film exhibited the highest dielectric strength, the highest thermal conductivity, and the lowest thermal resistance. Therefore, it can be expected that the aerosol-deposited AlN thick film on Al substrate could be used as a powerful heatsink.     

Development of Polypyrrole/Epoxy Composites as Isotropically Conductive Adhesives

As a possible replacement for lead bearing solders, metal filled isotropically conductive adhesives (ICAs) have shown a lot of potential recently. But still they have to come a long way and overcome their limitations like low impact strength and moisture instability. The current paper attempts to address the limitations of these ICAs by using intrinsically conducting polymer as a filler in place of metals. Conducting polymer (CP) polypyrrole (PPy) was incorporated as a filler in an epoxy/anhydride (EP) system and its application as an isotropic conductive adhesive was studied. PPy was synthesized by chemical polymerization using dodecyl-benzene sulphonic acid (DBSA) as dopant. The composites with varying PPy concentrations were studied for curing behavior and thermal degradation properties using DSC and TGA, respectively. The composites show good impact properties and conductivity at very low filler concentrations. SEM observations established that PPy particles were dispersed in the epoxy matrix uniformly. The overall characteristics of these conductive adhesives establish that they can be used as conductive adhesives in the electronics industry.     

聚合物导热材料的研究进展

综述近年来有关导热高分子复合材料的研究。简单介绍导热高分子的导热机制,分析填料对复合材料导热性能的影响,并对今后研究提出建议。