Intrinsic stress and preferred orientation in TiN coatings deposited on Al using plasma immersion ion implantation assisted deposition

TiN coatings were deposited on Al substrates using the plasma immersion ion implantation and deposition (PIIIAD) technique, employing a filtered Ti cathodic arc in a nitrogen atmosphere. Negative pulsed bias voltages between 0 to −4.0 kV were applied with varying duty cycles, at a constant time-averaged bias. Stress measurements using X-ray diffraction reveal an increase and then a decrease in the intrinsic compressive stress at increasing on-time bias. A bias-dependent preferred orientation of TiN is observed, i.e. {111}, {200} and {220} at low bias and predominantly {200} at higher bias. The hardness reduces from 29 GPa at lower bias to 20 GPa at higher bias. Thus, the time averaged energy of ion bombardment does not uniquely determine the properties of the growing coating, which can be adjusted by the on-time substrate bias applied for very short durations. A simplified subplantation model of stress development is formulated for the case of pulsed bias, the predictions of which are in reasonable agreement with the experimental data.     

Improving hardness of biomedical Co-Cr by deposition of dense and uniform TiN films using negative substrate bias during reactive sputtering

This paper reports the deposition of a fully dense and uniform TiN film to improve the surface hardness of Co-Cr, particularly, by applying a negative substrate bias during reactive direct current (DC) sputtering. As the TiN film was deposited with a negative substrate bias voltage of 150 V, the microstructure of the films was shifted from a columnar to non-columnar one that was observed to have a dense, uniform and smooth surface. In addition, the preferred orientation was the (111) plane when the films were deposited with a negative substrate bias; however, the (200) plane when they were deposited without a substrate bias. The deposition of the dense and uniform TiN film resulted in a significant increase of the hardness of the Co-Cr. The TiN-deposited Co-Cr with a negative substrate bias showed a very high hardness of 44.7 ± 1.7 GPa, which was much higher than those of the bare Co-Cr (4.2 ± 0.3 GPa) and TiN-deposited Co-Cr without a negative substrate bias (23.6 ± 2.8 GPa).     

Alteration of internal stresses in SiO2/Cu/TiN thin films by X-ray and synchrotron radiation due to heat treatment

A break of wiring by stress-migration becomes a problem with an integrated circuit such as LSI. The present study investigates residual stress in SiO₂/Cu/TiN film deposited on glass substrates. A TiN layer, as an undercoat, was first deposited on the substrate by arc ion plating and then Cu and SiO₂ layers were deposited by plasma coating. The crystal structure and the residual stress in the deposited multi-layer film were investigated using in-lab. X-ray equipment and a synchrotron radiation device that emits ultra-high-intensity X-rays. It was found that the SiO₂ film was amorphous and both the Cu and TiN films had a strong {1 1 1} orientation. The Cu and TiN layers in the multi thick (Cu and TiN:1.0 μm)-layer film and multi thin (0.1 μm)-layer film exhibited tensile residual stresses. Both tensile residual stresses in the multi thin-layer film are larger than the multi thick-layer film. After annealing at 400 °C, these tensile residual stresses in both the films increased with increasing the annealing temperature. Surface swelling formations, such as bubbles were observed in the multi thick-layer film. However, in the case of the multi thin-layer films, there was no change in the surface morphology following heat-treatment.     

Stress and texture in HIPIMS TiN thin films

Titanium nitride (TiN) films in the thickness range of 0.013 µm to 0.3 µm were grown by high power impulse magnetron sputtering (HIPIMS) on silicon substrates in two deposition modes: a) the substrate was grounded and b) − 125 V bias was applied to the substrate. On the films we performed microstructure-, film texture- and film stress-analysis. The films deposited under − 125 V bias experienced a more energetic ion bombardment than the films deposited on grounded substrates. This difference in ion bombardment energy is reflected in the different microstructure. In contrast to previous results for TiN films grown by conventional reactive magnetron sputtering, we observe no major film stress gradient for increasing film thicknesses. We explain this observation from the absence of a 200-to-111 texture crossover during film growth.A moderate ion bombardment leads to TiN films with (111) texture, while an intense ion bombardment leads to films with (001) texture (Greene et al.; Appl. Phys. Lett. 67 (20) 2928-2930 (1995)). At the same time (001) oriented grains are much more susceptible to compressive stress generation by ion bombardment than (111) oriented grains.     

Effects of nitrogen partial pressure on microstructure,morphology and N/Ti ratio of TiN films deposited by reactive magnetron sputtering

Abstract

TiN films were deposited on Si(111) substrates at different nitrogen partial pressures with reactive magnetron sputtering. The crystal structure and preferred growth orientation of the films were determined using X-ray diffraction (XRD) analysis. Their morphology and composition were analysed using field emission scanning electron microscopy (FESEM) and energy dispersive spectroscopy (EDS). It is found that with the increase in nitrogen partial pressure, the growth of TiN films varies from the {111} preferred orientation to the {100} preferred orientation and the deposition rate of TiN films decreases. When the {111} preferred orientation is presented, TiN films reveal a kind of surface morphology of triangular pyramid with right angles; while the {100} orientation is dominant, TiN films characterise another kind of domelike surface morphology. Furthermore, the N/Ti ratio of the TiN films first increases, then decreases and increases again as nitrogen partial pressure enlarges.     

Crystal orientation changes of Ag thin films on the Si(111) substrate due to tribo-assisted recrystallization

Crystal orientation changes of Ag thin films due to the tribo-assisted recrystallization have been studied using grazing incidence X-ray diffraction with synchrotron radiation. After preparation of an Si(111) √3 × √3-Ag surface, a 5-nm-thick Ag film was deposited on the surface at the substrate temperature of 303 K in an ultra-high vacuum chamber. The friction experiments were carried out using a diamond pin-on-plate type tribometer just after the Ag deposition in the same UHV chamber. We found that the coefficient of friction of the Ag films on the Si(111) √3 × √3-Ag surface decreases from 0.07 to 0.03, with increasing reciprocal sliding cycles. In synchronization with the coefficient change, Ag{100} grains are gradually disappearing. As a result, the Ag{111} grains cover the entire surface after 50 sliding cycles. Moreover, we found that the domain size of the Ag{111} grains increases with increasing reciprocal sliding cycles by measuring the rocking curve width. These results directly show that the Ag(111) plane is the sliding plane of friction and the coefficient of friction of Ag films is determined by the fraction of the Ag(111) grains in the Ag films. Moreover, to clarify the reaction between the Ag film and the Si substrate due to the tribo-assisted recrystallization, the substrate strain has been studied by an extremely asymmetric X-ray diffraction technique using synchrotron radiation.     

Cathodic arc plasma deposited TiAlSiN thin films using an Al-15 at.% Si cathode

Thin films of TiAlSiN were deposited on SKD 11 tool steel substrates using two cathodes, of Ti and Al-15 at.% Si, in a cathodic arc plasma deposition system. The influence of AlSi cathode arc current and substrate bias voltage on the mechanical and structural properties of the films was investigated. The TiAlSiN films had a multilayered structure in which nanocrystalline cubic TiN layers alternated with nanocrystalline hexagonal AlSiN layers. The hardness of the films decreased with the increase of the AlSi cathode arc current. The hardness of the films also decreased as the bias voltage was raised from − 50 V to − 200 V. The maximum hardness of 43 GPa was observed at the films deposited at the pressure 0.4 Pa, Ti cathode arc current 55 A, Al cathode arc current 35 A, temperature 250 °C and bias voltage of − 50 V.     

Annealing effects on microstructure and mechanical properties of sputtered multilayer Cr(1 − x)AlxN films

Multilayer Cr_(1 − x)Al_xN films with a total thickness of 2 μm were deposited on high-speed steel by medium frequency magnetron sputtering from Cr and Al-Cr (70 at.% Al) targets. The samples were annealed in air at 400 °C, 600 °C, 800 °C and 1000 °C for 1 hour. Films were characterized by cross-sectional scanning electron microscopy and X-ray diffraction analysis. The grain size of the as-deposited multilayer films is about 10 nm, increasing with the annealing temperature up to 100 nm. Interfacial reactions have clearly changed at elevated annealing temperatures. As-deposited films' hardness measured by nanoindentation is 22.6 GPa, which increases to 26.7 GPa when the annealing temperature goes up to 400 and 600 °C, but hardness decreases to 21.2 GPa with further annealing temperature increase from 600 to 1000 °C. The multilayer film adhesion was measured by means of the scratch test combined with acoustic emission for detecting the fracture load. The critical normal load decreased from 49.7 N for the as-deposited films to 21.2 N for the films annealed at 1000 °C.     

Influence of thickness on the crystallography and surface topography of TiN nano-films deposited by reactive DC and pulsed magnetron sputtering

TiN films of 50 nm and 500 nm thickness were deposited on M2 tool steel substrates by reactive closed field unbalanced magnetron sputtering operating in direct current (DC) and pulsed magnetron sputtering (PMS) modes. Parameters of the crystallographic structure and surface roughness and their evolution during the films growth were analyzed via X-ray diffraction and atomic force microscopy. The obtained results show that all the analyzed films have polycrystalline and mono-phase (TiN) structures. In the 50 nm films, the in plane crystallographic texture that formed was 100% {111}. During film growth a weakening of the preferred crystallographic orientation and a decrease of the concentration of lattice imperfections occurred. Both processes are more pronounced in the film deposited by PMS compared to that deposited by DC sputtering. Film growth is accompanied by increasing of surface smoothness. Pulsing the target power led to a decrease of the mean surface roughness of both the 50 nm and 500 nm films.     

Influence of the ion-atom flux ratio on the mechanical properties of chromium nitride thin films

In this paper we report the mechanical properties of chromium nitride (CrN) thin films deposited at different levels of ion bombardment and their relationship with the microstructural parameters, such as grain size, preferred orientation and residual stress. The samples were deposited by unbalanced magnetron sputtering changing the substrate-target distance and the substrate bias, keeping other deposition condition fixed. The mechanical properties were obtained by nanoindentation performed on 1.8 μm thick samples. Under the different deposition conditions all of the CrN films were approximately stoichiometric, but clear variations in the microstructure were seen. The hardness was nearly constant at 24-27 GPa even when the grain size, residual stress and crystalline orientation changed. However, the elastic modulus showed a steady increase from 300 to 350 GPa, proportional to the variations in grain size and the residual stress level.     

Influences of process parameters on texture and microstructure of NiO films

The experimental result shows that the preferred orientations of NiO thin films are closely related to the working pressure of argon. All of NiO(111), NiO(200), and NiO(220) diffraction peaks are observed in the XRD patterns and exhibited random orientation of NiO film when the film is deposited in low Ar pressure of 0.67 Pa. As the Ar pressure is increased to 2.67 Pa, only the NiO(200) peak appears and shows (200)-textured NiO films. However, the lattice parameter of NiO film deposited in high Ar pressure of 2.67 Pa is 0.426 nm, which is much larger than that of the NiO bulk (0.417 nm). The lattice parameter can be reduced by post-annealing the film because the interstitial Ar atoms are released from the NiO lattice, decreasing continuously from 0.423 to 0.417 nm as the NiO films are annealed by rapid thermal annealing (RTA) from 300 to 600 °C.     

Effect of bias voltage on microstructure, mechanical and wear properties of Al-Si-N coatings deposited by cathodic arc evaporation

Al-Si-N coatings were deposited on tungsten carbide (WC-Co) and silicon wafer substrates using Cr and AlSi (12 at.% Si) alloy targets using a dual cathode source with short straight-duct filter in the cathode arc evaporation system. Al-Si-N coatings were synthesized under a constant flow of nitrogen, using various substrate bias voltages at a fixed AlSi cathode power. To enhance adhesive strength, the Cr/(Cr_xAl_ySi_z)N graduated layer between the top coating and the substrate was deposited as a buffer interlayer. The effects of bias voltage on the microstructure, mechanical and wear properties of the Al-Si-N films were investigated. Experimental results reveal that the Al-Si-N coatings exhibited a nanocomposite structure of nano-crystalline h-AlN, amorphous Si₃N₄ and a small amount of free Si and oxides. It was also observed that the deposition rate of as-deposited films gradually decreased from about 25.1 to 18.8 nm/min when the substrate bias was changed from − 30 to − 150 V. The XRD results revealed that h-AlN preferred orientation changed from (002) to (100) as the bias voltage increased. The maximum hardness of approximately 35 GPa was obtained at the bias voltage of −90 V. Moreover, the grain size was inversely proportional to the hardness of the film. Wear test results reveal that the Al-Si-N film had a lower coefficient of friction, between 0.5 and 0.7, than that 0.7 of the AlN film.     

Structural evolution of PZTN thin films produced by pulsed laser ablation deposition

The study of highly oriented Nb-doped PZT thin films deposited by laser ablation on n-type (111) Si substrates is reported. Sintered ceramics based on the nominal composition Pb_0.995(Zr_0.65Ti_0.35)_0.99Nb_0.01O₃ (PZTN) with an excess of PbO were used as targets. The films were deposited using the 3rd harmonic (355 nm) of a pulsed Nd:YAG laser (7 ns pulse duration) with 7 J/cm² fluence, at different oxygen pressures (from 10⁻¹ to 10⁻⁴ mbar) and at a vacuum of 10⁻⁶ mbar. The substrate temperature was varied in the range of 500-600 °C. In optimized conditions, the as-deposited PZT-based films show perovskite structure oriented along the (110) direction with minor impurities (PbO), as revealed from X-ray diffraction spectra. Further, microstructural analysis of the as-grown including chemical composition is also presented. The relationship between composition of the target, deposition conditions and film properties are then discussed.     

Deposition,structure and hardness of Ti–Cu–N hard films prepared by pulse biased arc ion plating

In this work, Ti–Cu–N hard nanocomposite films were deposited on 304 stainless steel (SS) substrate by using pulse biased arc ion plating system with Ti–Cu alloy target. The effects of negative substrate pulse bias voltages on chemical composition, structure, morphology and mechanical properties were investigated. The composition and structure of these films was found to be dependent on the pulse bias, whereas the pulse biases put little influence on hardness of these films. The XPS spectra of Cu 2p showed that obtained peak values correspond to pure metallic Cu. Cu content in Ti–Cu–N nanocomposite films changed with pulse bias voltage. In addition, X-ray diffraction analysis showed that a pronounced TiN (111) texture is observed under low pulse bias voltage while it changed to TiN (220) orientation under high pulse bias voltage. Surface roughness of the Ti–Cu–N nanocomposite films achieved to the minimum value of 0.11 μm with the negative pulse bias voltage of −600 V. The average grain size of TiN was less than 17 nm. The mechanical properties of Ti–Cu–N hard films investigated by nanoindentation revealed that the hardness was about 22–24 GPa and the hardness enhancement was not obtained.     

Texture development, microstructure and phase transformation characteristics of sputtered Ni-Ti Shape Memory Alloy films grown on TiN<111>

Near equiatomic Ni-Ti films have been deposited by magnetron co-sputtering on TiN films with a topmost layer formed by < 111> oriented grains (TiN/SiO₂/Si(100) substrate) in a chamber installed at a synchrotron radiation beamline. In-situ X-ray diffraction during Ni-Ti film growth and their complementary ex-situ characterization by Auger electron spectroscopy, scanning electron microscopy and electrical resistivity measurements during temperature cycling have allowed us to establish a relationship between the structure and processing parameters.A preferential development of < 110> oriented grains of the B2 phase since the beginning of the deposition has been observed (without and with the application of a substrate bias voltage of −45 and −90 V). The biaxial stress state is considerably influenced by the energy of the bombarding ions, which is dependent on the substrate bias voltage value applied during the growth of the Ni-Ti film. Furthermore, the present work reveals that the control of the energy of the bombarding ions is a promising tool to vary the transformation characteristics of Ni-Ti films, as shown by electrical resistivity measurements during temperature cycling.The in-situ study of the structural evolution of the growing Ni-Ti film as a consequence of changing the Ti:Ni ratio during deposition (on a TiN<111> layer) has also been performed. The preferential growth of < 110> oriented grains of the Ni-Ti B2 phase has been as well observed despite the precipitation of Ti₂Ni during the deposition of a Ti-rich Ni-Ti film fraction. Functionally graded Ni-Ti films should lead to an intrinsic “two-way” shape memory effect which is a plus for the miniaturization of Ni-Ti films based devices in the field of micro-electro-mechanical systems.     

Deposition,structure and hardness of Ti–Cu–N hard films prepared by pulse biased arc ion plating

In this work, Ti–Cu–N hard nanocomposite films were deposited on 304 stainless steel (SS) substrate by using pulse biased arc ion plating system with Ti–Cu alloy target. The effects of negative substrate pulse bias voltages on chemical composition, structure, morphology and mechanical properties were investigated. The composition and structure of these films was found to be dependent on the pulse bias, whereas the pulse biases put little influence on hardness of these films. The XPS spectra of Cu 2p showed that obtained peak values correspond to pure metallic Cu. Cu content in Ti–Cu–N nanocomposite films changed with pulse bias voltage. In addition, X-ray diffraction analysis showed that a pronounced TiN (111) texture is observed under low pulse bias voltage while it changed to TiN (220) orientation under high pulse bias voltage. Surface roughness of the Ti–Cu–N nanocomposite films achieved to the minimum value of 0.11 μm with the negative pulse bias voltage of ?600 V. The average grain size of TiN was less than 17 nm. The mechanical properties of Ti–Cu–N hard films investigated by nanoindentation revealed that the hardness was about 22–24 GPa and the hardness enhancement was not obtained.     

Effect of deposition angle on the structure and properties of pulsed-DC magnetron sputtered TiAlN thin films

This article reports the comparison of structure and properties of titanium aluminum nitride (TiAlN) films deposited onto Si(100) substrates under normal and oblique angle depositions using pulsed-DC magnetron sputtering. The substrate temperature was set at room temperature, 400 °C and 650 °C, and the bias was kept at 0, − 25, − 50, and − 80 V for both deposition angles. The surface and cross-section of the films were observed by scanning electron microscopy. It was found that as the deposition temperature increases, films deposited under normal incidence exhibit distinct faceted crystallites, whereas oblique angle deposited (OAD) films develop a kind of “tiles of a roof” or “stepwise structure”, with no facetted crystallites. The OAD films showed an inclined columnar structure, with columns tilting in the direction of the incident flux. As the substrate temperature was increased, the tilting of columns nearly approached the substrate normal. Both hardness and Young's modulus decreases when the flux angle was changed from α = 0° to 45° as measured by nanoindentation. This was attributed to the voids formed due to the shadowing effect. The crystallographic properties of these coatings were studied by θ-2θ scan and pole figure X-ray diffraction. Films deposited at α = 0° showed a mixed (111) and (200) out-of-plane orientation with random in-plane alignment. On the other hand, films deposited at α = 45° revealed an inclined texture with (111) orientation moving towards the incident flux direction and the (200) orientation approaching the substrate normal, showing substantial in-plane alignment.     

Studies on the residual stress of fluorine-doped SnO2 film deposited by chemical vapor deposition

Fluorine-doped tin oxide films were deposited on Na-Ca-Si glass substrate at 650 °C by chemical vapor deposition, and then heat treatment was carried out at 200 °C, 400 °C and 600 °C for 4 min in a resistance furnace. The residual stress in SnO₂:F films was systematically measured using the sin²Ψ method based on X-ray diffraction. The incidence angle was adopted as Ψ = 0°, 15°, 20°, 25° and 30°. The results showed that the films were polycrystalline with tetragonal SnO₂ structure, together with a weak peak of SnO phase. All the films exhibited a preferred orientation with the (200) plane. The minimum value of residual stress (− 0.24 ± 0.01 GPa) was obtained when the films were heat-treated at 200 °C.     

Bias effects on microstructure, mechanical properties and corrosion resistance of arc-evaporated CrTiAlN nanocomposite films on AISI 304 stainless steel

CrTiAlN films were deposited on AISI 304 stainless steel by cathodic arc evaporation under a systematic variation of the substrate bias voltage. The effects of substrate bias on the coating morphology and mechanical properties, such as structure, composition, adhesion, hardness and Young's modulus, were studied in details using field emission scanning electron microscopy, X-ray diffraction, electron probe microanalysis and indenter. Polarization test and immersion test were also carried out to evaluate the corrosion behavior of the various films. CrTiAlN films are nanocrystalline that exhibit a CrN/TiAlN multi-layered morphology. At the optimal value of substrate bias voltage (i.e., − 150 V), the CrTiAlN film showed an increased Cr content and improved properties, such as higher adhesion, higher hardness (38 ± 2 GPa), and greater Young's modulus (319 ± 16 GPa) vs. the films deposited at other substrate bias voltages. Moreover, the optimum film has better corrosion resistance in 3.5 wt.% NaCl and 20 vol.% HCl solutions.     

The mechanical properties and resistivity of Au/NiCr/Ta multi-layered films on Si-(111) substrate

Au/NiCr/Ta multi-layered metallic films were deposited on Si substrate by magnetron sputtering at different substrate temperatures. The residual stress, hardness and resistivity were investigated as a function of substrate temperature by laser polarization phase shift technique, nanoindentation technique and four point probe method, respectively. The residual stress in as-deposited films at different substrate temperatures was tension with 385 MPa-606 MPa. Nanoindentation tests at shallow indentation depths (h ≤ t/4) where the hardness is reliable for metal films on hard substrate. Au film at deposition temperature 200 °C has the highest hardness 4.2 GPa. The resistivity in the deposited films reached the lowest value 3.1 μΩ.cm at substrate temperature 200 °C. The most interesting facts are that the hardness decreases with increasing residual stress and resistivity increases with increasing residual stress. The relationship of residual stress and resistivity may hint that there is a definite correlation between the mechanical properties and electrical properties in the metallic films.