Asynchronous design methodologies: an overview

Asynchronous design has been an active area of research since at least the mid 1950's, but has yet to achieve widespread use. We examine the benefits and problems inherent in asynchronous computations, and in some of the more notable design methodologies. These include Huffman asynchronous circuits, burst-mode circuits, micropipelines, template-based and trace theory-based delay-insensitive circuits, signal transition graphs, change diagrams, and complication-based quasi-delay-insensitive circuits     

An overview of experimental methodologies and their applications for die strength measurement

As the trends in semiconductor packages continue toward a decrease in overall package size and an increase in functionality and performance requirements, they bring challenges of processing, handling, and understanding smaller components and, in particular, thinner dies. In the meantime, high reliability remains a critical necessity. It is necessary to be able to appropriately characterize thinned dies in terms of their mechanical integrity and, equally important, in terms of the processes used to produce them. In practice, die strength can be adversely affected during various manufacturing processes, such as thinning and singulation. A realistic understanding of the significance of processing on die strength is gained through the study of the actual, processed component. This work outlines three methodologies that enable the measurement of die strength and demonstrates their application in three studies. Characterization of die damage, experimentation, and failure analysis are coupled to gain understanding of die strength with respect to processing conditions. The approaches demonstrated ultimately show the use of such information toward quantifying die strength, developing design criteria, selecting wafer processes, and optimizing processes.     

Simulation-based design optimization methodologies applied to CFD

Finding the optimal physical design for an electronic system is extremely time-consuming. In this paper, we describe a sequential global optimization methodology that can lead to better designs in less time, and illustrate its use by optimizing the design of a heat sink for a simple system. The results show the need for a global approach, the insights that can be gained through automated design optimization, and illustrate the efficiency of the reported methodology in finding the optimum design.     

IC设计产业攻略

简况 据FSA(无工厂半导体协会)的统计,2003年世界Fabless(无工厂)设计公司产值达242亿美元,比上年增长16%,与世界半导体销售值相比,约占其14%.展望今后,IC设计业在半导体产业中的地位将日增,市场仍有很大的成长空间,因此,IC设计业成为产业关心的焦点,令人称羡的明星产业.     

Distributed database design methodologies

This paper surveys methodological approaches for distributed database design. The design of distribution can be performed top-down or bottom-up; the first approach is typical of a distributed database developed from scratch, while the second approach is typical of the development of a multi-database as the aggregation of existing databases. We review the design problems and methodologies along both directions, and we describe DATAID-D, a top-down methodology for distribution design. We indicate how the methodology is part of a global approach to database design; how to collect the requirements about the distribution of data and applications; and how to progressively build the distribution of a schema. Our approach is exemplified through one case study.     

An overview to integrated power module design for high power electronics packaging

In recent years, there has been an explosion in demand for smaller and lighter, more efficient, and less expensive power electronic supplies and converters. There are a number of reasons for this recent necessity, ranging from the need for smaller and cheaper power converters for consumer electronics (such as laptop computers and cellular phones) to the need for highly reliable power electronics for such items as satellite and military craft power systems, which are required to be highly efficient, light in weight, smaller in volume, and low cost. This paper discusses the concept of Integrated Power Modules (IPMs), in which the electronic control circuitry and the high power electronics of the converter are integrated into a single compact standardized module. The advantages and disadvantages of such an approach will be discussed in reference to the current industry standard for power electronics design and packaging. The researchers will then take the readers through the IPM design, including basic circuit topology layout, module fabrication processes, and finally thermal considerations.     

System design methodologies: aiming at the 100 h design cycle

As methodologies and tools for chip-level design mature, design effort becomes focused on increasingly higher levels of abstraction. We present a tutorial on a design methodology for chip and system design and present a test case that justifies the future goal of a 100 h design cycle     

Low power design for DSP: methodologies and techniques

Power dissipation is becoming a limiting factor in the realization of VLSI systems. The principal reasons for this are maximum operating temperature and, for portable applications, battery life. Because of the relatively greater complexity, the power dissipation in digital signal processing (DSP) applications is of special significance, and low power design techniques are now emerging. This paper provides an overview of the techniques and methodologies that have emerged in the past few years for DSP system design. These include techniques for minimizing power at architectural and algorithmic levels including DSP programming issues. In addition, the paper indicates some potential design directions.