10Gbit/s甚短距离并行光传输模块与实验系统

介绍符合OIF-VSR4-03.0规范的10Gbit/s甚短距离(VSR)实验系统研究.该系统由16×622Mbit/s到4×2.488Gbit/s转换集成电路、自制12通道850nm垂直腔面发射激光器(VCSEL)并行光发射模块和商用12通道并行接收光模块构成.用一片FPGA实现转换芯片的全部功能,采用基于二分查找法的SDH STM-64/OC192 并行帧对齐及同步算法,大大提高了转换芯片的工作速度和节省了逻辑资源,自制12通道VCSEL并行发射模块工作速率达到12×2.488Gbit/s的设计指标.在SDH STM-64/OC192 10Gbit/s测试仪点到点的传输系统测试中,采用5米的12芯400MHz·km 62.5μm多模带状光纤互联,系统误码率低于1×10^-14.     

200Gbit/s PAM4光发射组件封装技术研究

针对200Gbit/s PAM4光收发模块的设计需求,提出了一种基于四阶脉冲幅度调制(PAM4)、数据传输速率达200Gbit/s的光发射组件封装方案。该封装内部集成了4路PAM4电/光转换通道,单通道数据传输速率为50Gbit/s。介绍了该200Gbit/s PAM4光发射组件的组成和技术难点,然后对其中的50Gbit/s数据传输通道进行了建模、仿真和优化,最后完成了样品的测试。测试结果表明:样品的单通道PAM4数据速率可达50Gbit/s,整体PAM4数据速率可达200Gbit/s,满足光收发模块的设计需求。     

40 Gbit/s多路并行光收发模块的研制

基于VCSEL激光器阵列和PIN探测器阵列,设计和制作了40Gbit/s甚短距离的4通道发射4通道接收并行光收发模块.通过高速电路信号仿真设计,解决了信号完整性、串扰和电磁兼容等问题;通过键合金丝长度设计增加了通道带宽.光模块单通道传输速率可达到5 Gbit/s,8通道并行总传输速率达到40Gbit/s,实现了并行光收发模块高速率、高密度、高可靠性以及小体积设计,为甚短距离高速数据处理和传输提供了高可靠的多路数据链接.     

120Gbit/s甚短距离并行光模块的研制

基于12通道垂直腔面发射激光器(VCSEL)阵列和12通道PD探测器阵列,设计制作了120 Gbit/s甚短距离的12通道并行光发送模块和12通道并行光接收模块.基于电磁场、传输线理论的信号完整性设计,减小了通道间串扰;利用过孔模型分析和阻抗设计,解决信号反射问题;且通过减小金丝直连长度等手段增加了通道带宽.光模块单通道传输速率不小于10Gbit/s,12通道并行总传输速率高达120 Gbit/s.并行光模块具有高速率、高集成度以及低成本等特点,为短距离高速率并行光传输系统提供具竞争力的解决方案.     

基于垂直腔面发射激光器的高速率并行光发射模块

报道了关于并行光发射模块的设计与制作.优化设计、制作并测试了12信道并行光发射模块,单信道传输速率可达3Gbit/s.采用波长为850nm的垂直腔面发射激光器作光源,激光器与驱动电路芯片直接用金丝连接.输出光束直接耦合进入12信道的光纤阵列中.采用小型化可插拔封装结构以便在应用中实现热插拔.模块的测试结果表明,在8mA的工作电流下,测到3Gbit/s的清晰眼图.     

并行光收发模块与光互连

以GaAs基VCSEL列阵为光源成功研制出12路并行光发射模块,总速率达37.5Gbps以GaAs基12路PIN探测器列阵为接收单元研制出响应速率达30Gbps的12路并行光接收模块;采用并行光收发模块研制出并行光传输系统,其系统传输速率达10Gbit/s.该并行光发射和接收模块以及并行光传输系统能应用于高性能计算机等系统的光互连.     

并行光收发模块与光互连

以GaAs基VCSEL列阵为光源成功研制出12路并行光发射模块,总速率达37.5Gbps以GaAs基12路PIN探测器列阵为接收单元研制出响应速率达30Gbps的12路并行光接收模块;采用并行光收发模块研制出并行光传输系统,其系统传输速率达10Gbit/s.该并行光发射和接收模块以及并行光传输系统能应用于高性能计算机等系统的光互连.     

高速率并行光发射模块的研制

介绍了有关并行光发射模块设计与制作的最新进展,制作并测试了12信道并行光发射模块,单信道传输速率大于2．5Gbit／s（最高可达3Gbit／s）,12信道并行总传输速率为30Gbit／s。模块采用波长为850nm的垂直腔面发射激光器（VCSEL）作光源,激光器与驱动电路芯片直接用Au丝连接,输出光束直接耦合进入12信道的光纤阵列中,在单信道8mA的工作电流下,可以测到最高为3Gbit／s的清晰眼图。     

一种基于SiGe BiCMOS工艺的单片集成光接收机前端放大电路

基于0.13μm SiGe BiCMOS工艺,设计了一种25 Gbit/s的光接收机前端放大电路单片集成的放大电路。该电路实现了光接收机前端放大电路的单片集成,并采用带反馈系统的跨阻放大器、电感峰化、自动增益控制电路等设计有效提高了增益、带宽和系统稳定性。经仿真与测试,该设计增益达到69.9 dB,带宽为19.1 GHz,并在工业级芯片工作温度(-40℃~+85℃)下带宽误差不超过0.1%。该芯片工作时需要的供电电流为45 mA,功耗为81 mW,信号抖动RMS值为5.8 ps,具有良好的性能和稳定性。本设计提供了一种能够适用于100 Gbit/s(25 Gbit/s×4线)光互连系统的设计方案,具有广泛的应用前景。     

100 Gbit/s CFP光收发模块的研究

随着网络流量的持续增长,100 Gbit/s以太网已开始商用,100 Gbit/s以太网的客户侧光模块为100 Gbit/s CFP(小型可插拔式)光收发模块。文章介绍了100 Gbit/s CFP光收发模块的相关标准,并给出了一种模块的设计方案。该模块由速率转换单元、发射单元、接收单元及控制单元组成。依照IEEE 802.3ba标准对模块进行了测试,结果显示该模块单通道发射平均光功率达到了1.47dBm,接收灵敏度达到了-9.5dBm,各项性能完全符合相关标准,能够应用于100 Gbit/s以太网中。     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Nanoimprint Lithography -A Next Generation High Volume Lithography Technique

IntroductionNanoimprint Lithography is a well-acknowl-edged low cost, high resolution, large area pattern-ing process. It includes the most promising methods,high-pressure hot embossing lithography (HEL) [2],UV-cured imprinting (UV-NIL) [3] and micro contactprinting (m-CP, MCP) [4]. Curing of the imprintedstructures is either done by subsequent UV-lightexposure in the case of UV-NIL or by cooling downbelow the glass transition temperature of the ther-moplastic material in case of HEL…     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

Influence of PVK ： NPB hole transporting layer on the characteristics of organic light-emitting devices

A doping system consisting of NPB and PVK is employed as a composite hole transporting layer （CHTL）. By adjusting the component ratio of the doping system, a series of devices with different concentration proportion of PVK ： NPB are constracted. The result shows that doping concentration of NPB enhances the competence of hole transporting ability, and modifies the recombination region of charge as well as affects the surface morphology of doped film. Optimum device with a maximum brightness of 7852 cd/m^2 and a power efficiency of 1.75 lm/W has been obtained by choosing a concentration proportion of PVK ： NPB at 1：3.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.     

Analysis of error performance on Turbo coded FDPIM

Due to variable symbol length of digital pulse interval modulation（DPIM）, it is difficult to analyze the error performances of Turbo coded DPIM. To solve this problem, a fixed-length digital pulse interval modulation（FDPIM） method is provided. The FDPIM modulation structure is introduced. The packet error rates of uncoded FDPIM are analyzed and compared with that of DPIM. Bit error rates of Turbo coded FDPIM are simulated based on three kinds of analytical models under weak turbulence channel. The results show that packet error rate of uncoded FDPIM is inferior to that of uncoded DPIM. However, FDPIM is easy to be implemented and easy to be combined, with Turbo code for soft-decision because of its fixed length. Besides, the introduction of Turbo code in this modulation can decrease the average power about 10 dBm, which means that it can improve the error performance of the system effectively.     

A method for calculating the center position of collimated light

It is a key problem to accurately calculate beam spots＇ center of measuring the warp by using a collimated laser. A new method, named double geometrical center method （DGCM）, is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device （CCD） is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What＇s more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.