Cure kinetics of biphenyl epoxy resin system using latent catalysts

The investigation of the cure kinetics of a biphenyl epoxy–phenol resin system with different kinds of latent catalysts was performed by differential scanning calorimetry using an isothermal approach. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicated that the curing reaction of the biphenyl epoxy resin system in this experiment proceeded through an autocatalytic kinetic mechanism, irrespective of the kind of catalyst. The epoxy resin system with acid/diazabicycloundecene (DBU) salt as the latent catalyst showed a second overall reaction order; however, a third reaction order was represented for microencapsulated triphenylphosphine (TPP). The storage stability tests for these systems were performed, and a good shelf life was observed in the epoxy resin system with pyromellitic acid/DBU salt, trimellitic acid/DBU salt, and microencapsulated TPP as the latent catalyst. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 2711–2720, 2001     

Curing characteristics of epoxy resin systems that include a biphenyl moiety

The curing characteristics of epoxy resin systems that include a biphenyl moiety were investigated according to the change of curing agents. Their curing kinetics mainly depend on the type of hardener. An autocatalytic kinetic reaction occurs in epoxy resin systems with phenol novolac hardener, regardless of the kinds of epoxy resin and the epoxy resin systems using Xylok and DCPDP (dicyclopentadiene‐type phenol resin) curing agents following an nth‐order kinetic mechanism. The kinetic parameters of all epoxy resin systems were reported in terms of a generalized kinetic equation that considered the diffusion term. The fastest reaction conversion rate among the epoxy resin systems with a phenol novolac curing agent was obtained in the EOCN‐C epoxy resin system, and for systems with Xylok and DCPDP hardeners, the highest reaction rate values were obtained in NC‐3000P and EOCN‐C epoxy resin systems, respectively. The system constants in DiBenedetto's equation of each epoxy resin system with different curing agents were obtained, and their curing characteristics can be interpreted by the curing model using a curing agent as a spacer. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 1942–1952, 2002     

联苯酚醛环氧树脂固化动力学及热性能研究

以4,4'-二氨基二苯砜(DDS)为固化剂,采用非等温示差扫描量热法(DSC)研究了联苯酚醛环氧树脂(BPNE)的固化动力学。通过外推法确定了体系的固化工艺。采用Kissinger、Ozawa法计算出固化体系的表观活化能,根据Crane理论计算得到该体系的固化反应级数。采用DSC,热重分析(TGA)研究了固化物的耐热性。结果表明:BPNE的固化工艺为160℃/2h+200℃/2h+230℃/2h;固化反应的活化能约为61.86kJ/mol,指前因子为5.27×105min-1,反应级数为1.1;玻璃化转变温度(Tg)为167℃,其10%热失重温度为398.1℃,800℃残炭率为29.37%,与双酚A环氧树脂/DDS固化物相比,分别提高了22℃,11.71%。     

脂环族环氧树脂/酸酐体系固化促进剂的研究

利用示差扫描量热仪研究了乙酰丙酮铝、三苯基膦、2-乙基-4-甲基咪唑(2E4MZ)等3种促进剂在脂环族环氧树脂(UVR-6103)/甲基六氢邻苯二甲酸酐(MHHPA)体系中的固化行为,通过Ellerstien方程计算得到了UVR-6103/MHHPA体系在3种促进剂作用下的固化动力学参数,其表观活化能分别为48.6,69.2,90.2kJ/mol,反应级数分别为0.96,2.09和1.60。     

含杂萘联苯结构的环氧树脂固化动力学分析

采用差示扫描量热法（DSC）对含杂萘联苯结构环氧单体（3EPZ）与聚醚胺（ED-2003）的固化过程进行研究。采用Starink模型及自催化模型获得了不同转化率下体系的活化能及相关动力学参数,并建立了动力学方程。实验结果曲线与模型计算结果曲线的相关系数大于99%,表明所建立的自催化动力学模型能够较好地描述体系的固化过程。     

聚乙二醇接枝改性纳米炭黑对环氧树脂固化过程的影响

采用差示扫描量热法研究了以聚乙二醇(PEG)接枝改性的纳米炭黑(NC)(NC-PEG)为填料对环氧树脂/4,4-二氨基二苯砜非等温固化反应的影响,通过Flynn-Wall-Ozawa法和Malek法确定了固化反应的动力学参数.结果表明:两参数的自催化模型能够很好地描述环氧树脂及其复合材料的固化反应过程,各试样的模型拟合结果与实验数据相吻合.NC-PEG能够促进环氧树脂的固化,使固化活化能降低,其中,NC-PEG用量为3 phr时,活化能最低.     

桐马酸酐与环氧树脂的非等温固化反应动力学

采用Málek法对桐马酸酐与双酚A环氧树脂E-51体系(含有1%质量分数的DMP-30)的非等温固化反应动力学进行了研究。通过机理函数esták-Berggren方程很好地模拟了真实的固化反应过程。等转化率法求得反应活化能为69.78 kJ/mol。指前因子A的值为4.567×108 min-1,n和m的值分别为1.082和0.456。根据得到的固化动力学方程计算可知,在固化温度为137.05℃时达到98%固化度的固化时间为115 min。     

新型环氧树脂胶粘剂的固化动力学研究

在不同升温速率下采用非等温差示扫描量热（DSC）技术对一种新型改性环氧树脂胶粘剂的固化反应过程进行了跟踪,并利用Kissinger、crane方程以及Arrhenius方程对该固化反应进行了动力学分析。结果表明,该固化反应的活化能为59.18kJ／mol,反应级数为0．89;结合Dsc谱图确定其固化工艺为130℃／1h＋150℃／2h＋175℃／3h。     

Effect of amino-polycarbonate on the curing kinetics and morphology of epoxy resin

The curing kinetics and the glass transition behavior of amino-polycarbonate with diglycidyl ether of bisphenol-A epoxy resin systems were studied by differential scanning calorimetry (DSC). The ASTM E-698 method was chosen to determine the kinetics parameters of the curing reaction, including the activation energy, preexponential factor, rate constant, and 60-min half-life temperature. The amino-polycarbonate was able to accelerate the curing reaction, reduce the apparent active energy, and decrease T_g of the systems. A homogeneous amino-polycarbonate/epoxy resin network was observed in scanning electron microscopy (SEM) pictures. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 833–838, 2001     

Differential scanning calorimetric study of curing of acrylated epoxy resin with benzoyl peroxide

The curing reaction of the acrylated diglycidyl ether of bisphenol-A (DGEBA) with benzoyl peroxide has been investigated by differential scanning calorimetry at three different heating rates. The overall cure kinetics were found to be first-order, with Arrhenius parameters E=83 kJ mol^?1 and In A = 16.5 min^?1, independent of the scan rate, up to at least 90% conversion.     

New tetrafunctional epoxy resin system with increased shelf life

Chlorine‐ and methyl‐substituted aromatic diamines based on diaminodiphenylmethane were epoxidized and characterized. The effect of different substituents on epoxidation was studied. The cure studies of the two new tetrafunctional resins in comparison with unsubstituted resin N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM) was carried out by DSC with 3,3′‐dichloro‐4,4′diaminodiphenylmethane (o‐DCDDM; 30% w/w) as a common curing agent. The mechanical properties such as flexural, Izod impact, heat distortion temperature (HDT), of such cured neat resins were also studied. The results of the cure studies indicate that the substitution of the α‐hydrogen of the resin by chlorine or methyl group decreases the reactivity of the resin leading to an increase in the shelf life. This study also indicates that the functionality of the resin plays a pivotal role in the reactivity and thus the shelf life of an epoxy resin system. The results of the mechanical properties of the neat resin casts obtained by subjecting to a common cure schedule when compared with the unsubstituted resin showed a decrease in impact strength, which is obvious because of the presence of a bulky pendant group but the impact strength was higher than that of the TGOS30 resin system. Results of flexural strength of the different substituted neat resin casts did not show much of a deviation from that of the unsubstituted resin system. The HDT results indicate no significant difference in the values of the unsubstituted resin vis‐a‐vis with substituted resin systems. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 93: 2790–2801, 2004     

Kinetics of 4,4′-diaminodiphenylmethane curing of bisphenol-S epoxy resin

The kinetics of the cure reaction for a system of bisphenol-S epoxy resin (BPSER), with 4,4′-diaminodiphenylmethane (DDM) as a curing agent, were studied by means of differential scanning calorimetry (DSC). Analysis of DSC data indicated that an autocatalytic behavior showed in the first stages of the cure, with the model proposed by Kamal, which includes two rate constants, k₁ and k₂, and two reaction orders, m and n. Rate constants k₁ and k₂ were observed to be greater when curing temperature increased. The over-all reaction order, m + n, is in the range of 2.5 ∼ 3. The activation energies for k₁ and k₂ were 55 kJ/mol and 57 kJ/mol, respectively. Diffusion control is incorporated to describe the cure in the latter stages. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 1799–1803, 1999     

环氧树脂固化反应动力学研究及其活性增韧

采用动态DSC法跟踪环氧树脂E-51／固化剂5784体系的反应历程,确定固化温度,利用Kissinger方程和Crane方程对固化反应动力学进行分析,通过红外分析确定聚硫橡胶的增韧方式,研究不同聚硫橡胶用量列固化产物力学性能的影响,采用扫描电镜分析试样断口形貌。研究结果表明：该固化体系的动力学参数为表观活化能△E=63．946kJ／mol,指前因子Ak=1．90×10^5,反应能级n=0．91,聚硫橡胶增韧环氧树脂通过化学键合来实现,并且效果明显。     

2-甲基咪唑/环氧树脂体系的固化动力学研究

利用等温DSC法对E-51环氧树脂/2-甲基咪唑(2-MI)体系的固化动力学进行了研究,拟合得到n级固化模型、自催化模型及Kamal复合模型方程中的各个参数值,以确定固化模型。研究表明:E-51/2-MI体系的固化过程分为2个阶段,即诱发阶段和加成反应,其固化反应兼具n级固化与自催化的特征,符合Kamal复合模型。     

腰果酚缩醛胺与环氧树脂的固化反应动力学的研究

在不同升温速率下,用差示扫描量热分析(DSC)研究了腰果酚缩醛胺固化剂(PCD)与环氧树脂的固化反应动力学。通过Kissinger、Crane方程和等转化率的方法求得了其表观活化能E=39.89kJ/mol,固化反应级数n=0.906。     

聚双胍/环氧树脂体系潜伏性固化过程

用己二胺与双氰胺熔融缩聚, 合成了一种新型潜伏性环氧树脂固化剂, 并研究了其与环氧树脂的固化过程。用FTIR、XPS、¹H NMR分析了固化剂的结构;用DSC分析得到了固化剂与环氧树脂的适宜配比、固化体系的适宜固化温度及固化动力学参数;通过XRD分析了固化物的相结构;通过TG分析了固化物的热稳定性。结果表明, 与双氰胺环氧树脂固化体系相比, 固化温度降低近70℃, 同时潜伏性能良好, 30 d内固化度少于10%, 热稳定性能良好, 热分解温度超过300℃。     

The effect of brominated epoxy on epoxy/phenolic reactive blends

Innovative reactive blends containing epoxy and brominated epoxy (BE) incorporated with resole-type phenolic were studied with the aim to elucidate the curing kinetics and the final thermomechanical characteristics of this unique system. Curing kinetics was investigated by means of the activation energy determined using differential scanning calorimetry (DSC ) at various heating rates analyzed by the Arrhenius equation. Both DSC and Fourier transform infrared revealed that bromine elimination at elevated temperatures (above 220 °C) had lowered the activation energy in the case of BE containing phenolic blends. The thermomechanical properties showed that the addition of conventional epoxy to resole decreased its thermal properties and modulus compared to neat resole. Distinctively, BE/resole blends exhibited increased glass-transition temperature, compared to diglycidyl ether of bisphenol A/resole blends in combination with higher elongation and toughness compared to neat resole. It was concluded that BE/epoxy resin/phenolic reactive systems offer high T _g, mechanical properties and toughness and hence are applicable for structural adhesives and for matrices of polymer-fiber composites. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47172.     

Effect of surface area of nanosilica particles on the cure kinetics parameters of an epoxy resin system

Knowing of thermoset curing kinetics is essential for process development, quality control, and achieving desirable products. Hence, in this article, cure kinetics of an EPON 828 epoxy resin/dicyandiamide curing agent/diuron accelerator system is investigated. This resin system is usually used for the production of epoxy/glass fiber prepregs used in wind turbine blades. For this, differential scanning calorimetry analysis is used and the effect of temperature, weight percentage, and size of nanosilica is studied by conducting isothermal tests at several temperatures for samples with and without nanoparticles. An autocatalytic curing model is applied to describe the cure kinetic of system and then the variations in model parameters calculated by curve fitting using the MATLAB software. The results show that the increase in temperature, weight percentage of nanosilica from 0 to 6%, and surface area of nanosilica particles lead to the increase in curing rate, whereas the increase in the percentage and surface area of nanosilica particles significantly decreases total heat of reaction. At the end, the relation between each of model parameters and the total surface area of nanosilica particles, calculated by mathematical equations, is obtained. The allowable maximum surface area of nanosilica used in the mathematical equations is 12 m² g⁻¹. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47958.     

丁香酚环氧有机硅树脂的制备及其固化动力学研究

利用丁香酚环氧和环四硅氧烷硅氢加成得到新型生物基环氧树脂D4EUEP,通过核磁共振氢谱和飞行时间质谱表征其准确结构。使用非等温DSC对D4EUEP/33DDS固化体系进行分析,采用双参数自催化模型和Málek判据建立了该体系固化动力学模型。模型计算结果与实验结果相关系数大于99%,证明该模型可以较好地描述D4EUEP/33DDS体系的固化过程。通过AICM方法研究了体系的有效活化能与转化率之间的关系,揭示了微观反应机理的变化,并通过Vyazovkin法对D4EUEP/33DDS体系进行了等温固化预测。     

催化剂对环氧树脂/酚类固化剂体系反应性的影响

采用三氟甲磺酸铒和三氟甲磺酸镱作为环氧树脂/酚类固化剂的催化剂,筛选了固化剂的最佳用量,采用胶化时间研究了催化剂的催化活性,并采用差热分析法对环氧树脂/酚类固化剂/三氟甲磺酸铒动力学参数进行了研究。结果表明,酚类固化剂的最佳质量分数为9%(以环氧树脂计),三氟甲磺酸铒的催化活性最强,环氧树脂/酚类固化剂/三氟甲磺酸铒体系的活化能为79.53 kJ/mol,反应级数为0.95。