Managing technology CAD for competitive advantage: an efficientapproach for integrated circuit fabrication technology development

This paper describes a methodology to exploit the full capabilities of technology computer-aided design (TCAD) for the development of integrated circuit fabrication processes. The development process of integrated circuits is represented by a simple model that describes the technology specifications at the beginning and the product specifications at the end of the product development cycle. Considering this model, different intermediate tasks are defined to obtain initial guess process recipe from the target product specifications. The complete technology development is shown to be achieved using TCAD in three different phases such as the generation of initial guess process recipe, the optimization of process technology, and the evaluation of process manufacturability. A simple quantitative analysis to estimate the major advantages of TCAD in reducing the cycle time and cost of technology development is presented. The technical limitations of TCAD and the measures to address these limitations are discussed. The organizational and social issues of the implementation of TCAD and the managerial responsibilities in adopting TCAD for the development of integrated-circuit fabrication process are also discussed     

Test device structures for integrated circuit design,process technology development and evaluation

In the present paper, mask contours of npn transistors, pnp lateral transistors, diffused and pinch resistors, bridge and Greek cross sheet resistors, metal to doped silicon region contact resistors, parasitic pnp transistors, test diodes and alignment marks have been drawn (500 ×) for the development and testing of integrated circuit design and technology.The layout design of devices is based on 10 μm design rules with defined minimum dimensions and clearances in order to avoid the failure of the circuit due to technological inaccuracies. Devices could be easily designed, fabricated and performance evaluated in a fairly good R & D set-up having semiconductor device fabrication facilities.     

An integrated micro cooling system for electronic circuits

A fully FR4-compatible integrated cooling system has been developed. Cooling channels have been etched into a thick copper layer to form microchannels. The structure is reinforced by two prepreg layers toward the component and solder side. Several cooling channels can be independently run. The heat dissipation capability of the system is 20 W per channel (and heat source). Typical coolants are water or methoxynonafluorobutane. For an outlet to inlet temperature difference of 25°C and a power dissipation of 30 W, a (water) flow rate of 20 ml/min is required. Pressure losses are below 300 mbar (for water)     

An integrated robot system architecture

This paper describes the architecture of a robot system designed both to work in an integrated manufacturing environment and to support continuing research in programmable automation. Major system components include a controller, robot and sensor hardware, operator's pendant, and system software. A new high-level interactive language, AML, allows the user to combine manipulation, sensing, computational, and data processing functions provided by the system. Important aspects of the system design objectives, major functional components, and the AML language are described, and examples drawn from an actual production application are used to illustrate the interrelationship of the topics discussed.     

系统集成中的高阻硅IPD技术

集成无源器件(IPD)技术可以将分立的无源器件集成在衬底内部,提高器件Q值及系统集成度。由于高阻硅衬底具有良好的射频特性,高阻硅IPD技术可以制备出Q值高达70以上的电感。高阻硅IPD基于薄膜技术具有高精度、高集成度等特点,可将无源器件特征尺寸缩小一个数量级。同时可利用成熟的硅工艺平台,便于批量生产降低成本。此外,高阻硅IPD技术可与硅通孔(TSV)技术兼容,可实现三维叠层封装。分析表明,高阻硅IPD技术在系统集成中具有广泛应用前景。     

视频分享网站系统综合技术解决方案

今天,互联网越来越普及,互联网技术也在日新月异的变化,简单的、宣传栏式的网站,已越来越不能满足客户的要求,以及我们发展的需要,工欲成其事,必先利其器！建立充分反映视频分享网站是非常必要的。伴着新网站的建设与开通,我们有理由相信明天一定会更辉煌！     

An integrated error correction and detection system for digitalaudio broadcasting

Hybrid in-band on-channel digital audio broadcasting systems deliver digital audio signals in such a way that is backward compatible with existing analog FM transmission. We present a channel error correction and detection system that is well-suited for use with audio source coders, such as the so-called perceptual audio coder (PAC), that have error concealment/mitigation capabilities. Such error mitigation is quite beneficial for high quality audio signals. The proposed system involves an outer cyclic redundancy check (CRC) code that is concatenated with an inner convolutional code. The outer CRC code is used for error detection, providing flags to trigger the error mitigation routines of the audio decoder. The inner convolutional code consists of so-called complementary punctured-pair convolutional codes, which are specifically tailored to combat the unique adjacent channel interference characteristics of the FM band. We introduce a novel decoding method based on the so-called list Viterbi algorithm (LVA). This LVA-based decoding method, which may be viewed as a type of joint or integrated error correction and detection, exploits the concatenated structure of the channel code to provide enhanced decoding performance relative to decoding methods based on the conventional Viterbi algorithm (VA). We also present results of informal listening tests and other simulations on the Gaussian channel. These results include the preferred length of the outer CRC code for 96-kb/s audio coding and demonstrate that LVA-based decoding can significantly reduce the error flag rate relative to conventional VA-based decoding, resulting in dramatically improved decoded audio quality. Finally, we propose a number of methods for screening undetected errors in the audio domain     

An integrated content and metadata based retrieval system for art

A new approach to image retrieval is presented in the domain of museum and gallery image collections. Specialist algorithms, developed to address specific retrieval tasks, are combined with more conventional content and metadata retrieval approaches, and implemented within a distributed architecture to provide cross-collection searching and navigation in a seamless way. External systems can access the different collections using interoperability protocols and open standards, which were extended to accommodate content based as well as text based retrieval paradigms. After a brief overview of the complete system, we describe the novel design and evaluation of some of the specialist image analysis algorithms including a method for image retrieval based on sub-image queries, retrievals based on very low quality images and retrieval using canvas crack patterns. We show how effective retrieval results can be achieved by real end-users consisting of major museums and galleries, accessing the distributed but integrated digital collections.     

An integrated system for prediction and analysis of solderinterconnection shapes

In this paper, an integrated system [predicting solder interconnection shapes (PSIS)] is built to predict and analyze the shape of solder interconnections in electronic packaging. The purposes are to numerically simulate the formation of solder joints, analyze the shape of solder joints and its influential factors and provide an efficient tool for design and manufacturing engineers to improve the integrity of solder interconnections. The formation of solder joints is numerically simulated through a surface evolver program and the calculation is automated with an additional controller. A datafile generator is developed in which the potential energies, geometry of the conjunction and boundary conditions of the initial solder joint can be generated visually and transferred into evolver syntax automatically. A post processor is built to analyze the global three-dimensional (3-D) shape and cross section profiles of solder fillets. Also, the applications for solder interconnection shape prediction of chip component (RC3216) are conducted with this system     

An integrated automatic design system for complex DSP algorithms

An integrated design environment for the automated design of DSP systems is described. The overall design time of complex DSP systems on silicon can be reduced drastically by offering the designer a complete silicon compilation environment, integrating architectural level synthesis tools, a module generator and a floorplanner. The system is supported by a flexible and powerful library. A true exploration of the design space in an interactive way is possible. Examples of the first complex chips that have been designed with this system are discussed.     

舰载综合射频系统关键技术分析

针对现有海军舰艇存在的天线拥挤、电磁干扰严重和电磁隐身等问题,先进的舰载多功能综合射频系统是未来的发展方向。根据国外舰载综合射频系统的发展状况,分析了综合射频系统的组成及工作原理。舰载综合射频系统的功能利用软件定义,相对于传统的舰载射频系统具有相应的优点。最后,对舰载综合射频系统的关键技术进行了分析。为未来海军发展舰载多功能射频系统的实现提供技术支持。     

PHM技术在综合航空电子系统中的应用

从某种角度上说,PHM技术并不是本世纪的新技术与新概念.PHM技术说到底是对监测检查系统的升华与独立,这是随着综合航空系统电子系统发展所产生的必然,也是未来航空电子系统中的重点.PHM技术也是我国军事航空中的重点研发项目,对其在综合航空电子系统中的应用的分析,有着重要意义.     

基于砷化镓工艺的集成式功分器

A compact lumped integrated power divider with low insertion loss using 0.5 μm GaAs pHEMT technology is presented. The proposed power divider uses the π-type LC network for transmission line equivalence and a thin film resistor for isolation tuning simultaneously. The quality factor of the inductor is analyzed and synthesized for insertion-loss influence. The measured insertion loss is less than 0.5 dB when the operating frequency is within the range of 5.15-6.15 GHz. The return loss and isolation are better than 15 dB and 20 dB, respectively. The compact dimension of the power divider is as small as 0.9 × 0.85 mm^2. The measured results agree well with the simulated ones.     

仿真技术在半导体和集成电路生产流程优化中的应用

半导体和集成电路制造是一个流程高度复杂,资金高度密集的加工过程。集成电路制造的特殊性表现在产品工序的繁多,对设备的高利用率要求,和“再进入”(Re-entry)的流程特点。这种特殊的工艺流程特点决定了半导体集成电路工序中的排队优化选择策略比其他制造行业更为复杂,对生产效率和制造周期有更直接的影响。本文通过EXTEND仿真软件对英特尔的一个微型晶圆试验台进行初步研究,来说明计算机仿真手段在半导体集成电路生产流程优化中的作用。     

应用于毫米波无线接收系统的高集成化LTCC AIP设计

介绍了一种基于低温共烧陶瓷工艺的新型高度集成毫米波无源接收前端, 该前端由阵列天线、馈电网络和带通滤波器构成.上述无源器件以天线集成封装方式经过一体化设计, 并应用于毫米波无线系统.首先, 设计了2×2线极化空气腔阵列天线, 通过采用新颖的内埋空气腔体结构, 使天线最大增益提高了2.9 dB.其次, 将具有双层谐振结构的三阶小型化发卡型带通滤波器和天线馈电网络进行一体化设计.该滤波器测试结果显示:插入损耗为1.9 dB, 3 dB相对带宽为8.1%(中心频率为34 GHz).最后将上述天线和滤波网络进行一体化设计, 实现了三维无线接收前端.在集成结构中, 通过采用金属柱栅栏抑制了寄生模式.测试结果显示天线最大增益可达14.3dB, 通过集成滤波馈电网络, 其阻抗带宽为2.8 GHz.该新型一体化集成前端系统具有良好的射频性能, 可作为全集成无源前端应用于Ka波段无线系统中.     

应用于毫米波无线接收系统的高集成化LTCC AIP设计

介绍了一种基于低温共烧陶瓷工艺的新型高度集成毫米波无源接收前端,该前端由阵列天线、馈电网络和带通滤波器构成.上述无源器件以天线集成封装方式经过一体化设计,并应用于毫米波无线系统.首先,设计了2×2线极化空气腔阵列天线,通过采用新颖的内埋空气腔体结构,使天线最大增益提高了2.9 dB.其次,将具有双层谐振结构的三阶小型化发卡型带通滤波器和天线馈电网络进行一体化设计.该滤波器测试结果显示:插入损耗为1.9dB,3 dB相对带宽为8.1％(中心频率为34 GHz).最后将上述天线和滤波网络进行一体化设计,实现了三维无线接收前端.在集成结构中,通过采用金属柱栅栏抑制了寄生模式.测试结果显示天线最大增益可达14.3dB,通过集成滤波馈电网络,其阻抗带宽为2.8 GHz.该新型一体化集成前端系统具有良好的射频性能,可作为全集成无源前端应用于Ka波段无线系统中.     

CORBA 技术在传输网网络管理系统中的应用

文章介绍了公用对象请求代理体系结构(CORBA)及其技术特色，分析了传输网网络管理系统(NMS)的功能要求，讨论了CORBA技术在传输网统一NMS中的应用．