High-performance ZnO thin film transistors with sputtering SiO2/Ta2O5/SiO2 multilayer gate dielectric

A high-performance ZnO thin film transistor （ZnO-TFT） with SiO₂/Ta₂O₅/SiO₂ (STS) multilayer gate insulator is fabricated by sputtering at room temperature. Compared to ZnO-TFTs with sputtering SiO₂ gate insulator, its electrical characteristics are significantly improved, such as the field effect mobility enhanced from 11.2 to 52.4 cm²/V s, threshold voltage decreased from 4.2 to 2 V, and sub-threshold swing improved from 0.61 to 0.28 V/dec. The improvements are attributed to the high gate capacitance (from 50 to 150 nF/cm²) as well as nice surface morphology by using dielectric with high～k Ta₂O₅ sandwiched by SiO₂ layers. The capacitance-voltage characteristic of a metal-insulator-semiconductor capacitor with the structure of Indium Tin Oxide/STS/ZnO/Al was investigated and the trap charges at the interface or bulk is evaluated to be 2.24 × 10¹² cm⁻². From the slope of C⁻² versus gate voltage, the doping density N_D of ZnO is estimated to be 1.49 × 10¹⁶ cm⁻³.     

Copper phthalocyanine thin-film field-effect transistor with SiO2/Ta2O5/SiO2 multilayer insulator

Top-contact Copper phthalocyanine (CuPc) thin-film field-effect transistor (TFT) with SiO₂/Ta₂O₅/SiO₂ (STS) multilayer as the dielectric was fabricated and investigated. With the multi-layer dielectric, drive voltage was remarkably reduced. A relatively large on-current of 1.1 × 10⁻⁷ A at a V_GS of −15 V was obtained due to the strong coupling capability provided by the STS multilayer gate insulator. The device shows a moderate performance: saturation mobility of μ_sat = 6.12 × 10⁻⁴ cm²/V s, on-current to off-current ratio of I_on/I_off = 1.1 × 10³, threshold voltage of V_TH = −3.2 V and sub-threshold swing SS = 1.6 V/dec. Atomic force microscope images show that the STS multilayer has a relative smooth surface. Experiment results indicate that STS multilayer is a promising insulator for the low drive voltage CuPc-based TFTs.     

Nd-substituted SrBi2Ta2O9 ferroelectric thin films prepared by radio frequency magnetron sputtering

Nd-substituted SrBi₂Ta₂O₉ (SNBT) thin films are sputtered on Pt/Ta/SiO₂/Si substrates. X-ray diffraction and x-ray photoelectron spectroscopy studies indicate that Nd³⁺ is substituted into the bismuth layered perovskite structure, preferentially at the Sr²⁺ site. The annealed thin film is polycrystalline with plate/needle-like grain microstructure. Secondary ion mass spectrometry results show that elements in SNBT thin film homogeneously distribute along film depth and interfacial diffusion takes place during post annealing. The Nd substitution leads to enhanced remnant polarization (2P_r = 18 μC/cm²) and reduced coercivity (2E_c = 64 kV/cm) at 180 kV/cm measured at 25 °C. After 10¹⁰ switching cycles, around 9% remnant polarization is decreased.     

Electrical properties of Ta2O5 thin films deposited on Cu

The electrical and dielectric properties of reactively sputtered Ta₂O₅ thin films with Cu as the top and bottom electrodes forming a simple metal insulator metal (MIM) structure, Cu/Ta₂O₅/Cu/n-Si, were studied. Ta₂O₅ films subjected to rapid thermal annealing (RTA) at 800°C for 30 s in N₂ ambient crystallized the film, decreased the leakage current density and resulted in reliable time-dependent dielectric breakdown characteristics. The conduction mechanism at low electric fields (<100 kV/cm) is due to Ohmic conduction; however, the Schottky mechanism becomes predominant at high fields (>100 kV/cm). Present studies demonstrate the use of Cu as a potential electrode material to replace the conventional precious metal electrodes for Ta₂O₅ storage capacitors.     

Dielectric properties of DC reactive magnetron sputtered Al2O3 thin films

Alumina (Al₂O₃) thin films were sputter deposited over well-cleaned glass and Si < 100 > substrates by DC reactive magnetron sputtering under various oxygen gas pressures and sputtering powers. The composition of the films was analyzed by X-ray photoelectron spectroscopy and an optimal O/Al atomic ratio of 1.59 was obtained at a reactive gas pressure of 0.03 Pa and sputtering power of 70 W. X-ray diffraction results revealed that the films were amorphous until 550 °C. The surface morphology of the films was studied using scanning electron microscopy and the as-deposited films were found to be smooth. The topography of the as-deposited and annealed films was analyzed by atomic force microscopy and a progressive increase in the rms roughness of the films from 3.2 nm to 4.53 nm was also observed with increase in the annealing temperature. Al-Al₂O₃-Al thin film capacitors were then fabricated on glass substrates to study the effect of temperature and frequency on the dielectric property of the films. Temperature coefficient of capacitance, AC conductivity and activation energy were determined and the results are discussed.     

Formation process of Al2O3 thin film by reactive sputtering

Al and Al₂O₃ films were deposited by RF magnetron sputtering using a mixed gas of Ar and O₂. The surface of the Al target was changed from the metallic mode to the oxide mode at a critical O₂ flow ratio of 8%. The atomic ratio of sputtered Al atoms to supplied oxygen atoms was found to be approximately 2:3 at the critical O₂ flow ratio. The oxide layer thickness formed on the Al target was estimated to be 5-7 nm at an O₂ flow ratio of 100% by ellipsometry.     

Switching properties of vanadium doped TiO2 thin films prepared by magnetron sputtering

In the present work thin films of Ti-Me (where Me: V, Nb, Ta) were deposited onto glass substrates by magnetron sputtering of mosaic target in reactive oxygen plasma. The properties of the prepared thin films were studied by X-ray diffraction (XRD), electron dispersive spectroscopy, temperature-dependent electrical and optical transmission spectroscopy measurements. The structural investigations indicate that thin films were XRD-amorphous. Reversible thermoresistance effect, recorded at 52 ± 1 °C was found from electrical measurements. The prepared coatings were well transparent in the visible part of the light spectrum from ca. 350 nm.     

Evaluation of ion conductivity of ZrO2 thin films prepared by reactive sputtering in O2, H2O, and H2O + H2O2 mixed gas

Hydrated ZrO₂ thin films were prepared by reactive sputtering in O₂, H₂O, and H₂O + H₂O₂ mixed gas, and the effect of the sputtering atmosphere on ion conductivity of the films was investigated. The results showed that the films deposited in O₂ gas exhibited poor ion conductivity; however, the ion conductivities of the films deposited in the other two kinds of atmosphere were similar and 300-500 times higher than that of the films deposited in O₂ gas. It was indicated that the higher ion conductivity of the films was caused by lower film density and higher water content.     

Electrical characterization of Ta2O5 films deposited by laser reactive ablation of metallic Ta

Tantalum oxide films have been deposited by 355 nm pulsed laser ablation of metallic Ta target in O₃/O₂ ambient. The structure and the composition of as-deposited and annealed films were examined by X-ray diffraction and Fourier transform infrared spectroscopy. The measurements of the current–voltage and capacitance–voltage characteristics of the Al/Ta₂O₅/Si capacitors were performed to reveal the electrical properties of the Ta₂O₅ films. The effects of annealing temperature on the characteristics of thin films have been studied. The results suggest that the films annealed above 700°C have the structure of orthorhombic β-Ta₂O₅, thc annealing treatment at high temperature decreases the bulk trap charge, the border trap, and the interface trap densities of as-deposited films, and improves significantly the dielectric and electrical properties of Ta₂O₅ film.     

Hydrophilic properties of nano-TiO2 thin films deposited by RF magnetron sputtering

Microstructure and hydrophilicity of nano-titanium dioxide (TiO₂) thin films, deposited by radio frequency magnetron sputtering, annealed at different temperatures, were studied by field emission scanning electron microscopy (SEM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and water contact angle methods. It is found that the crystal phase transforms from amorphous to rutile structure with increase of annealing temperature from room temperature to 800 °C. It is also indicated that the organic contaminants on the surface of the films can be removed and the oxygen vacancies can be reduced by the annealing treatment. Annealed at the temperature below 300 °C, amorphous TiO₂ thin films show rather poor hydrophilicity, and annealed at the temperature range from 400 to 650 °C, the super hydrophilicity anatase of TiO₂ thin films can be observed. However, when the annealing temperature reaches 800 °C, the hydrophilicity of the films declines mainly derived from the appearance of rutile.     

Photocatalytic Zn-doped TiO2 films prepared by DC reactive magnetron sputtering

Zn-doped TiO₂ films were prepared by means of pulsed DC reactive magnetron sputtering method using Ti and Zn mixed target. The deposition condition was optimized to produce uniform and transparent TiO₂ films. Titanium was in the Ti⁴⁺ oxidation state in all Zn-doped TiO₂ films. The zinc oxide deposited on the substrate was in the fully oxidized state of ZnO. Increase of zinc concentration inhibited the crystal growth in the TiO₂ films. The surface morphology gradually changed from crystalline to amorphous along with the increase of doped zinc concentration. The optical transmittances of these films decreased only slightly with increasing zinc concentration due to very similar band edges of ZnO and anatase TiO₂. The doped ZnO had weak influence on light absorption of the TiO₂ films. When zinc concentration was very low (<1 at%), the photocatalytic activities of the doped films had nearly no difference from that of pure TiO₂ film. Photocatalytic activities decreased obviously in the films containing high amount of zinc oxide.     

Control of electrical resistivity of TaN thin films by reactive sputtering for embedded passive resistors

Tantalum nitride thin films were deposited by radio frequency (RF) reactive sputtering at various N₂/Ar gas flow ratios and working pressures to examine the change of their electrical resistivity. From the X-ray diffraction (XRD) and four-point probe sheet resistance measurements of the TaN_x films, it was found that the change of the crystalline structures of the TaN_x films as a function of the N₂ partial pressure caused an abrupt change of the electrical resistivity. When the hexagonal structure TaN thin films changed to an f.c.c. structure, the sheet resistance increased from 16 Ω/sq to 1396 Ω/sq. However, we were able to control the electrical resistivity of the TaN thin film in the range from 69 Ω/sq to 875 Ω/sq, with no change in crystalline structure, within a certain range of working pressures. The size of the grains in the scanning electron microscopy (SEM) images seemed to decrease with the increase of working pressure.     

Characterization and photocatalytic activity of TiO2 thin films prepared by RF magnetron sputtering

TiO₂ nano-structured thin films were prepared by RF magnetron sputtering and annealed in ambient air for 1 h at 400, 600, 800, 1000, and 1200 °C, respectively. Their phase structure, surface topography, and energy gap were characterized by X-ray diffractometer, atomic force microscope, and fluorescence spectrometer. Photocatalytic activity of the films was evaluated by light induced degradation of methyl orange (C₁₄H₁₄N₃NaO₃S) solution using a high pressure mercury lamp as lamp-house. The relation of photocatalytic activity and annealed temperature was studied in detail. It is found that the crystal phase transforms from amorphous to anatase, and rutile structure with annealing temperature increasing from room temperature to 1200 °C. Energy gap varies with annealing temperature. Photocatalytic activity is dependent on energy gap and grain size. Suitable energy gap from 2.97 to 3.07 eV is favorable for creation of electronic-hole pairs that make the films show excellent photocatalytic activity.     

Stability and effect of annealing on the optical properties of plasma-deposited Ta2O5 and Nb2O5 films

Tantalum and niobium oxide optical thin films were prepared at room temperature by plasma-enhanced chemical vapor deposition using tantalum and niobium pentaethoxide (M(OC₂H₅)₅) precursors. We studied the evolution of their optical and microstructural properties as a result of annealing over a broad temperature range from room temperature up to 900 °C. The as-deposited films were amorphous; their refractive index, n, and extinction coefficient, k, at 550 nm were n = 2.13 and k < 10^− 4 for Ta₂O₅, and n = 2.24 and k < 10^− 4 for Nb₂O₅. The films contained a small amount of residual carbon (∼ 2-6 at.%) bonded mostly to oxygen. During annealing, the onset of crystallization was observed at approximately T_C1 = 650 °C for Ta₂O₅ and at T_C1 = 450 °C for Nb₂O₅. Upon annealing close to T₁ (300 °C for Nb₂O₅ and 400 °C for Ta₂O₅), n at 550 nm decreased by less than 1%. This was correlated with the decrease of carbon content, as suggested by Fourier transform infrared spectroscopy, elastic recoil detection and static secondary ion mass spectroscopy (SIMS) results. During annealing, we observed phase transition from the δ- (hexagonal) phase to the L- (orthorhombic) phase between 800 °C and 900 °C for Ta₂O₅, and between 600 °C and 700 °C for Nb₂O₅. The structural changes were also marked by silicon diffusion from the substrate into the oxide layer at annealing temperatures above 500 °C for Ta₂O₅ and above 400 °C for Nb₂O₅. As a consequence of oxygen, silicon and metal interdiffusion, the interface between the Si substrate and the metal oxide (Ta₂O₅ or Nb₂O₅) is characterized by its broadening, well documented by spectroscopic ellipsometry and SIMS data.     

Properties of zirconia thin films prepared by reactive magnetron sputtering

The search for alternative dielectric materials with high dielectric constant, thermodynamic stable on silicon substrate and low direct tunneling current leads to oxide based materials like zirconia. Zirconia thin films were prepared by reactive magnetron sputtering. The capacitance voltage, ac and dc electrical characteristics were investigated and the values like fixed oxide charges were calculated and compared among the samples with and without annealing. Films annealed at 700 °C showed a dielectric constant ∼ 26 with interface trap densities of 1.629 × 10¹² eV^− 1 cm^− 2.     

Tantalum pentoxide (Ta2O5) thin films for advanced dielectric applications

This paper reviews the present knowledge on tantalum pentoxide (Ta₂O₅) thin films and their applications in the field of microelectronics and integrated microtechnologies. Different methods used to produce tantalum oxide layers are described, emphazing elaboration mechanisms and key parameters for each technique. We also review recent advances in the deposition of Ta₂O₅ in the particular field of microelectronics where high quality layers are required from the structural and electrical points of view. The physical, structural, optical, chemical and electrical properties of tantalum oxide thin films on semiconductors are then presented and essential film parameters, such as optical index, film density or dielectric permittivity, are discussed. After a reminder of the basic mechanisms that control the bulk electrical conduction in insulating films, we carefully examine the origin of leakage currents in Ta₂O₅ and present the state-of-the-art concerning the insulating behaviour of tantalum oxide layers. Finally, applications of tantalum oxide thin films are presented in the last part of this paper. We show how Ta₂O₅ has been employed as an antireflection coating, insulating layer, gate oxide, corrosion resistant material, and sensitive layer in a wide variety of components, circuits and sensors.     

Crystallization behavior of Nd-doped SrBi2Ta2O9 thin films prepared by magnetron sputtering

Nd-doped SrBi₂Ta₂O₉ thin films are magnetron-sputtered on Pt/Ta/SiO₂/Si substrates. The effect of heating rate on crystallization behavior is investigated with conventional furnace annealing (CFA) and rapid thermal annealing (RTA). Grazing incidence X-ray diffraction and field emission scanning electron microscopy reveal that the crystallization goes through three stages (phases): amorphous, fluorite and finally Aurivillius. Under RTA, the fluorite-to-Aurivillius transformation starts around 100 °C lower than that under CFA. The reasons behind the transformation temperature drop are also discussed.     

Conductivity of nanometer TiO2 thin films by magnetron sputtering

The conductivity of nanometer TiO₂ thin films was presented in this paper. The dependence of the conductivity of TiO₂ thin films on the thickness of the film and the substrate material were educed. The TiO₂ films were deposited by reactive magnetron sputtering of a Ti targets in an Ar+O₂ mixture in a conventional sputtering reactor. The thickness of the films deposited on Ti varied in the range from 15 to 225 nm. The resistivity of the films was measured at room temperature in the air. It was found that the conductivity of TiO₂ thin films varies in the range from conductor, semiconductor to nonconductor. This was attributed to electrons transfer at the interface between the TiO₂ and substrates, and the depth of electrons transfer was determined by the difference of work function.     

Comparison of hydrophilic properties of TiO2 thin films prepared by sol-gel method and reactive magnetron sputtering system

This article reports on preparation, characterization and comparison of TiO₂ films prepared by sol-gel method using the titanium isopropoxide sol (TiO₂ coating sol 3%) as solvent precursor and reactive magnetron sputtering from substoichiometric TiO_2 − x targets of 50 mm in diameter. Dual magnetron supplied by dc bipolar pulsed power source was used for reactive magnetron sputtering. Depositions were performed on unheated glass substrates. Comparison of photocatalytic properties was based on measurements of hydrophilicity, i.e. evaluation of water contact angle on the film surface after UV irradiation. It is shown, that TiO₂ films prepared by the sol-gel method exhibited higher hydrophilicity in the as-deposited state but has significant deterioration of hydrophilicity during aging, compared to TiO₂ films prepared by magnetron sputtering. To explain this effect AFM, SEM and high resolution XPS measurements were performed. It is shown that the deterioration of hydrophilicity of sol-gel TiO₂ films can be suppressed if as-deposited films are exposed to the plasma of microwave oxygen discharge.     

Cu2O thin films deposited by reactive direct current magnetron sputtering

The Cu₂O thin films were prepared on quartz substrate by reactive direct current magnetron sputtering. The influences of oxygen partial pressure and gas flow rate on the structures and properties of deposited films were investigated. Varying oxygen partial pressure leads to the synthesis of Cu₂O, Cu₄O₃ and CuO with different microstructures. At a constant oxygen partial pressure of 6.6 × 10^− 2 Pa, the single Cu₂O films can be obtained when the gas flow rate is below 80 sccm. The as-deposited Cu₂O thin films have a very high absorption in the visible region resulting in the visible-light induced photocatalytic activity.