Thermal conductivity of gypsum boards beyond dehydration temperature

The thermal conductivity of gypsum plasterboard at temperatures beyond its dehydration/calcination temperature is, besides the effective heat capacity, the main parameter defining the increase in heat transfer when the board is submitted on one side to a strongly transient temperature boundary condition. The present study investigates the significant rise in thermal conductivity of dehydrated gypsum plaster board between 200 and 800 °C, reaching the initial hydrated value of 0.3 W/(m·K). It is shown that the main reason for this increase is independent of radiative and convective heat transfers and only due to an enhancement of the conduction between the single crystals induced by an effect similar to sintering. Copyright © 2014 John Wiley & Sons, Ltd.     

Thermal strain of high strength polyethylene fiber in low temperature

High strength polyethylene fiber (Toyobo, Dyneema® fiber: hereinafter abbreviated to DF) has a negative thermal expansion coefficient. Relation between fiber structure and thermal strain of DF used as reinforcement of DF reinforced plastic (DFRP) for cryogenic use was investigated. The crystallinities and orientation angles of several kinds of polyethylene fibers having different modulus from 15 to 134Gpa (herein after abbreviated to DFs) were measured by NMR and X‐ray. We obtained the parameters of the mechanical series‐parallel model composed of crystal and amorphous by crystallinity and modulus. Thermal expansion coefficients of DFs were estimated by mechanical series‐parallel model. All DFs having different modulus showed negative thermal expansion coefficients in the temperature range from 180 to 300K, and absolute values of those markedly increased by increasing tensile modulus of DF. The estimated thermal expansion coefficients showed negative values, and thermal strains showed a similar curve to observed ones mostly. Average thermal expansion coefficients in the temperature range from 180 to 300K estimated by mechanical model agreed with the observed ones. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 93: 2918–2925, 2004     

Highly porous nano-SiC with very low thermal conductivity and excellent high temperature behavior

Highly porous nano-SiC is fabricated by partial sintering and decarburizing process using SiC nano-powders as starting materials and graphite flakes as pore forming agents. The prepared porous nano-SiC ceramics possess multiple pore structures, including well-distributed meso-pores in the skeleton and interconnected flakelike micro-pores. The samples prepared at 1800 °C have relatively low thermal conductivities of 5.61 ～ 0.25 W m^?1 K^?1 with porosities of 55.5–76.1%. While the samples sintered at 1500 °C with porosities between 54.0% to 76.3% show very low thermal conductivities of 0.74 ～ 0.14 W m^?1 K^?1, which is attributed to the integrated nano-scale phonon-scattering mechanisms and duplex pore structures. Porous nano-SiC ceramics also show good retention of elastic stiffness up to 1350 °C and low thermal conductivity at 1400 °C. Our results shed light on porous nano-SiC as a promising thermal insulator used in extreme thermal and chemical environments.     

液相己二酸二乙酯热导率

己二酸二乙酯是有机合成重要的溶剂和中间体,也在日用化学工业和食品工业,如香料、增塑剂等方面应用广泛。近年来,含氧燃料如己二酸二乙酯可以改善油品性能和降低柴油机排放,被认为是良好的柴油添加剂和替代燃料。然而到目前为止,对己二酸二乙酯的热物性研究相对不足。利用钽丝作为热线的瞬态双热线系统对温度区间为283～383K、压力区间为0.1～30MPa的液相己二酸二乙酯热导率进行了实验研究,并将实验数据拟合为温度和压力的关联式。实验数据与热导率关联式计算结果的标准偏差和最大偏差分别为0.14%和0.43%,热导率的标准合成不确定度为±1.0%。     

碳酸二甲酯液相热导率

利用瞬态单热线法重新研制了一套可耐高压的热导率测量装置,热导率测量的不确定度为±2%。用推荐物质甲苯对该装置在286～350 K的温度范围内进行了检验,得到的结果与甲苯热导率推荐值的绝对平均偏差为0.48%。用该装置对温度区间为290～390 K、压力区间为0.1～30 MPa的碳酸二甲酯(DMC)的热导率进行了实验研究,并将实验数据拟合成关于温度和压力的热导率方程,实验数据与拟合方程计算值的最大偏差为-1.97%,绝对平均偏差为0.86%。     

Thermal conductivity and diffusivity of carbon-reinforced polyetherketoneketone composites

Heat transfer properties play an important role in processing of polyetherketoneketone (PEKK)/carbon fiber (CF) composites. Accordingly, thermal conductivity and diffusivity of PEKK, PEKK/glassy carbon (GC), and PEKK/CF composites have been studied. Observed increase in conductivity and diffusivity with carbon filler addition was analyzed using the Maxwell–Eucken model. PEKK/GC composites with low carbon fraction indicated good fitting experimental points of the model, indicating good dispersion of particles. For PEKK/CF composites, the thermal conductivity and diffusivity increase is a reflection of a decrease in porosity. Results as observed from the model points to a homogenous dispersion within the PEKK/CF composites as well. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47975.     

热力系统锅炉水相电导率温度响应参数的解析

为了探讨离子在实际锅炉水相与取样水之间迁移转化规律的异同,找出适用于锅炉水相电导率较精确的还原方法.选取不同的Na2PO4、NaOH、Na2HPO4配比的水溶液模拟六种典型工况下的锅炉水相,跟踪测试了系统在20～70℃(△T=5℃)范围内电导率随温度变化.求出了各水相的电导温度系数和电导活化能.实验及计算结果表明:(1)各水相电导温度系数存在明显差别;(2)锅炉水相的电导温度系数取各离子浓度和电导温度系数乘积的加权平均值较为准确;(3)电导活化能是反映炉水中离子迁移和反应能力的一个重要的表征指标.     

Thermal conductivity of high density polyethylene filled with graphite

The effect of the grade, the content, and the particle diameter on the thermal conductivity of high‐density polyethylene (HDPE) filled with graphite were studied. The results show an increase of thermal conductivity of the HDPE/graphite composite with increase of graphite content. The thermal conductivity of the HDPE filled with the expanded graphite was larger than that of the HDPE filled with the colloid graphite system. At the same volume content (7%), the thermal conductivity of the former was twice that of the latter one. The particle diameter of the graphite also affected the thermal conductivity of HDPE composites. With increase of the particle diameter of the colloid graphite, the thermal conductivity of the HDPE/graphite increased. However, when the particle diameter of colloid graphite was larger than 15 μm, the increase of thermal conductivity of HDPE/graphite changed by inches. Some models proposed to predict thermal conductivity of a composite in a two‐phase system could not be applied to HDPE filled graphite powder composites, such as Maxwell‐Eucken, Cheng and Vachon, Zieblend, Lewis and Nielsen, Agari and Uno equations. But, according to the increase of thermal conductivity of HDPE composites filled with the colloid graphite, we find that Ziebland equation is suitable except of some constant. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 3806–3810, 2006     

Thermal conductivity of adhesive filled with metal powders

The development of a rapid method for measuring the thermal conductivity of adhesives is described. This was used for determining the effects of additions of copper and aluminium powders on the thermal conductivity of a toughened, single part epoxy adhesive. Results were obtained for various concentrations and grain sizes of both powder materials.     

Thermal stability and thermal conductivity of stacked Cs intercalated layered niobate

Layered materials exhibit competitively low thermal conductivity along the out-of-plane direction. The solution process is a promising method for preparing stacked structures. However, the thermal stability of the layered materials is poor after processing in solution, thus hindering their applications at high temperatures. One of the solutions to improve the thermal stability of layered structures is to expand the interlayer distance by inserting large-size metal ions. In this work, we studied the thermal properties of Cs⁺ intercalated layered niobate obtained by the ion-exchanged process. The layered structure of the Cs⁺ intercalated layered niobate survives after thermal treatment even at 1200 °C. The room temperature thermal conductivity of as prepared stacked Cs–HCa₂Nb₃O₁₀ is as low as 0.11 W m⁻¹ k⁻¹. Upon thermal annealing, the thermal conductivity increases. After annealing at 1200 °C, the value is 0.90 W m⁻¹ k⁻¹. The finding suggests Cs⁺ intercalated layered niobate is a promising material for high-temperature insulation applications.     

Thermal conductivity reduction of crystalline silicon by high-pressure torsion

We report a dramatic and irreversible reduction in the lattice thermal conductivity of bulk crystalline silicon when subjected to intense plastic strain under a pressure of 24 GPa using high-pressure torsion (HPT). Thermal conductivity of the HPT-processed samples were measured using picosecond time domain thermoreflectance. Thermal conductivity measurements show that the HPT-processed samples have a lattice thermal conductivity reduction by a factor of approximately 20 (from intrinsic single crystalline value of 142 Wm⁻¹ K⁻¹ to approximately 7.6 Wm⁻¹ K⁻¹). Thermal conductivity reduction in HPT-processed silicon is attributed to the formation of nanograin boundaries and metastable Si-III/XII phases which act as phonon scattering sites, and because of a large density of lattice defects introduced by HPT processing. Annealing the samples at 873 K increases the thermal conductivity due to the reduction in the density of secondary phases and lattice defects.     

Thermal conductivity of carbon nanotubes and graphene in epoxy nanofluids and nanocomposites

We employed an easy and direct method to measure the thermal conductivity of epoxy in the liquid (nanofluid) and solid (nanocomposite) states using both rodlike and platelet-like carbon-based nanostructures. Comparing the experimental results with the theoretical model, an anomalous enhancement was obtained with multiwall carbon nanotubes, probably due to their layered structure and lowest surface resistance. Puzzling results for functionalized graphene sheet nanocomposites suggest that phonon coupling of the vibrational modes of the graphene and of the polymeric matrix plays a dominant role on the thermal conductivities of the liquid and solid states.PACS: 74.25.fc; 81.05.Qk; 81.07.Pr.     

甲基叔丁基醚饱和液相导热系数的实验研究

利用瞬态双热线法测量了243—403 K温度范围内饱和液相甲基叔丁基醚的导热系数,并将实验数据拟合为温度的关联式。实验数据与导热系数关联式计算结果的标准偏差和最大偏差分别为0.30%和0.89%,导热系数的合成标准不确定度小于±1.0%。甲基叔丁基醚导热系数的实验研究为正在进行的甲基叔丁基醚替代物筛选提供急需的基础热物性数据,对改进汽油、柴油质量,提高油品的环境友好性及推广使用清洁燃料方面有重要价值。     

Thermal conductivity of carbon fiber/liquid crystal polymer composites

Thermally conductive resins are needed for bipolar plates in fuel cells. Currently, the materials used for these bipolar plates often contain a single type of graphite in a thermosetting resin. In this study, varying amounts of two different types of polyacrylonitrile based carbon fibers, Fortafil 243 and Panex 30, were added to a thermoplastic matrix (Vectra A950RX Liquid Crystal Polymer). The resulting single filler composites were tested for thermal conductivity and a simple exponential thermal conductivity model was developed for the square root of the product of the in‐plane and through‐plane thermal conductivity . The experiments showed that the through‐plane thermal conductivity was similar for composites up to 40 vol % fiber. However, at higher loadings, the Panex 30 samples exhibited higher thermal conductivity. The experiments also showed that the in‐plane thermal conductivity of composites containing Panex 30 was higher than those containing Fortafil 243 for all volume fractions studied. Finally, the model agreed very well with experimental data covering a large range of filler volume fraction (from 0 to 55 vol % for both single filler systems). The model can be used with existing through‐plane thermal conductivity models to predict in‐plane thermal conductivity. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 5456–5462, 2006     

HDPE/BN复合材料的热导率

研究了高密度聚乙烯(HDPE)／氮化硼(BN)复合材料中BN分散状态、含量及粒径对热导率的影响。用粉末混合法制得的复合材料中BN粒子围绕在HDPE粒子周围,形成特殊的网状导热通路,在(?)(BN)为30％时复合材料的热导率达1．20 W／(m·K),是纯HDPE的4倍。随BN粒径减小,复合材料的热导率升高,小粒子在基体中形成导热通路能力优于大粒子。HDPE／BN复合材料具有优良的电绝缘性能和机械性能。     

Thermal conductivity of several geopolymer composites and discussion of their formulation

We fabricated 50.8-mm cube-shaped samples of metakaolin geopolymer (GP) composites with various additives chosen to increase or decrease the thermal conductivity of the composite. Sodium-based GP (NaGP) and GP composites were more conductive than potassium-based GP (KGP) composites for a given phase fraction of filler, but the maximum amount of filler phase was higher with KGP due to the lower viscosity of the KGP mixture. The highest thermal conductivity achieved was about 8 W/m K by KGP + 44-vol% graphite flakes, whereas NaGP + 27 vol% graphite flakes reached 4.7 W/m K. The thermal conductivity was strongly affected by the moisture remaining in the composite, which appeared to have a greater effect at higher filler content. On the other hand, the size of alumina particles (6, 40, or 120 μm) did not have any apparent effect on thermal conductivity for the same filler content. Larger particles caused less change in mixture viscosity, though, thus permitting incorporation of higher filler phase fractions and therefore higher thermal conductivity.     

Thermal conductivity mapping of oxidized SiC/SiC composites by time-domain thermoreflectance with heterodyne detection

Silicon carbide/silicon carbide (SiC/SiC) composites are often used in oxidizing environments at high temperatures. Measurements of the thermal conductance of the oxide layer provide a way to better understand the oxidation process with high spatial resolution. We use time-domain thermoreflectance (TDTR) to map the thermal conductance of the oxide layer and the thermal conductivity of the SiC/SiC composite with a spatial resolution of 3 μm. Heterodyne detection using a 50-kHz-modulated probe beam and a 10-MHz-modulated pump suppresses the coherent pick-up and enables faster data acquisition than what has previously been possible using sequential demodulation. By analyzing the noise of the measured signals, we find that in the limit of small integration time constants or low laser powers, the dominant source of noise is the input noise of the preamplifier. The thermal conductance of the oxide that forms on the fiber region is lower than the oxide on the matrix due to small differences in thickness and thermal conductivity.     

Thermal and electrical conductivity of carbon–filled liquid crystal polymer composites

The thermal and electrical conductivity of resins can be increased by adding conductive carbon fillers. One emerging market for thermally and electrically conductive resins is for bipolar plates for use in fuel cells. In this study, varying amounts of five different types of carbon, one carbon black, two synthetic graphites, one natural flake graphite, and one calcined needle coke, were added to Vectra A950RX Liquid Crystal Polymer. The resulting composites containing only one type of filler were then tested for thermal and electrical conductivity. The objective of this work was to determine which carbon filler produced a composite with the highest thermal and electrical conductivity. The results showed that composites containing Thermocarb TC‐300 synthetic graphite particles had the highest thermal and electrical conductivity. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 99; 1552–1558, 2006     

Tuning stoichiometry of high-entropy oxides for tailorable thermal expansion coefficients and low thermal conductivity

Thermal barrier coating materials with proper thermal expansion coefficient (TEC), low thermal conductivity, and good high-temperature stability are of great significance for their applications in next-generation turbine engines. Herein, we report a new class of high-entropy (La_0.2Sm_0.2Er_0.2Yb_0.2Y_0.2)₂Ce_xO_3+2x with different Ce⁴⁺ contents synthesized by a solid-state reaction method. They exhibit different crystal structures at different Ce⁴⁺ content, including a bixbyite single phase without Ce⁴⁺ doping (x = 0), bixbyite-fluorite dual-phase in the RE₂O₃-rich region (0 < x < 2), and fluorite single phase in the stoichiometric (x = 2) and CeO₂-rich region (x > 2). The high-entropy (La_0.2Sm_0.2Er_0.2Yb_0.2Y_0.2)₂Ce_xO_3+2x exhibit tailorable TECs at a large range of 9.04 × 10^–6–13.12 × 10^–6 °C^–1 and engineered low thermal conductivity of 1.79–2.63 W·m^–1·K^–1. They also possess good sintering resistance and high-temperature phase stability. These results reveal that the high-entropy (La_0.2Sm_0.2Er_0.2Yb_0.2Y_0.2)₂Ce_xO_3+2x are promising candidates for thermal barrier coating materials as well as thermally insulating materials and refractories.     

Calculation of thermal conductivity of gypsum plasterboards at ambient and elevated temperature

Plasterboard often protects steel structures of buildings because it conducts heat slowly and absorbs the heat of the fire by its volumetric enthalpy. The most important property governing the heat transfer is the thermal diffusion. This property depends on the density, specific heat and thermal conductivity. The first two can be calculated based on the mass composition of the board. The thermal conductivity is more difficult to derive since it is a directional property. This paper will focus on the calculation of the thermal conductivity at ambient and elevated temperatures. It is shown that the thermal conductivity of gypsum plasterboard (i.e. a porous medium) can be assumed to be a three‐phase system. Plasterboard consists of a solid phase and a water/air mix in the voids. The differences between different theoretical equations for both dry and moistured plasterboards are presented. The equation proposed by Zehner and Schlunder (Chem. Ing.‐Tech. 1972; 44 (23):1303–1308) with shape‐factor C of 5 gave good agreement with experimental data of the different boards. Furthermore, the influence of the composition of the boards on the thermal conductivity is investigated. This has an influence, especially since the composition is also related to its moisture content. Regression analysis points out that the moisture content depends only on the gypsum content. A value of 2.8% absorbed water on the mass of gypsum is found, and this water plays an important role in the thermal conductivity of plasterboard at ambient temperature. Finally, the thermal conductivity of board at elevated temperature is computed. A close fit between computed and experimental values derived from literature is found. Copyright © 2009 John Wiley & Sons, Ltd.