Si含量对固态钢/液态铝界面反应与界面力学性能的影响

采用热物理模拟方法研究Si含量对固态钢与液态铝界面反应初始阶段(反应时间<10 s)内金属间化合物的显微组织和生长动力学的影响.同时,通过高频感应加热的方式研究Si添加对钢/铝界面力学性能的影响.结果表明,在界面反应初期,金属间化合物层主要包括η-Fe2Al5和θ-Fe4Al13两相.铝液中添加Si后金属间化合物层的厚...     

1.0%Zn,Ni对Sn-3.5Ag/Cu界面反应及化合物生长的影响

在微电子互连结构中,反应界面化合物层的形貌及厚度是决定焊点可靠性的一个重要因素.通过向Sn-3.5Ag共晶钎料中添加第三元素,分别研究元素Zn和Nj对Sn-3.5Ag/Cu界面反应的影响.结果表明,对于Sn-3.5Ag/Cu界面,液态反应初始生成物为Cu6Sn5,在随后的热老化阶段形成Cu3Sn化合物层;Zn元素不影响界面的初始生成相及其厚度,但在150℃老化阶段,Cu3Sn化合物的形成受到抑制,取代的是非连续的Cu5Zn化合物层,并且,化合物层增厚速度减慢;然而,当添加1.0%(质量分数)的Ni元素后,界面初始生成相为(Cu,Ni)6Sn5,该化合物层厚度明显大于前者,老化阶段界面无其它相生成.     

Influence of interfacial reaction between molten SnAgCu solder droplet and Au/Ni/Cu pad on IMC evolution

Intermetallic compounds（IMC） formed at Sn-Ag-Cu solder droplet/pad interface during wetting reaction were investigated. Comparative studies of the IMC evolution during reflow and aging were also conducted. The results show that the wetting reaction between molten solder droplet and pad leads to the formation of Au-Sn compound at interface, but Au element is not fully consumed during wetting reaction. After reflow, all Au layer disappears from the interface, Au element is dissolved into solder and Au-Sn intermetallic compounds are precipitated in the bulk. Reaction between Ni layer and Sn-Ag-Cu solder leads to the formation of （CuxNi1-x）6Sn5 layer at interface during reflow. According to the thermodynamic-kinetic of interfacial reaction, the wetting reaction at solder droplet/pad interface influences the phase selectivity of IMC evolution during reflow and aging process.     

钢/铝异种金属焊接固/液界面反应研究进展

钢/铝异种金属的焊接的核心问题是如何抑制界面金属间化合物的形成。因此,近年来国内外学者钢/铝异种金属固/液界面反应研究进行了大量研究。总结了固/液界面反应条件下金属间化合物的类型、形态、厚度以及影响其生长的因素。此外,还对金属间化合物生长模型进行了简要的概述,并分析了这些模型中存在的问题,为相关研究提供参考。     

High temperature DSC study on interfacial reaction of aluminum borate whisker reinforced aluminum alloys

1lNTR0DUCTIONRecently,theceramicwhiskerreinfOrcedmetalshavebeenpaidmoreattentionbecausethesecompositesp0ssessexcellentbehaviorssuchaslowdensity,goodstrength,highspecificstiffnessandspecificmodulus,exce1lentfatigue-resistanceandwear-resistance,andthenwhisker/metalcompositesbecomeanimportantbranchofmetalmatrixcomposites.TheearlydevelopedwhiskerreinforcedmetalaremainlyexpensiveSiCandSi3N4seriescomp0sites,sothatthewideapplicationsofthiskindofcompos-itesarelimited.Atpresent,astateofartwhisker…     

Cu颗粒增强的Sn-9Zn复合钎料/Cu钎焊接头界面反应

研究了长时间再流焊条件下,在粉状Sn-9Zn无铅钎料中加入Cu颗粒增强质点(复合钎料)对Sn-9Zn/Cu钎焊接头界面反应的影响.结果表明,在Sn-9Zn无铅钎料中加入Cu颗粒,可有效降低Sn-9Zn/Cu钎焊接头界面金属间化合物(IMC)的生长速度,从而减小界面IMC层的厚度,减少IMC层内的柯肯达尔(Kirkendall)缺陷;IMC层的厚度随再流焊时间的增加而增加,随Cu颗粒加入量的增加而减小.在现试验条件下,IMC层由Cu-Zn金属间化合物组成,未检测到Cu-Sn金属间化合物的存在.     

Effect of Ag addition on the corrosion properties of Sn‐based solder alloys

Corrosion properties of three different Sn‐Ag lead free solder alloys have been investigated in 0.3 wt% Na₂SO₄ solution as corrosive environment. As cast solder alloy was analyzed by X‐ray diffraction (XRD) and scanning electron microscopy (SEM). Volume fractions of the Ag₃Sn in the solders were determined by image analysis technique. Pitting potential and corrosion potential for the alloys were determined by potentiodynamic tests. Electrochemical impedance spectroscopy (EIS) was carried out to measure the film and charge transfer resistance. Alloys with lower Ag content have been found as better corrosion resistance material.     

Effect of antimony on vigorous interfacial reaction of Sn-Sb/Te couples

A vigorous reaction between molten Sn-Sb solder and Te substrate leads to a thick SnTe-Sn mixture layer at the soldered junction. The effect of Sb addition in Sn on the kinetics of Sn-Sb/Te interfacial reaction and formation of SnTe-Sn reaction layer is reported. Sb element was found to expedite the growth of SnTe-Sn reaction layer in the Sn-Sb/Te couples dramatically. With increasing Sb content in Sn-Sb solder, the growth rate of SnTe-Sn reaction layer increases while both the size of SnTe grains and the fraction of Sn in SnTe-Sn decrease. The thickness of SnTe-Sn layer follows a parabolic law with reaction time for Sn-Sb/Te couples, unlike the linear dependence with time for Sn/Te couples. An apparent diffusivity of 2 × 10⁻⁷ cm²/s was determined for Sn transport through the SnTe-Sn layer in the Sn-Sb/Te couples reacting at 250 °C.     

电流密度对Cu/Sn-9Zn/Ni焊点液-固电迁移行为的影响

采用同步辐射实时成像技术对比研究了不同电流密度对Cu/Sn-9Zn/Ni焊点液-固电迁移行为和界面反应的影响。结果表明,当电流密度为5.0×10~3A/cm~2时,无论电子方向如何,钎料中的Zn原子均定向扩散至Cu侧界面参与界面反应,导致Cu侧界面处金属间化合物(intermetallic compounds,IMC)的厚度大于Ni侧界面处IMC的厚度;而当电流密度升高至1.0×10~4和2.0×10~4 A/cm~2时,钎料中的Zn原子均定向扩散至阴极界面,界面IMC的生长表现为"反极性效应",电流密度越高界面IMC的"反极性效应"越显著。液-固电迁移过程中Cu基体消耗明显,特别是在高电流密度条件下,电子从Ni侧流向Cu侧时,Cu基体的溶解厚度与时间呈现线性关系,电流密度越高Cu基体的溶解速率越快。此外,基于焊点中原子电迁移通量J_(em)和化学势通量J_(chem)对Zn原子和Cu在不同电流密度下的迁移行为进行了研究。     

Zn添加对预时效处理的Al-Mg-Si-Cu合金原子团簇行为和烤漆硬化响应的影响

本文通过显微硬度、透射电镜和三维原子探针表征测试手段,研究了Zn添加对Al-Mg-Si-Cu合金原子团簇行为和烤漆硬化响应的影响。结果表明,经100&#176;C/3h预时效处理后,含Zn和不含Zn合金中均形成了Mg-Si原子团簇。然而,与不含Zn的合金相比,含Zn合金中Mg-Si原子团簇数量更多,表明Zn添加促进了Mg-Si原子团簇的形成。经185&#176;C /25min烤漆处理后,两个合金在预时效过程中形成的Mg-Si原子团簇转变为具有明显增强效果的β″相,对应的烤漆增量也明显增加。由于预时效后的含Zn合金中Mg-Si原子团簇数量更多,这为烤漆过程中β″的形成提供了更多的形核核心。因此,含Zn合金β″相的尺寸更小,分布更致密,相对应的烤漆硬化响应速率也得以增强。     

细间距倒装芯片互连过程中焊点界面金属间化合物的形成与演化

利用凸点间距为100μm,高度约为45μm,焊料成分为Sn-3.0Ag-0.5Cu(质量分数,%)(SAC305)的倒装芯片与树脂基板互连封装,研究芯片单侧凸点及芯片与BT基板焊点互连回流过程中界面金属间化合物(intermetalic compound,IMC)的形成和演化.结果表明,封装互连前,在芯片单侧镍焊盘界面上形成了长针状(Ni,Cu)₃Sn₄和薄层状Ni₃P,由于反应过程中焊料基体中Cu原子的大量消耗,没有形成典型的(Cu,Ni)₆Sn₅.封装互连过程中,由于大量Cu原子从铜界面扩散到镍界面,促使镍焊盘界面(Ni,Cu)₃Sn₄逐渐转化成(Cu,Ni)₆Sn₅,形貌由针状转变成短棒状,反应后(Cu,Ni)₆Sn₅成为主要IMC层;在铜焊盘界面上,形成了一层短棒状的(Cu,Ni)₆Sn₅,由于从镍焊盘界面扩散过来的Ni原子对Cu₃Sn生长的限制作用,反应后没有形成典型的Cu₃Sn.     

锌对SnxZn/Cu界面微空洞的影响

通过向锡钎料中添加不同含量的Zn元素,系统研究了锌对SnxZn/Cu(x=0,0.2,0.5,0.8(质量分数,％))界面处柯肯达尔空洞形成的影响.结果表明,经热老化处理后,纯Sn/Cu接头中的Cu3 Sn层和Cu3 Sn/Cu界面出现了大量柯肯达尔空洞.然而随着Zn元素含量的增加,反应界面处的Cu3Sn层逐渐变薄甚至消失,柯肯达尔空洞也随之显著减少或消失;锌在反应界面处的富集现象越来越显著.锌参与了界面反应,形成了(Cu,Zn)6Sn5相、Cu6(Sn,Zn)5相和Cu-Zn固溶合金,其中Cu-Zn固溶合金层可以显著影响铜的界面扩散.Zn元素直接参与了界面扩散,在很大程度上缓和铜和锡的不平衡扩散,从而有效抑制了柯肯达尔空洞的形成.     

冷轧钢基复合材料界面相的形貌及反应动力学研究

利用SEM、EDS对钢基复合材料的界面形貌特征、界面物相组成及物相析出规律进行研究,并对界面化合物层的厚度进行了测量.在此基础上,分析了钢-铝固-固界面反应物相的形核及生长的演变模式,讨论了界面化合物物相Fe2Al5的生长的动力学机制.结果表明:铝硅合金覆层试样界面化合物层较纯铝覆层试样生长缓慢,化合物相生成与反应活化能值、反应速率常数有关;在723～873 K条件下,化合物层厚度与化合物反应活化能成反比,与反应速率常数成正比,最终获得了金属间化合物相生长动力学模型.     

Al-Fe金属间化合物对复合板界面结合的影响(英文)

对固态铝和固态铁界面金属间化合物的生长及金属间化合物对界面结合的影响进行了研究。结果表明,固态铝和固态铁热处理后的界面主要包括Fe2Al5和FeAl3化合物层,金属间化合物恶化了界面结合强度。在拉剪测试中,断裂主要发生在Fe2Al5或FeAl3化合物层,断裂的位置主要取决于化合物层内部的缺陷,包括微裂纹和空洞。热膨胀系数不匹配产生的应力导致内部微裂纹产生,内部孔洞产生的原因是Kirkendall效应。该研究对铝和铁的焊接与连接,尤其是对铝钢复合板的制备,奠定了一定的基础。     

Numerical simulation of interfacial reaction between titanium and zirconia

Based on the conservation laws of energy and mass,and taking into account the effect of chemical reaction between liquid titanium and zirconia ceramic mold on the concentration field and the temperature field,a comprehensive mathematical model for numerical simulation of heat and mass transfer has been established to study the interfacial reaction between liquid Ti and ZrO2 ceramic mold.With the proposed model,numerical simulations were preformed to investigate the effects of pouring temperature and holding time on the oxygen concentrations and reactive layer thickness in metal.The results showed that both the oxygen concentration and the thickness of reactive layer in metal increase with the increase of the holding time and the pouring temperature.The development of reactive layer thickness with time consists of three stages:inoculation (0-1 s),linear increase (1-5 s)and parabolic increase (after 5 s).     

固液球磨制备Fe-Sn金属间化合物粉末

采用固液反应球磨专利技术制备Fe-Sn金属间化合物。所谓固液反应球磨，是在一定温度区间，球磨介质对金属液体进行球磨时，磨球和金属液体反应生成固相的金属间化合物粉末。为加速反应进行，可以在金属液体中加人与磨球成分相同的金属粉末。通过固液反应球磨制备了FeSn2，FeSn，Fe3Sn2和Fe1,3Sn4种金属间化合物纳米粉末，并对固液反应球磨技术制备金属间化合物的机理和特点进行了讨论。     

反应合成Ni-Al金属间化合物的组织及形成机理(英文)

以Ni粉和Al粉为原料,通过热爆反应合成制备Ni-Al系金属间化合物,研究了反应物摩尔比对生成物物相、组织结构和显微硬度的影响。结果表明:当Ni、Al摩尔比为1:1时,反应生成物为单一的NiAl相;当Ni、Al摩尔比为2:1时,生成物相组成为NiAl+Ni3Al相,因为非平衡冷却,NiAl含量多,呈不规则块状形态分布,Ni3Al相析出量少,主要沿初生NiAl晶界分布,当进一步提高Ni含量,且Ni、Al摩尔比为3:1时,生成物组织形态复杂,除枝晶状的β-NiAl、粗大块状和网状的γ-Ni3Al外,还有板条状和针片状的M-NiAl和不规则的块状或者尖条状的γ′-Ni3Al,这主要是由非平衡冷却和β-NiAl内的成分差异而引起的。     

Effect of Yb addition on precipitation and microstructure of Al-Cu-Mg-Ag alloys

Al-Cu-Mg-Ag alloys with different Yb contents were prepared by ingot metallurgy and thermomechanical treatment. The effect of Yb addition on the precipitation and microstructure of the alloys was investigated using mechanical properties testing, optical microscopy, differential scanning calorimetry（DSC）, scanning electron microscopy（SEM） and transmission electron microscopy（TEM）. The results show that adding 0.10%-0.35% Yb accelerates the aging hardening process, increases the maximum hardness and the tensile strength of the extruded alloys from room temperature to 300 ℃. Trace Yb element addition refines the grains of the casting alloys from 85 μm to 30 μm, decreases the precipitation temperature of Ω phase. Moreover, the addition of Yb into AI-Cu-Mg-Ag alloy decreases the precipitates size, and improves the density and the thermal stability of.Ω phase between 200 ℃ and 300 ℃.     

Sn对Mg-5Li合金铸态和挤压态组织的影响

在氩气保护气氛下熔炼,得到Mg-5Li-xSn（x=0.15,0.25和0.65,质量分数）系列合金。通过光学显微镜、扫描电镜、X射线衍射仪和能谱仪分析合金的显微组织。结果表明,Mg-5Li合金中添加的Sn元素可以起到明显的晶粒细化作用,当Sn含量从0.15%增加到0.65%时,铸态合金的平均晶粒尺寸从556μm细化到345μm,相应的挤压态合金的晶粒从33μm减小到23μm。近似网状的第二相Mg2Sn分布在铸态合金的晶界上,挤压之后,颗粒状的Mg2Sn主要分布在晶粒内部。这些金属间化合物在挤压动态再结晶中可以作为有效的形核质点,从而起到细化晶粒的作用。     

Chemical kinetic studies on interfacial reaction in SCS-6 SiC/Ti matrix composites

Interfacial reaction and its mechanism of SiC/Ti composite were revealed by chemical kinetic studies. A two-step dynamic model of interfacial reaction in SCS-6 SiC/Ti composites was built up, and the rate constant and the activation energy of the interfacial reactions were obtained based on the quantum chemistry calculation. The results show that the first step, in which the atomic Ti, C and Si are decomposed from Ti matrix and SiC fiber, respectively, is a rate-determined step because the activation energy of the step is much larger than that of the second one in which deferent interfacial reaction products form. The theoretically predicted result of the interfacial reaction is coincident with that of experimental observation.