Curing of epoxy siloxane monomer with anhydride

Epoxy siloxane monomer, 1,3‐Bis[2‐(3‐{7‐oxabicyclo[4.1.0]heptyl})ethyl]‐tetramethyldisiloxane, was cured with methylhexahydrophthalic anhydride, and the catalysts, N,N‐dimethylbenzylamine (BDMA) and tetra‐n‐butylphosphonium o,o‐diethylphosphorodithioate (PX‐4ET), were compared. The curing reactivity of BDMA was higher than that of PX‐4ET, but the thermal stability of the polymer was lower. PX‐4ET caused less thermal discoloration, which increased in proportion to catalyst concentration. The optimum was 0.71–0.35 mol %. Maximum hardness and glass transition temperature as well as minimum coefficient of thermal expansion and thermal discoloration was achieved with equivalent amounts of epoxy and anhydride. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 946–951, 2005     

Cure kinetics of epoxy/anhydride nanocomposite systems with added reactive flame retardants

Montmorillonite nanocomposite systems obtained from epoxy cured using anhydride and the addition of a reacting flame retardant are studied in this paper. In particular, a thermokinetic analysis of the behavior of five different compounds was performed, using a differential scanning calorimeter. The isothermal tests showed double reaction peaks, due to the cure reactions of DGEBA/acid anhydride systems. The comparisons between dynamic thermograms (and between isothermal ones, too) for the different mixtures also showed that the addition of other active substances (such as a nanofiller or a flame retardant additive) does not change the mechanism of crosslinking from a qualitative point of view, but both the nanoreinforcement and the flame retardant seemed to exert an evident catalytic action on the cure reactions. A model describing the cure behavior of the aforementioned materials is proposed in this work. This model takes into account the fact that the reaction mechanism of each analyzed system is composed of a couple of parallel phenomena: the fast opening of anhydride ring (corresponding to a first exothermic peak and characterized by “n‐th order” kinetics) and resin networking (corresponding to a second exothermic peak and characterized by an “auto‐catalytic with zero initial velocity” behavior). The verification of the proposed model was performed by means of a comparison between experimental data (normalized curves derived from DSC thermograms) and theoretical data (derived from a numerical integration—using the second order Runge–Kutta method—of the model‐representative equation) and provided very good results. This allows one to apply such a model to any engineering process problem concerning the cure of DGEBA/acid anhydride/phyllosilicate nanocomposite systems. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 1676–1689, 2004     

Model free kinetics coupled with finite element method for curing simulation of thermosetting epoxy resins

A finite element method algorithm for epoxy curing degree simulation was developed in Abaqus by integrating the discretized analytical solution of the model free kinetics into its user subroutines. This method was verified by nonisothermal and isothermal DSC experiments of an epoxy resin. By means of this method, the real manufacturing press cycle could be simulated regarding temperature distribution and curing degree with advanced curing degree‐dependent material properties. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46408.     

An evaluation of the curing characteristics of thermosetting epoxy carbon fiber sheet molding compounds and validation through computer simulations and molding trials

Sheet molding compounds (SMC) are ready-to-mold thermoset composite materials reinforced with discontinuous fibers, usually compression molded. Finite element (FE) based compression molding tools can be employed to optimize this process; FE tools require to define material models using raw material data measured through different characterization techniques. In this study, the cure kinetics of an epoxy-based carbon fiber SMC has been characterized by means of differential scanning calorimetry (DSC) and moving die rheometer (MDR) techniques. Based on these datasets, Claxton-Liska and Kamal-Souror models have been set and the compression molding of a validation plate was performed, both experimentally and virtually. The results indicate that, even if both characterization techniques are valid for SMC curing characterization, MDR technique enables the characterization of the material at real molding temperatures and the model based on MDR leads to more accurate results.     

Curing kinetics and curing process of phenolic impregnated carbon ablator

Phenolic impregnated carbon ablator (PICA), which is composed of the phenolic resin (PR) and carbon fiber, is of particular interest to researchers in the aerospace field. In this work, PICA was prepared by the double‐stage isothermal heating curing. Then, the curing kinetics of boron‐modified phenolic resin (BPR) was investigated by non‐isothermal differential scanning calorimetry method in order to optimize the curing temperature of BPR. Further, the effect of the heating rate during curing process on the compressive strength of PICA was discussed in detail. The experimental data show that the curing of BPR needs more energy so that the curing temperature of BPR under different condition is higher than that of virgin PR. Notably, with the increasing heating rate during the curing process, the micro‐cracks increase and the compressive strength of PICA decreases. Once the heating rate exceeds a critical value, the micro‐cracks no longer increase and the heating rate has insignificant effect on the compressive strength. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 45434.     

Curing kinetics of a “green” thiol‐containing resin: Oligo(ethylene‐2‐mercaptosuccinate)

This work focuses on examining the curing process of neat oligo(ethylene‐2‐mercaptosuccinate) using differential scanning calorimetry (DSC), rheology, and Fourier transform infrared (FTIR) spectroscopy. The thiol‐containing resin offers much promise as a bioabsorbable polymer in medical field and as a reusable thermoset in sustainable applications. Although curing between thiol groups has been investigated in solutions, studies of neat materials without solvent are rare. Here, the evolution of glass transition temperature (T_g), complex shear modulus (G*), gelation, and chemical structure are monitored as a function of isothermal curing time and temperature. Both T_g and G* increase with curing, indicating the formation of polymer networks. The conversion of the cure is determined from the DiBenedetto equation and is found to follow a second‐order plus second‐order autocatalytic reaction model. Importantly, the intensity of the S–H bond absorption decreases with the extent of curing, which confirms the curing mechanism, i.e., disulfide formation between the thiol groups. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43205.     

Investigation of cure kinetics in epoxy/multiwalled carbon nanotube nanocomposites

With the increased interest in thermoset resin nanocomposites, it is important to understand the effects of the material on nanoscale characteristics. In this study, a curing reaction of an epoxy resin, which contained 0.25, 0.50, or 1.00 wt % of multiwalled carbon nanotubes (MWCNTs), at different heating rates was monitored by differential scanning calorimetry; cure kinetics were also evaluated to establish a relationship between crosslinking (network formation) and mechanical properties. MWCNT concentrations above 0.25 wt % favored crosslinking formation and decreased the activation energy (E_a) in the curing reaction. Examination of the kinetic mechanism suggests that the MWCNT locally restricted the spatial volume and favored the formation of nodular morphology in the resin, especially for high MWCNT concentrations. The MWCNT exhibited some entanglement in the matrix, which hindered a more pronounced effect on the mechanical properties. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 39857.     

没食子酸环氧树脂/蓖麻油酸多胺体系固化动力学及性能

以蓖麻油和三乙烯四胺为原料合成蓖麻油酸多胺固化剂(COAPA),再将其与没食子酸环氧树脂(GAER)混合组成全生物基GAER/COAPA固化体系,采用非等温差示扫描量热法(DSC)对其固化反应过程进行了研究,确定了固化体系最佳质量配比为7:3(GAER:COAPA),获得了最佳固化工艺温度参数;利用Kissinger方...     

Modeling the chemorheological behavior of epoxy/liquid aromatic diamine for resin transfer molding applications

The analysis of the chemorheological behavior of an epoxy prepolymer based on a diglycidylether of bisphenol‐A (DGEBA) with a liquid aromatic diamine (DETDA 80) as a hardener was performed by combining the data obtained from Differential Scanning Calorimetry (DSC) with rheological measurements. The kinetics of the crosslinking reaction was analyzed at conventional injection temperatures varying from 100 to 150°C as experienced during a Resin Transfer Molding (RTM) process. A phenomenological kinetic model able to describe the cure behavior of the DGEBA/DETDA 80 system during processing is proposed. Rheological properties of this low reactive epoxy system were also measured to follow the cure evolution at the same temperatures as the mold‐filling process. An empirical model correlating the resin viscosity with temperature and the extent of reaction was obtained to carry out later a simulation of the RTM process and to prepare advanced composites. Predictions of the viscosity changes were found to be in good agreement with the experimental data at low extents of cure, i.e., in the period of time required for the mold‐filling stage in RTM process. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 4228–4237, 2006     

Curing behavior and network formation of cyanate ester resin/polyethylene glycol

The mechanism and kinetics of the curing reaction of cyanate ester (CE) resin modified with polyethylene glycol were investigated by means of differential scanning calorimetry (DSC) and Fourier‐transform infrared spectroscopy (FTIR). The relationship of heat flow versus conversion rate was used to evaluate the effects of polyethylene glycol (PEG) on the curing reaction of CE. DSC results showed that the addition of PEG decreased the curing temperature of CE effectively when its content was less than 20 wt %. The curing behavior of CE/PEG still complies with the self‐catalytic kinetic model proposed by Kamal. The effects of PEG content on the kinetics parameters and conversion rate of the curing reaction were discussed. FTIR results indicated that the –OH groups in PEG participated in the polymeric reaction of CE and formed –O–C (=NH) –O– structure through block copolymerization, which extended the chain length between triazine rings and reduced the density of triazine rings. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41841.     

Isothermal and nonisothermal cure kinetics of an epoxy/poly(oxypropylene)diamine/octadecylammonium modified montmorillonite system

The effect of an octadecylammonium‐exchanged montmorillonite on the curing kinetics of a thermoset system based on a bisphenol A epoxy resin and a poly(oxypropylene)diamine curing agent were studied with differential scanning calorimetry (DSC) in isothermal and dynamic (constant‐heating‐rate) conditions. Montmorillonite and the prepared composites were characterized by X‐ray diffraction analysis and simultaneous DSC and thermogravimetric analysis. The analysis of the DSC data indicated that the intercalated octadecylammonium cations catalyzed the epoxy–amine polymerization. A kinetic model, arising from an autocatalyzed reaction mechanism, was applied to the DSC data. Fairly good agreement between the experimental data and the modeling data was obtained. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 1765–1771, 2006     

Cure kinetics of an epoxy/liquid aromatic diamine modified with poly(ether imide)

The cure kinetics and mechanisms of an epoxy oligomer based on diglycidyl ether of bisphenol A (DGEBA), polymerized with a liquid aromatic diamine based on diethyl toluene diamine (DETDA 80), and its blends with poly(ether imide) (PEI) at concentrations of 0–15 wt % were studied with differential scanning calorimetry under dynamic and isothermal conditions. The kinetic analyses were performed with a phenomenological approach. The reaction mechanism of the blends remained the same as that of the neat epoxy. However, the addition of PEI had a marked effect on the cure kinetics in the DGEBA/DETDA 80 system. The rate of reaction decreased with an increase in the thermoplastic content. Diffusion control was incorporated to describe the cure behavior of the blends in the latter stages. Greater diffusion control was observed as the PEI concentration increased and the cure temperature decreased. Polymer blends based on this epoxy/liquid aromatic diamine had not been previously studied from a kinetic viewpoint. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 660–672, 2005     

苯并(口恶)嗪改性环氧酸酐体系的固化机理及动力学

利用一种二胺型苯并(口恶)嗪改性环氧酸酐体系。通过FT-IR和DSC分析了改性体系的固化机理。结果表明：共混树脂体系在固化时存在两个反应,首先是环氧树脂与足量的酸酐在咪唑作用下在100℃先开始固化,并在150℃固化2 h后固化完全,之后苯并(口恶)嗪在180℃发生开环聚合。用非等温DSC法研究了该共混体系的固化动力学。采用Flynn-Wall-Ozawa方法求出了共混体系在固化时两个固化反应的活化能,分别为65.27 kJ·mol^-1和92.8 kJ·mol^-1,并利用Friedman方法判断了两个反应都是自催化反应,计算得到自催化模型曲线与实验曲线能较好地吻合。     

TG-siloxane改性BPFER/mXDA体系固化反应动力学与热性能

以1,3-二氨丙基-1,1,3,3-四甲基二硅氧烷(DSX)和环氧氯丙烷(ECH)为原料,利用相转移催化剂,合成双酚F环氧树脂(BPFER)改性剂N,N,N',N'-四缩水甘油基-1,3-二氨丙基-1,1,3,3-四甲基二硅氧烷(TG-siloxane),并用FTIR、¹³C NMR谱图对其结构进行了表征。对TG-siloxane改性BPFER/mXDA(间苯二甲胺)体系的固化动力学进行了研究。根据DSC曲线和Starink方程,得该体系表观固化活化能为51.52 kJ·mol^-1。用Šesták-Berggren模型求得不同升温速率下的表观因子、反应级数。动力学方程表明,升温速率对固化反应影响明显;所得方程用于预估反应进程时,与实测值吻合程度高。TG分析表明,TG-siloxane改性BPFER/mXDA体系固化物的耐热性能优于单纯BPFER/mXDA固化物。     

Curing behavior of epoxy resins in two‐stage curing process by non‐isothermal differential scanning calorimetry kinetics method

In this research, a new thermal curing system, with two‐stage curing characteristics, has been designed. And the reaction behaviors of two different curing processes have been systematically studied. The non‐isothermal differential scanning calorimetry (DSC) test is used to discuss the curing reaction of two stages curing, and the data obtained from the curves are used to calculate the kinetic parameters. Kissinger‐Akahira‐Sunose (KAS) method is applied to determine activation energy (E_a) and investigate it as the change of conversion (α). Málek method is used to unravel the curing reaction mechanism. The results indicate that the curing behaviors of two different curing stages can be implemented successfully, and curing behavior is accorded with ?esták‐Berggren mode. The non‐isothermal DSC and Fourier transform infrared spectroscopy test results reveal that two different curing stages can be implemented successfully. Furthermore, the double x fitting method is used to determine the pre‐exponential factor (A), reaction order (m, n), and establish the kinetic equation. The fitting results between experiment curves and simulative curves prove that the kinetic equation can commendably describe the two different curing reaction processes. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40711.     

Modeling the effect of the curing conversion on the dynamic viscosity of epoxy resins cured by an anhydride curing agent

Nanocomposites of poly(vinyl alcohol) (PVA) with Mg‐Al layered double hydroxides (LDHs) were prepared with different compositions, viz., 2, 4, 6, and 8 wt %, of LDH, by solution‐intercalation method. The effect of LDH contents on thermal, physicomechanical, and morphological property of PVA films were investigated. Differential scanning calorimetric analysis reveals that LDH layers promote a new crystalline phase for PVA. The tensile analysis of PVA/LDH nanocomposites indicates reduction in tensile strength and modulus with change in LDH concentration and moisture. The microstructure analysis by optical microscopy and scanning electron microscopy demonstrates exfoliation and dispersion of LDHs in the PVA matrix in a disorderly fashion. The primary focus of the present investigation is to explore the potential of LDHs as nanofiller in a polyhydroxy polymer without surface modification. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Curing behavior of epoxy resin/tung oil anhydride exfoliated nanocomposite by differential scanning calorimetry

The nanocomposite of epoxy resin/tung oil anhydride/organic montmorillonite was prepared by casting and curing. The distance of the clay gallery rose and the exfoliated nanocomposite was formed. The exfoliation behaviors of the nanocomposite had been investigated by X‐ray diffraction (XRD). The curing mechanism and kinetics of epoxy resin with the different amounts of organic montmorillonite were studied using isothermal and dynamic methods by differential scanning calorimetry (DSC). Some parameters, the activation energy and reaction orders, were calculated by the modified Avrami equation in analysis of the isothermal experiment. The total curing mechanism and kinetics of curing reaction were also analyzed by the Flynn–Wall–Ozawa method. It was noted that the instantaneous activity energy during the curing process could be obtained by the Flynn–Wall–Ozawa method and the trend of the results was in agreement with those obtained from the modified Avrami equation. These results show that the activity energy decreases with the addition of organic montmorillonite. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 3822–3829, 2004     

非等温DSC法研究环氧树脂固化反应动力学过程

采用非等温DSC(差示扫描量热)法研究了环氧树脂(EP)体系的固化过程,并采用Kissinger方程、Crane方程和T-β(温度-升温速率)外推法计算出该EP体系固化反应的动力学参数和固化温度。研究结果表明:当m(EP)∶m(填料)∶m(固化剂)∶m(促进剂)=100∶30∶90∶0.4时,EP体系固化反应的表观活化能为78.90 kJ/mol、指前因子为2.58×109min-1和反应级数为0.914,其最佳固化条件为"从室温升温至92℃(开始凝胶)→继续升温至140℃(恒温固化)→最后升温至169℃(进行后固化处理)"。     

TPP/PMMA复合物促进环氧树脂/酸酐体系的固化动力学研究

以三苯基膦(TPP)和甲基丙烯酸甲酯(MMA)为原料合成了TPP/PMMA复合物,用DSC研究了TPP/PMMA催化双酚A二缩水甘油醚(EP828)/甲基四氢苯酐(MTHPA)体系固化反应动力学。非等温固化动力学研究结果表明,转化率在20%～60%范围内,用Ozawa法能较好地描述环氧树脂/酸酐体系的固化反应过程。