Cure kinetics and thermal stability of micro and nanostructured thermosetting blends of epoxy resin and epoxidized styrene‐block‐butadiene‐block‐styrene triblock copolymer systems

The compatibility of styrene‐block‐butadiene‐block‐styrene (SBS) triblockcopolymer in epoxy resin is increased by the epoxidation of butadiene segment, using hydrogen peroxide in the presence of an in situ prepared catalyst in water/dichloroethane biphasic system. Highly epoxidized SBS (epoxy content SBS >26 mol%) give rise to nanostructured blends with epoxy resin. The cure kinetics of micro and nanostructured blends of epoxy resin [diglycidyl ether of bisphenol A; (DGEBA)]/amine curing agent [4,4′‐diaminodiphenylmethane (DDM)] with epoxidized styrene‐block‐butadiene‐block‐styrene (eSBS 47 mol%) triblock copolymer has been studied for the first time using differential scanning calorimetry under isothermal conditions to determine the reaction kinetic parameters such as kinetic constants and activation energy. The cure reaction rate is decreased with increasing the concentration of eSBS in the blends and also with the lowering of cure temperature. The compatibility of eSBS in epoxy resin is investigated in detailed by Fourier transform infrared spectroscopy, optical and transmition electron microscopic analysis. The experimental data of the cure behavior for the systems, epoxy/DDM and epoxy/eSBS(47 mol%)/DDM show an autocatalytic behavior regardless of the presence of eSBS in agreement with Kamal's model. The thermal stability of cured resins is also evaluated using thermogravimetry in nitrogen atmosphere. POLYM. ENG. SCI., 2012. © 2012 Society of Plastics Engineers     

Preparation,curing kinetics,and thermal properties of bisphenol fluorene epoxy resin

Diglycidyl ether of 9,9‐bis(4‐hydroxyphenyl) fluorene (DGEBF) was synthesized to introduce more aromatic structures into an epoxy resin system. The structure of DGEBF was characterized with Fourier transform infrared and ¹H‐NMR. 4,4′‐Diaminodiphenylmethane (DDM) was used as the curing agent for DGEBF, and differential scanning calorimetry was applied to study the curing kinetics. The glass‐transition temperature of the cured DGEBF/DDM, determined by dynamic mechanical analysis, was 260°C, which was about 100°C higher than that of widely used diglycidyl ether of bisphenol A (DGEBA). Thermogravimetric analysis was used to study the thermal degradation behavior of the cured DGEBF/DDM system: its onset degradation temperature was 370°C, and at 700°C, its char yield was about 27%, whereas that of cured DGEBA/DDM was only 14%. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Epoxy resin based on 4,4′-dihydroxydiphenysulfone. I. Synthesis and reaction kinetics with 4,4′-diaminodiphenylmethane and 4,4′-diaminodiphenylsulfone

Epoxy resins based on 4,4′-dihydroxydiphenylsulfone (DGEBS) and diglycidyl ether of bisphenol A (DGEBA) were prepared by alkaline condensation of 4,4′-dihydroxydiphenylsulfone (bisphenol S) with epichlorohydrin and by recrystallization of liquid, commercial bisphenol A-type epoxy resin, respectively. Curing kinetics of the two epoxy compounds with 4,4′-diaminodiphenylmethane (DDM) and with 4,4′-diaminodiphenylsulfone (DDS) as well as T_g values of the cured materials were determined by the DSC method. It was found that the ? SO₂? group both in the epoxy resin and in the harener increases T_g values of the cured materials. DGEBS reacts with the used hardeners faster than does DGEBA and the curing reaction of DGEBS begins at lower temperature than does the curing reaction of DGEBA when the same amine is used. © 1994 John Wiley & Sons, Inc.     

Epoxy toughening using low viscosity liquid diglycidyl ether of ethoxylated bisphenol‐A

Two new epoxy resins, diglycidyl ether of ethoxylated bisphenol‐A (BPA) with two and six oxyethylene units (DGEBAEO‐2 and DGEBAEO‐6) were synthesized and characterized. DGEBAEO‐6 was used to toughen the conventional epoxy resin diglycidyl ether of BPA (DGEBA). The blends of DGEBA with different amounts of DGEBAEO‐6 were cured by 4,4′‐diamino diphenylmethane (DDM), and their thermal and mechanical properties were examined. The DSC and DMA results presented that DGEBA/DGEBAEO‐6 blends exhibited a homogenous phase, and the glass transition temperature of the blends was inversely proportional to the content of DGEBAEO‐6. The impact strength of the cured blends was directly proportional to the content of DGEBAEO‐6, and reached five times higher than that of the neat DGEBA when 50 wt % DGEBAEO‐6 was used; the same impact strength was achieved for DDM‐cured DGEBAEO‐2. The viscosities of the blends decreased with increasing the DGEBAEO‐6 content, whereas the tensile and flexural strength and the thermal stabilities were not obviously affected. Scanning electron microscopic results confirmed that the plastic deformation inducing by the incorporated flexible oxyethylene units was responsible for the toughness improvement. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Miscibility and mechanical properties of tetrafunctional epoxy resin/phenolphthalein poly(ether ether ketone) blends

Phenolphthalein poly(ether ether ketone) (PEK‐C) was found to be miscible with uncured tetraglycidyl 4,4′‐diaminodiphenylmethane (TGDDM), which is a type of tetrafunctional epoxy resin (ER), as shown by the existence of a single glass transition temperature (T_g) within the whole composition range. The miscibility between PEK‐C and TGDDM is considered to be due mainly to entropy contribution. Furthermore, blends of PEK‐C and TGDDM cured with 4,4′‐diaminodiphenylmethane (DDM) were studied using dynamic mechanical analysis (DMA), Fourier‐transform infrared (FTIR) spectroscopy, and scanning electron microscopy (SEM). DMA studies show that the DDM‐cured TGDDM/PEK‐C blends have only one T_g. SEM observation also confirmed that the blends were homogeneous. FTIR studies showed that the curing reaction is incomplete due to the high viscosity of PEK‐C. As the PEK‐C content increased, the tensile properties of the blends decreased slightly and the fracture toughness factor also showed a slight decreasing tendency, presumably due to the reduced crosslink density of the epoxy network. SEM observation of the fracture surfaces of fracture toughness test specimens showed the brittle nature of the fracture for the pure ER and its blends with PEK‐C. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 79: 598–607, 2001     

Curing kinetics and reaction‐induced homogeneity in networks of poly(4‐vinyl phenol) and diglycidylether epoxide cured with amine

Mixtures of diglycidyl ether of bisphenol‐A (DGEBA) epoxy resin with poly(4‐vinyl phenol) (PVPh) of various compositions were examined with a differential scanning calorimeter (DSC), using the curing agent 4,4′‐diaminodiphenylsulfone (DDS). The phase morphology of the cured epoxy blends and their curing mechanisms depended on the reactive additive, PVPh. Cured epoxy/PVPh blends exhibited network homogeneity based on a single glass transition temperature (T_g) over the whole composition range. Additionally, the morphology of these cured PVPh/epoxy blends exhibited a homogeneous network when observed by optical microscopy. Furthermore, the DDS‐cure of the epoxy blends with PVPh exhibited an autocatalytic mechanism. This was similar to the neat epoxy system, but the reaction rate of the epoxy/polymer blends exceeded that of neat epoxy. These results are mainly attributable to the chemical reactions between the epoxy and PVPh, and the regular reactions between DDS and epoxy. Polym. Eng. Sci. 45:1–10, 2005. © 2004 Society of Plastics Engineers.     

Synthesis and properties of trifluoromethyl groups containing epoxy resins cured with amine for low Dk materials

The study synthesized a trifluoromethyl (CF₃) groups with a modified epoxy resin, diglycidyl ether of bisphenol F (DGEBF), using environmental friendly methods. The epoxy resin was cured with 4,4′‐diaminodiphenyl‐methane (DDM). For comparison, this study also investigated curing of commercially available diglycidyl ether of bisphenol A (DGEBA) with the same curing agent by varying the ratios of DGEBF. The structure and physical properties of the epoxy resins were characterized to investigate the effect of injecting fluorinated groups into epoxy resin structures. Regarding the thermal behaviors of the specimens, the glass transition temperatures (T_g) of 50–160°C and the thermal decomposition temperatures of 200–350 °C at 5% weight loss (T_d5%) in nitrogen decreased as amount of DGEBF increased. The different ratios of cured epoxy resins showed reduced dielectric constants (D_k) (2.03–3.80 at 1 MHz) that were lower than those of pure DGEBA epoxy resins. Reduced dielectric constant is related to high electrronegativity and large free volume of fluorine atoms. In the presence of hydrophobic CF₃ groups, the epoxy resins exhibited low moisture absorption and higher contact angles. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

The Miscibility of Novel Bisphenol-Propylene Epoxy Resin With Liquid NBR

A novel kind of bisphenol-type epoxy resin with a vinyl side-chain was developed and its miscibility behavior with liquid nitrile-butadiene rubber (NBR) was investigated. The diglycidyl ether of bisphenol propylene (DGEBP) was prepared by the condensation of phenol with acrolein in the presence of an acid catalyst and the subsequent epoxidization with epichlorohydrin (ECH). The structures of the bisphenol and corresponding epoxy resin were characterized by infrared (IR) and nuclear magnetic resonance (NMR) spectral analyses and the epoxy value was determined to be 0.34 mol/100 g by titration. The mixture of DGEBP with the liquid NBR containing diglycidyl ether of bisphenol acetone (DGEBA) was prepared and cured with diaminodiphenylmethane (DDM). The miscibility and morphology of the mixture system were studied by dynamic mechanical thermal analysis (DMTA) and transmission electron microscopy (TEM), respectively. The cured mixture of DGEBP/NBR/DDM exhibited good miscibility and, therefore, no separation, along with a transparent appearance at rubber contents of 10 wt% and 30 wt%. For cured DGEBP/DGEBA/NBR/DDM systems at 20 wt% rubber content, the dispersed rubber phase and rubber particles were not observed by DMTA or TEM at DGEBP content above 40 wt%. The DMTA plot showed a single peak related to the glass transition temperature (T _g) which decreased with increasing DGEBP content. The appearance of the system varied from transparent to opaque and the rubber separated from the epoxy matrix to form two phases when the DGEBP content decreased. The T _g values of the rubber- and epoxy-rich phases were strongly dependent on the DGEBP content in the mixed system. The miscibility of epoxy resin with liquid NBR can be altered by varying the ratio of DGEBP to DGEBA.     

Biobased epoxy resin derived from eugenol with excellent integrated performance and high renewable carbon content

Developing biobased epoxy resin with high renewable carbon content and outstanding integrated performance is beneficial for both sustainable development and applications in cutting‐edge fields. Herein, a biobased epoxy monomer (TEUP‐EP) with high renewable carbon content (100%) was synthesized from renewable eugenol with a sustainable process; TEUP‐EP was then blended with 4,4′‐diaminodiphenylmethane (DDM) to develop a new biobased epoxy resin (TEUP‐EP/DDM). The integrated performance of TEUP‐EP/DDM resin was studied and compared with that of petroleum‐based diglycidyl ether of bisphenol A (DGEBA)/DDM resin. Compared with DGEBA/DDM resin, TEUP‐EP/DDM resin has much better integrated performance and not only exhibits a glass transition temperature about 26 °C higher and a 24.4% or 57% increased flexural strength or modulus, but also shows outstanding flame retardancy. Specifically, the limiting oxygen index increases from 26.5% to 31.4% and the UL‐94 grade improves from no rating to the V‐0 level; moreover, the peak heat release rate and total heat release decreased by 63.1% and 57.4%, respectively. All these results fully prove that TEUP‐EP/DDM is a novel biobased high performance epoxy resin. The mechanism behind these attractive integrated performances is discussed intensively. © 2018 Society of Chemical Industry     

Synthesis and characterization of a new phosphorus‐containing furan‐based epoxy curing agent as a flame retardant

In this study, 5‐hydroxymethyl‐2‐furfural (HMF) was used as a renewable resource for preparing an epoxy curing agent (furan‐based flame retardant, FBF), and a phosphorus‐containing functional group was also incorporated to enhance the flame retardancy of FBF. FBF was easily synthesized, and the total yield was 83%. 2‐Methyl imidazole was chosen as an accelerant to reduce the activation energy for the reaction of FBF with diglycidyl ether of bisphenol A (DGEBA). The DGEBA cured with FBF showed a low glass transition temperature and cross‐linking density compared with those of DGEBA cured with isophorondiamine (IPDA) and 4,4′‐diaminodiphenylmethane (DDM). However, the FBF‐cured DGEBA exhibited a comparable tensile strength with that of the DGEBA‐IPDA and DGEBA‐DDM systems (81.96 MPa) and a significantly higher tensile modulus (1721 MPa) owing to the H‐bonding via oxygens of the phosphorus group of FBF in the network structure. The DGEBA cured with FBF showed a high char yield and a high limitation of oxygen index value (29.7%) compared with those of the IPDA‐ and DDM‐cured ones. The cone calorimeter measurement also showed that the DGEBA‐FBF system had a low heat release rate, total heat release, and smoke production rate, indicating the improved flame retardancy mediated by FBF.     

Improvement of Elastic Modulus and Thermal Stability of Epoxy Resin Using New Curing Agents

New curing agents 2,5-diamino-1,3,4-thiadiazole (DATD) and N-(4-hydroxybenzal) N'(4′-hydroxyphenyl) thiourea (HHPT) were synthesised and characterized using FT-IR, 1H-NMR and 13C-NMR analysis. The curing reactions were studied for the epoxy resin diglycidyl ether of bisphenol-A (DGEBA) using new curing agents along with the conventional aromatic diamine 4,4′-diamino diphenyl methane (DDM) for comparison purpose. The curing profiles of DDM, DATD and DATD/HHPT towards DGEBA were examined by Differential Scanning Calorimetry (DSC). Elastic modulus and thermal stability of the cured resins were evaluated using DMA and TGA analysis. When compared with DDM and DATD, the DATD/HHPT curing system accelerated the curing rate due to the presence of phenol molecules in the HHPT. Furthermore, the DATD/HHPT-cured epoxy resin demonstrated higher elastic modulus along with better thermal stability.     

Morphology,viscoelastic properties,and mechanical behavior of epoxy resin modified with hydroxyl‐terminated poly(ether ether ketone) oligomer with pendent tert‐butyl groups

Hydroxyl‐terminated poly (ether ether ketone) with pendent tert‐butyl groups (PEEKTOH) synthesized from 4,4′‐difluorobenzophenone and tert‐butyl hydroquinone was blended with diglycidyl ether of bisphenol‐A (DGEBA) epoxy resin. A diamine, 4,4′‐diaminodiphenyl sulfone (DDS) was used as the curing agent. The thermal and mechanical properties, fracture toughness, and morphology of the blends were investigated. Morphological analysis of the blends revealed a particulate structure with PEEKTOH phase dispersed in the epoxy matrix. Unlike classical polymer blend systems, increase in concentration of PEEKTOH does not increase the domain size. Instead, a decrease is obtained. The fracture toughness increased with the addition of oligomer without much decrease in tensile and flexural strengths. Addition of 15 phr oligomer gave maximum toughness. The dispersed PEEKTOH initiated several mechanisms that improved the fracture toughness of the blends. The cross‐link density calculated from the storage modulus in the rubbery plateau region decreased with the increase in PEEKTOH. The thermal stability of epoxy resin remained unaffected even after blending with PEEKTOH. POLYM. ENG. SCI., 45:1645–1654, 2005. © 2005 Society of Plastics Engineers     

Synthesis of polysiloxane‐type multifunctional flame retardant and its application in epoxy systems

Polymethyl(3‐glycidyloxypropyl)siloxane (PMGS) was synthesized as a flame‐retardant additive, which were cocured with diglycidyl ether of bisphenol‐A (DGEBA) using 4,4′‐diaminodiphenylsulfone as a curing agent. The structure of PMGS was confirmed through Fourier transform infrared and ¹H‐NMR spectra. The cured products were characterized with dynamic mechanical thermal analysis, thermogravimetric analysis, and oxygen index analyzer. With PMGS incorporated, the cured epoxy resin showed better thermal stability, higher limited oxygen index, and higher char yield. At moderate loading of PMGS, the storage modulus and glass transition temperature of the cured epoxy resin based on neat DGEBA were obviously improved. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Dielectric monitoring of curing of liquid oligomer‐modified epoxy matrices

Dielectric measurements were performed in ‘real‐time’ at several temperatures to follow polymerization reactions on blends of a diglycidyl ether of bisphenol A (DGEBA) epoxy resin with 4, 4′‐diaminodiphenylmethane (DDM) hardener and different amounts of polyoxypropylenetriamine (POPTA) oligomer. These systems exhibit phase separation induced by molar mass increasing through curing of the resin. Monitoring of phase separation and vitrification (related to the α‐relaxation) was performed by this technique. The results are compared with those for the unmodified resin–hardener mixture. The change of the main α‐relaxation with cure time, cure temperature, and amount of modifier was measured for the mixtures. This change of the main relaxation through curing in the frequency domain was indicative of the cure reaction advancement, because of its dependence on the viscosity of the medium. The change of the ionic conductivity during curing was also analysed, showing its dependence upon cure temperature. © 2001 Society of Chemical Industry     

Preparation of 4‐(4‐hydroxyphenoxy)phenol diglycidyl ether with improved toughness behavior

A high‐performance difunctional epoxy resin, 4‐(4‐hydroxyphenoxy)phenol diglycidyl ether (DHPOP), was synthesized by a two‐step method. The curing behavior of DHPOP was investigated by nonisothermal differential scanning calorimetry method and the curing kinetics results revealed that the introduction of ether linkage could improve the activity of epoxy groups, leading to a lower curing temperature and apparent activation energy compared with that of the commercial bisphenol‐A diglycidyl ether (DGEBA). A series of copolymers were then prepared by varying the mass ratio of DHPOP and DGEBA, which were cured with 4,4′‐diaminodiphenyl methane. The effect of DHPOP contents on thermal and mechanical properties and fracture morphology was studied. As expected, with the increase of DHPOP in the network, the impact strength and char yield were significantly enhanced, while the glass transition temperature (T_g) remained unchanged because of the increase of crosslink density. The excellent toughness endows the DHPOP with the promising potential for the application as high‐performance resin matrix. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46458.     

Phthalonitrile‐epoxy blends: Cure behavior and copolymer properties

Binary blends composed of 4,4′‐bis(3,4‐dicyanophenoxy)biphenyl (biphenyl PN) and diglycidyl ether of bisphenol A (epoxy resin) and oligomeric n = 4 phthalonitrile (n = 4 PN) and epoxy resin were prepared. The cure behavior of the blends was studied under dynamic and isothermal curing conditions using differential scanning calorimetry, simultaneous thermogravimetric/differential thermal analysis, infrared spectroscopy, and rheological analysis. The studies revealed that phthalonitrile‐epoxy blends exhibited good processability and that they copolymerized with or without the addition of curing additive. In the absence of curing additive, the blends required higher temperatures and longer cure times. The thermal and dynamic viscoelastic properties of amine‐cured phthalonitrile‐epoxy copolymers were examined and compared with those of the neat epoxy resin. The properties of the epoxy resin improved with increasing biphenyl PN content and with n = 4 PN addition. Specifically, the copolymers exhibited higher glass transition temperatures, increased thermal and thermo‐oxidative stabililty, and enhanced dynamic mechanical properties relative to the commercially available epoxy resin. The results showed that the phthalonitrile‐epoxy blends and copolymers have an attractive combination of processability and high temperature properties. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Novel adamantane‐containing epoxy resin

A novel adamantane‐containing epoxy resin diglycidyl ether of bisphenol‐adamantane (DGEBAda) was successfully synthesized from 1,3‐bis(4‐hydroxyphenyl)adamantane by a one‐step method. The proposed structure of the epoxy resin was confirmed with Fourier transform infrared, ¹H‐NMR, gel permeation chromatography, and epoxy equivalent weight titration. The synthesized adamantane‐containing epoxy resin was cured with 4,4′‐diaminodiphenyl sulfone (DDS) and dicyandiamide (DICY). The thermal properties of the DDS‐cured epoxy were investigated with differential scanning calorimetry and thermogravimetric analysis (TGA). The dielectric properties of the DICY‐cured epoxy were determined from its dielectric spectrum. The obtained results were compared with those of commercially available diglycidyl ether of bisphenol A (DGEBA), a tetramethyl biphenol (TMBP)/epoxy system, and some other associated epoxy resins. According to the measured values, the glass‐transition temperature of the DGEBAda/DDS system (223°C) was higher than that of the DGEBA/DDS system and close to that of the TMBP/DDS system. TGA results showed that the DGEBAda/DDS system had a higher char yield (25.02%) and integral procedure decomposition temperature (850.7°C); however, the 5 wt % degradation temperature was lower than that of DDS‐cured DGEBA and TMBP. Moreover, DGEBAda/DDS had reduced moisture absorption and lower dielectric properties. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Effect of backbone moiety in epoxies on thermal conductivity of epoxy/alumina composite

We chose two commercial epoxies, bisphenol A diglycidyl ether (DGEBA) and 3,3′,5,5′‐tetramethyl‐4,4′‐biphenol diglycidyl ether (TMBP), and synthesized one liquid crystalline epoxy (LCE), 4′4′‐bis(4‐hydroxybenzylidene)‐diaminophenylene diglycidyl ether (LCE‐DP) to investigate the effect of backbone moiety in epoxies on the thermal conductivity of epoxy/alumina composite. The DGEBA structure shows an amorphous state and the TMBP structure displays a crystal phase, whereas the LCE‐DP structure exhibits a liquid crystalline phase. The curing behaviors of them were examined employing 4,4′‐diaminodiphenylsulfone (DDS) as a curing agent. The heat of curing of epoxy resin was measured with dynamic differential scanning calorimetry (DSC). Alumina (Al₂O₃) of commercial source was applied as an inorganic filler. Thermal conductivity was measured by laser flash method and compared with value predicted by two theoretical models, Lewis‐Nielsen and Agari‐Uno. The results indicated that the thermal conductivity of the LCE‐DP structure was larger than that of the commercial epoxy resins such as TMBP and DGEBA and the experimental data fitted quite well in the values estimated by Agari‐Uno model. POLYM. COMPOS., 2013. © 2013 Society of Plastics Engineers     

Porous epoxy monolith prepared via chemically induced phase separation

Macroporous epoxy monolith was prepared via chemically induced phase separation using diglycidyl ether of bisphenol A (DGEBA) as a monomer, 4,4′-diaminodiphenylmethane (DDM) as a curing agent, and epoxy soybean oil (ESO) as a solvent. The morphology of the cured systems after removal of ESO was examined using scanning electron microscopy, and the composition of epoxy precursors/solvent for phase inversion was determined. The phase-separation mechanism was deduced from the optic microscopic images to be spinodal decomposition. The pore structure of the cured monolith was controlled by a competition between the rates of curing and phase separation. The ESO concentration, content of curing agent, and the curing temperature constituted the influencing factors on the porous morphology. The average pore size increased with increasing ESO concentration, increasing curing temperature, and decreasing the content of curing agent.