Electrode effect on resistive switching of Ti-added amorphous SiOx films

Ti-added amorphous SiO_x films were sputter-deposited into stacks of Pt/SiO_x/Pt and Cu/SiO_x/Pt. Optimally prepared Pt/SiO_x/Pt exhibits unipolar resistive switching over 10² cycles, resistance ratio ∼ 10³, yet wide voltage distribution (2 ∼ 7 V for SET, 0.5 ∼ 1.5 V for RESET). Cu/SiO_x/Pt exhibit similar endurance, resistance ratio up to 10⁷, and SET and RESET voltages reduced to 1.8 ∼ 4.2 V and 0.5 ∼ 1 V, respectively. Cu diffusion into SiO_x at the virgin state may play a role in resistive switching of Cu/SiO_x/Pt stack besides of filament conduction. Ti-added amorphous SiO_x films incorporating Cu electrode shows potential for resistive memory.     

Resistive switching characteristics of ytterbium oxide thin film for nonvolatile memory application

This paper studies the effects of both the positive and negative forming processes on the resistive switching characteristics of a Pt/Yb₂O₃/TiN RRAM device. The polarity of the forming process can determine the transition mechanism, either bipolar or unipolar. Bipolar behavior exists after the positive forming process, while unipolar behavior exists after the negative forming process. Furthermore, the bipolar switching characteristics of the Pt/Yb₂O₃/TiN device can be affected by using a reverse polarity forming treatment, which not only reduces the set and reset voltage, but also improves the on/off ratio.     

Unipolar resistive switching characteristics in Co3O4 films

Unipolar resistive switching behavior has been investigated in Pt/Co₃O₄/Pt stacks. The resistance ratio of the high- and low- resistance states is over 5 × 10³. The “ON/OFF” operation of the memory cells can be repeated more than 200 times at room temperature. The resistance of the two states can be kept for more than 16 h without showing degradation. The temperature dependence of the resistance shows a metallic behavior at the low-resistance state, but a semiconductor-behavior at the high-resistance state. The mechanism responsible for the observed unipolar resistive switching behavior has been discussed.     

The deposition and optical properties of Ge1−xCx thin film and infrared multilayer antireflection coatings

The effects of deposition parameters on the deposition rate, microstructure, and composition of Ge_1−xC_x thin films prepared by plasma enhanced chemical vapor deposition were studied and the films' infrared optical properties were investigated. The results show that the carbon content of these films increases as the precursor gas flow ratio of CH₄:GeH₄ increases, while the infrared refractive index of these films decreases from 4 to 2. The deposition rate increases with the radio-frequency power and reaches a constant value when the power goes above 60 W. Ge_1−xC_x/diamond-like carbon infrared antireflection coatings were prepared, and the transmittance of the coatings in the band of 8 to 14 μm was 88%, which is superior to that of Zinc Sulfide substrate by 14%.     

Formation of NiSi2/SiNX compound nanocrystal for nonvolatile memory application

In this paper, the NiSi₂/SiN_X compound NCs (CNCs) structure is studied to further improve the retention. To introduce the nitride based traps, NiSi₂ was also sputtered in the mixture gas of Ar (50 sccm) and NH₃ (10 sccm) at room temperature, and the NiSi₂/SiN_X CNCs can be easily formed after rapid thermal annealing. In addition, standard memory devices with single and double NiSi₂ nanocrystal were also prepared for comparison. By XPS analyses, the nanocrystals fabricated in the ambiance of NH₃ can be confirmed to be composited of NiSi₂ and SiN_X compound. According to memory characteristics results, better retention characteristic of device with single-layer NiSi₂/SiN_X compound nanocrystal NVMs can be observed after 10⁴ s, raises from 50% to 72% in comparison with the control sample, even better than the double-layer NiSi₂ nanocrystal, 58%. Indeed, the formation of NiSi₂/SiN_X CNCs can improve the retention characteristics remarkably due to the additional tunnel barrier and deep traps in the nitride.     

Investigation of the effect of different oxygen partial pressure to LaAlO3 thin film properties and resistive switching characteristics

The pulsed laser deposition and growth of a high-k dielectric lanthanum aluminate LaAlO₃ (LAO) thin film on indium tin oxide/glass substrate at different oxygen partial pressure was studied. Based on the pulsed laser deposition growth mechanism, we explain how a difference in the oxygen partial pressure influences the surface roughness, formation of an interfacial layer, and the transparent resistive switching characteristics of LAO thin films. The micro-structure and oxygen concentration difference inside LAO thin films may be the main reason for the difference in electrical and resistive switching properties. Films grown at higher oxygen partial pressure displayed more reliable resistive switching performance, due to the formation of the interfacial layer and a lower concentration of oxygen vacancies. The interfacial layer serves as a good oxygen reservoir and the involvement of more oxygen ions ensures the switching reliability. The migration of oxygen ions between the interfacial layer and the LAO film under applied bias may be the switching mechanism.     

Titanium Interlayer Mediated Epitaxy of CoSi2 on Si1−xGex

Titanium Interlayer Mediated Epitaxy (TIME) has been shown to promote the formation of epitaxial CoSi₂ on Si (100). Similarities between Si and Si_1−xGe_x alloys have motivated a study of whether the TIME process could be successful in forming epitaxial CoSi₂ on Si_1−xGe_x. Titanium layers of varying thickness were deposited as interlayers between a Co layer and c-Si/Si_0.8Ge_0.2 grown epitaxially onto Si (100) to investigate their role in the formation of epitaxial CoSi₂ on Si_1−xGe_x alloys. The effect of Ti interlayer thickness on the orientation of CoSi₂ to the Si_1−xGe_x substrate, and the conditions under which a polycrystalline CoSi₂ film has been formed have been studied. It was found that Ti was beneficial in promoting epitaxy to the substrate in all cases. The experimental results indicate that with a Ti interlayer thickness of ∼ 50 Å, the formation of epitaxial CoSi₂ adjacent to the substrate was achieved, and pinhole formation was minimized. It was also observed that for increased interlayer thickness, Ti reacted with Si to form a titanium silicide.     

Preparation and characterization of CuIn1 − xGaxSe2 − ySy thin film solar cells by rapid thermal processing

This paper describes the synthesis and characterization of CuIn_1 − xGa_xSe_2 − yS_y (CIGSeS) thin-film solar cells prepared by rapid thermal processing (RTP). An efficiency of 12.78% has been achieved on ~ 2 µm thick absorber. Materials characterization of these films was done by SEM, EDS, XRD, and AES. J-V curves were obtained at different temperatures. It was found that the open circuit voltage increases as temperature decreases while the short circuit current stays constant. Dependence of the open circuit voltage and fill factor on temperature has been estimated. Bandgap value calculated from the intercept of the linear extrapolation was 1.1-1.2 eV. Capacitance-voltage analysis gave a carrier density of 4.0 × 10¹⁵ cm^− 3.     

Plasma deposition of n-SiOx nanocrystalline thin film for enhancing the performance of silicon thin film solar cells

In this paper, we firstly optimized the properties of n-SiO_x nanocrystalline thin film through tuning deposition parameters by plasma enhanced chemical vapor deposition, so that we can actively control the properties of materials obtained. Secondly, we proposed using n-SiO_x/Al as back reflector for amorphous silicon (a-Si:H) solar cells. Compared to Al single-layer as back reflector, adding an n-SiO_x layer into the back reflector could improve the solar cell performance, which not only enhances the short circuit current density by an improvement of spectral response in the wavelength range of 550-750 nm, but also improves the open circuit voltage. With an optimized n-SiO_x/Al back reflector, a-Si:H solar cells with an intrinsic layer thickness of 270 nm show 13.1% enhancement in efficiency. In addition, a-Si:H/μc-Si:H tandem solar cells with n-SiO_x as intermediate reflector were also researched. As a result, it evidently balanced the current matching between top and bottom cell.     

Investigation of SiOxCy film as the encapsulation layer for full transparent OLED using hollow cathode discharge plasma at room temperature

The plasma polymer of SiO_xC_y film has attracted much attention because it could possess both the organic and inorganic properties simultaneously for wide range applications. In this work, a SiO_xC_y film with a gradient composition through tuning the N₂O/N₂O + Ar ratio from 0% to 100% was used for TOLED encapsulation using hollow cathode discharge plasma. In order to confirm whether the plasma damage was caused during the PECVD process, a ZnO buffer layer prepared using RF sputtering was deposited before encapsulation. Furthermore, the reference samples with glass lid encapsulation were also used for comparison. The results showed that the SiO_xC_y film with a gradient composition cooperated with the sputtering ZnO buffer layer was a simple and effective method for TOLED encapsulation.     

Influence of Se on the electron mobility in thermal evaporated Bi2(Te1−xSex)3 thin films

Thermoelectric solid solutions of Bi₂ (Te_1−xSe_x)₃ with x = 0, 0.2, 0.4, 0.6, 0.8 and 1 were grown using the Bridgman technique. Thin films of these materials of different compositions were prepared by conventional thermal evaporation of the prepared bulk materials. The temperature dependence of the electrical conductivity σ, free carriers concentration n, mobility μ_H, and seebeck coefficient S, of the as-deposited and films annealed at different temperatures, have been studied at temperature ranging from 300 to 500 K. The temperature dependence of σ revealed an intrinsic conduction mechanism above 400 K, while for temperatures less than 400 K an extrinsic conduction is dominant.The activation energy, ΔE, and the energy gap, E_g, were found to increase with increasing Se content. The variation of S with temperature revealed that the samples with different compositions x are degenerate semiconductors with n-type conduction. Both, the annealing and composition effects on Hall constant, R_H, density of electron carriers, n, Hall mobility, μ_H, and the effective mass, m^∗/m₀ are studied in the above temperature range.     

Structural study of Si1 − xGex nanocrystals embedded in SiO2 films

We have investigated the structural properties of Si_1 − xGe_x nanocrystals formed in an amorphous SiO₂ matrix by magnetron sputtering deposition. The influence of deposition parameters on nanocrystal size, shape, arrangement and internal structure was examined by X-ray diffraction, Raman spectroscopy, grazing incidence small angle X-ray scattering, and high resolution transmission electron microscopy. We found conditions for the formation of spherical Si_1 − xGe_x nanocrystals with average sizes between 3 and 13 nm, uniformly distributed in the matrix. In addition we have shown the influence of deposition parameters on average nanocrystal size and Ge content x.     

Luminescence properties of Eu ions doped in Y2−xGdxO3 thin films grown by pulsed laser deposition method

Luminescence properties of Y_2−xGd_xO₃:Eu³⁺ (x = 0 to 2.0) thin films are investigated by site-selective laser excitation spectroscopy. The films were grown by pulsed laser deposition method on SiO₂ (100) substrates. Cubic phase Y₂O₃ and Gd₂O₃ and monoclinic phase Gd₂O₃ are identified in the excitation spectrum of the ⁷F₀ → ⁵D₀ transition of Eu³⁺. The emission spectra of the ⁵D₀ → ⁷F_J (J = 1 and 2) transition from individual Eu³⁺ centers were obtained by tuning the laser to resonance with each excitation line. The excitation line at around 580.60 nm corresponds to the line from Eu³⁺ with C₂ site symmetry of cubic phase. New lines at 578.65 and 582.02 nm for the C_S sites of Gd₂O₃ with monoclinic phase are observed by the incorporation of Gd in Y₂O₃ lattice. Energy transfer occurs between Eu³⁺ ions at the C_S sites and from Eu³⁺ ions at the C_S sites to those at the C₂ site in Y_2−xGd_xO₃.     

Effect of additive gases on the selective etching of ZrOx film using inductively coupled BCl3-based plasmas

In this study, the effect of BCl₃/C₄F₈ gas mixture on the ZrO_x etch rates and the etch selectivities of ZrO_x/Si were investigated and its etch mechanism was studied. The increase of C₄F₈ in BCl₃/C₄F₈ decreased the silicon etch rate significantly and finally deposition instead of etching occurred by mixing C₄F₈ more than 3%. In the case of ZrO_x, the etch rate remained similar until 4% of C₄F₈ was mixed, however, the further increase of C₄F₈ percentage finally decreased the ZrO_x etch rate and deposition instead of etching occurred by mixing more than 6%. Therefore, by mixing 3-4% of C₄F₈ to BCl₃, infinite etch selectivity of ZrO_x/Si could be obtained while maintaining the similar ZrO_x etch rate. The differences in the etch behaviors of ZrO_x and Si were related to the different thickness of C-F polymer formed on the surfaces. The thickness of the C-F polymer on the ZrO_x surface was smaller due to the removal of carbon incident on the surface by forming CO_x with oxygen in ZrO_x. Using 12 mTorr BCl₃/C₄F₈ (4%), 700 W of rf power, and − 80 V of dc bias voltage, the ZrO_x etch rate of about 535 Å/min could be obtained with infinite etch selectivity to Si.     

Dye-sensitized solar cells composed of Ti1−xSnxO2 nanocrystals

Ti_1−xSn_xO₂ nanocrystals were successfully synthesized by using a simple solvothermal route, and its band energy gap broaden and flat band potential can be rationally regulated with increasing x value. Furthermore, Ti_1−xSn_xO₂ nanocrystals were first used as the photoelectrode material for dye-sensitized solar cells. A cell made of Ti_1−xSn_xO₂ (x = 0.3) exhibited the best photovoltaic performance. This is due to its most narrow band gap energies, most negative flat band potential and lowest dark current densities. After the surface of Ti_1−xSn_xO₂ (x = 0.3) electrode was treated with TiCl₄ solution, the cell sensitized by a mixed solution of N719 and D131 dye exhibited the best efficiency of 4.64% under the illumination of 1 sun (AM1.5, 100 mW cm⁻²).     

Controlling temperature coefficient of resistivity in La1−xSrxMnO3 ceramics

We propose La_1−xSr_xMnO₃ as a new lead-free and ruthenium-free conductive oxide used for thick film resistors. The temperature coefficient of resistivity (TCR) of the La_1−xSr_xMnO₃ was controlled systematically by changing the composition x. The TCR behavior depended on the change of the crystal symmetries and the average valence of Mn ions. The highest value of 9356 ppm/°C was obtained at the x = 0.35. Zero TCR was realized around 0.200 < x < 0.225 and 0.45 < x < 0.50, where the critical x values were related to the characteristic change from Mott-insulator to metallic behavior. The systematical controlling TCR and the zero TCR are the first to be demonstrated for conductive oxide.     

Electrical properties of lead-free thick film NTC thermistors based on perovskite-type BaCoxCo2xBi1 − 3xO3

Lead-free thick film negative temperature coefficient (NTC) thermistors based on perovskite-type BaCo^II_xCo^III_2xBi_1 − 3xO₃ (x ≤ 0.1) were prepared by mature screen-printing technology. The microstructures of the thick films sintered at 720 °C were examined by X-ray diffraction and scanning electron microscopy. The electrical properties were analyzed by measuring the resistance-temperature characteristics. For the BaBiO₃ thick films, the room-temperature resistivity is 0.22 MΩ cm, while the room-temperature resistivity is sharply decreased to about 3 Ω cm by replacing of Bi with a small amount of Co. For compositions 0.02 ≤ x ≤ 0.1, the values of room-temperature resistivity (ρ₂₃), thermistor constant (B_25/85) and activation energy are in the range of 1.995-2.975 Ω cm, 1140-1234 K and 0.102-0.111 eV, respectively.     

Microstructure and mechanical properties of CrAlN/SiNx nanostructure multilayered coatings

Multilayered CrAlN and SiN_x films were deposited periodically by radio frequency reactive magnetron sputtering. In the CrAlN/SiN_x multilayered coatings, the thickness of CrAlN layer was fixed at 4 nm, while that of SiN_x layer was adjusted from 4 nm to 0.3 nm. The dependence of the SiN_x layer thickness on the preferred orientation, crystalline behavior and mechanical properties of multilayered coatings were discussed with the aid of XRD patterns and HRTEM. It was demonstrated that amorphous SiN_x layer transformed to a crystallized one when the thickness decreased from 4 nm to 0.3 nm. The crystalline SiN_x layer grew epitaxially, formed the coherent interface with the CrAlN layer, and the columnar structure was exhibited. The critical layer thickness for the transition from amorphous SiN_x to a crystallized one was found to be around 0.4 nm, and maximum hardness of 33 GPa was revealed.     

Resistance switching properties of molybdenum oxide films

Resistive random access memory (ReRAM) properties in which the resistance of the insulating material drastically changes by voltage application have recently attracted much attention. In this work, molybdenum oxide prepared by thermal oxidation of Mo films was studied to investigate its potential as a material exhibiting ReRAM switching. The samples oxidized between 400 and 600 °C were composed of MoO₃ and were switchable. Current-to-voltage curves, which were measured in air at room temperature by using a Pt-Ir probe as the top electrode, indicated the yielding of both the monopolar and bipolar switching properties. The resistance on-off ratio was between 10 and 10².     

Unipolar resistive switching behavior in Dy2O3 films for nonvolatile memory applications

In this article, we report the forming-free resistive switching behavior of a Ru/Dy₂O₃/TaN memory device incorporating a Dy₂O₃ thin film fabricated entirely through processing at room temperature. We used X-ray diffraction, secondary ion mass spectrometry, and X-ray photoelectron spectroscopy to investigate the structural and chemical features of the Dy₂O₃ film. The dominant conduction mechanisms in the low- and high-resistance states were ohmic behavior and Poole-Frenkel emission, respectively. The Ru/Dy₂O₃/TaN memory device exhibited a high resistance ratio and provided nondestructive readout and reliable data retention. This memory device has a great potential for application in nonvolatile resistive switching memory.