Influence of N2 flow rate on the mechanical properties of SiNx films deposited by microwave electron cyclotron resonance magnetron sputtering

Hydrogen-free amorphous silicon nitride (SiN_x) films were deposited at room temperature by microwave electron cyclotron resonance plasma-enhanced unbalance magnetron sputtering. Varying the N₂ flow rate, SiN_x films with different properties were obtained. Characterization by Fourier-transform infrared spectrometry revealed the presence of Si-N and Si-O bonds in the films. Growth rates from 1.0 to 4.8 nm/min were determined by surface profiler. Optical emission spectroscopy showed the N element in plasma mainly existed as N⁺ species and N₂⁺ species with 2 and 20 sccm N₂ flow rate, respectively. With these results, the chemical composition and the mechanical properties of SiN_x films strongly depended on the state of N element in plasma, which in turn was controlled by N₂ flow rate. Finally, the film deposited with 2 sccm N₂ flow rate showed no visible marks after immersed in etchant [6.7% Ce(NH₄)₂(NO₃)₆ and 93.3% H₂O by weight] for 22 h and wear test for 20 min, respectively.     

Effect of NH3 flow rate on growth, structure and luminescence of amorphous silicon nitride films by electron cyclotron resonance plasma

In this paper, hydrogenated amorphous silicon nitride (a-SiN_x:H) films have been deposited using an electron cyclotron resonance chemical vapor deposition system. The effect of NH₃ flow rate R on the deposition rate, structure and luminescence were studied using various techniques such as optical emission spectroscopy, Fourier Transform Infrared absorption (FTIR), X-ray photoelectron spectroscopy (XPS) and fluoro-spectroscopy, respectively. Optical emission behavior of SiH₄ + NH₃ plasma shows that atomic Si radical concentration determines the film deposition rate. Structural transition of a-SiN_x film from Si-rich one to near-stoichiometric/N-rich one with R was revealed by FTIR and the two phase separation of a-Si and a-Si₃N₄ was also convinced in Si-rich SiN_x films by XPS. Either photo- or electroluminescence for all the SiN_x films with R > 3 sccm shows a strong light emission in visible light wavelength range. As R < 6 sccm, recombination of electrons and holes in a-Si quantum dots is the main mechanism of photo/electroluminescence for Si-rich SiN_x films, however, for photoluminescence, gap states' luminescence is also in competition; as R > 6 sccm, light emission of the SiN_x film originates from defect states in its band gap.     

Characterization of SiNx:H films deposited by rapid thermal chemical vapor deposition

Hydrogenated silicon nitride films were deposited with NH₃, SiH₄ and N₂ gas mixture at 700 °C by rapid thermal chemical vapor deposition (RTCVD) system. The NH₃/N₂ flow ratio and deposition pressure are found to influence the film properties. The stress of SiN_x:H films deposited by RTCVD is tensile, which can reach ~ 1.5 GPa in our study. The stress of SiN_x:H films is dependent on the deposition parameters, which can be associated with chemical configuration of the film. It is suggested that the presence of hydrogen atoms will relax the Si-N network, which results in the decrease of tensile stress of the SiN_x:H film.     

Effect of pulse duration on characteristics of modulated radio-frequency SiH4/N2/NH3 discharges

A one-dimensional fluid model is developed to investigate the behavior of plasma in the afterglow of pulsed voltage modulated SiH₄/N₂/NH₃ discharges at radio-frequency (400 kHz), which are used for the deposition of silicon nitride (SiN_x) films. The model incorporates particle balances, electron energy balance, and Poisson's equation, allowing the equations solved self-consistently. The current work is an attempt to understand the effect of duty cycle on the characteristics of silicon nitride (SiN_x) films. Therefore, the influences of duty cycle on the plasma density, electron temperature, and ion energy at the powered electrode were carefully discussed. We find that by decreasing the duty cycle, the negative ions can be able to escape during the off-time, and the positive ion energy is effectively decreased. On the other hand, the positive ion density is slightly decreased.     

Microstructure and mechanical properties of CrAlN/SiNx nanostructure multilayered coatings

Multilayered CrAlN and SiN_x films were deposited periodically by radio frequency reactive magnetron sputtering. In the CrAlN/SiN_x multilayered coatings, the thickness of CrAlN layer was fixed at 4 nm, while that of SiN_x layer was adjusted from 4 nm to 0.3 nm. The dependence of the SiN_x layer thickness on the preferred orientation, crystalline behavior and mechanical properties of multilayered coatings were discussed with the aid of XRD patterns and HRTEM. It was demonstrated that amorphous SiN_x layer transformed to a crystallized one when the thickness decreased from 4 nm to 0.3 nm. The crystalline SiN_x layer grew epitaxially, formed the coherent interface with the CrAlN layer, and the columnar structure was exhibited. The critical layer thickness for the transition from amorphous SiN_x to a crystallized one was found to be around 0.4 nm, and maximum hardness of 33 GPa was revealed.     

Effect of grain size on mechanical properties in CrAlN/SiNx multilayer coatings

Both CrAlN and SiN_x coatings were deposited sequentially by RF magnetron sputtering. During sputtering, thickness of SiN_x layer was set to be 1 nm, while that of CrAlN layer was controlled to be 4, 20, 40, 100, and 200 nm. According to XRD results, it was revealed that grain size of the CrAlN coatings increased from 3.6 nm to 24.2 nm with the increasing thickness. From HRTEM images, the variation on grain size was attributed to the amorphous SiN_x layer, which significantly retarded the continuous growth of CrAlN layer. Hardness of the CrAlN/SiN_x coatings with various bilayer thicknesses was measured by nanoindentation. The relationship between grain size and hardness could be interpreted by the Hall-Petch equation, and an improved hardness around 32 GPa was achieved.     

Deep level transient spectroscopy on charge traps in high-k ZrO2

The deep trap properties of high-dielectric-constant (k) ZrO₂ thin films were examined by deep level transient spectroscopy (DLTS). The hole traps of a ZrO₂ dielectric deposited by sputtering were investigated in a MOS structure over the temperature range, 375 K-525 K. The potential depth, cross section and concentration of hole traps were estimated to be ∼ 2.5 eV, ∼ 1.8 × 10^− 16 cm² and ∼ 1.0 × 10¹⁶ cm^− 3, respectively. DLTS of ZrO₂ dielectrics can be used to examine the threshold voltage shift (?V_th) during the operation of SONOS-type flash memory devices, which employ high-k materials.     

Structural study of Si1 − xGex nanocrystals embedded in SiO2 films

We have investigated the structural properties of Si_1 − xGe_x nanocrystals formed in an amorphous SiO₂ matrix by magnetron sputtering deposition. The influence of deposition parameters on nanocrystal size, shape, arrangement and internal structure was examined by X-ray diffraction, Raman spectroscopy, grazing incidence small angle X-ray scattering, and high resolution transmission electron microscopy. We found conditions for the formation of spherical Si_1 − xGe_x nanocrystals with average sizes between 3 and 13 nm, uniformly distributed in the matrix. In addition we have shown the influence of deposition parameters on average nanocrystal size and Ge content x.     

Three-dimensional supercapacitors composed of Ba0.65Sr0.35TiO3 (BST)/NiSi2/silicon microchannel plates

Three-dimensional (3D) supercapacitors consisting of Ba_0.65Sr_0.35TiO₃ (BST)/NiSi₂/silicon microchannel plate (MCP) stacked structure have been fabricated. The silicon MCP produced by electrochemical etching is utilized as a backbone of the 3D structure on which a nickel silicide current collector layer and Ba_0.65Sr_0.35TiO₃ dielectric layer are deposited successively by electroless plating and the sol-gel method, respectively. The morphology and structure of the 3D BST/NiSi₂/Si-MCP structure are characterized by scanning electron microscopy (SEM) and X-ray diffraction (XRD) and the electrochemical properties are determined by cyclic voltammetry (CV) and chronopotentiometry. The structure exhibits excellent capacitive behavior with a maximum capacitance of 784 F g⁻¹. After 700 charging/discharging cycles, the C_f decreases slightly with only a 5.7% loss and is stable after more than 700 cycles. The BST/NiSi₂/Si-MCP 3D structure is a potential supercapacitor in industrial applications.     

Excellent passivation effect of Cat-CVD SiNx/i-a-Si stack films on Si substrates

We have demonstrated that the surface recombination velocity can be lowered to as low as 1.3 cm/s for n-type c-Si wafers and to 9.0 cm/s for p-type wafers by using amorphous Si (a-Si) and Si nitride (SiN_x) stacked films prepared by catalytic chemical vapor deposition (Cat-CVD). These values are much lower than those of c-Si wafers passivated by same stacked structures formed by low-damage remote plasma-enhanced CVD (PECVD). It is revealed that Cat-CVD a-Si insertion layers play an important role to improve interface quality, and also SiN_x films are also essential for reducing the surface recombination velocity down to such low levels.     

Investigation of optical and compositional properties of thin SiNx:H films with an enhanced growth rate by high frequency PECVD method

Hydrogenated thin silicon nitride (SiN_x:H) films were deposited by high frequency plasma enhanced chemical vapor deposition techniques at various NH₃ and SiH₄ gas flow ratios [R = NH₃/(SiH₄ + NH₃)], where the flow rate of NH₃ was varied by keeping the constant flow (150 sccm) of SiH₄. The deposition rate of the films was found to be 7.1, 7.3, 9 and 11 Å/s for the variation of R as 0.5, 0.67, 0.75 and 0.83, respectively. The films were optically and compositionally characterized by reflectance, photoluminescence, infrared absorption and X-ray photoelectron spectroscopy. The films were amorphous in nature and the refractive indices of the films were varied between 2.46 and 1.90 by changing the gas flow ratio during the deposition. The PL peak energy was increased and the linear band tails become broad with the increase in R. The incorporation of nitrogen takes place with the increase in R.     

Protection of organic light-emitting diodes over 50 000 hours by Cat-CVD SiNx/SiOxNy stacked thin films

Silicon oxynitride (SiO_xN_y) films have been formed by adding proper amount of oxygen gas to usual forming condition of silicon nitride (SiN_x) films in catalytic chemical vapor deposition (Cat-CVD) method. The composition and refractive index of the film can be systematically controlled by changing oxygen flow rate. Organic light-emitting diodes (OLEDs) covered with SiN_x/SiO_xN_y stacked films have been completely protected from damage due to oxygen and moisture and their initial emission intensity is maintained over 1000 hours under 60 °C and 90% RH, which is equivalent to 50 000 hours in normal temperature and humidity conditions.     

Structure and mechanical properties of ZrO2 films deposited by gas flow sputtering

ZrO₂ films were deposited by reactive gas flow sputtering (GFS) where voltage is applied to a cyindrical hollow-cathode target from a DC source, the discharge being produced at relatively high sputtering pressure. In this system, secondary electrons form a major component of the total current flow and lead to heating of the substrate which in turn has an effect on the properties of deposited films. The present experiments were carried out under the following conditions: Ar gas flow rate of 200 sccm, O₂ flow rate FO₂ in the range between 0.003 and 1 sccm, and sputtering power (P_S) in the range of 50-800 W. The reults showed that the crystal structure of the films deposited for P_S below 200 W was monoclinic but for P_S above 400 W, the films included tetragonal cystals of stable structure formed at high temperature by the electron bombardment. The films were formed with grains of 20-100 nm in diameter in a porous structure. The mechanical properties of the films were determined by a nanoindentation technique. Martens hardness (H_M) of the porous films was found to be in the range between 220 and 330 MPa which is substantially less than that of films typically deposited by rf magnetron sputtering.     

Interconnect and contact for nanoelectronics: Metallic TaSi2 nanowires

TaSi₂ nanowires have been synthesized on Si substrate by annealing FeSi₂ thin film and NiSi₂ films at 950 °C in an ambient containing Ta vapor whose length would be grown up to 13 μm. The metallic TaSi₂ nanowires exhibit excellent electrical properties with remarkable high failure current density of 3 × 10⁸ A cm^− 2. In addition, the growth mechanism is addressed in detail, The TaSi₂ nanowires are formed in three steps: segregation of Si atoms from the FeSi₂ thin film and NiSi₂ films underlayer to form Si base, growth of TaSi₂ nanodots on Si base, and elongation of TaSi₂ nanowire along the growth direction. This simple approach promises future applications in nanoelectronics and nano-optoelectronics.     

Annealing optimization of silicon nitride film for solar cell application

Hydrogenated films of silicon nitride (SiNx:H) is commonly used as an antireflection coating as well as passivation layer in crystalline silicon solar cell. SiNx:H films deposited at different conditions in Plasma Enhanced Chemical Vapor Deposition (PECVD) reactor were investigated by varying annealing condition in infrared (IR) heated belt furnace to find the optimized condition for the application in silicon solar cells. By varying the gases ratio (R = NH₃/SiH₄ + NH₃) during deposition, the SiNx:H films of refractive indices 1.85-2.45 were obtained. Despite the poor deposition rate, the silicon wafer with SiNx:H film deposited at 450 °C showed the best effective minority carrier lifetime. The film deposited with the gases ratio of 0.57 shows the best peak of carrier lifetime at the annealing temperature of 800 °C. The single crystalline silicon solar cells fabricated in conventional industrial production line applying the optimized film deposition and annealing conditions on large area substrates (125 mm × 125 mm) were found to have the conversion efficiencies as high as 17.05 %. Low cost and high efficiency single crystalline silicon solar cells fabrication sequence employed in this study has also been reported in this paper.     

Dielectric and electric studies of the [N(CH3)4][N(C2H5)4]ZnCl4 compound at low temperature

The [N(CH₃)₄][N(C₂H₅)₄]ZnCl₄ compound was prepared and characterized by electrical technique. The temperature dependence of the dielectric permittivity shows that this compound is ferroelectric below T = 268 K. The two semi-circles observed in the complex impedance identify the presence of the grain interior and grain boundary contributions to the electrical response in the material. The equivalent circuit is modeled by a combination series of two parallel R_P–CPE circuits. The frequency dependent conductivity is interpreted in term of Jonscher's law. The modulus plots can be characterized by the empirical Kohlrausch–Williams–Watts (K.W.W.) function: ?(t) = exp [(−t/τ)^β]. The temperature dependence of the alternative current conductivity (σ_p), direct current conductivity (σ_dc) and the relaxation frequency (f_p) confirm the presence of the ferroelectric–paraelectric phase transition.     

Amorphous In-Ga-Zn-O thin-film transistor with coplanar homojunction structure

Amorphous In-Ga-Zn-O (a-IGZO) thin-film transistors (TFTs) with a coplanar homojunction structure are demonstrated. The coplanar source and drain regions made of a-IGZO were formed by depositing a hydrogenated silicon nitride (SiN_X:H) layer onto the a-IGZO layer. The a-IGZO regions on which the SiN_X:H layer was directly deposited showed the low resistivity of 4.7 × 10⁻³  Ω cm and degenerated conduction. The fabricated TFT showed excellent transfer and output characteristics with a field-effect mobility of 11 cm² V^− 1 s^− 1, a subthreshold swing of 0.17 V decade^− 1, and an on-to-off current ratio larger than 1 × 10⁹. The width-normalized source-to-drain resistance (R_sdW) calculated using a channel resistance method was 51 Ω cm. This TFT also showed good stability over environment change and under electrical stress.     

Synthesis and crystal sructure of a new dihydrogenomonophosphate (4-C2H5C6H4NH3)H2PO4

Chemical preparation, crystal structure, calorimetric, and spectroscopic investigations are given for a new organic-cation dihydrogenomonophosphate, (4-C₂H₅C₆H₄NH₃)H₂PO₄ in the solid state. This compound crystallizes in the orthorhombic space group Pbca with the following unit cell parameters: a=8.286(3) Å, b=9.660(2) Å, c=24.876(4) Å, Z=8, V=1991.2(7) Å³, and D_X=1.442 g cm⁻³. Crystal structure was solved with a final R=0.054 for 3305 independent reflections. The atomic arrangement coaled described as H₂PO₄⁻ layers between which are located the 4-ethylanilinium cations.     

The etching characteristics of Al2O3 thin films in an inductively coupled plasma

In this study, the etching characteristics of ALD deposited Al₂O₃ thin film in a BCl₃/N₂ plasma were investigated. The experiments were performed by comparing the etch rates and the selectivity of Al₂O₃ over SiO₂ as functions of the input plasma parameters, such as the gas mixing ratio, the DC-bias voltage, the RF power, and the process pressure. The maximum etch rate was obtained at 155.8 nm/min under a 15 mTorr process pressure, 700 W of RF power, and a BCl₃ (6 sccm)/N₂ (14 sccm) plasma. The highest etch selectivity was 1.9. We used X-ray photoelectron spectroscopy (XPS) to investigate the chemical reactions on the etched surface. Auger electron spectroscopy (AES) was used for the elemental analysis of the etched surfaces.     

Promotional effects of carbon nanotubes on V2O5/TiO2 for NOX removal

A series of V₂O₅/TiO₂-carbon nanotube (CNT) catalysts were synthesized by sol-gel method, and their activities for NO_X removal were compared. A catalytic promotional effect was observed by adding CNTs to V₂O₅/TiO₂. The catalyst V₂O₅/TiO₂-CNTs (10 wt.%) showed an NO_X removal efficiency of 89% at 300 °C under a GHSV of 22,500 h⁻¹. Based on X-ray diffraction, scanning electron microscopy, X-ray photoelectron spectroscopy, Raman spectroscopy, NH₃-temperature-programmed desorption, temperature-programmed reduction, Brunauer-Emmett-Teller surface area measurements, differential scanning calorimetry, and thermogravimetric analysis, the increased acidity and reducibility, which could promote NH₃ adsorption and oxidation of NO to NO₂, respectively, contributed to this promotion.