Formation of low-resistance and transparent indium tin oxide ohmic contact for high-brightness GaN-based light-emitting diodes using a Sn–Ag interlayer

We report on the formation of low-resistance and highly transparent indium tin oxide (ITO) ohmic contacts to p-GaN using a Sn–Ag alloy interlayer. Although the as-deposited Sn–Ag(6 nm)/ITO(200 nm) contacts show non-ohmic behaviors, the scheme becomes ohmic with specific contact resistance of 4.72×10⁻⁴ Ω cm² and produce transmittance of ∼91% at wavelength of 460 nm when annealed at 530 °C. Blue light-emitting diodes (LEDs) fabricated with the Sn–Ag/ITO contacts give forward-bias voltage of 3.31 V at injection current of 20 mA. LEDs with the Sn–Ag/ITO contacts show the improvement of the output power by 62% (at 20 mA) compared with LEDs with Ni/Au contacts.     

Effect of Al:Ag alloy cathode on the performance of transparent organic light-emitting devices

Transparent organic light-emitting devices (TOLEDs) based on a stacked alloy cathode of LiF/Al:Ag are investigated. The devices have a structure of indium-tin-oxide (ITO)/4,4′,4′′-Tris[2-naphthyl(phenyl)amino]triphenylamine (2T-NATA) (25 nm)/N,N''-Di-[(1-naphthyl)-N,N''-diphenyl]-1,1''-biphenyl-4,4''-diamine (NPB) (40 nm)/tris-(8-hydroxyquinoline) aluminum (Alq3) (50 nm)/LiF (1 nm)/Al:Ag (1:3) (x), where the thicknesses of cathode metal layers (Al:Ag) are adjusted, respectively, from 70 nm to 100 nm. In the experiment, it is found that the LiF (1 nm)/Al:Ag (1:3) (75 nm) has good electron injection efficiency. Compared with an Al-only cathode, the turn-on voltage is lowered. At the voltage of 10 V, the luminances for bottom emission from ITO anode side and top emission from metal cathode side are 2 459 cd/m2 and 1 729 cd/m2, respectively. Thanks to electron injection enhancement by using Al:Ag cathode, we can obtain a better energy level matching between the cathode and the organic layer, thus the devices have lower turn-on voltage and higher luminance. The total transmittance of the devices can achieve about 40% at the wavelength of 550 nm.     

Iridium-based semi-transparent current spreading layer on short-period-superlattice (SPS) tunneling contact of InGaN/GaN LEDs

Iridium-containing and Ni(4 nm)/Au(6 nm) films were evaporated separately on the n⁺-InGaN–GaN short-period-superlattice (SPS) structure of light-emitting diodes (LEDs). The collective deposition of iridium and other metals as an ohmic contact induces the formation of highly transparent IrO₂, which helps to enhance the light output and decrease the series resistance of LEDs. By comparing different metal films used as current spreading contact layer, Ir/Ni film annealed at 500 °C for 20 min in O₂ ambient renders devices with lowest turn-on voltage at 20 mA and highest luminous intensity. Moreover, we also analyzed films using atomic force microscopy (AFM) with an emphasis on studying how the surface quality of Ir/Ni and Ni/Au films influences the current spreading and luminosity of LEDs.     

Ambipolar Conductive 2,7‐Carbazole Derivatives for Electroluminescent Devices

A series of 2,7‐disubstituted carbazole (2,7‐carb) derivatives incorporating arylamines at the 2 and 7 positions are synthesized via palladium‐catalyzed C–N or C–C bond formation. These compounds possess glass transition temperatures ranging from 87 to 217 °C and exhibit good thermal stabilities, with thermal decomposition temperatures ranging from 388 to 480 °C. They are fluorescent and emit in the purple‐blue to orange region. Two types of organic light emitting diodes (OLEDs) were constructed from these compounds: (I) indium tin oxide (ITO)/2,7‐carb (40 nm)/1,3,5‐tris(N‐phenylbenzimidazol‐2‐yl)benzene (TPBI, 40 nm)/Mg:Ag; and (II) ITO/2,7‐carb (40 nm)/tris(8‐hydroxyquinoline) aluminum (Alq₃, 40 nm)/Mg:Ag. In type I devices, the 2,7‐disubstituted carbazoles function as both hole‐transporting and emitting material. In type II devices, light is emitted from either the 2,7‐disubstituted carbazole layer or Alq₃. The devices appear to have a better performance compared to devices fabricated with their 3,6‐disubstituted carbazole congeners. Some of the new compounds exhibit ambipolar conductive behavior, with hole and electron mobilities up to 10^–4 cm² V^–1 s^–1.     

Nitride-based light-emitting diodes with Ni/ITO p-type ohmic contacts

The optical and electrical properties of Ni(5 nm)-Au(5 nm) and Ni(3.5 nm)-indium tin oxide (ITO) (60 nm) films were studied. It was found that the normalized transmittance of Ni/ITO film could reach 87% at 470 nm, which was much larger than that of the Ni-Au film. It was also found that the specific contact resistance was 5 /spl times/ 10/sup -4/ /spl Omega/ /spl middot/ cm/sup 2/ and 1 /spl times/ 10/sup -3/ /spl Omega/ /spl middot/ cm/sup 2/, respectively, for Ni-Au and Ni/ITO on p-GaN. Furthermore, it was found that the 20 mA output power of light-emitting diode (LED) with Ni-Au p-contact layer was 5.26 mW. In contrast, the output power could reach 6.59 mW for the LED with Ni/ITO p-contact layer.     

Au-Doped Indium Tin Oxide Ohmic Contacts to <Emphasis Type="Italic">p</Emphasis>-Type GaN

Indium tin oxide (ITO) thin films doped with Au, Ni, or Pt (3.5 at.% to 10.5 at.%) were deposited on p-GaN epilayers (Mg ~4 × 10¹⁹ cm⁻³) using direct-current (DC) sputter codeposition. It was found that undoped ITO con- tacts to p-GaN exhibited leaky Schottky behavior, whereas the incorporation of a small amount of Au (3.5 at.% to 10.5 at.%) significantly improved their ohmic characteristics. Compared with standard Ni/ITO contacts, the Au-doped ITO contacts had a similar specific contact resistance in the low 10⁻² Ω cm⁻² range, but were more stable above 600°C and more transparent at blue wavelengths. These results provide support for the use of Au-doped ITO ohmic contact to p-type GaN in high-brightness blue light-emitting diodes.     

ITO-free,efficient, and inverted phosphorescent organic light-emitting diodes using a WO3/Ag/WO3 multilayer electrode

We present an indium tin oxide (ITO)-free, bottom-emission inverted phosphorescent organic light-emitting diode (PHOLED) with a maximum luminance of 280,000 cd/m² at 8 V, total maximum current efficiency of 81.4 cd/A, and external quantum efficiency of 22.4%. The inverted OLED structure is composed of glass/WO₃ (30 nm)/Ag (15 nm)/WO₃ (5 nm)/BPhen:15wt% CS₂CO₃ (5 nm)/BPhen (30 nm)/CBP: 8wt% Ir(ppy)₃ (10 nm)/TAPC (50 nm)/WO₃ (5 nm)/Ag (150 nm) multilayers. In this device structure, the WO₃/Ag/WO₃ (WAW) multilayer serving as a transparent cathode demonstrates a low sheet resistance (3.5 Ω/sq) and high optical transmittance (approximately 80%) in a visible light range of 400–600 nm; this multilayer was prepared by thermal evaporation to form a relatively smooth morphology of the conductive thin film on the glass substrate. In addition, an electron-only WAW device was subjected to electrical characterization, and the results revealed that this device exhibited a more efficient electron injection property at the WAW/BPhen:CS₂CO₃ interface than the contact electrode of a standard ITO-based device.     

Improvement of the electrical performance of near UV GaN-based light-emitting diodes using Ni nanodots

We report on the improvement of the electrical characteristics of GaN-based light-emitting diodes (LEDs) fabricated with Ag (1 nm)/indium tin oxide (ITO) (250 nm) p-type contacts by using Ni nanodots. As-deposited Ag/ITO contacts with and without the Ni nanodots give non-linear electrical behaviour. However, annealing the samples at 530–630 °C for 1 min in air results in ohmic behaviour. The reverse leakage current characteristics of near UV LEDs are much improved when the Ni nanodots are used. The output power (at 20 mA) of LEDs fabricated with the Ni nanodots is enhanced by a factor of 1.34 as compared with that of LEDs made without the Ni nanodots.     

AlGaInN-based light emitting diodes with a transparent <Emphasis Type="Italic">p</Emphasis>-contact based on thin ITO films

A method for obtaining transparent conductive ITO (indium-tin oxide) films aimed for use in light emitting diodes of the blue spectral range is developed. The peak external quantum efficiency of light-emitting diodes with a p-contact based on the obtained films reaches 25%, while for similar light-emitting diodes with a standard semitransparent metal contact, it is <10%. An observed increase in the direct voltage drop from 3.15 to 3.37 V does not significantly affect the possibility of applying these films in light-emitting diodes since the optical power of light-emitting diodes with a transparent p-contact based on ITO films exceeds that of chips with metal semitransparent p-contacts with a working current of 20 mA by a factor of almost 2.5. Light-emitting diodes with p-contacts based on ITO films successfully withstand a pumping current that exceeds their calculated working current by a factor of 5 without the appearance of any signs of degradation.     

Organic Photovoltaic Cells Based On Solvent‐Annealed,Textured Titanyl Phthalocyanine/C60 Heterojunctions

Organic photovoltaic cells (OPV) with good near‐IR photoactivity are created from highly textured titanyl phthalocyanine (TiOPc)/C₆₀ heterojunctions. Vacuum deposited TiOPc thin films are converted to the near‐IR absorbing “Phase II” polymorph using post‐deposition solvent annealing. The Phase I → Phase II transition broadens the absorbance spectrum of the Pc film producing absorptivities (α ≈ 10⁵ cm^?1) from 600–900 nm, along with substantial texturing of the Pc layer. Atomic force microscopy and field‐emission scanning electron microscopy of the solvent annealed films show that the surface roughness of the Pc layers is increased by a factor of greater than 2× as a result of the phase transformation. Current–voltage (J–V) responses for white light illumination of ITO (100 nm)/TiOPc (20 nm)/C₆₀ (40 nm)/BCP (10 nm)/Al (100 nm) OPVs show a near doubling of the short‐circuit photocurrent (J_SC), with only a small decrease in open‐circuit photopotential (V_OC), and a concomitant increase in power conversion efficiency. Incident photon current efficiency (IPCE) plots confirmed the enhanced near‐IR OPV activity, with maximum IPCE values of ca. 30% for devices using Phase II‐only TiOPc films. UV‐photoelectron spectroscopy (UPS) of TiOPc/C₆₀ heterojunctions, for both Phase I and Phase II TiOPc films, suggest that the Phase II polymorph has nearly the same HOMO energy as seen in the Phase I polymorph, and similar frontier orbital energy offsets, E_HOMO^Pc–E_LUMO^C60, leading to comparable open‐circuit photovoltages. These studies suggest new strategies for the formation of higher efficiency OPVs using processing conditions which lead to enhance near‐IR absorptivities, and extensive texturing of crystalline donor or acceptor films.     

Low sublimation temperature cesium pivalate complex as an efficient electron injection material for organic light-emitting diode devices

Cesium pivalate ((CH₃)₃CCOOCs) has been synthesized and applied as an electron injection material for organic light-emitting diodes, which showed low sublimation temperature of 180 °C. Typical bilayer structure of ITO/NPB (60 nm)/Alq₃ (50 nm)/EIL/Al was used to evaluate the electron injection efficacy of (CH₃)₃CCOOCs, the results showed (CH₃)₃CCOOCs/Al exhibits better electron injection than LiF/Al cathode and the power efficiency was improved by about 19% at current density of 50 mA/cm². More interestingly, in the typical three layer OLED structure ITO/2-TNATA (60 nm)/NPB (10 nm)/Alq₃:2% C545T (40 nm)/MADN (15 nm)/(CH₃)₃CCOOCs (2 nm)/Al, the maximum current efficiency is up to 20 cd/A with Commission Internationale d’Eclairage (CIE_x,_y) color coordinates of (x = 0.30, y = 0.65) at current density of 140 mA/cm², which indicates that the non-aromatic alkali metal complex can also have good match with the chemically stable compound and exhibit good electron injection properties.     

Inkjet printed metallizations for Cu(In1−x Ga x )Se2 photovoltaic cells

This study reports the inkjet printing of Ag front contacts on Aluminum doped Zinc Oxide (AZO)/intrinsic Zinc Oxide (i‐ZnO)/CdS/Cu(In_1−xGa_x)Se₂ (CIGS)/Mo thin film photovoltaic cells. The printed Ag contacts are being developed to replace the currently employed evaporated Ni/Al bi‐layer contacts. Inkjet deposition conditions were optimized to reduce line resistivity and reduce contact resistance to the Al:ZnO layer. Ag lines printed at a substrate temperature of 200°C showed a line resistivity of 2.06 µΩ · cm and a contact resistance to Al:ZnO of 8.2 ± 0.2 mΩ · cm² compared to 6.93 ± 0.3 mΩ · cm² for thermally evaporated contacts. These deposition conditions were used to deposit front contacts onto high quality CIGS thin film photovoltaic cells. The heating required to print the Ag contacts caused the performance to degrade compared to similar devices with evaporated Ni/Al contacts that were not heated. Devices with inkjet printed contacts showed 11.4% conversion efficiency compared to 14.8% with evaporated contacts. Strategies to minimize heating, which is detrimental for efficiency, during inkjet printing are proposed. Copyright © 2011 John Wiley & Sons, Ltd.     

High brightness InGaN green LEDs with an ITO on n/sup ++/-SPS upper contact

Indium tin oxide (ITO) (260 nm) and Ni (5 nm)/Au (10 nm) films were deposited onto glass substrates, p-GaN layers, n/sup +/-InGaN/GaN short-period-superlattice (SPS), n/sup ++/-SPS and nitride-based green light-emitting diodes (LEDs). It was found that ITO could provide us an extremely high transparency (i.e., 95% at 520 nm). It was also found that the 1.03/spl times/10/sup -3/ /spl Omega/cm/sup 2/ specific contact resistance of ITO on n/sup ++/-SPS was reasonably small. Although the forward voltage of the LED with ITO on n/sup ++/-SPS upper contacts was slightly higher than that of the LED with Ni/Au on n/sup ++/-SPS upper contacts, the 20 mA output power and external quantum efficiency of the former could reach 4.98 mW and 8.2%, respectively, which were much larger than the values observed from the latter. The reliability of ITO on n/sup ++/-SPS upper contacts was also found to be reasonably good.     

Highly Reliable High-Brightness GaN-Based Flip Chip LEDs

The properties of indium-tin-oxide (ITO)/Ni films as transparent ohmic contacts of nitride-based flip chip (FC) light emitting diodes (LEDs) were studied. It was found that 300degC rapid thermal annealed (RTA) ITO(15 nm)/Ni(1 nm) could provide good electrical and optical properties for FC LED applications. It was also found that 20-mA operation voltage and output power of the 465-nm FC LEDs with ITO/Ni/Ag reflective mirror were 3.16 V and 21 mW, respectively. Furthermore, it was found that output intensity of the proposed LED only decayed by 5% after 1200 h under 30-mA current injection at room temperature.     

Transparent conductors with an ultrathin nickel layer for high-performance photoelectric device applications

A thin nickel (Ni) layer of thickness 5 nm was inserted in between the indium tin oxide (ITO) layers of thickness 50 nm each so as to increase the conductivity of ITO without affecting much of its transmittance nature. ITO layers with and without Ni film were prepared by reactive DC sputtering on both Si and glass substrates. The influence of Ni layer on the optical and electrical properties of prepared devices was investigated. Due to the insertion of thin Ni layer, the resistivity of ITO/Ni/ITO sample (3.2×10⁻⁴ Ω cm) was reduced 10 times lesser than that of ordinary ITO layer (38.6×10⁻⁴ Ω cm); consequently it increased the mobility of ITO/Ni/ITO device. The external and internal quantum efficiencies (EQE and IQE) of ITO/Ni/ITO device exhibited better performance when compared to ITO layer that has no Ni film. At wavelengths of 350 and 600 nm, the photoresponses of ITO/Ni/ITO device were predominant than that of reference ITO device. This highly conductive and photoresponsive Ni inserting ITO layers would be a promising device for various photoelectric applications.     

Improvedn-type GaAs ohmic contacts compatible with a chlorine-based dry-etch process

We report the use of a Mo barrier layer within Ni/Au-Ge based ohmic contacts to GaAs for eliminating an etch stop reaction that occurs during Cl-based dry etching of heterojunction bipolar transistors. With conventional Ni/Au-Ge/Ag ohmic contacts, chlorinecontaining discharges produce a passivating layer of AgCl on the semiconductor surface, preventing further etching. This layer is absent when the Ag in the contact is replaced with Mo. The Mo has several advantages over other diffusion barrier layers and yields contacts with excellent adhesion, smooth morphology, and sharp edge definition. The average contact resistivity of these contacts ton ⁺-GaAs(n = 6 × 10¹⁸ cm^-3) was 0.074 ohm-mm, which is lower than the typical contact resistivity of conventional Ni/Au-Ge/ Ag metallization (0.11 ohm-mm).     

基于Alq3光耦合层的新型顶发射蓝光有机电致发光器件

研制了一种结构为Ag/Glass/ITO/TAPC/mCP/mCP∶Firpic/TPBi/LiF/Al/Ag/Alq₃的顶发射有机电致发光器件,通过在ITO玻璃衬底背面生长一层Ag反射膜,使器件发出的蓝光被反射膜反射到顶电极出射。利用顶电极表面的Alq₃光耦合层有效地提升了金属复合阴极的透射率,降低了器件的微腔效应。实验结果表明,当光耦合层厚度为30nm时,获得了最大电流效率和最大亮度分别为8.91cd/A和5758cd/m²的蓝光顶发射有机电致发光器件(TEOLED);同时,在10V电压下,其色坐标为(0.157,0.320),当亮度从1cd/m²变化到5000cd/m²时,其色坐标仅漂移(0.002,0.010),表现出良好的色稳定性。     

Enhancement of hole injection with an ultra-thin Ag2O modified anode in organic light-emitting diodes

The interface between the organic layer and the Indium Tin Oxide (ITO) layer of an organic light-emitting diode (OLED) is crucial to the performance of the device. An ultra-thin Ag₂O film, used as an anode modification layer, has been employed on ITO surface through the UV-ozone treatment of Ag films. The insertion of this thin film with higher work function enhances the hole injection in the organic light-emitting diode and improves the performance of the devices effectively. The maximum electroluminescence (EL) efficiency of the device with the Ag₂O film is 4.95 cd/A, it is about 60% higher than that of the device without it.     

Molecular Engineering of Blue Fluorescent Molecules Based on Silicon End‐Capped Diphenylaminofluorene Derivatives for Efficient Organic Light‐Emitting Materials

Blue fluorescent materials based on silicone end‐capped 2‐diphenylaminofluorene derivatives are synthesized and characterized. These materials are doped into a 2‐methyl‐9,10‐di‐[2‐naphthyl]anthracene host as blue dopant materials in the emitting layer of organic light‐emitting diode devices bearing a structure of ITO/DNTPD (60 nm)/NPB (30 nm)/emitting layer (30 nm)/Alq₃ (20 nm)/LiF (1.0 nm)/Al (200 nm). All devices exhibit highly efficient blue electroluminescence with high external quantum efficiencies (3.47%–7.34% at 20 mA cm^?2). The best luminous efficiency of 11.2 cd A^?1 and highest quantum efficiency of 7.34% at 20 mA cm^?2 are obtained in a device with CIE coordinates (0.15, 0.25). A deep‐blue OLED with CIE coordinates (0.15, 0.14) exhibits a luminous efficiency of 3.70 cd A^?1 and quantum efficiency of 3.47% at 20 mA cm^?2.     

白光有机电致发光器件发光稳定性研究

基于红绿/蓝双发光层,制作了结构为ITO/MoO ₃(10nm)/NPB(40nm)/TCTA(10nm)/CBP:R-4B(2%):GIR1(14%,X nm)/mCP:Firpic(8%,Y nm/BCP(10nm)/Alq₃(40nm)/LiF(1nm)/Al( 100nm)的白色全磷光有机电致发光器件(OLED),通过 调节红绿发光层的厚度X与蓝光发光层的厚度Y,研究了不同发光层厚度器件发 光性能的影响。研究发现:当X 为23nm、Y为7nm时,器件的光效和色坐标都具有 很高的稳定性,在电压分别为5、 10和15V时,色坐标分别为(0.33,0.37)、(0.33,0. 37)和(0.34,0.38);在电压为 5V时,电流密度为0.674mA,亮度为158.7cd ,最大电流效率为26.87cd/A;利用电子阻 挡材料TCTA和空穴阻挡材料BCP能够显著提高载流子的复合效率。分析认为:发光层顺序 为红绿/蓝时,更有利于蓝光的出射,从而使白光的色坐标更稳定。