InAs/AlSb异质结的Pd/Ti/Pt/Au合金化欧姆接触（英文）

为了得到较低的接触电阻,研究了帽层未掺杂的InAs/AlSb异质结的Pd/Ti/Pt/Au合金化欧姆接触.利用传输线模型(TLM)测量了接触电阻Rc.在最佳的快速热退火条件为275℃和20s时,InAs/AlSb异质结的Pd/Ti/Pt/Au接触电阻值为0.128Ω·mm.TEM观察发现经过快速热退火后Pd已经扩散到半导体中有利于高质量欧姆接触的形成.研究表明经过Pd/Ti/Pt/Au合金化欧姆接触后Rc有明显减小,适用于InAs/AlSb异质结的应用.     

Ti/Al/Ti/Au与AlGaN欧姆接触特性

研究了溅射Ti/Al/Ti/Au四层复合金属与AlGaN/GaN的欧姆接触特性,并就环境温度对欧姆接触特性的影响进行了分析研究.试验证实:溅射的Ti/Al/Ti/Au与载流子浓度为2.24×1018cm-3的AlGaN之间在室温下无需退火即可形成欧姆接触.随快速退火温度的升高接触电阻降低.快速退火时间30s已可实现该温度下最佳欧姆接触.当工作温度不高于300℃时接触电阻几乎不受温度的影响.     

Ti/Al/Ti/Au与AlGaN欧姆接触特性

研究了溅射 Ti/ Al/ Ti/ Au四层复合金属与 Al Ga N / Ga N的欧姆接触特性 ,并就环境温度对欧姆接触特性的影响进行了分析研究 .试验证实 :溅射的 Ti/ Al/ Ti/ Au与载流子浓度为 2 .2 4× 10 1 8cm- 3的 Al Ga N之间在室温下无需退火即可形成欧姆接触 .随快速退火温度的升高接触电阻降低 .快速退火时间 30 s已可实现该温度下最佳欧姆接触 .当工作温度不高于 30 0℃时接触电阻几乎不受温度的影响     

台面型InP/InGaAs PIN光伏探测器的p-InP低阻欧姆接触

研究了电子束蒸发淀积的非合金膜系Au/Pt/Ti/p-InP(2×1018cm-3)接触的物理特性,通过450℃、4 min的快速退火,获得了欧姆接触,其比接触电阻为7.3×10-5 Wcm2.接触电极退火后,采用离子溅射法淀积加厚电极Cr/Au.利用俄歇电子能谱(AES)进行深度剖面分析,表明Pt层能够相对有效地阻挡...     

退火参数对p型GaAs欧姆接触性能的影响

采用磁控溅射的方法在p型GaAs衬底上沉积了Ti/Pt/Au金属薄膜,研究了退火工艺参数(温度和时间)对p-GaAs/Ti/Pt/Au欧姆接触性能的影响。结果表明:p-GaAs上制作的Ti/Pt/Au金属系统能在很短的退火时间(60 s)内形成很好的欧姆接触。过分延长退火时间,并不能改善系统的欧姆接触性能。退火温度在400~450℃时均可得到较好的欧姆接触。当退火温度为420℃,退火时间为120 s时,比接触电阻率达到最低,为1.41×10–6.cm2。     

非故意掺杂GaN上Ti/Al/Ni/Au欧姆接触研究

基于圆形传输线模型,研究了背景载流子浓度为71016cm3的非故意掺杂GaN与Ti/Al/Ni/Au多层金属之间欧姆接触的形成。样品在N2气氛中,分别经过温度450,550,700,800,900℃的1 min快速热退火处理后发现,当退火温度高于700℃欧姆接触开始形成,随着温度升高欧姆接触电阻持续下降,在900℃时获得了最低比接触电阻6.6106O·cm2。研究表明,要获得低的欧姆接触电阻,需要Al与Ti发生充分固相反应,并穿透Ti层到达GaN表面;同时,GaN中N外扩散到金属中,在GaN表面产生N空位起施主作用,可提高界面掺杂浓度,从而有助于电子隧穿界面而形成良好欧姆接触。     

金属/n型AlGaN欧姆接触

用传输线模型对n型AlGaN(n-AlGaN)上Au/Pt/Al/Ti多金属层欧姆接触进行了接触电阻率的测量.在850℃退火5min后,测得欧姆接触电阻率达1.6×10-4Ω·cm2.经X射线衍射分析,Au/Pt/Al/Ti/n-AlGaN界面固相反应得出在500℃以上退火过程中,AlGaN层中N原子向外扩散,在AlGaN表面附近形成n型重掺杂层,导致欧姆接触电阻率下降;随退火温度的升高,N原子外扩散加剧,到800℃以上退火在Au/Pt/Al/Ti/n-AlGaN界面形成Ti2N相,导致欧姆接触电阻率进一步下降.     

金属/n型AlGaN欧姆接触

用传输线模型对n型AlGaN(n-AlGaN)上Au/Pt/Al/Ti多金属层欧姆接触进行了接触电阻率的测量.在850℃退火5min后,测得欧姆接触电阻率达1.6×10-4Ω·cm2.经X射线衍射分析,Au/Pt/Al/Ti/n-AlGaN界面固相反应得出在500℃以上退火过程中,AlGaN层中N原子向外扩散,在AlGaN表面附近形成n型重掺杂层,导致欧姆接触电阻率下降;随退火温度的升高,N原子外扩散加剧,到800℃以上退火在Au/Pt/Al/Ti/n-AlGaN界面形成Ti2N相,导致欧姆接触电阻率进一步下降.     

n型4H-SiC上Ni/Pt和Ti/Pt欧姆接触(英文)

研究了Ni/Pt和Ti/Pt金属在n型4H-SiC上的欧姆接触。在1 020℃退火后,Ni/Pt与n型4H-SiC欧姆接触的比接触电阻为2.2×10-6Ω·cm2。Ti/Pt与n型4H-SiC欧姆接触的比接触电阻为5.4×10-6Ω·cm2,退火温度为1 050℃。虽然Ni的功函数比Ti的功函数高,但是Ni比Ti更容易与n型4H-SiC形成欧姆接触。使用能谱分析仪(EDX)分析了Ni/Pt和Ti/Pt金属与4HSiC接触面的元素,观察到C原子相对于Pt原子的原子数分数随退火温度的变化而不同。实验验证了在n型4H-SiC中退火导致的碳空位起施主作用是有利于欧姆接触形成的主要原因。     

退火参数对p型GaAs欧姆接触性能的影响

采用磁控溅射的方法在p型GaAs衬底上沉积了Ti/Pt/Au金属薄膜,研究了退火工艺参数(温度和时间)对p-GaAs/Ti/Pt/Au欧姆接触性能的影响。结果表明:p-GaAs上制作的Ti/Pt/Au金属系统能在很短的退火时间(60 s)内形成很好的欧姆接触。过分延长退火时间,并不能改善系统的欧姆接触性能。退火温度在400~450℃时均可得到较好的欧姆接触。当退火温度为420℃,退火时间为120 s时,比接触电阻率达到最低,为1.41×10–6.cm2。     

Modeling InAs/GaSb and InAs/InAsSb Superlattice Infrared Detectors

InAs/GaSb and InAs/InAsSb type II superlattices have been proposed as promising alternatives to HgCdTe for the photon-absorbing layer of an infrared detector. When combined with a barrier layer based on an InAs/AlSb superlattice or an AlSbAs alloy, respectively, they can be used to make diffusion-limited “barrier” detectors with very low dark currents. In this work we compare theoretical simulations with experimental bandgap and photoabsorption data for such superlattices, spanning from the mid to the long-wave infra-red (2.3–12 μm). The spectral response of detectors based on these materials is also simulated. The simulations are based on a version of the k · p model developed by one of the authors, which takes interface contributions and bandgap bowing into account. Our results provide a way of assessing the relative merits of InAs/GaSb and InAs/InAsSb superlattices as potential detector materials.     

Cyclotron resonance of dirac fermions in InAs/GaSb/InAs quantum wells

The band structure of three-layer symmetric InAs/GaSb/InAs quantum wells confined between AlSb barriers is analyzed theoretically. It is shown that, depending on the thicknesses of the InAs and GaSb layers, a normal band structure, a gapless state with a Dirac cone at the center of the Brillouin zone, or inverted band structure (two-dimensional topological insulator) can be realized in this system. Measurements of the cyclotron resonance in structures with gapless band spectra carried out for different electron concentrations confirm the existence of massless Dirac fermions in InAs/GaSb/InAs quantum wells.     

Investigation of negative differential resistance phenomena inGaSb/AlSb/InAs/GaSb/AlSb/InAs structures

The negative differential resistance (NDR) phenomena were observed in GaSb/AlSb/InAs/-GaSb/AlSb/InAs resonant interband tunnel structures. Electrons have resonantly achieved interband tunneling through the InAs/GaSb broken-gap quantum well. The InAs well width causes significant variations of the peak current density and NDR behaviors. The peak current density varies exponentially with the AlSb barrier thickness. The multiple NDR behavior was observed with appropriate InAs well and AlSb barrier thicknesses, e.g., 30 Å thick AlSb barrier and 240 Å wide InAs well. Only single negative resistance has, otherwise, been seen. The three-band model was used to interpret the effect of the InAs well and AlSb barrier on the current-voltage characteristics of GaSb/AlSb/InAs/GaSb/AlSb/InAs structures     

An InAlAs/InAs MODFET

An InAs modulation-doped field-effect transistor (MODFET) using an epitaxial heterostructure based entirely on arsenides is reported. The heterostructure was grown by MBE on InP and contains a 30-Å InAs channel. A 2-μm-gate-length device displays well-behaved characteristics, showing sharp pinch-off (V_th=0.8 V) and small output conductance (5 mS/mm) at 300 K. The maximum transconductance is 170 mS mm with a maximum drain current of 312 mA/mm. Strong channel quantization results in a breakdown voltage of -9.6 V, a severalfold improvement over previous InAs MODFETs based on antimonides. Low-temperature magnetic field measurements show strong Shubnikov-de Haas oscillations which, over a certain range of gate voltage, strongly indicate that the electron channel resides in the InAs layer     

InAs/AlSb dual-gate HFETs

We report the first implementation of InAs/AlSb dual-gate (DG) HFETs. The devices were fabricated by conventional optical lithography and consist of two electrically distinct 1-μm gates, with a 1-μm intergate separation. The DG-HFETs feature well-behaved, kink-free drain characteristics, and exhibit both high transconductance and low output conductance. We find that DG operation significantly reduces the short-channel effects that have so far plagued InAs/AlSb devices, and increases the maximum allowable drain bias. We estimate that cutoff frequencies as high as 30 GHz-μm may be possible for such devices based on simple equivalent circuit models and previously published experimental data on single-gate InAs/AlSb HFETs     

High-performance double-modulation-doped InAlAs/InGaAs/InAs HFETs

We demonstrate the improvement of double-sided-doped InAlAs/InGaAs MODFETs by inserting a thin InAs layer in the center of the conventional InGaAs channel. A maximum extrinsic transconductance of 1.4 S/mm is achieved for 0.13-μm devices. The current gain cutoff frequency of this device is as high as 265 GHz. Delay time analysis shows a significant improvement in the effective saturated velocity, from 2.4×10⁷ cm/s for LM devices to 3.1×10⁷ cm/s for InAs devices. We believe the superior performance of this device is primarily due to the reduction of scattering from donor layers, especially under the channel, and the interface roughness, which is achieved by inserting a 4-nm InAs layer in the channel     

Photoconductivity of InAs/GaAs structures with InAs nanoclusters in the near-infrared region

InAs/GaAs multilayered heterostructures containing dense arrays of the low-defect partially relaxed InAs nanoclusters larger than defect-free quantum dots are fabricated by metal-organic chemical vapor deposition in an atmospheric-pressure reactor. The structures have intense photoconductivity in the wavelength range of 1–2 μm at room temperature. The detectivity of fabricated prototypes of photodetectors is D* = 10⁹ cm Hz^1/2 W⁻¹. The relaxation time of photoconductivity at a wavelength of 1.5 μm is less than 10 ns.     

High-breakdown-voltage AlSbAs/InAs n-channel field-effecttransistors

InAs channel field-effect transistors of 1-μm gate length were grown by molecular beam epitaxy and observed to operate at channel electric fields (20 kV/cm) higher than previously demonstrated and several times greater than the threshold for impact ionization in bulk InAs. Voltage gains on the order of 10 were observed with transconductances as high as 414 mS/mm and output conductances as low as 33 mS/mm. These voltage gains are comparable to those of GaAs-based devices and are the highest observed for InAs channel devices. The results demonstrate the potential for practical room-temperature operation of InAs FETs     

High-transconductance delta-doped InAs/AlSb HFETs with ultrathinsilicon-doped InAs quantum well donor layer

Modulation-doping of InAs/AlSb quantum wells generally requires the use of chalcogenide donor impurities because silicon, the usual donor of choice in MBE, displays an amphoteric behavior in antimonide compounds. In this letter, we demonstrate the use of an ultrathin 9 Å silicon doped InAs well to delta-dope the current-carrying InAs channel of an InAs/AlSb heterostructure field-effect transistor (HFET). Using this new approach, we have fabricated delta-doped 0.6-μm gate InAs/AlSb HFETs with a measured extrinsic transconductance of 800 mS/mm at V_DS=0.8 V, a cutoff frequency f_T=60 GHz (F_MAX=87 GHz), and well-behaved I-V curves. HFET's with a 2-μm gatelength also feature very high transconductances in the 700-800 mS/mm range at V_DS=1.5 V. The present work eliminates the requirement for chalcogenide compound donor sources to delta-dope InAs/AlSb quantum wells by allowing the use of silicon in the fabrication of high-performance InAs/AlSb HFET's     

InAs/GaAs自组装量子点结构的能带不连续量

为确定异质结界面带阶,结合光致发光(PL)谱和深能级瞬态谱(DLTS)测量结果,利用有效质量近似理论,计算得到了InAs/GaAs自组装量子点结构的能带不连续量,其中导带不连续量ΔEc＝0.97 eV,价带不连续量ΔEv＝0.14 eV.