驱动AM-OLED的2-a-Si∶H TFT的设计与制作

a-Si∶H/SiNx∶HTFT在长时间栅偏应力作用下,会产生阈值电压漂移,这主要是由绝缘层电荷注入和有源层亚稳态产生而引起的。针对电荷注入现象,文章首先通过控制源气体SiH4和NH3流量的不同,利用PECVD制作了不同N/Si比(0.87～1.68)的氮化硅绝缘材料,对其进行了椭偏、红外和光电子散射能谱(EDS)测试。制作了不同的MIS结构电容,对其进行老化实验和C-V测试分析,结果表明稍富氮(N/Si比稍大于标准Si3N4的化学计量比1.33)的氮化硅做成的MIS样品在老化前后C-V曲线偏移不是很明显,表明其缺陷态密度相对较小,能够有效减小半导体/绝缘层界面间的电荷注入。设计了驱动OLED的2-a-Si∶HTFT像素电路及其阵列版图,优化了电路中的几个关键参数,即T1的W/L=2.5、T2的W/L=25和存储电容Cs=0.8pF。运用7PEP生产工艺,制作了13cm(5.2in)的TFT阵列样品。对TFT进行I-V特性测试,其开态电流为10μA,开关比为106;对AMOLED显示屏样品进行了静态驱动下的亮度测试,其最高亮度为341cd/m2。     

a-Si:H-TFT阈值电压漂移机理及其在驱动OLED显示中的补偿设计

分析了a—Si：H—TFT阈值电压漂移的机理，即分析了栅偏应力下电荷注入到SiNx：H栅绝缘层和a—Si：H中亚稳态的产生对TFT阈值电压漂移的影响。根据非晶硅中亚稳态产生的特点，并针对驱动OLED的两管a—Si：H—TFT像素电路，提出了一种通过对数据信号时序的重新设计来补偿周值电压漂移的方法，即在数据信号间加插一个与数据信号极性相反的补偿信号。通过这种正负交替的信号，使驱动管TFT中由亚稳态造成的阈值电压漂移始终保持在一个动态平衡的过程，来实现驱动OLED电流稳定的目的。     

PECVD氮化硅膜的微电子学特性

利用电子极化的劳伦茨-劳伦兹关系研究了PECVD氮化硅膜的组分(Si/N).生长条件的变化导致薄膜的Si/N比率千差万别.采取C-V测试和高温准静态离子电流测试对不同Si/N比率的氮化硅膜的微电子学特性进行了探讨.     

单片式红外焦平面阵列的进展

本文着重介绍金属硅化物肖特基势垒红外探测器阵列（MSSBIRDA），碲汞电荷注入器件（HgCdTeCID)，电荷成像矩阵（CIM），锑化铟电荷注入器件（InSbCID)以及砷化镓／砷铝镓（GaAs/GaAlAs)多量子阱单片式红外焦平面阵列的现状。     

调制掺杂AlxGa1-xN/GaN异质结中AlxGa1-xN势垒层表面态及其他局域态性质研究

通过测量调制掺杂Al0.22Ga0.78N／GaN异质结样品的变频电容-电压(C-V)特性，对Al0.22Ga0.78N势垒层表面态的性质进行了研究．结果发现在小偏压下，样品的电容随着测量信号频率的增加而下降，说明势垒层中存在表面态．实验数据分析表明：表面态密度约为10^13cm^-2量级，表面态的时间常数比势垒层中其他局域态大．随着空间隔离层厚度的增加，势垒层中其他局域态密度随之增加．在金属电极和Al0.22Ga0.78N势垒层之间加入Si3N4绝缘层可以对表面态起到显的钝化作用，使表面态密度降为～10^12cm^-2量级．     

二氧化锡/多孔硅/硅光伏特性研究

测量了二氧化锡（SnO2）／多孔硅（PS）／硅（Si）的光电压谱，分析表明：在SnO2／PS／Si材料中存在着两个异质结；当样品吸附还原性气体时，其光电压明显下降。当样品在1％液化石油气的氛围时（相对于空气），光电压减少了16．4％-27．5％；在1％CO氛围时，减少了8．1％-19．4％；在1％H2氛围时，减少了12．1％-14．9％，因此SnO2／PS／Si可作为一种新的敏感元件。文中还对测量结果进行了讨论分析。     

SiO_2-Si_3N_4栅介质膜陷阱特性的高频C-V分析

采用高频 C-V特性测试技术 ,研究由热氧化生成的超薄 Si O2 膜和低压化学汽相淀积法制备的非均匀结构 Si3N4膜 ,两者组成的栅介质膜的陷阱特性 (包括陷阱密度、能量和空间分布深度等参数 )。结果表明 :在栅复合膜陷阱电荷非稳态释放模型下建立的高频 C-V理论及其分析方法 ,可以很好地表征实验曲线 ,并获取所需的存储陷阱分布参数     

薄膜绝缘层对陶瓷厚膜电致发光显示器件的影响

采用丝网印刷技术，在Al2O3陶瓷板上印刷、高温烧结内电极及绝缘层制备出陶瓷厚膜基板，进而制备了新型厚膜电致发光显示器（TDEL），整个器件结构为陶瓷基板／内电极／厚膜绝缘层／发光层／薄膜绝缘层／ITO透明电极。对用不同薄膜绝缘材料制备的显示器件的特性进行测试、比较、分析，结果表明薄膜绝缘介质层对器件的阈值电压、发光亮度均有一定的影响，以复合绝缘层的性能最优。最后对器件的衰减特性进行了初步分析。     

引入a—Si：H材料的氮化硅芯片电容

本文研制了两种引入a-Si:H材料的氮化硅芯片电容,其一是作为辅助介质引入的,其二是为了改善Si/Si2N4界面而引入的,文章报导了这两种电容的研制工艺及样品的各种性能,其结构表明,这类电容有希望应用于厚薄膜集成电路.     

Triode PECVD氢稀释制备的nc-Si:H薄膜的新结果

采用三极管型等离子体增强化学汽相淀积（TriodePECVD）系统，适当选取硅烷（SiH4）和氢气（H2）流量比制备纳米硅（nc-Si：H）薄膜．保持栅极偏压为－100V，改变SiH4、H2流量比可以得到薄膜从非晶硅（a－Si：H）到nc－Si：H的结构转变，其氢气流量比例[H2]／（[H2]＋[SiH4]）的阈值为93．3％．随着流量比进一步增大，晶化比例从12％增大至50％，但晶粒尺寸基本保持不变，nc－Si晶粒的平均尺寸约2．5nm，这是不同于常规二极管PECVD、氢稀释制备的nc－Si：H薄膜的新结果，并从实验上验证了电导率和电子迁移率的渗流现象．     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Nanoimprint Lithography -A Next Generation High Volume Lithography Technique

IntroductionNanoimprint Lithography is a well-acknowl-edged low cost, high resolution, large area pattern-ing process. It includes the most promising methods,high-pressure hot embossing lithography (HEL) [2],UV-cured imprinting (UV-NIL) [3] and micro contactprinting (m-CP, MCP) [4]. Curing of the imprintedstructures is either done by subsequent UV-lightexposure in the case of UV-NIL or by cooling downbelow the glass transition temperature of the ther-moplastic material in case of HEL…     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

Influence of PVK ： NPB hole transporting layer on the characteristics of organic light-emitting devices

A doping system consisting of NPB and PVK is employed as a composite hole transporting layer （CHTL）. By adjusting the component ratio of the doping system, a series of devices with different concentration proportion of PVK ： NPB are constracted. The result shows that doping concentration of NPB enhances the competence of hole transporting ability, and modifies the recombination region of charge as well as affects the surface morphology of doped film. Optimum device with a maximum brightness of 7852 cd/m^2 and a power efficiency of 1.75 lm/W has been obtained by choosing a concentration proportion of PVK ： NPB at 1：3.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.     

Analysis of error performance on Turbo coded FDPIM

Due to variable symbol length of digital pulse interval modulation（DPIM）, it is difficult to analyze the error performances of Turbo coded DPIM. To solve this problem, a fixed-length digital pulse interval modulation（FDPIM） method is provided. The FDPIM modulation structure is introduced. The packet error rates of uncoded FDPIM are analyzed and compared with that of DPIM. Bit error rates of Turbo coded FDPIM are simulated based on three kinds of analytical models under weak turbulence channel. The results show that packet error rate of uncoded FDPIM is inferior to that of uncoded DPIM. However, FDPIM is easy to be implemented and easy to be combined, with Turbo code for soft-decision because of its fixed length. Besides, the introduction of Turbo code in this modulation can decrease the average power about 10 dBm, which means that it can improve the error performance of the system effectively.     

A method for calculating the center position of collimated light

It is a key problem to accurately calculate beam spots＇ center of measuring the warp by using a collimated laser. A new method, named double geometrical center method （DGCM）, is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device （CCD） is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What＇s more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.