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1.
采用分子束外延技术生长了GaAs/AlGaAs单量子阱得多量子阱材料。采用GaAs/AlGaAs超晶格缓冲层掩埋衬底缺陷,获得的量子阱结构材料被成功地用于制作量子阱激光器。波长为778nm的激光器,最低阈值电流为30mA,室温下线性光功率大于20mW。  相似文献   

2.
分子束外延生长CdTe/HgCdTe非对称多量子阱,用反射高能电子衍射监测生长过程,并用x射线衍射测定其结构参数。通过对吸收光谱的研究并结合包络函数计算,发现该结构子带吸收很强,吸收限在9~11μm。  相似文献   

3.
利用国产分子束外延设备研制出高质量GaAs-AlGaAs量子阱结构材料.经光荧光测量分析,其n=1的电子-重空穴自由激子复合发光的谱线很窄,半峰宽仅1.2MeV(阱宽141A,温度10.5K),表明量子阱阱宽和异质结界面平整度的起伏小于一个单原于层.样品从低温到室温都能保持激子发光特性.  相似文献   

4.
采用分子束外延技术在GaAs(110)衬底上制备了一系列生长温度和As2/Ga束流等效压强比不同的样品,通过室温光致发光谱、高分辨X射线衍射仪和低温光致发光谱对这些样品进行了分析,找到了在GaAs(110)衬底上生长高质量高Al组分的Al0.4Ga0.6As生长条件.  相似文献   

5.
采用分子束外延技术在GaAs(110)衬底上制备了一系列生长温度和As2/Ga束流等效压强比不同的样品,通过室温光致发光谱、高分辨X射线衍射仪和低温光致发光谱对这些样品进行了分析,找到了在GaAs(110)衬底上生长高质量高Al组分的Al0.4Ga0.6As生长条件.  相似文献   

6.
在Si和Ge衬底上用分子束外延生长HgCdTe   总被引:1,自引:0,他引:1  
傅祥良 《红外》2005,(9):19-24,48
在当前大规模红外焦平面器件的研制中,高性能器件的制备需要高质量、大面积、组分均匀的碲镉汞材料。衬底和外延材料的晶格失配导致了大量的位错增殖,严重影响红外焦平面器件的工作性能。本文对各种衬底进行了比较,并对Si基和Ge基上的外延碲镉汞材料的生长工艺及性能进行了调研和评价。  相似文献   

7.
采用分子束外延方法在GaAs(331)A高指数衬底上制备自对齐InAs量子线(QWR)或者三维(3D)岛状结构。InAs量子线(QWR)选择性生长在GaAs层的台阶边缘。通过原子力显微镜(AFM)仔细研究了InAs纳米微结构的表面形貌,发现不同的生长条件如衬底温度、生长速率和InAs层厚度等,对InAs表面形貌有很大的影响。低温更容易导致线状纳米微结构的形成,而高温更利于3D岛状结构形成。表面形貌的转变归结于表面能同应变能之间的竞争。  相似文献   

8.
MBE生长高质量GaAs/AlGaAs量子阱激光器   总被引:2,自引:4,他引:2  
我们利用分子束外延方法研制了GaAs/AlGaAs缓交折射率分别限制(GRIN-SCH)单量子阱和双量子阱激光器.对腔长为600μm的端面不镀膜的宽接触条型F-P腔激光器,阈值电流密度(平均值)分别为290A/cm2和240A/cm2.腔长在1200μm的双量子阱激光器的阈电流密度低达190A/cm2.对出光面和背面分别镀以增透膜和高反膜的宽接触条型(80μm).激光器,线性输出功率高达1.82W;出光面的斜率效率达到1.04W/A;利用湿法化学腐蚀所制备的脊形波导结构单量子阱激光器阈值电流最低可达8mA  相似文献   

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11.
Molecular beam epitaxy growth of an InxGa1-xAs/GaAs quantum well(QW) structure(x equals to 0.17 or 0.3) on offcut(100) Ge substrate has been investigated.The samples were characterized by atomic force microscopy,photoluminescence(PL),and high resolution transmission electron microscopy.High temperature annealing of the Ge substrate is necessary to grow GaAs buffer layer without anti-phase domains.During the subsequent growth of the GaAs buffer layer and an InxGa1-xAs/GaAs QW structure,temperature plays a key role. The mechanism by which temperature influences the material quality is discussed.High quality InxGa1-x As/GaAs QW structure samples on Ge substrate with high PL intensity,narrow PL linewidth and flat surface morphology have been achieved by optimizing growth temperatures.Our results show promising device applications forⅢ-Ⅴcompound semiconductor materials grown on Ge substrates.  相似文献   

12.
We studied the effects of Ar ion laser irradiation during the growth of InGaAs/ GaAs multiple quantum wells (MQW) structures by metalorganic molecular beam epitaxy. Structural and optical properties were characterized by Nomarski microscopy, Dektak stylus profiler, and low-temperature photoluminescence (PL) measurements. For MQW structures grown at a relatively low substrate temperature (500°C), the laser irradiation influences greatly the growth process of the In^Ga^^As well and results in a large blue shift of about 2000à in the PL peak. Such a large blue shift suggests that laser modification during growth could have some novel applications in optoelectronics. On the other hand, the laser irradiation has relatively small effects on samples grown at a higher substrate temperature (550°C).  相似文献   

13.
In0.5Ga0.5As on silicon photodetectors, including three types of interdigitated-finger devices as well as linear photoconductors, were fabricated and measured. The InGaAs/Si structure was grown by molecular beam epitaxy and utilized a 100 Å GaAs intervening nucleation layer between the silicon substrate and the InGaAs layers, step-graded InxGa1?xAs layers, and an in-situ grown 40 Å thick GaAs surface layer, which substantially enhanced the metal-semiconductor barrier height (Φb = 0.67 V) for the InGaAs. Schottky diodes fabricated independently of the photodetectors had nearly ideal characteristics with an ideality factor (n) of 1.02 and a reverse breakdown voltage of 40 V. The interdigitated Schottky photodetectors showed dark currents between <3nA and 54 μA at a 3 V bias and initial photoresponse rise times in the range of 600 to 725 ps, comparable to similar InGaAs metal-semiconductor-metal photodetectors grown lattice matched on InP. The photoconductors fabricated in the same material had rise times in the range of 575 to 1300 ps, thus being slightly slower, and had dark currents of 7 to 80 mA. The responsivity of the photoconductors was typically greater than that of the diodes by a factor of five to fifteen. The results show potential for monolithic integration of InGaAs photodetectors on silicon substrates.  相似文献   

14.
利用全固态分子束外延(MBE)方法在Ge(100)衬底上异质外延GaAs薄膜,并通过高能电子衍射(RHEED)、高分辨X射线衍射(XRD),原子力显微镜等手段研究了不同生长参数对外延层的影响.RHEED显示在较高的生长温度或较低的生长速率下,低温GaAs成核层呈现层状生长模式.同时降低生长温度和生长速率会使GaAs薄膜的XRD摇摆曲线半高宽(FWHM)减小,并降低外延层表面的粗糙度,这主要是由于衬底和外延薄膜之间的晶格失配度减小的结果.  相似文献   

15.
The nucleation and growth of GaAs films on offcut (001) Ge wafers by solid source molecular beam epitaxy (MBE) is investigated, with the objective of establishing nucleation conditions which reproducibly yield GaAs films which are free of antiphase domains (APDs) and which have suppressed Ge outdiffusion into the GaAs layer. The nucleation process is monitored by in-situ reflection high energy electron diffraction and Auger electron spectroscopy. Several nucleation variables are studied, including the state of the initial Ge surface (single-domain 2×1 or mixed-domain 2×1:1×2), the initial prelayer (As, Ga, or mixed), and the initial GaAs growth temperature (350 or 500°C). Conditions are identified which simultaneously produce APD-free GaAs layers several microns in thickness on Ge wafers with undetectable Ge outdiffusion and with surface roughness equivalent to that of GaAs/GaAs homoepitaxy. APD-free material is obtained using either As or Ga nucleation layers, with the GaAs domain dependent upon the initial exposure chemical species. Key growth steps for APD-free GaAs/Ge growth by solid source MBE include an epitaxial Ge buffer deposited in the MBE chamber to bury carbon contamination from the underlying Ge wafer, an anneal of the Ge buffer at 640°C to generate a predominantly double atomic-height stepped surface, and nucleation of GaAs growth by a ten monolayer migration enhanced epitaxy step initiated with either pure As or Ga. We identify this last step as being responsible for blocking Ge outdiffusion to below 1015 cm−3 within 0.5 microns of the GaAs/Ge interface.  相似文献   

16.
In this paper, we report the effect of using a group-V residual source evacuation (RSE) time on the interfaces of InGaAs/lnGaAsP quantum wells (QWs) grown by gas-source molecular beam epitaxy. High-resolution x-ray rocking curve and low-temperature photoluminescence (PL) were used to characterize the material quality. By optimizing the RSE time, a PL line width at 15K as narrow as 6.6 meV is observed from a 2 nm wide single QW, which is as good as or better than what has been reported for this material system. Very sharp and distinct satellite peaks as well as Pendellosung fringes are observed in the x-ray rocking curves of InxGa1−xAs/InxGa1−xASyP1−y multiple QWs, indicating good crystalline quality, lateral uniformity, and vertical periodicity. Theoretical considerations of the PL linewidths of InxGa1−xAs/InxGa1−xASyP1−y single QWs show that for QW structures grown with the optimized RSE time, the PL linewidth is mainly due to alloy scattering, whereas the contribution from interface roughness is small, indicating a good interface control.  相似文献   

17.
Low pressure metalorganic vapor phase epitaxy grown strained InGaAs/GaAs quantum well structures have been characterized by photoluminescence and x-ray diffraction. It is shown that beyond the pseudomorphic limit, these structures show considerable gallium/indium interdiffusion at the interfaces and partial strain relaxation in the quantum well layers.  相似文献   

18.
The surface morphology of GaAs films grown on Ge substrates is studied by scanning force microscopy. We find a dramatic difference arising from Ga as opposed to As prelayers in the formation of anti-phase boundaries (APBs), surface features near threading dislocations, and surface roughness, for films as thick as 1 μm. Ga prelayer samples are smooth; thin films display some APBs with predominantly one growth domain while the 1 μm thick film displays the morphology of a homoepitaxial GaAs film. In contrast, As prelayer samples are rough with complicated APB structures, which can be attributed to the increase in single steps during As2 deposition.  相似文献   

19.
We report on the realization of a modified delta doping technique to obtain doping profiles in MBE grown GaAs, measured by capacitance-voltage (C-V) methods with full-widths at half-maximum (FWHM)s of 25 ± 5Å and peak concentrations of up to 1.1 × 1019 cm?3. In this modified delta doping technique, both the Ga and Si shutters were opened for 15 sec during the delta doped layer growth while only the Si shutter is opened during conventional delta doping. Comparison of the two techniques under the same dopant flux and shutter-open-time interval shows that higher sheet-carrier concentrations with narrower FWHMs and higher peak concentrations are obtained with the modified delta doping than with the conventional delta doping method. This suggests that Si donor incorporation is enhanced by the Ga adatoms while broadening of the Si donor distribution is still negligible for this short time interval. The effects of the substrate temperature and the shutter-open time on the Si donor distribution have also been investigated.  相似文献   

20.
Electrical characteristics ofp-Ge/n-GaAs heterojunctions on GaAs(l00) grown by molecular beam epitaxy (MBE) have been investigated. Thep-type Ge layer was produced by intentionally doping with Ga atoms, in addition to the diffusion of Ga atoms from the surface of the GaAs layer. The best ideality factor of 1.04 over six decades of the forward current and the lowest reverse current density of the order of 10−6 A/cm2 were obtained for diodes with Ge grown at 500° C. The ideality factor increased slightly up to 1.12 when the operating temperature was decreased to 77 K. By studying the temperature dependence of the forward current, the conduction band discontinuity has been estimated to be 40 ± 10 meV. The suppression of Ga diffusion into the Ge film and its effect on pn-junction characteristics were also studied by growing a thin Ge film on GaAs at less than 300° C prior to the normal Ge film growth at 500° C.  相似文献   

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