Imaging one-dimensional and two-dimensional planar photodiode detectors fabricated by ion milling molecular beam epitaxy CdHgTe

Imaging one-dimensional (1-D) and two-dimensional (2-D) arrays of mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) planar photodiodes were fabricated by ion milling of vacancy-doped molecular beam epitaxy Cd_xHg_1−xTe layers. Sixty-four-element 1-D arrays of 26×26 μm² or 26×56 μm² diodes were processed. Zero-bias resistance-area values (R₀A) at 77 K of 4×10⁶ Θcm² at cutoff wavelength λ_CO=4.5 μm were measured, as well as high quantum efficiencies. To avoid creating a leakage current during ball bonding to the 1-D array diodes, a ZnS layer was deposited on top of the CdTe passivation layer, as well as extra electroplated Au on the bonding pads. The best measured noise equivalent temperature difference (NETD) on a LWIR array was 8 mK, with a median of 14 mK for the 42 operable diodes. The best measured NETD on a MWIR array was 18 mK. Two-D arrays showed reasonably good uniformity of R₀A and zero-bias current (I₀) values. The first 64×64 element 2-D array of 16×16 μm² MWIR diodes has been hybridized to read-out electronics and gave median NETD of 60 mK.     

Status of the MBE technology at leti LIR for the manufacturing of HgCdTe focal plane arrays

This paper presents recent developments that have been made in Leti Infrared Laboratory in the field of molecular beam epitaxy (MBE) growth and fabrication of medium wavelength and long wavelength infrared (MWIR and LWIR) HgCdTe devices. The techniques that lead to growth temperature and flux control are presented. Run to run composition reproducibility is investigated on runs of more than 15 consecutively grown layers. Etch pit density in the low 10⁵ cm⁻² and void density lower than 10³ cm⁻² are obtained routinely on CdZnTe substrates. The samples exhibit low n-type carrier concentration in the 10¹⁴ to 10¹⁵ cm⁻³ range and mobility in excess of 10⁵ cm²/Vs at 77 K for epilayers with 9.5 μm cut-off wavelength. LWIR diodes, fabricated with an-on-p homojunction process present dynamic resistance area products which reach values of 8 10³ Ωcm² for a biased voltage of −50 mV and a cutoff wavelength of 9.5 μm at 77 K. A 320 × 240 plane array with a 30 μm pitch operating at 77 K in the MWIR range has been developed using HgCdTe and CdTe layers MBE grown on a Germanium substrate. Mean NEDT value of 8.8 mK together with an operability of 99.94% is obtained. We fabricated MWIR two-color detectors by the superposition of layers of HgCdTe with different compositions and a mixed MESA and planar technology. These detectors are spatially coherent and can be independently addressed. Current voltage curves of 60 × 60 μm² photodiodes have breakdown voltage exceeding 800 mV for each diode. The cutoff wavelength at 77 K is 3.1 μm for the MWIR-1 and 5 μm for the MWIR-2.     

HgCdTe Growth on 6 cm × 6 cm CdZnTe Substrates for Large-Format Dual-Band Infrared Focal-Plane Arrays

This paper describes molecular-beam epitaxy growth of mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) dual-band device structures on large-area (6 cm × 6 cm) CdZnTe substrates. Wafer-level composition and defect mapping techniques were used to investigate the limiting mechanisms in improving the cutoff wavelength (λ _c) uniformity and reducing the defect density. Structural quality of epitaxial layers was monitored using etch pit density (EPD) measurements at various depths in the epitaxial layers. Finally, 640 × 480, 20-μm-pixel-pitch dual-band focal-plane arrays (FPAs) were fabricated to demonstrate the overall maturity of growth and fabrication processes of epitaxial layers. The MWIR/LWIR dual-band layers, at optimized growth conditions, show a λ _c variation of ±0.15 μm across a 6 cm × 6 cm CdZnTe substrate, a uniform low macrodefect density with an average of 1000 cm⁻², and an average EPD of 1.5 × 10⁵ cm⁻². FPAs fabricated using these layers show band 1 (MWIR) noise equivalent temperature difference (NETD) operability of 99.94% and band 2 (LWIR) NETD operability of 99.2%, which are among the highest reported to date.     

Ten-inch molecular beam epitaxy production system for HgCdTe growth

Growth of Hg_1−xCd_xTe by molecular beam epitaxy (MBE) has been under development since the early 1980s at Rockwell Scientific Company (RSC), formerly the Rockwell Science Center; and we have shown that high-performance and highly reproducible MBE HgCdTe double heterostructure planar p-on-n devices can be produced with high throughput for various single- and multiplecolor infrared applications. In this paper, we present data on Hg_1−xCd_xTe epitaxial layers grown in a ten-inch production MBE system. For growth of HgCdTe, standard effusion cells containing CdTe and Te were used, in addition to a Hg source. The system is equipped with reflection high energy electron diffraction (RHEED) and spectral ellipsometry in addition to other fully automated electrical and optical monitoring systems. The HgCdTe heterostructures grown in our large ten-inch Riber 49 MBE system have outstanding structural characteristics with etch-pit densities (EPDs) in the low 10⁴ cm⁻² range, Hall carrier concentration in low 10¹⁴ cm⁻³, and void density <1000 cm². The epilayers were grown on near lattice-matched (211)B Cd_0.96Zn_0.04Te substrates. High-performance mid wavelength infrared (MWIR) devices were fabricated with R₀A values of 7.2×10⁶ Ω-cm² at 110 K, and the quantum efficiency without an antireflection coating was 71.5% for cutoff wavelength of 5.21 μm at 37 K. For short wavelength infrared (SWIR) devices, an R₀A value of 9.4×10⁵ Ω-cm² at 200 K was obtained and quantum efficiency without an antireflection coating was 64% for cutoff wavelength of 2.61 μm at 37 K. These R₀A values are comparable to our trend line values in this temperature range.     

Long wavelength infrared, molecular beam epitaxy, HgCdTe-on-Si diode performance

In the past several years, we have made significant progress in the growth of CdTe buffer layers on Si wafers using molecular beam epitaxy (MBE) as well as the growth of HgCdTe onto this substrate as an alternative to the growth of HgCdTe on bulk CdZnTe wafers. These developments have focused primarily on mid-wavelength infrared (MWIR) HgCdTe and have led to successful demonstrations of high-performance 1024×1024 focal plane arrays (FPAs) using Rockwell Scientific’s double-layer planar heterostructure (DLPH) architecture. We are currently attempting to extend the HgCdTe-on-Si technology to the long wavelength infrared (LWIR) and very long wavelength infrared (VLWIR) regimes. This is made difficult because the large lattice-parameter mismatch between Si and CdTe/HgCdTe results in a high density of threading dislocations (typically, >5E6 cm⁻²), and these dislocations act as conductive pathways for tunneling currents that reduce the R_oA and increase the dark current of the diodes. To assess the current state of the LWIR art, we fabricated a set of test diodes from LWIR HgCdTe grown on Si. Silicon wafers with either CdTe or CdSeTe buffer layers were used. Test results at both 78 K and 40 K are presented and discussed in terms of threading dislocation density. Diode characteristics are compared with LWIR HgCdTe grown on bulk CdZnTe.     

Mid-wavelength infrared p-on-n Hg1−xCdxTe heterostructure detectors: 30–120 kelvin state-of-the-Art performance

We report on Hg_1−xCd_xTe mid-wavelength infrared (MWIR) detectors grown by molecular-beam epitaxy (MBE) on CdZnTe substrates. Current-voltage (I-V) characteristics of HgCdTe-MWIR devices and temperature dependence of focal-plane array (FPA) dark current have been investigated and compared with the most recent InSb published data. These MWIR p-on-n Hg_1−xCd_xTe/CdZnTe heterostructure detectors give outstanding performance, and at 68 K, they are limited by diffusion currents. For temperatures lower than 68 K, in the near small-bias region, another current is dominant. This current has lower sensitivity to temperature and most likely is of tunneling origin. High-performance MWIR devices and arrays were fabricated with median R_oA values of 3.96 × 10¹⁰ Ω-cm² at 78 K and 1.27 × 10¹² Ω-cm² at 60 K; the quantum efficiency (QE) without an antireflection (AR) coating was 73% for a cutoff wavelength of 5.3 μm at 78 K. The QE measurement was performed with a narrow pass filter centered at 3.5 μm. Many large-format MWIR 1024 × 1024 FPAs were fabricated and tested as a function of temperature to confirm the ultra-low dark currents observed in individual devices. For these MWIR FPAs, dark current as low as 0.01 e⁻/pixel/sec at 58 K for 18 × 18 μm pixels was measured. The 1024 × 1024 array operability and AR-coated QE at 78 K were 99.48% and 88.3%, respectively. A comparison of these results with the state-of-the-art InSb-detector data suggests MWIR-HgCdTe devices have significantly higher performance in the 30–120 K temperature range. The InSb detectors are dominated by generation-recombination (G-R) currents in the 60–120 K temperature range because of a defect center in the energy gap, whereas MWIR-HgCdTe detectors do not exhibit G-R-type currents in this temperature range and are limited by diffusion currents.     

Uniformity in HgCdTe diode arrays fabricated by reactive ion etching

Two-dimensional, midwavelength infrared (MWIR) HgCdTe detector arrays have been fabricated using reactive ion etching (RIE). Detector-to-detector uniformity has been studied in the devices fabricated with CdTe- and ZnS-passivation layers. Mapping of the doping profile, passivant/HgCdTe interface electrical properties, and diode impedance-area product (R₀A_j) in a two-dimensional array of diodes has been carried out. Temperature and perimeter/area dependence of the dark current are studied to identify the bulk and surface current components. Maximum R₀A_j=2×10⁷ Θcm² was achieved in CdTe-passivated, 200×200 μm² diode arrays. It demonstrates that CdTe-passivated, RIE-processed HgCdTe is a feasible technology.     

Planar p-on-n HgCdTe heterojunction mid-wavelength infrared photodiodes formed using plasma-induced junction isolation

Planar p-on-n HgCdTe heterojunction photodiodes have been fabricated using a plasma-induced type conversion process for device junction isolation. The technique is presented as a fully planar alternative technology to the commonly used mesa isolation structure. The starting material consisted of an indium-doped n-type mid-wavelength infrared (MWIR) HgCdTe absorbing layer that was capped by a 1-μm-thick wider bandgap arsenic-doped p-type layer. Junction-isolated p-on-n diodes were formed by selectively p-to-n type converting the p-type cap layer using a plasma process. Photodiode dark current-voltage measurements were performed as a function of temperature, along with noise and responsivity. The devices have cut-off wavelengths between 4.8 μm and 5.0 μm, exhibit diffusion-limited dark currents down to 145 K, give R₀A values greater than 1 × 10⁷Ω·cm² at 80 K and greater than 1 × 10⁵Ω·cm² at 120 K, and have negligible 1/f noise current at zero applied bias.     

Investigation of 1/<Emphasis Type="Italic">f</Emphasis> Noise Mechanisms in Midwave Infrared HgCdTe Gated Photodiodes

In this work, gated midwave infrared (MWIR) Hg_1–x Cd _x Te photodiodes are used to investigate the physical origin of 1/f noise generation. Gated photodiodes were fabricated on liquid-phase epitaxy p-type HgCdTe MWIR material with a vacancy-doped concentration of 1.6 × 10¹⁶ cm⁻³ and x = 0.31. CdTe was thermally deposited and used as both a passivant and a mask for the plasma-based type conversion, and ZnS was used as an insulator. Fabricated devices show a R ₀ A of 1–5 × 10⁴ Ωcm² with zero gate bias. Application of 2 V to the gate improves the R ₀ A by more than two orders of magnitude to 6.0 × 10⁶ Ωcm², which corresponds to the p-type surface being at transition between depletion and weak inversion. Trap-assisted tunneling (TAT) current was observed at negative gate biases and reverse junction biases. For gate biases greater than 3 V, a field-induced junction breakdown was observed. An I _n = α I ^β f ^−0.5 trend was observed above 200 pA reverse bias dark current, with α = 3.5 × 10⁻⁵ and β = 0.82, which corresponds to the TAT dominated region. Below 200 pA, junction generation-recombination (GR) current starts to dominate and this previously mentioned trend is no longer observed. Junction GR current was not seen to be correlated with 1/f noise in these photodiodes.     

Molecular beam epitaxy grown long wavelength infrared HgCdTe on Si detector performance

The use of silicon as a substrate alternative to bulk CdZnTe for epitaxial growth of HgCdTe for infrared (IR) detector applications is attractive because of potential cost savings as a result of the large available sizes and the relatively low cost of silicon substrates. However, the potential benefits of silicon as a substrate have been difficult to realize because of the technical challenges of growing low defect density HgCdTe on silicon where the lattice mismatch is ∼19%. This is especially true for LWIR HgCdTe detectors where the performance can be limited by the high (∼5×10⁶ cm⁻²) dislocation density typically found in HgCdTe grown on silicon. We have fabricated a series of long wavelength infrared (LWIR) HgCdTe diodes and several LWIR focal plane arrays (FPAs) with HgCdTe grown on silicon substrates using MBE grown CdTe and CdSeTe buffer layers. The detector arrays were fabricated using Rockwell Scientific’s planar diode architecture. The diode and FPA and results at 78 K will be discussed in terms of the high dislocation density (∼5×10⁶ cm²) typically measured when HgCdTe is grown on silicon substrates.     

A study of GaAs: Si/GaAs: C tunnel diodes grown by MOCVD

Technological modes in which high-efficiency GaAs: Si/GaAs: C tunneling structures can be fabricated by MOS-hydride epitaxy have been determined. It was demonstrated that use of C and Si dopants makes it possible to obtain a p-n junction with low diffusion spreading of dopant profiles. It was shown that fabrication of high-efficiency tunnel diodes requires that GaAs layers should be doped with acceptor and donor impurities to a level of ∼9 × 10¹⁹ cm⁻³. Tunnel diodes were fabricated using the tunnel structures and their current-voltage characteristics were studied. Peak current densities J _p ≈ 1.53 kA cm⁻² and a differential resistance R ≈ 30 mΩ under a reverse bias were obtained in the tunnel diodes.     

HgCdZnTe quaternary materials for lattice-matched two-color detectors

As the number of bands and the complexity of HgCdTe multicolor structures increases, it is desirable to minimize the lattice mismatch at growth interfaces within the device structure in order to reduce or eliminate mismatch dislocations at these interfaces and potential threading dislocations that can degrade device performance. To achieve this we are investigating the use of Hg_1−x−yCd_xZn_yTe quaternary alloys which have an independently tunable lattice constant and bandgap. Lattice matching in Hg_1−x−yCd_xZn_yTe structures can be achieved using small additions of Zn (y<0.015) to HgCdTe ternary alloys. We have investigated some of the basic properties of Hg_1−x−yCd_xZn_yTe materials with x≈0.31 and 0≤y≤0.015. The quaternary layers were grown on (112)CdZnTe substrates using MBE and the amount of Zn in the layers was determined from calibrated SIMS measurements. As expected, the lattice constant decreased and the bandgap increased as Zn was added to HgCdTe to form Hg_1−x−yCd_xZn_yTe. Hall-effect results for both n-type (In) and p-type (As) Hg_1−x−yCd_xZn_yTe layers were very similar to HgCdTe control samples. We have also utilized x-ray rocking curve measurements with (246) asymmetric reflections as a novel sensitive technique to determine the correct amount of Zn needed to achieve lattice matching at an interface. MWIR/LWIR n-p-n two-color triple-layer heterojunction structures were grown to evaluate the effects of minimizing the lattice mismatch between the widest bandgap p-type collector layer, using Hg_1−x−yCd_xZn_yTe, and the HgCdTe MWIR and LWIR collector layers and compared to structures that did not incorporate the quaternary. Sequential mode two-color detectors were fabricated using a 256 × 256, 30 μm unit cell design. There were several interesting findings. Macro defects predominantly affected the LWIR band (Band 2) operability and had little effect on the MWIR band (Band 1). The incorporation of Hg_1−x−yCd_xZn_yTe p-type collector layers had little effect on MWIR detector performance, but overall the LWIR performance was generally better. These initial detector results indicate that the use of Hg_1−x−yCd_xZn_yTe alloys in multicolor detector structures are potentially promising and should be pursued further.     

Low-Noise Mid-Wavelength Infrared Avalanche Photodiodes

Mid-wavelength infrared (MWIR) p ⁺–n ⁻–n ⁺ avalanche photodiodes (APDs) were fabricated using two materials systems, one with mercury cadmium telluride (HgCdTe) on a silicon (Si) substrate and the other with an indium arsenide/gallium antimonide (InAs/GaSb) strained layer superlattice (SLS). Diode characteristics, avalanche characteristics, and excess noise factors were measured for both sets of devices. Maximum zero-bias resistance times active area (R ₀ A) of 3 × 10⁶ Ω cm² and 1.1 × 10⁶ Ω cm² and maximum multiplication gains of 1250 at −10 V and 1800 at −20 V were measured for the HgCdTe and the SLS, respectively, at 77 K. Gains reduce to 200 in either case at 120 K. Excess noise factors were almost constant with increasing gain and were measured in the range of 1 to 1.2.     

Characterization of HgCdTe Diodes on Si Substrates Using Temperature-Dependent Current-Voltage Measurements and Deep Level Transient Spectroscopy

Reverse current in diodes can be dominated by generation processes, depending exponentially on temperature according to the rate-limiting step in the generation process. In this report, the current-voltage-temperature (IVT) relationship is analyzed for several midwave infrared and long-wave infrared (MWIR x = 0.295, LWIR x = 0.233) Hg_1−x Cd _x Te (MCT) diodes. The energy varied from diode to diode. At high reverse biases, the energy tends toward the band gap energy. Close to zero bias, the energy ranged from 0.06 to 0.1 eV. Deep level transient spectroscopy (DLTS) showed a broad peak centered at 55–80 K for the MWIR MCT. Comparison of the DLTS spectrum to a simulation based on the energy and capture cross section from a rate window analysis shows that the peak is a band of traps. The capacitance transient amplitude increased as the filling pulse increased from 1 μs to 0.1 s, consistent with capture at a dislocation. A shift to lower temperatures for the peak was also observed when the diodes are cooled under forward bias. The shift is reversible, indicating that the traps consist at least partially of a bistable defect.     

Metalorganic chemical vapor deposition of HgCdTe for photodiode applications

Metalorganic chemical vapor depositon (MOCVD) in situ growth of p-on-n junctions for long wavelength infrared (LWIR) and medium wavelength infrared (MWIR) photodiodes is reported. The interdiffused multilayer process was used for the growth of the HgCdTe junctions on CdTe and CdZnTe substrates. The n-type region was grown undoped while the p-type layer was arsenic doped using tertiarybutylarsine. Following a low temperature anneal in Hg vapor, carrier densities of (0.2-2) x 10¹⁵ cm³ and mobilities of (0.7-1.2) x 10⁵ cm²/V-s were obtained for n-type LWIR (x ~ 0.22) layers at 80K. Carrier lifetimes of these layers at 80 K are ~l-2 μs. For the p-type region arsenic doping was controlled in the range of (1-20) x 10¹⁶ cm^-3. Arsenic doping levels in the junctions were determined by calibrated secondary ion mass spectroscopy depth profile measurements. Composition and doping of the p-on-n heterojunctions could be independently controlled so that the electrical junction could be located deeper than the change in the composition. The graded composition region between the narrow and wide (x = 0.28-0.30) bandgap regions are 1–2 μm depending on the growth temperature. Backside-illuminated variable-area circular mesa photodiode arrays were fabricated on the grown junctions as well as on ion implanted n-on-p MWIR junctions. The spectral responses are classical in shape. Quantum efficiencies at 80K are 42–77% for devices without anti-reflection coating and with cutoff wavelengths of 4.8–11.0 μm. Quantum efficiencies are independent of reverse bias voltage and do not decrease strongly at lower temperatures indicating that valence band barrier effects are not present. 80K R_oA of 15.9 Ω-cm² was obtained for an array with 11.0 μm cutoff. Detailed measurements of the characteristics of the MOCVD in situ grown and implanted photodiodes are reported.     

Planar p-on-n HgCdTe FPAs by Arsenic Ion Implantation

This paper reviews recent developments in the characterization of planar p-on-n photodiodes fabricated from long- and mid-wavelength Hg_1−x Cd _x Te at␣the Electronics and Information Technology Laboratory (LETI). The Hg_1−x Cd _x Te epitaxial layers were grown by both liquid-phase and molecular-beam epitaxy. Planar p-on-n photodiodes were fabricated by arsenic implantation into an indium-doped Hg_1−x Cd _x Te base layer. Electro-optical characterization on these p-on-n photodiodes showed low leakage currents (shunt resistance > 10 GΩ) and mean R ₀ A values comparable to the state of the art, i.e., equal to 5000 Ω cm² at λ _c = 9.3 μm (λ _c: cutoff wavelength). Results of focal-plane arrays operating in both the long-wavelength infrared (IR) and middle-wavelength IR bands are reported, with noise equivalent delta temperature and responsivity values at λ _c = 9.3 μm in excess of 99.64%. These results demonstrate the viability and technological maturity of both material growth and device processing.     

MBE P-on-n Hg1−xCdxTe heterostructure detectors on silicon substrates

The capability of growing state-of-the-art middle wavelength infrared (MWIR)-HgCdTe layers by molecular beam epitaxy (MBE) on large area silicon substrates has been demonstrated. We have obtained excellent compositional uniformity with standard deviation of 0.001 with mean composition of 0.321 across 1.5″ radii. R₀A as high as 5 × 10⁷ ω-cm² with a mean value of 7 × 10⁶ Θ-cm² was measured for cut-off wavelength of 4.8 μm at 77K. Devices exhibit diffusion limited performance for temperatures above 95K. Quantum efficiencies up to 63% were observed (with no anti-reflection coating) for cut-off wavelength (4.8–5.4) μm @ 77K. Excellent performance of the fabricated photodiodes on MBE HgCdTe/CdTe/Si reflects on the overall quality of the grown material in the MWIR region.     

HgCdTe mid-wavelength IR photovoltaic detectors fabricated using plasma induced junction technology

Preliminary characterization results are presented for mid-wave infrared (MWIR) mercury cadmium telluride n-on-p photodiodes fabricated using a plasma induced type conversion junction formation technology. The diodes have been fabricated on three different vacancy doped p-type epitaxial starting materials, grown by liquid phase epitaxy (LPE) on CdZnTe, LPE on sapphire, and P/p isotype heterojunction material grown by molecular beam epitaxy (MBE) on CdZnTe. All materials had CdTe mole fraction in the active region of the device of ∼0.3. The process uses a H₂/CH₄ plasma generated in a parallel plate reactive ion etching (RIE) system to type convert the p-type material to n-type. The process is different from previously reported type conversion techniques in that it does not require a high temperature anneal, does not expose the junction at the surface to atmosphere after formation, and requires significantly fewer process steps than other planar processes. Homojunction devices fabricated using this process exhibit R₀A values >10⁷ Ω·cm² at 80 K. The R₀A is diffusion limited for temperatures >∼135 K. Results for responsivity, bias dependence of dynamic resistance — junction area product and 1/f noise show that the resulting diodes are comparable to the best planar diodes reported in the literature.     

Effect of Proton Irradiation on Interface State Density in Sc<Subscript>2</Subscript>O<Subscript>3</Subscript>/GaN and Sc<Subscript>2</Subscript>O<Subscript>3</Subscript>/MgO/GaN Diodes

Proton irradiation of Sc₂O₃/GaN and Sc₂O₃/MgO/GaN metal-oxide semiconductor diodes was performed at two energies, 10 MeV and 40 MeV, and total fluences of 5 × 10⁹ cm⁻², corresponding to 10 years in low-earth orbit. The proton damage causes a decrease in forward breakdown voltage and a flat-band voltage shift in the capacitance-voltage characteristics, indicating a change in fixed oxide charge and damage to the dielectric. The interface state densities after irradiation increased from 5.9 × 10¹¹ cm⁻² to 1.03 × 10¹² cm⁻² in Sc₂O₃/GaN diodes and from 2.33 × 10¹¹ to 5.3 × 10¹¹ cm⁻² in Sc₂O₃/MgO/GaN diodes. Postannealing at 400°C in forming gas recovered most of the original characteristics but did increase the interfacial roughness.     

MWIR DLPH HgCdTe photodiode performance dependence on substrate material

Mid wavelength infrared p-on-n double layer planar heterostructure (DLPH) photodiodes have been fabricated in HgCdTe double layers grown in situ by liquid phase epitaxy (LPE), on CdZnTe and for the first time on CdTe/sapphire (PACE-1). Characterization of these devices shed light on the nature of the material limits on device performance for devices performing near theoretical limits. LPE double layers on CdZnTe and on PACE-1 substrates were grown in a horizontal slider furnace. All the photodiodes are p-on-n heterostructures with indium as the n-type dopant and arsenic the p-type dopant. Incorporation of arsenic is via implantation followed by an annealing step that was the same for all the devices fabricated. The devices are passivated with MBE CdTe. Photodiodes have been characterized as a function of temperature. R₀A_imp values obtained between 300 and 78K are comparable for the two substrates and are approximately a factor of five below theoretical values calculated from measured material parameters. The data, for the PACE-1 substrate, indicates diffusion limited performance down to 110K. Area dependence gives further indications as to the origin of diffusion currents. Comparable R₀A_imp for various diode sizes indicates a p-side origin. R₀A and optical characteristics for the photodiodes grown on lattice-matched CdZnTe substrates and lattice mismatched PACE-1 are comparable. Howover, differences were observed in the noise characteristics of the photodiodes. Noise was measured on 50 × 50 μm devices held under a 100 mV reverse bias. At 110K, noise spectrum for devices from the two substrates is in the low 10⁻¹⁵ A/Hz^1/2 range. This value reflects the Johnson noise of the room temperature 10¹⁰ Ω feedback resistor in the current amplifier that limits the minimum measurable noise. Noise at 1 Hz, −100 mV and 120K for the 4.95 μm PACE-1 devices is in the 1–2 × 10⁻¹⁴ A/Hz^1/2, a factor of 5–10 lower than previously grown typical PACE-1 n⁺-on-p layers. Noise at 120K for the 4.60 μm PACE-1 and LPE on CdZnTe was again below the measurement technique limit. Greatest distinction in the noise characteristics for the different substrates was observed at 163K. No excess low frequency noise was observed for devices fabricated on layers grown by LPE on lattice-matched CdZnTe substrates. Photodiode noise measured at 1Hz, −100 mV and 163K in the 4.60 μm PACE-1 layer is in the 1–2×10⁻¹³ A/Hz^1/2, again a factor of 5–10 lower than previously grown PACE-1 n⁺-on-p layers. More variation in noise (4×10⁻¹³−2×10⁻¹² A/Hz^1/2) was observed for devices in the 4.95 μm PACE-1 layer. DLPH devices fabricated in HgCdTe layers grown by LPE on lattice-matched CdZnTe and on lattice-mismatched PACE-1 have comparable R₀A and quantum efficiency values. The distinguishing feature is that the noise is greater for devices fabricated in the layer grown on lattice mismatched substrates, suggesting dislocations inherent in lattice mismatched material affects excess low frequency noise but not zero bias impedance.