共查询到18条相似文献,搜索用时 62 毫秒
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伴随高密度电子组装技术的发展,BGA(Ball Grid Array)成为高密度、高性能、多功能及高I/O数封装的最佳选择。文章分析了影响BGA焊点可靠性的关键因素,特别提出了减少焊点空洞缺陷和提高剪切强度的主要措施,并通过试验优化出各工艺参数。结果表明:运用优化的工艺参数制作的BGA焊点,焊接空洞以及芯片剪切强度有了明显改善,其中对BGA焊接样品进行150℃、1000h的高温贮存后,焊点的剪切强度完全满足GJB548B-2005的要求。 相似文献
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曹艳玲 《现代表面贴装资讯》2006,5(6):11-12
BGA——阵列封装技术,因其强大的I/O接口优势、生产工艺简单及封装尺寸的小型化,使其在电子工业界的需求不断增加。原来的锡/铅组装工艺、生产及返工/返修工艺己趋成熟,不再是批量生产瓶颈,可谓“Trouble—free,无麻烦”,然而自2006—7—1,环境立法要求电子生产/设备/材料/工艺转向无铅生产,所以BGA器件封装材料、与之匹配的BGA焊盘设计及PCB组装工艺都要逐步满足无铅需求。 相似文献
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介绍根据所标JW61-95《表面组装印制电路板设计要求》自行设计的焊盘图形的合理性、可靠性进行验证的过程。将试验过程中的主要问题进行了分析,估算了焊点的可靠率置信下限,提出了焊盘可靠性设计的几点要素。 相似文献
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研究了几何因素和基板材料对无铅焊点可靠性的影响,建立了CSP封装元件的有限元模型。进行了温度循环测试,分析了焊点的应力应变情况。结果表明:基板厚度,焊点高度与焊盘直径的变化对焊点寿命有着不同的影响趋势。同时比较了FR4,Al2O3,PI材料基板与无铅焊点互连的情况,最终得出PI基板是最有利于封装器件使用的基板材料。但是由于其加工成本较高等方面的原因一般只用于高可靠性要求的军事产品领域。 相似文献
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随着集成电路封装技术的发展,倒装芯片技术得到广泛的应用。由于材料的热膨胀失配,使倒装焊点成为芯片封装中失效率最高的部位,而利用快捷又极具参考价值的有限元模拟法是研究焊点可靠性的重要手段之一。介绍了集成电路芯片焊点可靠性分析的有限元模拟法,概括了利用该方法对芯片焊点进行可靠性评价常见的材料性质和疲劳寿命预测模型。 相似文献
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PBGA封装焊点寿命影响因素的有限元分析 总被引:2,自引:0,他引:2
为明确PBGA焊点设计及环境温度参数对其可靠性影响,利用有限元软件ANSYS分析了温度循环、焊点材料、焊点高度与直径、PCB板的厚度、刚度、热膨胀系数(CTE)对焊点寿命的影响.焊点采用了Anand本构关系描述,寿命预测采用Darveaux模型.研究结果表明,温度循环的范围变大焊点寿命变短,保温时间缩短能增加焊点寿命;经过优化的焊球,寿命会增加;PCB板越厚,焊点寿命越短;PCB板的杨氏模量越大,焊点寿命越长. 相似文献
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Effect of Size of Lid-Substrate Adhesive on Reliability of Solder Balls in Thermally Enhanced Flip Chip PBGA Packages 总被引:1,自引:0,他引:1
Jen Y.-M. Fang C.-K. Yeh Y.-H. 《Components and Packaging Technologies, IEEE Transactions on》2006,29(4):718-726
Six design cases of lid-substrate adhesive with various combinations of widths and heights were analyzed to investigate how the size of the adhesive affects the reliability of the solder balls of thermally enhanced flip chip plastic ball grid array (FC-PBGA) packages in thermal cycling tests. Analysis results were compared with data on the reliability of conventional FC-PBGA packages. Thermal-mechanical behavior was simulated by the finite element (FE) method and the eutectic solder was assumed to exhibit elastic-viscoplastic behavior. The temperature-dependent nonlinear stress/strain relationship of the adhesive was experimentally determined and used in the FE analysis. Darveaux's model was employed to obtain the predicted fatigue life of the solder ball. Simulation results reveal that the fatigue life of the solder balls in thermally enhanced FC-PBGA packages is much shorter than that in conventional FC-PBGA packages, and the life of solder balls increases with both the width and the height of the adhesive. However, the effect of the width of the adhesive on the reliability of the solder ball is stronger than that of the height. Moreover, increasing either the width or the height reduces the plastic strain in the adhesive at critical locations, indicating that the reliability of the adhesive can be improved by its size. The predicted results of the life of solder balls for some selected studied packages are also compared with experimental data from thermal cycling tests in the paper 相似文献
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Y. S. Chen C. S. Wang T. C. Wang W. H. Chan K. C. Chang T. D. Yuan 《Journal of Electronic Materials》2007,36(1):6-16
This study investigates the reliability of flip chip ball grid array (FCBGA) components with three types of solder materials:
eutectic solder with a composition Sn63Pb37 and the lead-free solders SnAg3.0Cu0.5 and SnAg4.0Cu0.5. Two substrate-side solder
mask (S/M) opening sizes, 0.4 mm and 0.525 mm, were used. Both the monotonic and cyclic mechanical four-point bend tests are
conducted for the reliability assessment. It is found that the FCBGA components with SnAg3.0Cu0.5 solder have the best durability
during the cyclic bend test, yet the eutectic solder is the strongest during the monotonic bend test. Besides, the FCBGA components
with 0.525-mm S/M opening have around 3 times more life cycles than those with the 0.4-mm S/M opening in the cyclic bend test.
It is also noteworthy that the lead-free solder materials have much variation in the failed cycles during the cyclic test.
Moreover, the failure locations for those components with 0.4-mm S/M openings are found to be at the interface between the
package side metal pad and the solder ball, and those with an S/M opening of 0.525 mm are observed to be failed mostly at
the interface between the printed circuit board (PCB) side metal pad and the solder ball. 相似文献
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The structure of flip chip solder bumps was optimized in terms of shear height and shear speed using a shear test method with
both experimental investigation and nonlinear, three-dimensional, finite element analysis being conducted. A representative,
Pb-free solder composition, Sn-3.0Ag-0.5Cu, was used to optimize the shear test of the flip chip solder joints. Increasing
the shear height, at a fixed shear speed, decreased the shear force, as did decreasing the shear speed, at a fixed shear height.
These experimental and computational results supported the recommendation of low shear height and low shear speed condition
for the shear testing of flip chip solder bumps. This optimized shear test method was applied to investigate the effect of
various heights of mini bumps on the shear force of the solder joints. The shear force increased with increasing Ni-P mini
bump height. 相似文献