Curing characteristics of epoxy resin systems that include a biphenyl moiety

The curing characteristics of epoxy resin systems that include a biphenyl moiety were investigated according to the change of curing agents. Their curing kinetics mainly depend on the type of hardener. An autocatalytic kinetic reaction occurs in epoxy resin systems with phenol novolac hardener, regardless of the kinds of epoxy resin and the epoxy resin systems using Xylok and DCPDP (dicyclopentadiene‐type phenol resin) curing agents following an nth‐order kinetic mechanism. The kinetic parameters of all epoxy resin systems were reported in terms of a generalized kinetic equation that considered the diffusion term. The fastest reaction conversion rate among the epoxy resin systems with a phenol novolac curing agent was obtained in the EOCN‐C epoxy resin system, and for systems with Xylok and DCPDP hardeners, the highest reaction rate values were obtained in NC‐3000P and EOCN‐C epoxy resin systems, respectively. The system constants in DiBenedetto's equation of each epoxy resin system with different curing agents were obtained, and their curing characteristics can be interpreted by the curing model using a curing agent as a spacer. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 1942–1952, 2002     

An infrared spectroscopic investigation of the curing reactions of the EPON 828/meta-phenylenediamine system

Mid- and near-infrared (IR) spectroscopy has been used to study the curing of a bisphenol-A based epoxy resin (EPON-828) with a tetrafunctional curing agent, viz., meta-phenylenediamine (MPDA). Three different cure cycles were used in the study. Primary amine functionality was observed to react relatively rapidly; none remained after curing for 2 h at 75°C. Secondary amine functionality was exhausted in epoxy rich samples subjected to the standard cure cycle (2 h at 75°C followed by 2 h at 125°C). In samples with stoichiometric amount or higher MPDA, complete reaction of secondary amine or epoxy groups was not observed. In amine-rich samples subjected to post curing (6 h at 175°C), evidence was seen for the reaction of hydroxyl and epoxy groups, resulting in a considerable increase in the crosslink density of these samples.     

Effect of diluents on the curing behavior of vinyl ester resin

An acidic vinyl ester resin (～6 mg KOH per gram of solid) was prepared by reacting a bisphenol‐A‐based epoxy resin with acrylic acid in the presence of tributyl amine. The acrylated epoxy resin thus obtained was characterized by Fourier transform infrared spectroscopy. Five samples of vinyl ester resin containing styrene and methyl methacrylate (MMA) in the weight ratios 40:0, 30:10, 20:20, 10:30, and 0:40 were prepared at 30°C, and their curing behavior was studied by differential scanning calorimetry in the presence of benzoyl peroxide (2 phr). Curing behavior was dependent on the ratio of the two monomers used as reactive diluents. The kinetic parameters were determined by Ozawa's method. The energy of activation and frequency factor varied from 17 to 23 kcal mol^?1 and 8.47 × 10⁹ to 5.21 × 10¹² min^?1, respectively and were lowest for the samples containing 30:10 and 10:30 styrene/MMA weight ratios. The curing reactions followed first‐order kinetics and obeyed the Arrhenius rate expression. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 87: 1948–1951, 2003     

Synthesis and characterization of emulsion‐type curing agent of water‐borne epoxy resin

Self‐emulsified water‐borne epoxy curing agent of nonionic type was prepared using triethylene tetramine (TETA) and derivative of epoxy resin as a capping agent, which was synthesized by liquid epoxy resin (E51) and polyethylene glycol (PEG), and the curing agent possessed emulsification and curing properties at the same time. The curing agent with good property of emulsifying liquid epoxy resin could be obtained under the condition of the molar ratio of PEG : E51 : TETA as 0.8 : 1 : 3.5 at 80°C for 5 h. The mean particle size of the emulsion liquid was about 220 nm with the prepared curing agent and epoxy resin at the mass ratio of 1 : 3. The structure of the emulsion‐type curing agent was confirmed by FTIR and ¹H NMR spectra, and the mechanism of cured film formation was also analyzed by SEM photographs. The cured film prepared by the emulsion‐type curing agent and epoxy resin under ambient cure conditions showed good properties even at high staving temperature. This study provides useful suggestions for the application of the water‐borne epoxy resins in coating industry. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 2652–2659, 2013     

Microencapsulation of imidazole curing agents by spray‐drying method

An epoxy resin–imidazole system was used to form the adhesives for the anisotropic conducting film (ACF), and a latent curing system was necessary for the ACF. In this study, imidazoles were microencapsulated for the latent curing system. Polycaprolactone (PCL) was used as the wall material, and the spray‐drying method was used to form the microcapsule. The imidazoles used in this study were imidazole, 2‐methylimidazole, and 2‐phenylimidazole. The effect of the ratio of PCL to imidazoles, and the effect of PCL molecular weight were investigated during the microcapsule formation. The amount of imidazoles in the microcapsule was measured using thermogravimetric analyzer and elemental analysis. The permeability of the microcapsules was measured in ethanol, and the shelf life of the microcapsules was studied for the epoxy resin. The curing behavior of these microcapsules to epoxy resin was examined using differential scanning calorimeter. In the curing reaction, the microcapsule of imidazoles exhibited delayed kinetic behaviors compared to pure imidazoles. And the curing times were estimated at 150 and 180°C using an indentation method. These microcapsules of imidazoles exhibited a long shelf life, and the curing did not occur in some of the microcapsule–epoxy resin systems at 20°C for 15 days. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Microencapsulation of 1-methylimidazole using solid epoxy resin: study on microcapsule residence time and properties of the system

In this study for the first time 1-methylimidazole was microencapsulated successfully by solid epoxy resin using solvent evaporation method. Fourier transform infrared spectroscopy, scanning electron microscopy, thermal gravimetric and differential scanning calorimetry were used for characterization of microcapsule and epoxy resin/microcapsule systems. The results revealed that although the solid epoxy shell was in contact with imidazole curing agent for a long time, it still remained as a thermoplastic. The chain length of the solid epoxy resin was grown in anionic polymerization process which led to an increase in the melting temperature from 64 to 78 °C. On the other hand, all epoxy functional groups of the shell did not participate in the curing reaction of resin with core curing agent of the microcapsule. The results showed that by increasing the residence time of the microcapsules, the number of epoxy groups of liquid epoxy decreased slightly but the rate of complex viscosity increase or the rate of curing reaction was increased and the cured epoxy system exhibited a single-phase morphology. On the other hand, in the presence of microcapsules the curing reaction of epoxy resin was successfully carried out and the curing temperature and the onset of viscosity increase or gel time at 120 °C were not more or less affected by sufficiently long contact time of epoxy and microcapsule.     

Curing of epoxy resin by ultrafine silica modified by grafting of hyperbranched polyamidoamine using dendrimer synthesis methodology

Hyperbranched polyamidoamine–grafted silica was prepared according to dendrimer synthesis methodology. The modified silica was dispersed uniformly in epoxy resin, and the curing of epoxy resin proceeded successfully by heating in the presence of the modified silica; the gel fraction of the epoxy resin cured by the hyperbranched polyamidoamine–grafted silica (grafting = 80.2%) reached 77% at 170°C after 48 h. The gel fraction increased with increasing terminal amino group content of the hyperbranched polyamidoamine–grafted silica. In addition, the curing ability of the silica increased by complexation of the terminal amino groups of the grafted polyamidoamine with boron trifluoride. The modulus of elasticity of the curing materials obtained using the modified silica as a curing agent was lower than that using conventional a curing agent such as ethylenediamine in the presence of untreated silica. On the other hand, the heat resistance of the curing product using the modified silica was superior to that using ethylenediamine, but no difference in glass‐transition temperature was observed. It is expected that hyperbranched polyamidoamine grafted‐silica is incorporated uniformly with chemical bonds in the matrix of the epoxy resin. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 573–579, 2001     

Laboratory investigation of the properties of asphalt modified with epoxy resin

Epoxy asphalts were prepared by mixing styrene–butadiene–styrene (SBS) modified asphalt with epoxy resin. The curing process and morphology of epoxy asphalts were characterized by infrared spectroscopy and fluorescent microscope, respectively. The effects of epoxy resin contents, ratio of curing agent to epoxy resin and curing temperature on properties of epoxy asphalt were investigated. Results indicated that epoxy resin and epoxy asphalt showed similar curing efficiency. Epoxy asphalts can be cured at 120 or 60°C and its viscosity at 120°C can meet the demands of asphalt mixture mixing and paving. The chemical reaction of epoxy resin in epoxy asphalt is slow and reaction occurs not only with the curing agent but also carboxylic acid in epoxy asphalt. The microstructure of epoxy asphalt transforms from the dispersed structure to networks structure with epoxy resin content increasing and phase transition starts when 30 wt % epoxy resin present in asphalt. The softening point and tensile strength of epoxy asphalt increased with epoxy resin contents increasing. The softening point and tensile strength of epoxy asphalt were markedly improved when epoxy resin content was more than 30 wt %, which is attributed to formation of continuous structure of epoxy resin. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Curing of epoxy resin with poly(m‐phenylene methylphosphonate)

The mechanism and kinetics of curing of epoxy resin with poly(m‐phenylene methylphosphonate) (PMP) was studied by extraction and swelling experiments, DSC, ³¹P NMR, and FTIR. It was shown that at linear heating of 20°C/min PMP cures bisphenol A type epoxy resin at 230–300°C, whereas in the presence of catalytic amount of 2‐methyl imidazole the curing occurs at 200–230°C. Under isothermal conditions, epoxy resin was cured with PMP after 40–70 min at 150°C. An unusual mechanism of curing due to opening and insertion of epoxy into the phosphonate bond was suggested. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 4011–4022, 2006     

Preparation of epoxy-based insulator and optimization of its thermal property by Taguchi robust design method in double base propellant grain application

Taguchi method (orthogonal array, OA₉) was used to design an epoxy insulator by evaluating its glass transition temperature (T _g) for using in a double base (DB) propellant grain. In this design method, three epoxy resins based on diglycidylether bisphenol A (DGEBA), three polyamine curing agents and a DGEBA-based reactive diluent agent were used. The curing process of epoxy resins with polyamines was studied by Fourier transform infrared spectroscopy. The results showed that the curing process was completed at room temperature. The effects of four parameters including resin type, curing agent type, curing agent concentration and diluent quantity were investigated to design a resin formulation with a highest T _g after curing. The obtained results were quantitatively evaluated by the analysis of variance (ANOVA). The results of ANOVA showed that the highest T _g of 86.0 ± 9.0 °C was obtained for the optimum formulation of MANA POX-95 as epoxy resin, H-30 as curing agent and 52 phr H-30. The T _g measured by the experiment was 78.0 ± 0.9 °C. In addition, the single lap shear strength (adhesion strength) of the optimized insulator was measured at 13.66 ± 1.02 MPa. Pull-off test performed on the surface of DB propellant resulted a 1.935 ± 0.003 MPa adhesion strength.     

Synthesis of a self‐emulsifiable waterborne epoxy curing agent based on glycidyl tertiary carboxylic ester and its cure characteristics

A novel self‐emulsifiable waterborne amine‐terminated curing agent for epoxy resin based on glycidyl tertiary carboxylic ester (GTCE) was synthesized through three steps of addition reaction, capping reaction, and salification reaction of triethylene tetramine (TETA) and liquid epoxy resin (E‐44). The curing agent with good emulsifying and curing properties was gradually obtained under condition of the molar ratio of TETA: E‐44 as 2.2: 1 at 65 °C for 4 h, 100% primary amine capped with GTCE at 70 °C for 3 h, and 20% salifiable rate with glacial acetic acid. The curing agent was characterized by Fourier transform‐infrared spectroscopy (FT‐IR). The curing behavior of the E‐44/GTCE‐TETA‐E‐44 system was studied with differential scanning calorimetry (DSC) and FT‐IR. Results showed that the optimal mass ratio for E‐44/GTCE‐TETA‐E‐44 system was 3 to 1, and the curing agent showed a relatively lower curing temperature. The cured film prepared by the self‐emulsifiable curing agent and epoxy resin under the optimal mass ratio displayed good thermal property, hardness, toughness, adhesion, and corrosion resistance. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44246.     

Microencapsulation of imidazole curing agent for epoxy resin

An epoxy resin–imidazole system was used to form the adhesives for the anisotropic conducting film (ACF), and a latent curing system was necessary for the ACF. In this study, 2-phenylimidazole (2PhI) was encapsulated for the latent curing system. Polycaprolactone (PCL) was used as the wall material, and the solvent evaporation method was used to form the microcapsule. The effects of the ratio of 2PhI and PCL, and the effects of the molecular weight of PCL were investigated during the microcapsule formation. The amount of 2PhI in the microcapsule was measured using TGA. The permeability of the microcapsules was measured in ethanol, and the shelf life of the microcapsules was also studied for the epoxy resin. The curing behavior was examined using DSC. In the curing reaction of the epoxy resin, the microcapsule of 2PhI exhibited a delayed kinetic behavior compared to pure 2PhI. This microcapsule of 2PhI exhibited a long shelf life, and the curing did not occur in this microcapsule–epoxy resin system at 20 °C for more than 30 days.     

涂层磨损测试方法与环氧树脂耐蚀磨性能研究

研究了磨损测试方法和环氧树脂胶粘涂层的耐冲蚀磨损性能。通过添加不同填料并与固化剂反应制得了不同环氧树脂试样。试验表明:在攻角(入射角)45°时冲蚀率最大,攻角60°时冲蚀率最小。而随冲蚀速度增加,冲蚀率显著增大。加入纳米蒙脱土填料的环氧胶粘涂料比普通复合材料具有良好的抗冲蚀磨损性能。     

The studies of physical properties of dimeric fatty acid-modified thiodiphenyl epoxy resins

A thermally stable thiodiphenyl epoxy resin was modified with a dimeric fatty acid at an epoxy resin:fatty acid molar ratio of 4:1. The thermal and mechanical properties of the modified epoxy resin were studied by preparing an epoxy composition with an amine curing agent and a catalyst, followed by curing at 170 °C to produce a neat plastic epoxy resin. The tensile and impact strengths of the resin indicated improved flexibility and toughness compared to other epoxy resins. Enhanced toughness was confirmed by the increased lap shear strength in single lap joints prepared with steel substrates attached by the resin.     

Cure behavior of epoxy resin containing castor oil and cashew nut shell liquid and its derivative

The cure behavior of epoxy resin with a conventional amide‐type hardener (HD) was investigated in the presence of castor oil (CO), cashew nut shell liquid (CNSL), and cashew nut shell liquid–formaldehyde resin (CFR) with dynamic differential scanning calorimetry (DSC). The activation energy of the curing reaction was also calculated on the basis of nonisothermal DSC thermograms at various heating rates. A one‐stage curing was noted in the case of epoxy resin filled with CO, whereas the epoxy resin with CNSL and CFR showed a two‐stage curing process. A competitive cure reaction was noted for the epoxy resin/CNSL(or CFR)/HD blends. In the absence of HD, CFR showed lower values of curing enthalpy than that of CNSL. The activation energy of epoxy resin curing increased with increasing CNSL and CFR loading. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Adhesives and coatings based on poly(vinyl acetal)s

Phenolic resins such as resole phenol– and cresol–formaldehyde, as well as low-molecular-weight epoxy resin based on bis(4-hydroxy phenol) cyclohexane were prepared and modified with various types of the prepared poly(vinyl acetal)s. Poly(vinyl formal), poly(vinyl isobutyral), and poly(vinyl propional) were used. This study indicated that the optimum conditions for curing phenolic or epoxy resin–poly(vinyl acetal)s adhesive compositions are of an equal weight ratio or a 2 : 1 weight ratio in the presence of phthalic anhydride (10 or 20 wt %) of resin content as a curing agent at 150°C for 20 or 60 min, respectively. The effect of acetal type on the tensile shear strength values of resin samples, cured under the previously mentioned optimum conditions for different times, was investigated. The effect of structure of cresol–formaldehyde and epoxy resins was also studied. Metallic and glass coatings from the previous pure resins and their formulated mixtures were also prepared and evaluated as varnishes or paints. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 70: 1769–1777, 1998     

Grafting of Epoxy Resin on Surface-modified Poly(tetrafluoroethylene) Films

An epoxy/PTFE composite was prepared by curing the epoxy resin on the surface-modified PTFE film. Surface modification of PTFE films was carried out via argon plasma pretreatment, followed by UV-induced graft copolymerization with glycidyl methacrylate (GMA). The film composite achieved a 90°-peel adhesion strength above 15 N/cm. The strong adhesion of the epoxy resin to PTFE arose from the fact that the epoxide groups of the grafted GMA chains were cured into the epoxy resin matrix to give rise to a highly crosslinked interphase, as well as the fact that the GMA chains were covalently tethered on the PTFE film surface. Delamination of the composite resulted in cohesive failure inside the PTFE film and gave rise to an epoxy resin surface with a covalently-adhered fluoropolymer layer. The surface composition and microstructures of the GMA graft-copolymerized PTFE (GMA-g-PTFE) films and those of the delaminated epoxy resin and PTFE film surfaces were characterized by X-ray photoelectron spectroscopy (XPS), water contact angle and scanning electron microscope (SEM) measurements. The delaminated epoxy resin surfaces were highly hydrophobic, having water contact angles of about 140°C. The value is higher than that of the pristine PTFE film surface of about 110°. The epoxy resin samples obtained from delamination of the epoxy/GMA-g-PTFE composites showed a lower rate of moisture sorption. All the fluorinated epoxy resin surfaces exhibited rather good stability when subjected to the Level 1 hydrothermal reliability tests.     

Hybridization of aqueous PU/epoxy resin via a dual self‐curing process

Amino‐terminated and carboxyl‐containing polyurethane (PU) is prepared by an isocyanate‐terminated PU prepolymer process. Carboxyl‐containing epoxy resin is obtained from a half‐esterification of epoxy resin with maleic anhydride. These two aqueous resins are obtained after neutralization with triethylamine and dispersion into water phase, respectively. A latent curing agent (TMPTA‐AZ) is prepared by a Michael addition of aziridine with trimethylolpropane triacrylate (TMPTA). A self‐curing system of PU/epoxy hybrid is obtained from a blending of these two aqueous resins with latent curing agent. PU/epoxy hybrid is derived from two self‐curing reactions on drying. The first curing for hybridization between PU amino groups with oxirane groups of epoxy resin is via a ring‐opening reaction and the secondary curing takes place on carboxyl groups of PU/epoxy hybrid with aziridine of TMPTA‐AZ. The final properties of these dual self‐cured PU/epoxy hybrids are reported. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Study on the curing reaction,dielectric and thermal performances of epoxy impregnating resin with reactive silicon compounds as new diluents

Two silicon compounds including (3‐glycidoxypropyl)trimethoxysilane (A187) and (3‐glycidoxypropyl)methyldiethoxysilane (W78) were used and studied as reactive diluents for aluminum (III) acetylacetonate (Alacac) accelerated epoxy/anhydride impregnating resin systems. The dielectric performances were studied and characterized by the dielectric dissipation factor, dielectric constant, volume resistivity, and breakdown strength. The curing behaviors and thermal properties of the cured impregnants were studied by Fourier transform infrared (FTIR) spectroscopy, differential scanning calorimetry (DSC), and thermogravimetry. The activation energies of different epoxy formulations were determined with Kissinger method. The results showed that W78 was effective to decrease the viscosity and had little influence on the curing reaction. The cured sample of 15 parts‐of‐W78‐containing‐epoxy resin/methyl‐hexahydrophthalic anhydride (MHHPA) accelerated by Alacac exhibits good dielectric and heat resistant performances with a dielectric dissipation factor below 0.04 at 155°C. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

One-component epoxy adhesive for repair of cell phone board

The development of a one-component epoxy adhesive for cell phone board repair was described. The most important goal of this study is to obtain long storage stability in conjunction with the curing reaction process at a relatively low temperature of 95 °C. Bisphenol-A type, bisphenol-F type, and NBR-based epoxy resins were used as the basic resins. Dicyandiamide (DICY) was used as a curing agent, and 2-methylimidazole (2MI) was used as an accelerator. 2MI was encapsulated using a copolymer of methacrylic acid and dodecyl methacrylate to achieve latent curing performance. After mixing the epoxy resin with DICY and encapsulated 2MI, this curing system showed excellent storage stability with almost no viscosity increase for 2 months at 20 °C, and full curing was achieved at 95 °C for 50 min. We determined the optimum formulation of the epoxy adhesive for adhesion of a cell phone board after the measurement of physical properties.