表面处理对CdZnTe晶片漏电流的影响

采用EDS、XPS、I-V等方法研究了Cd1-xZnxTe(CZT)表面处理工艺与晶片漏电流之间的相互关系。结果表明,机械抛光后的CZT晶片存在损伤层,采用5%BM溶液腐蚀可有效去除损伤层,得到光滑无划痕的表面,但腐蚀后晶片表面组成偏离化学计量配比,随腐蚀时间的延长表面呈现富Te现象,晶体表面漏电流随之增大1～2个数量级;采用KOH溶液对BM抛光后的晶片进一步腐蚀10min,可消除多余的Te得到接近于化学计量比的表面;采用NH4F/H2O2溶液对晶片表面进行钝化,XPS分析表明样品表面的Te0或Te2-被氧化成Te4+,形成高阻氧化层。I-V测试结果表明晶片经KOH+NH4F/H2O2溶液两步钝化后,表面漏电流相对于BM抛光后降低2～3个数量级,具有较好的钝化效果。     

Si(100)表面S钝化效果与稳定性研究

基于Valence-Mending概念对Si(100)表面进行S钝化研究.对于Ni/n-Si肖特基接触,S钝化使其肖特基势垒高度向其理想势垒高度靠近了0.09 eV;对于Al/p-Si肖特基接触,S钝化使其肖特基势垒高度向其理想势垒高度靠近了0.08 eV.少子寿命测试结果表明S钝化使Si(100)表面少子寿命提高大约1个数量级;热稳定性实验结果表明560℃时S钝化效果退化;XPS测试结果表明S离子化学吸附在Si表面并形成Si-S键,样品在空气中放置一段时间后表面Si-S键被氧化,表明S钝化抗氧化性不强.     

CdZnTe探测器晶片的表面处理工艺

报道了CdZnTe探测器晶片表面钝化工艺对其性能的影响.先采用金相砂纸和化学腐蚀剂对CdZnTe晶片进行机械和化学抛光,然后分别用H2O2溶液和NH4F/H2O2溶液对晶片进行湿法钝化;再用ZC36微电流测试仪和扫描电镜测试研究了不同钝化时间对CdZnTe晶片电学性质和表面形态的影响.结果发现:用NH4F/H2O2溶液对CdZnTe探测器晶片进行钝化30min,晶片表面形成一层完整的高阻氧化层,表面漏电流最小、晶体电阻率提高1～2个数量级,达到109～10Ω·cm,适合探测器的制备.     

Ar和H2气氛退火CdZnTe表面的XPS研究

对CZT晶体进行了相同温度条件下Ar和H2气氛退火实验研究.利用XPS的离子溅射深度剖析对比分析了退火前和不同气氛退火后CZT晶体表面成分和价态的变化,并以上述变化为依据,推测了退火前CZT晶体的表面结构和成分以及退火过程中气体与CZT晶体表面发生的化学反应.结果表明,相比Ar气氛退火,H2气氛退火后因为TeO2和富Te层会先后和H2发生化学反应而大量减少,可以有效地去除TeO2和富Te层,增大H与CZT的接触面积,促进H与CZT的进一步反应.     

CdZnTe晶片表面钝化后的热处理研究

报道了CdZnTe晶片表面钝化后,热处理工艺对其性能的影响.先采用30;的H2O2钝化抛光好的CdZnTe 晶片,然后在恒温干燥箱中进行热处理;最后使用ZC36微电流测试仪、EDX能谱仪和扫描电镜(SEM)研究热处理对钝化后的CdZnTe晶片表面的电学性能、表面成分以及表面形貌的影响.分析表明:CdZnTe钝化后在大气氛围120℃下热处理40 min,表面H2TeO3、H6TeO6等分解较为完全,晶片表面氧化层分布均匀,表面漏电流显著减小,晶体电阻率提高1～2个数量级,对提高探测器的性能有重要作用.     

ZnO过渡层对Au/Hg3In2Te6肖特基接触特性的影响研究

利用脉冲激光沉积技术在Hg3In2Te6晶体表面制备ZnO过渡层,并对ZnO过渡层进行了表征.结合X射线光电子能谱深度剖析对ZnO/Hg3In2Te6界面元素的化合态进行研究,并通过半导体参数分析仪对Au/ZnO/Hg3In2Te6肖特基接触电学特性进行测试.研究结果表明,采用本实验条件可在Hg3In2Te6晶体表面获得结晶度高、表面粗糙度低,且沿(002)晶面择优生长的ZnO过渡层.同时,ZnO过渡层的引入使Au/Hg3In2Te6肖特基接触的漏电流降低一个数量级,势垒高度提高6.5;.这种现象可能是由于ZnO/Hg3In2Te6界面存在的互扩散使O原子占据了Hg原子空位,从而降低耗尽层中能级缺陷而引起.     

HgI2晶体溅射Au电极与化学镀Au电极的I-V特性

利用Agilent4155型CVIV测试仪测定了分别采用溅射Au和涂敷氯金酸(AuCl3溶液)作为电极材料时HgI2晶体的I-V特性.测试表明,Au/HgI2和AuCl3/HgI2的欧姆接触特性值b分别为0.89和1.06,HgI2晶体的电阻率为109 Ω·cm.计算接触电阻Rc的结果表明,Au/HgI2与AuCl3/HgI2接触电阻为1.6×107 Ω和4.3×106 Ω;AuCl3/HgI2更容易产生较低的接触电阻,形成良好的欧姆接触.分析认为AuCl3/HgI2接触中电极本质上是氯金酸分解产生Au单质并形成电极.由于电极制备工艺没有显著影响晶体表面质量,使AuCl3/ HgI2具有良好的欧姆接触特性.溅射Au电极在制备工艺中的温度升高和真空度造成晶体表面质量下降,使Au/HgI2欧姆接触特性较差.     

p型CdZnTe晶体(111)B面的Au/Zn复合电极的制备和研究

通过对p型CdZnTe(111)面的结构分析,用真空蒸发法在p型CdZnTe晶体(111)面制备出Au/Zn复合电极,运用金相显微镜、AFM测试、SEM剖面观察、EDS成分分析、Ⅰ-Ⅴ特性测试及势垒高度计算等多种手段研究了Au/Zn复合电极对金属和半导体接触性能的影响.结果表明,在P型CdZnTe(111)A面蒸镀Au电极,在B面蒸镀Au/Zn复合电极时获得的势垒高度最低,有效减小了富Te面对金半接触的影响.Au/Zn复合电极能获得比Au电极更理想的接触性能.     

CdZnTe平面核辐射探测器研究

采用垂直Bridgman方法生长的CdZnTe晶体,定向切割成12 mm×7 mm×2.5 mm单晶片.通过研磨、抛光、腐蚀、电极制备、钝化、退火等一系列工艺,制成了Au/CdZnTe/Al平面探测器.重点研究了快速退火对电极接触特性的影响.测试了Au/CdZnTe/Al平面探测器的能谱响应特性.结果表明:在室温偏压为350 V条件下,探测器的241Am 59.54 keV光谱能量分辨为3.95;(2.35 keV FWHM).     

籽晶垂直布里奇曼法生长大尺寸CdZnTe单晶体

采用改进的垂直布里奇曼(MVB)法并引入籽晶生长技术,成功生长出直径60mm,单晶体积超过200cm3的CdZeTe(CZT)晶锭.根据CZT 晶片在近红外(NIR)波段的透过谱,由截止波长推算Zn组分在晶片中的平均含量,进一步的拟合得出晶体生长过程Zn沿晶锭轴向分凝因数约为1.30;分析了晶片在中红外波段内的红外透过率,发现波数在2000～4000cm-1内透过率平直且较高,超过60;,而从2000cm-1到500cm-1随波数的减小透过率急速下降至零;由钝化后的Au/CZT晶片的I-V曲线,计算得到生长态CZT晶片的电阻率ρ达到1.8×109～2.6×1010Ω·cm.     

Study of ammonium fluoride passivation time on CdZnTe bulk crystal wafers

The chemical etching and the passivation processes of CdZnTe wafers were studied. The treatment effects were tested through an X‐Ray Photoelectron Spectroscopy (XPS) analysis and I–V measurement. The chemical etching in 2%Br–MeOH solution may effectively remove the damaged layer and improve the ohmic contact between CdZnTe wafer and Au electrodes making rich the surface with Te. After different etching times, the CdZnTe wafers were passivated with NH₄F/H₂O₂.CdZnTe wafer passivated immediately after etching showed the best passivation efficiency because the enriched Te on the surface was fully oxidized to TeO₂, which results in the thickest oxide layer, and the most stoichiometric surface. Also the surface leakage current was reduced in comparison with the sample passivated 24 h after etching. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Investigation of metal–GaN and metal–AlGaN contacts by XPS depth profiles and by electrical measurements

Metal/GaN Schottky contacts have been studied by X-ray photoelectron spectroscopy (XPS). Au/GaN, Pt/GaN, Pd/GaN are sharp while Ti/GaN is diffuse with the following composition, starting from the surface: Ti+TiN, Ti+Ti_xGa_yN, Ti+Ti_xGa_yN+Ga, GaN+Ga. Au/AlGaN and Ni/AlGaN contacts are much broader than Au/GaN: Al and Ga are found more than 100 Å away from the interface. Schottky barrier height was measured for the Au/GaN, Pd/GaN, Pt/GaN, Au/AlGaN and Ni/AlGaN contacts.     

Ti/Au复合电极在CdZnTe (111)B面上的表面结构与性能研究

近年来,碲锌镉(CdZnTe)材料制成的探测器已经成为研究热点,适当的接触特性已经成为提高探测器性能的关键问题。本文主要探讨了弱n型CdZnTe晶体(111)B面Ti/Au复合电极的欧姆接触性能,采用两步沉积工艺制备Ti/Au复合电极。通过AFM、FIB/TEM、XPS、I-V等测试方法研究了电极与CdZnTe的界面结构、化学成分和电学性能。结果表明,Ti过渡层的引入可以减轻和改善晶片抛光过程中形成的损伤层,增加了电极与晶体之间的欧姆特性。相比于CdZnTe (111)B面上的Cr/Au复合电极,Ti/Au复合电极的粗糙度更低、接触界面更平整,晶格失配层厚度也更低。Ti中间层促进了金/半界面的互扩散现象, 有利于增加黏附性和降低肖特基势垒,并且在Ti/Au复合电极与CdZnTe接触的界面上没有观察到氧元素的存在。I-V测试表明Ti/Au复合电极具有更加良好的欧姆特性和更低的肖特基势垒。     

Effects of barrier growth temperature on the properties of InGaN/GaN multi-quantum wells

The effects of the growth temperature and ambient of GaN quantum barriers on the characteristics of InGaN/GaN multi-quantum wells (MQWs) grown by a thermally pre-cracked ion-supplied metalorganic chemical vapor deposition (TPIS-MOCVD) system were investigated. The improvement of optical, structural properties and surface morphology in the MQWs with increasing the growth temperature of quantum barriers was found. Without a GaN capping layer, there were many pits and the thickness of quantum pair reduced by the thermal etching during the temperature-ramping process. Photoluminescence (PL) peaks showed a blue-shift and double peaks, but relative PL intensity abruptly increased due to the suppression of deep level related defects and smooth surface morphology caused by the increased surface mobility of adatom in the high temperature region. By using a GaN capping layer on the InGaN well layer, the thermal decomposition of the InGaN well layer was suppressed and pits on the surface abruptly reduced. A hydrogen carrier gas for the GaN barrier growth also improved the optical and structural properties of MQWs.     

Recent developments and progress on electrical contacts to CdTe, CdS and ZnSe with special reference to BARRIER contacts to CdTe

A summary of experimental work on electrical contacts to CdTe, CdS and ZnSe is presented and recent progress of research on electrical contacts to these materials is reviewed in this paper. The surface preparation and surface characterisation prior to metallisation, interactions at the interface during contact fabrication, Schottky barrier characterisation and subsequent aging effects are considered. XPS, AES, SIMS and PL are used for surface characterisation; XPS and soft-XPS are used for interface interaction studies; I-V, C-V, DLTS and BEEM are used for Schottky barrier characterisation; and AES, GDOES and EDX profiling are used to study aging effects. The surfaces of all three materials behave in a similar way when etched in wet chemical etchants. The semiconductor cation is preferentially etched by acidic solutions and the semiconductor anion is preferentially removed by alkaline solutions. It has also been shown that the surface stoichiometry affects the Fermi level pinning position at metal/semiconductor interfaces. Furthermore, the observed Schottky barrier heights with all three materials demonstrate a multi-level pinning behaviour producing different barrier heights depending on the history of the materials used and the fabrication procedure followed. Barrier heights observed are independent of the metal work function, and their stability depends mainly on interactions occurring at the metal/semiconductor interface and are strongly related to the native defect levels within the bulk material.     

Characterization of Pr2O3 Added Metals/GaAs Schottky Diodes using X-ray Photoelectron Spectroscopy

In this research, the surface chemical structures of Pr₂O₃ doped Liquid Phase Epitaxy (LPE) layers were investigated by X-ray Photoelectron Spectroscopy (XPS). The bonding energies of these grown surfaces are studied under various adding conditions. The comparisons of these surface chemical structures were used to explain the evolutions of the grown surfaces with their effects on the Schottky barrier height. Because the surface states are lowered and the Fermi level is not pinned, these metals(Au, Ag, Ni, Pt)/GaAs Schottky structures all show an improved diode performance by adding Pr₂O₃. The resulting barrier height and ideality factor, as estimated by the current-voltage measurement, can be as high as 0.94+-0.02 eV and as unitary as 1.03+-0.01, respectively.     

引入Si掺杂层调控InGaAs/GaAs表面量子点的光学特性

在InGaAs/GaAs表面量子点(SQDs)的GaAs势垒层中引入Si掺杂层,以研究Si掺杂对InGaAs/GaAs SQDs光学特性的影响。荧光发光谱(PL)测量结果显示,InGaAs/GaAs SQDs的发光强烈依赖于Si掺杂浓度。随着掺杂浓度的增加, SQDs的PL峰值位置先红移后蓝移; PL峰值能量与激光激发强度的立方根依赖关系由线性向非线性转变;通过组态交互作用方法发现SQDs的PL峰位蓝移减弱;时间分辨荧光光谱显示了从非线性衰减到线性衰减的转变。以上结果说明Si掺杂能够填充InGaAs SQDs的表面态,并且改变表面费米能级钉扎效应和SQDs的荧光辐射特性。本研究为深入理解与InGaAs SQDs的表面敏感特性关联的物理机制和载流子动力学过程,以及扩大InGaAs/GaAs SQDs传感器的应用提供了实验依据。     

Defect passivation by hydrogen reincorporation for silicon quantum dots in SiC/SiOx hetero-superlattice

The SiC/SiO_x hetero-superlattice (HSL) consisting of alternating near-stoichiometric SiC barrier layers for the electrical transport and silicon rich SiO_x matrix layers for the quantum dot formation is a promising approach to the realization of silicon quantum dot (Si–QD) absorbers for 3rd generation solar cells. However, additional defect states are generated during post deposition annealing needed for the Si–QD formation causing an increase in sub-band gap absorption and a decrease in PL intensity. Proper passivation of excess defects is of major importance for both the optical and electrical properties of the SiC/SiO_x HSL Si–QD absorber. In this work, we investigate the effectiveness of the hydrogen reincorporation achieved with hydrogen plasma in a plasma-enhanced chemical vapor deposition (PECVD) reactor, hydrogen dissociation catalysis in hot-wire chemical vapor deposition (HWCVD) reactor and annealing in forming gas atmosphere (FGA). Both the HSL samples and single layer reference samples are tested. The passivation quality of the hydrogen reincorporation was examined by comparing electrical and optical properties measured after deposition, after annealing and after passivation. In addition, the formation of Si–QDs in SiC/SiO_x HSL was evaluated using high resolution transmission electron microscopy. We demonstrated that hydrogen can be successfully reincorporated into the annealed HSL sample and its single layer reference samples. FGA passivation is most effective for SiO_1.2 single layers and HSL samples. Passivation with PECVD appeared to be only effective for SiC single layers.     

Etching of CaF2 single crystals in silica gels

Etching of {111} cleavage faces of CaF₂ crystals in aqueous solution of 50% HCl is carried out in citric acid set silica gel, and the kinetics of growth of etch pits at the sites of dislocations is investigated as a function of temperature, time of etching and height of gel column above the crystal surface. It is observed that the transient period required to initiate etch pit at the sites of a dislocation decreases (1) at particular temperature, with a decrease in gel height, and (2) for a particular gel height, with an increase in the temperature of etching. It is also observed that the morphology of dislocation etch pits remains triangular irrespective of the gel height and the temperature of etching. The results are compared with those of solution etching and discussed.     

Photoluminescence spectrum from heterojunction with intrinsic thin layer solar cells: An efficient tool for estimating wafer surface defects

In heterojunction with intrinsic thin layer “HIT” solar cells, care has to be taken to passivate the defects on the wafer surface before the deposition of the doped amorphous emitter and back surface field layers. Otherwise, these defects would lead to a significant loss in cell performance. It is therefore important to estimate the magnitude of these defects. In the passivation studies undertaken experimentally, both wafer surfaces were cleaned either by a dip in a 5% HF solution for 30 s or by various dry plasma processes, before depositing intrinsic a-Si:H layers. Detailed electrical–optical modeling of the measured PL signal from these wafers (in a solar cell configuration) not only allows us to quantify the surface defects in each case, relative to e.g., the sample showing the highest PL signal, but also to calculate the solar cell output parameters and link them to the intensity of the PL signal and the defect density on the wafer surface.Dry plasma cleaning has the advantage that it can be done in situ. Our preliminary plasma cleaning studies in conjunction with modeling indicate that it is possible in this way to achieve the levels of surface passivation comparable to standard HF dip cleaning.