固着磨料加工碳化硅反射镜的初步实验研究

本文采用了一种有别于传统的加工碳化硅反射镜的工艺---固着磨料加工工艺。此工艺不但可以利用大颗粒金刚石磨料快速加工出较好的镜面质量,而且由于其固着磨料与工件相对运动关系固定,有利于精确加工。在工艺实验中,分别测得了W7,W5,W3.5,W1.5固着磨料丸片在特定转速和压力下对碳化硅材料的去除特性。通过多组去除量曲线,我们得出此工艺不仅有着较高的去除率,而且其稳定性非常良好。另外在表面粗糙度结果方面,最初使用W7丸片获得了粗糙度为42.758nm rms的镜面。我们不断减小所用丸片的粒度,工件表面粗糙度随之减小。在使用W1.5丸片抛光后,最终获得了粗糙度为1.591nm rms的光滑镜面。实验结果表明,固着磨料加工碳化硅反射镜工艺在某些加工阶段内可以取代传统的散粒磨料加工工艺,有着良好的应用前景。     

Development of binder-free CMG abrasive pellet and finishing performance on mono-crystal sapphire

Chemo-mechanical-grinding (CMG) is a fixed abrasive process by integrating chemical reaction and mechanical grinding for sapphire wafer finishing, and shows advantages in surface integrity, geometric controllability and waste disposal. However, the material removal rate (MRR) obtained by the traditional CMG wheel is not high enough to meet the requirement from the mass production of sapphire wafers. As a potential solution, a new CMG wheel with extremely high abrasive concentration has been proposed. This paper targets on developing of binder-free abrasive pellets (BAP) with 100 wt% abrasive as well as investigating the performance of BAP in sapphire wafer finishing. The results of CMG experiment reveal that the MRR and surface roughness (Ra) of sapphire wafer finished by BAP constructed CMG wheel are able to reach 1.311 μm/h and 0.993 nm respectively. The characterization by Raman microscope indicates that the finished sapphire wafer also owns excellent subsurface integrity.     

固着磨料加工碳化硅反射镜的材料去除率及表面粗糙度的理论研究

本文基于固着磨料加工碳化硅反射镜的微观作用原理，理论上定量分析探讨了金刚石磨料压入碳化硅工件的深度对材料去除率、光学元件表面粗糙度的影响，分别获得了材料去除率数学模型及粗糙度的仿真计算结果。通过去除率及粗糙度的实验与理论模型的对比结果来看，实验值虽与理论值有偏差，但基本稳定在同一数量级内，由此验证了理论分析的正确性。固着磨料工艺的这一易于理论预测的特性对实际的光学加工有着极为重要的意义，因此这种较为新颖的固着磨料工艺在碳化硅反射镜加工领域内有着广阔的应用前景。