高分辨X射线衍射表征氮化镓外延层缺陷密度

利用高分辨X射线衍射方法, 分析了在4H-SiC(0001)面上采用金属有机物化学气相沉积(MOCVD)生长的GaN薄膜的位错。采用对称面衍射和斜对称面衍射等方法研究了晶面倾转角、面内扭转角、晶粒尺寸和晶面弯曲半径等参数, 通过排除仪器、晶粒尺寸及晶面弯曲对摇摆曲线半高宽的影响, 从而获得GaN薄膜的螺位错密度和刃位错密度分别为4.62×10⁷ cm^-2和5.20×10⁹ cm^-2, 总位错密度为5.25×10⁹ cm^-2。     

衬底温度对碲化镉薄膜性质及太阳电池性能的影响

蒸汽输运法是制备高质量且大面积均匀的CdTe薄膜的一种优良的方法。采用自主研发的一套蒸汽输运沉积系统制备了CdTe多晶薄膜, 并研究了衬底温度对CdTe薄膜性质及太阳电池性能的影响。利用XRD、SEM、UV-Vis和Hall等测试手段研究了衬底温度对薄膜的结构、光学性质和电学性质的影响。结果表明, 蒸汽输运法制备的CdTe薄膜具有立方相结构, 且沿(111)方向高度择优。随着衬底温度的升高(520℃~640℃), CdTe薄膜的平均晶粒尺寸从2 μm增大到约6 μm, CdTe薄膜的载流子浓度也从1.93×10¹⁰ cm^-3提高到2.36×10¹³ cm^-3, 说明提高衬底温度能够降低CdTe薄膜的缺陷复合, 使薄膜的p型更强。实验进一步研究了衬底温度对CdTe薄膜太阳电池性能的影响, 结果表明适当提高衬底温度, 能够大幅度提高电池的效率、开路电压和填充因子, 但是过高的衬底温度又会降低电池的长波光谱响应, 导致电池转换效率的下降。经过参数优化, 在衬底温度为610℃、无背接触层小面积CdTe薄膜太阳电池的转换效率达到11.2%。     

四步法制备高质量硅基砷化镓薄膜

为了提高在硅基上外延砷化镓薄膜的质量和实验的可重复性, 我们提出了一种叫做四步生长法的新方法, 该方法是通过在低温成核层和高温外延层中间先后插入低温缓冲层和高温缓冲层实现的。通过此方法, 可以制备出表面具有单畴结构、在强白光下依然光亮如镜、粗糙度低且缺陷少的高质量砷化镓薄膜, 而且此方法的重复性很好。即便没有任何生长后的退火处理, 外延出的1 μm厚砷化镓薄膜在5 μm×5 μm扫描区域内的表面粗糙度只有2.1 nm, 且由X射线双晶衍射测试出的砷化镓(004)峰的半高宽只有210.6 arcsec。     

Sc2W3O12薄膜制备及其负热膨胀性能

采用脉冲激光沉积法制备了斜方相Sc₂W₃O₁₂薄膜。利用X射线衍射仪(XRD)和场发射扫描电镜(FESEM)对Sc₂W₃O₁₂靶材和Sc₂W₃O₁₂薄膜组分、表面形貌和靶材断面形貌进行表征, 研究衬底温度与氧分压对薄膜制备的影响。采用变温XRD和热机械分析仪(TMA)分析了Sc₂W₃O₁₂陶瓷靶材和薄膜的负热膨胀特性。实验结果表明: 经1000℃烧结6 h得到结构致密的斜方相Sc₂W₃O₁₂陶瓷靶材, 其在室温到600℃的温度范围内平均热膨胀系数为-5.28×10^-6 K^-1。在室温到500℃衬底温度范围内脉冲激光沉积制备的Sc₂W₃O₁₂薄膜均为非晶态, 随着衬底温度的升高, 薄膜表面光滑程度提高; 随着沉积氧压强增大, 表面平整性变差。非晶膜经1000℃退火处理7 min后得到斜方相Sc₂W₃O₁₂多晶薄膜, 在室温到600℃温度区间内, Sc₂W₃O₁₂薄膜的平均热膨胀系数为-7.17×10^-6 K^-1。     

SiNx薄膜中硅纳米粒子的制备及表征

通过等离子增强化学气相沉积(PECVD)法, 以氨气和硅烷为反应气体, P型单晶硅和石英为衬底, 低温下(200℃)制备了含硅纳米粒子的非化学计量比氮化硅(SiN_x)薄膜. 经高温(范围500~950℃)退火处理优化了薄膜结构. 室温下测试了不同温度退火后含硅纳米粒子SiN_x薄膜的拉曼(Raman)光谱、光致发光(PL)光谱及傅立叶变换红外吸收(FTIR)光谱, 对薄膜材料的结构特性、发光特性及其键合特性进行了分析. Raman光谱表明. SiN_x薄膜内的硅纳米粒子为非晶结构. PL光谱显示两条与硅纳米粒子相关的光谱带, 随退火温度的升高此两光谱带峰位移动方向相同. 当退火温度低于800℃时, PL光谱峰位随退火温度的升高而蓝移. 当退火温度高于800℃时, PL光谱峰位随退火温度的升高而红移. 通过SiNx薄膜的三种光谱分析发现薄膜的光致发光源于硅纳米粒子的量子限制效应. 这些结果对硅纳米粒子制备工艺优化和硅纳米粒子光电器件的应用有重要意义.     

退火气氛对镶嵌在SiO2中Ag纳米颗粒热演变影响效应的研究

将70 keV的Ag离子以5×10¹⁶ cm^-2的剂量注入到SiO₂基底中, 随后分别在400~800℃的Ar、N₂、空气气氛中退火, 详细研究了样品的表面形貌、光吸收特性、结构及成分随退火气氛及退火温度的变化规律。原子力显微镜、紫外-可见分光光度计及掠入射X射线衍射仪的测试结果显示: Ar气氛退火样品中形成的Ag纳米粒子(NPs)细小均匀, 其颗粒密度在700℃时达到最大值, 光吸收性能最佳; N₂气氛退火引发Ag纳米颗粒的团聚生长, 在样品近表面形成较大的Ag NPs, 其颗粒密度也在700℃时达到最大值; 而空气中退火后, 由于AgO的形成、分解, 样品的光吸收强度随退火温度升高持续下降。最后, 卢瑟福背散射研究结果表明, 样品的这些变化主要归因于Ag原子在不同退火气氛下随退火温度的扩散行为不同。     

In:Ga2O3氧化物半导体晶体的生长与性能研究

β-Ga₂O₃晶体是一种新型宽禁带氧化物半导体材料, 本征导电性差。为了在调控导电性能的同时兼顾高的透过率和结晶性能, 离子掺杂是一种有效的途径。采用光学浮区法生长出ϕ8 mm×50 mm蓝色透明In:Ga₂O₃晶体, 晶体具有较高的结晶完整性。In³⁺离子掺杂后, β-Ga₂O₃晶体在红外波段出现明显的自由载流子吸收, 热导率稍有减小。室温下, In:Ga₂O₃晶体的电导率和载流子浓度分别为4.94×10^-4 S/cm和1.005×10¹⁶ cm^-3, 其值高于β-Ga₂O₃晶体约1个数量级。In:Ga₂O₃晶体电学性能对热处理敏感, 1200℃空气气氛和氩气气氛退火后电导率降低。结果表明, In³⁺离子掺杂能够调控β-Ga₂O₃晶体的导电性能。     

三嗪对CVD石墨烯n型掺杂的研究

以化学气相沉积(CVD)制备的单层石墨烯为原料, 小分子三嗪为掺杂剂, 采用吸附掺杂的方式, 在低温下对石墨烯实现n型掺杂。利用拉曼光谱(Raman)、X射线光电子能谱分析(XPS)、原子力显微镜(AFM)、紫外分光光度计(UV)和霍尔效应测试仪(Hall)对样品的形貌、结构及电学性能进行表征。结果表明: 该方法简单安全, 能够对石墨烯实现均匀的n型掺杂, 掺杂石墨烯的透光率达到95%。掺杂后石墨烯的特征峰G峰和2D峰向高波数移动。掺杂180 min后, 载流子浓度达到4×10¹²/cm², 接近掺杂前的载流子浓度, 掺杂后的石墨烯在450℃的退火温度下具有可逆能力, 其表面电阻在300℃以下具有较好的稳定性。     

等离子体辅助铝诱导纳米硅制备多晶硅的研究

以超白玻璃为衬底,利用热丝化学气相沉积和磁控溅射法制备了Glass/nc-Si/Al叠层结构,置入管式退火炉中进行等离子体辅助退火.样品在氢等离子体氛围下进行了400,425和450℃不同温度,5h的诱导退火,用光学显微镜和拉曼光谱对样品进行了性能表征.结果表明随着诱导温度升高,样品的Si(111)择优取向越来越显著;晶粒尺寸不断增大,在450℃诱导温度下获得了最大晶粒尺寸约500μm的连续性多晶硅薄膜,且该温度下薄膜晶化率达97％;薄膜的结晶质量也随着温度的升高而不断提高.样品经450℃诱导后的载流子浓度p为5.8× 1017 cm-3,薄膜霍尔迁移率μH为74 cm2/Vs.还从氢等离子体钝化的角度分析了等离子体环境下铝诱导纳米硅的机理.     

L-精氨酸掺杂钙钛矿太阳电池性能研究

钙钛矿太阳电池以其优异的性能和发展潜力而成为新能源领域研究热点, 但仍然存在缺陷密度大、稳定性差等不足。本研究通过实验对比多种常见氨基酸的掺杂效果后, 将小分子有机物L-精氨酸引入钙钛矿前驱体溶液, 并通过二元两步法制备钙钛矿太阳电池。L-精氨酸掺杂提升了器件的光电性能, 光电效率由18.81%提升到21.86%。L-精氨酸通过降低钙钛矿层缺陷密度(由4.83×10¹⁶ cm^-3降低到3.45×10¹⁶ cm^-3), 减少了载流子非辐射复合, 延长了载流子的平均寿命, 且钙钛矿晶粒尺寸增大、晶界减少、薄膜吸光能力增强且稳定性提升, 迟滞效应得到抑制。这是由于L-精氨酸的多种基团与钙钛矿材料作用钝化了缺陷造成的。本研究为钙钛矿太阳电池的性能优化提供了一种借鉴方法。     

Characterization of cobalt annealed on silicon-germanium epilayers

Cobalt-coated single-crystal Si-Ge layers grown epitaxially by ultrahigh vacuum chemical vapor deposition on silicon substrates were annealed by rapid thermal annealing in the temperature range from 450 °C to 800 °C for periods ranging from 1 to 3 min. The measured sheet resistivities of the films exhibit strong dependence on the annealing conditions. The Co-SiGe film annealed at 700 °C for 3 min had the lowest sheet resistivity (3Ω/p). Structural studies using cross-sectional transmission electron microscopy showed that the cobalt films reacted with the SiGe layer and the thickness of the resulting film increases with increasing annealing temperature or time. Electron diffraction and X-ray microanalysis using energy-dispersive spectrometry showed that CoSi₂ was formed during initial annealing. The detection of germanium in the reacted layer and the deviation of the reacted layer's lattice constant from that of CoSi₂ indicated that germanium diffused into the CoSi₂ and formed ternary compounds (Co_xSi_yGe_z) during further annealing.     

Growth of high-quality relaxed SiGe films with an intermediate Si1−yCy layer for strained Si n-MOSFETs

High quality and thin relaxed SiGe films were grown on Si (0 0 1) using ultra high vacuum chemical vapor deposition (UHV/CVD) by employing an intermediate Si_1−yC_y layer. The Si_1−yC_y/SiGe bilayer was found to change mechanism of relaxation in the SiGe overlayer. Compared with the samples with a Si layer, the equilibrium critical thickness of top SiGe films with rough surface by introducing an intermediate Si_0.986C_0.014 layer are drastically reduced; this result was attributed to larger tensile stress in the inserted Si_0.986C_0.014 layer. With a 210-nm-thick Si_0.8Ge_0.2 overlayer, this Si_0.8Ge_0.2/Si_0.986C_0.014/Si_0.8Ge_0.2 heterostructure has a threading dislocation density (TDs) less than 1 × 10⁵ cm⁻² and a residual strain of 30%. The root mean square (RMS) of surface roughness for this sample was measured to be about 1.8 nm. In this SiGe/Si_1−yC_y/SiGe structure, C atoms in the intermediate Si layer will improve the relaxation of thin SiGe overlayer, however, the relaxation for the 700-nm-thick SiGe overlayer is independent of the addition of C. The point defects rich Si_0.986C_0.014 layer plays the role to confine the misfit dislocations, which formed at the interface of the top Si_0.8Ge_0.2 and the Si_0.986C_0.014 layer, and blocked the propagation of TDs. Strained-Si n-channel metal-oxide-semiconductor transistors (n-MOSFETs) with a 210-nm-thick Si_0.8Ge_0.2 overlayers as buffer were fabricated and examined. Drain current and effective electron mobility for the strained-Si device with this novel substrate technology was found to be 100 and 63% higher than that of control Si device. Our results show that thin relaxed Si_0.8Ge_0.2 films with the intermediate Si_0.986C_0.014 layer serve as good candidates for high-speed strained-Si devices.     

Elastic stiffness and thermal expansion coefficients of various refractory silicides and silicon nitride films

The elestic stiffness parameter E_f/(1−ν_f) and the thermal expansion coefficient _f were obtained for four different silicides (TiSi₂, TaSi₂, MoSi₂ and WSi₂) and for two different nitrides (chemically vapor-deposited Nitrox Si₃N₄ and r.f. plasma SiN) from stress-temperature measurements on identical films deposited on two different substrate materials. The values determined for _f and E_f/(1−ν_f) were quite similar for all silicides and averaged 15 ppm °C⁻¹ and 1.1 × 10¹² dyncm⁻² respectively. The thermal mismatch of these silicides is such that, once safely formed, the silicide film should be able to withstand high temperature processing steps without cracking. For the nitrides the values were essentially the same (approximately 1.5 ppm°C^-1), although the larger value of E_f/(1−ν_f) chemically vapor-deposited Si₃N₄ film (3.7 × 10¹² as opposed to 1.1 × 10¹² dyn cm^-2) indicates that it is somewhat stiffer than the SiN film.     

Doping and electrical characteristics of in-situ heavily B-doped Si1−x−yGexCy films epitaxially grown using ultraclean LPCVD

Doping and electrical characteristics of in-situ heavily B-doped Si_1−x−yGe_xC_y (0.22<x<0.6, 0<y<0.02) films epitaxially grown on Si(100) were investigated. The epitaxial growth was carried out at 550°C in a SiH₄–GeH₄–CH₃SiH₃–B₂H₆–H₂ gas mixture using an ultraclean hot-wall low-pressure chemical vapor deposition (LPCVD) system. It was found that the deposition rate increased with increasing GeH₄ partial pressure, and only at high GeH₄ partial pressure did it decrease with increasing B₂H₆ as well as CH₃SiH₃ partial pressures. With the B₂H₆ addition, the Ge and C fractions scarcely changed and the B concentration (C_B) increased proportionally. The C fraction increased proportionally with increasing CH₃SiH₃ partial pressures. These results can be explained by the modified Langmuir-type adsorption and reaction scheme. In B-doped Si_1−x−yGe_xC_y with y=0.0054 or below, the carrier concentration was nearly equal to C_B up to approximately 2×10²⁰ cm⁻³ and was saturated at approximately 5×10²⁰ cm⁻³, regardless of the Ge fraction. The B-doped Si_1−x−yGe_xC_y with high Ge and C fractions contained some electrically inactive B even at the lower C_B region. Resistivity measurements show that the existence of C in the film enhances alloy scattering. The discrepancy between the observed lattice constant and the calculated value at the higher Ge and C fraction suggests that the B and C atoms exist at the interstitial site more preferentially.     

Atomic-layer doping in Si by alternately supplied PH3 and SiH4

Atomic-layer doping of P in Si epitaxial growth by alternately supplied PH₃ and SiH₄ was investigated using ultraclean low-pressure chemical vapor deposition. Three atomic layers of P adsorbed on Si(100) are formed by PH₃ exposure at a partial pressure of 0.26 Pa at 450°C. By subsequent SiH₄ exposure at 220 Pa at 450°C, Si is epitaxially grown on the P-adsorbed surface. Furthermore, by 12-cycles of exposure to PH₃ at 300–450°C and SiH₄ at 450°C followed by 20-nm thick capping Si deposition, the multi-layer P-doped epitaxial Si films of average P concentrations of 10²¹ cm⁻³ are formed. The resistivity of the film is as low as 2.4×10⁻⁴ Ω cm. By annealing the sample at 550°C and above, it is found that the resistivity increases and the surface may become rough, which may be due to formation of SiP precipitates at 550°C and above. These results suggest that the epitaxial growth of very low-resistive Si is achieved only at a very low-temperature such as 450°C.     

Te与In共掺杂对Cu2SnSe3热电性能的影响

Cu₂SnSe₃基化合物作为一种绿色环保的新型热电材料, 近年受到了研究者的广泛关注。然而, 本征Cu₂SnSe₃基化合物载流子浓度低、电性能较差。为优化Cu₂SnSe₃化合物的电热输运性能, 本研究采用熔融、退火结合放电等离子烧结技术制备了一系列Cu₂SnSe_3-xTe_x (x=0~0.2)和Cu₂Sn_1-yIn_ySe_2.9Te_0.1 (y=0.005~0.03)样品, 研究了Te固溶和In掺杂对材料电热输运性能的影响。Te在Cu₂SnSe_3-xTe_x (x=0~0.2)化合物中的固溶度为0.10, Te固溶显著增加了材料的载流子有效质量, 从本征Cu₂SnSe₃样品的0.2m_e增加到Cu₂SnSe_2.9Te_0.1样品的0.45m_e, 显著提高了材料的功率因子, Cu₂SnSe_2.99Te_0.01样品在300 K下获得最大功率因子为1.37 μW·cm^-1·K^-2。为了进一步提高材料的电传输性能, 本研究以Cu₂SnSe_2.9Te_0.1为基体并选取In在Sn位掺杂。In掺杂将Cu₂SnSe₃基化合物的载流子浓度从5.96×10¹⁸ cm^-3 (Cu₂SnSe_2.9Te_0.1)显著提高到2.06×10²⁰ cm^-3 (Cu₂Sn_0.975In_0.025Se_2.9Te_0.1)。调控载流子浓度促进了材料多价带参与电传输, 材料的电导率和载流子有效质量显著增加, 功率因子得到大幅度提升, 在473 K下Cu₂Sn_0.995In_0.005Se_2.9Te_0.1化合物获得最大功率因子为5.69 μW·cm^-1·K^-2。由于电输运行性能显著提升和晶格热导率降低, Cu₂Sn_0.985In_0.025Se_2.9Te_0.1样品在773 K下获得最大ZT为0.4, 较本征Cu₂SnSe₃样品提高了4倍。     

PdSe2半导体薄膜的真空硒化法制备研究

PdSe₂薄膜主要通过机械剥离法和气相沉积法制得, 本研究采用一种简单有效的可在SiO₂/Si衬底上制备PdSe₂薄膜的方法。通过高真空磁控溅射技术在SiO₂/Si衬底上沉积一层Pd金属薄膜, 将Pd金属薄膜与Se粉封在高真空的石英管中并在一定的温度下进行硒化, 获得PdSe₂薄膜。根据截面高分辨透射电镜(HRTEM)照片可知PdSe₂薄膜的平均厚度约为30 nm。进一步研究硒化温度对PdSe₂薄膜电输运性能的影响, 当硒化温度为300 ℃时, 所制得的PdSe₂薄膜的体空穴浓度约为1×10¹⁸ cm^-3, 具有最大的室温迁移率和室温磁阻, 分别为48.5 cm²·V^-1·s^-1和12%(B=9 T)。值得注意的是, 本实验中通过真空硒化法获得的薄膜空穴迁移率大于通过机械剥离法制得的p型PdSe₂薄膜。随着硒化温度从300 ℃逐渐升高, 由于Se元素容易挥发, Pd薄膜的硒化程度逐渐减小, 导致薄膜硒含量、迁移率和磁电阻降低。本研究表明：真空硒化法是一种简单有效地制备PdSe₂薄膜的方法, 在贵金属硫族化合物的大面积制备及多功能电子器件的设计中具有潜在的应用价值。     

A study on the formation and characteristics of the Si---O---C---H composite thin films with low dielectric constant for advanced semiconductor devices

The Si---O---C---H composite thin films were deposited on a p-type Si(100) substrate using bis-trimethylsilane (BTMSM) and O₂ mixture gases by an inductively coupled plasma chemical vapor deposition (ICPCVD). High density plasma of approximately 10¹² cm⁻³ is obtained at low pressure (<320 mtorr) with an RF power of approximately 300 W in the inductively coupled plasma source where the BTMSM and oxygen gases are greatly dissociated. Fourier transform infrared (FTIR) and X-ray photoelectron spectroscopy (XPS) spectra show that the film has Si---CH₃ and O---H related bonds. The CH₃ groups formed the void in the film and the Si atoms in the annealed sample have different chemical states from those in the deposited sample. It means that the void is formed due to the removing of O---H related bonds during the annealing process. The relative dielectric constant of the annealed sample with the flow rate ratio O₂/BTMSM as 0.3 at 500°C for 30 min is approximately 2.5.