Integration of Electrochemical Microsupercapacitors with Thin Film Electronics for On‐Chip Energy Storage

The development of self‐powered electronic systems requires integration of on‐chip energy‐storage units to interface with various types of energy harvesters, which are intermittent by nature. Most studies have involved on‐chip electrochemical microsupercapacitors that have been interfaced with energy harvesters through bulky Si‐based rectifiers that are difficult to integrate. This study demonstrates transistor‐level integration of electrochemical microsupercapacitors and thin film transistor rectifiers. In this approach, the thin film transistors, thin film rectifiers, and electrochemical microsupercapacitors share the same electrode material for all, which allows for a highly integrated electrochemical on‐chip storage solution. The thin film rectifiers are shown to be capable of rectifying AC signal input from either triboelectric nanogenerators or standard function generators. In addition, electrochemical microsupercapacitors exhibit exceptionally slow self‐discharge rate (≈18.75 mV h^?1) and sufficient power to drive various electronic devices. This study opens a new avenue for developing compact on‐chip electrochemical micropower units integrated with thin film electronics.     

3D Interdigital Au/MnO2/Au Stacked Hybrid Electrodes for On‐Chip Microsupercapacitors

On‐chip microsupercapacitors (MSCs) have application in powering microelectronic devices. Most of previous MSCs are made from carbon materials, which have high power but low energy density. In this work, 3D interdigital Au/MnO₂/Au stacked MSCs have been fabricated based on laser printed flexible templates. This vertical‐stacked electrode configuration can effectively increase the contact area between MnO₂ active layer and Au conductive layer, and thus improve the electron transport and electrolyte ion diffusion, resulting in enhanced pseudocapacitive performance of MnO₂. The stacked electrode can achieve an areal capacitance up to 11.9 mF cm^?2. Flexible and all‐solid‐state MSCs are assembled based on the sandwich hybrid electrodes and PVA/LiClO₄ gel electrolyte and show outstanding high‐rate capacity and mechanical flexibility. The laser printing technique in this work combined with the physical sputtering and electrodeposition allows fabrication of MSC array with random sizes and patterns, making them promising power sources for small‐scale flexible microelectronic energy storage systems (e.g., next‐generation smart phones).