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本文以双酚A型环氧树脂和二乙二醇醚为主要原料,合成了新型环氧树脂添加剂-环氧醚。实验表明,催化剂用量、反应温度和环氧树脂的种类对氧醚的性能有较大的影响。 相似文献
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Ai-jie Ma Weixing Chen Yonggang Hou 《Polymer-Plastics Technology and Engineering》2013,52(15):1578-1582
To further improve the thermal conductivity of epoxy resin, the multi-walled carbon nanotube/aluminum nitride (MWCNTs/AlN) hybrid filler was employed to prepare thermal conductivity MWCNTs/AlN/epoxy composite by casting process, and the silane coupling reagent of γ-glycidoxy propyl trimethoxy silane(KH-560) was also used to functionalize the surface of MWCNTs and/or AlN. Results revealed that, the thermal conductivity of epoxy resin was improved remarkably with the addition of MWCNTs/AlN hybrid filler, a higher thermal conductivity of 1.04 W/mK could be achieved with 29 wt% MWCNTs/AlN hybrid filler (4 wt% MWCNTs +25 wt% AlN), about 5 times higher than that of native epoxy resin. And the epoxy composite with 29 wt% MWCNTs/AlN hybrid filler possessed better thermal conductivity and mechanical properties than those of single 5 wt% MWCNTs or 40 wt% AlN. The thermal decomposition temperature of MWCNTs/AlN/epoxy composite was increased with the addition of MWCNTs/AlN hybrid filler. For given filler loading, surface treatment of MWCNTs and/or AlN by KH-560 exhibited a positive effect on the thermal conductivity of epoxy composite. 相似文献
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聚碳酸酯型聚氨酯—环氧树脂IPN的性能及结构形态 总被引:10,自引:0,他引:10
由甲苯二异氰酸酯和聚六亚甲基碳酸酯二醇制备聚氨酯预聚体,再由该预聚体、双酚A环氧树脂等用同步法合成了聚碳酸酯型聚氨酯-环氧树脂互穿网络聚合物(PCPU-EPIPN)。红外光谱分析表明PCPU和EP两组分间存在一定的化学结合。差示扫描量热分析及热重分析研究表明:IPN在高温区存在单一玻璃化转变峰,当PCPU与EP的质量比mU/mE=25/75时,IPN的Tg最高且热稳定性最好。透射电镜和扫描隧道显微镜研究表明,PCPU与EP的配比对IPN的形态结构有显著的影响。应力-应变测试发现:当mU/mE=25/75时IPN体系力学性能最佳。 相似文献
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Ai-Jie Ma Weixing Chen Yonggang Hou Gai Zhang 《Polymer-Plastics Technology and Engineering》2013,52(9):916-920
The nanometer carbon black (CB) was employed to prepare epoxy resin/carbon black (EP/CB) composites by blending-casting method. The different modified methods of silicone coupling agent were used to improve the dispersion of CB in epoxy resin. The mechanical and thermal properties of EP/CB composites were investigated. Experimental results showed that the mechanical properties increased at first, but decreased with excessive addition of CB. When the mass fraction of CB was 2%, the mechanical properties were maximum. The use of modified CB significantly enhanced the mechanical properties of the composites. For given CB loading, the CB modified by pretreatment method displayed better dispersion in the epoxy resin than that of the direct mixing method. SEM observation revealed that the tensile fracture surface of the composite filled with 2 wt% modified CB held more microcracks than that of 5 wt% modified CB, and the formed microcracks could consume more energy of rupture, finally to have better tensile strength. DSC analysis showed that the glass transition temperature (Tg) of the composites increased with the increasing mass fraction of CB. 相似文献
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球形二氧化硅/环氧树脂复合材料制备与性能表征 总被引:1,自引:1,他引:0
以普通角形二氧化硅为原料,采用氧-乙炔火焰法制备出球形二氧化硅。将环氧树脂(E-51)、固化剂(906)、固化促进剂(DMP-30)和球形化前后二氧化硅按照不同的比例经机械搅拌混合、超声分散和升温固化(100℃、2h和150℃、2h)后制备出二氧化硅/环氧树脂复合材料。研究对比球形化前后二氧化硅对环氧树脂浇注体系热学和力学性能的影响。结果表明:球形二氧化硅的加入,提高了环氧树脂的热稳定性,添加量30%时热分解温度达到最大值340℃,球形化后二氧化硅/环氧树脂复合材料热膨胀系数和初始黏度较球形化前明显降低,力学性能得到提高。 相似文献
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Jungang Gao Guixiang Hou Yong Wang Guodoug Liu 《Polymer-Plastics Technology and Engineering》2013,52(5):489-493
Liquid crystalline epoxy resin (LC epoxy resin) – p-phenylene di{4-[2-(2,3-epoxypropyl)ethoxy]benzoate} (PEPEB) was synthesized. The mixture of PEPEB with bisphenol-A epoxy resin (BPAER) was cured with a curing agent 4,4-diamino-diphenylmethane (DDM). The curing process and thermal behavior of this system were investigated by differential scanning calorimeter (DSC) and torsional braid analysis (TBA). The morphological structure was measured by polarizing optical microscope (POM) and scanning electron microscope (SEM). The results show that the initial curing temperature Ticu (gel point) of this system is 68.1°C, curing peak temperature T pcu is 102.5°C, and the disposal temperature T fcu is 177.6°C. LC structure was fixed in the cured epoxy resin system. The curing kinetics was investigated by dynamic DSC. Results showed that the curing reaction activation energy of BEPEB/BPAER/DDM system is 22.413 kJ/mol. The impact strength is increased 2.3 times, and temperature of mechanical loss peak is increased to 23°C than the common bisphenol-A epoxy resin, when the weight ratio of BEPEB with BPAER is 6 100. 相似文献
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