AlGaInP大功率发光二极管发光效率与结温的关系

目前,AlGaInP大功率发光二极管(LED)存在的主要问题是大电流工作时发热严重,主要是由于电流扩展不均匀、出光面电极对光子的阻挡和吸收以及器件材料与空气折射率之间的差距引起的全反射现象,这些因素造成大功率LED出光受到限制、发光效率低、亮度不高.提出了一种复合电流扩展层和复合分布式布拉格反射层(DBR)的新型结构LED,使得注入电流在有源区充分地扩散,同时提高了常规单DBR对光子的反射率.结果显示,这种新型结构LED比常规结构LED的性能得到了很大的提升,350 mA注入电流下两者的输出光功率分别为4 关键词： 复合电流扩展层 复合分布式布拉格反射层 出光效率 结温     

电流阻挡层对大功率LED光电热特性的影响

LED芯片作为LED光源的核心,其质量直接决定了器件的性能、寿命等,因此在内量子效率已达到高水平的情况下,致力于提高光提取效率是推动LED芯片技术发展的关键一步。由于蓝宝石衬底具有绝缘特性,传统LED将N和P电极做在芯片出光面的同一侧,而芯片出光面上的P电极焊盘金属会遮挡吸收其正下方发光区发出的大部分光而造成光损失,为改善这一现象并缓解P电极周围的电流拥挤效应,本文设计制备了在P电极正下方的氧化铟锡(ITO)透明导电层和p-GaN之间插入SiO_2薄膜作为电流阻挡层(CBL)的大功率LED,并与无CBL结构的大功率LED相比较。对未封装的有无CBL结构的LED在350 mA电流下进行正向偏压,辐射通量,主波长等裸芯性能测试,结果显示两种芯片的正向偏压均集中在3～3.1 V,而有CBL结构的LED光输出功率有明显提升,这是因为CBL阻挡了电流在P电极正下方的扩散,减少流向有源区的电流密度,故减小了P电极对光的吸收和遮挡,且电流通过CBL引导至远离P电极的区域,缓解了电极周围的电流拥挤。对两种芯片进行相同结构和工艺条件的封装,并对封装样品进行热特性及10～600 mA的变电流光电特性测试,得到两种器件的发光光谱及光功率等光学特性。结果表明随着电流增加,两种器件的光谱曲线均发生蓝移,且有CBL结构的LED主波长偏移量较无CBL结构LED少10 nm,可见有CBL结构的LED光谱受驱动电流变化的影响更小,因此其显色性能更为稳定。而在小电流条件下, CBL对器件光功率的影响不大,随着工作电流的增大, CBL对器件光功率的改善效果逐渐提升。在大电流条件下,无CBL结构的LED结温更高,正向电压更低,随电流的增大二者之间的电压差增大。在25℃的环境温度, 350 mA工作电流下,加入CBL结构使器件电压升高约0.04 V,但器件光功率最高提升了9.96%,且热阻明显小于无CBL结构器件,说明有CBL结构LED产热更少。因此CBL结构大大提高了器件的光提取效率,并使其光谱漂移更小,显色性能更为稳定。     

Si衬底功率型GaN基绿光LED性能

对本实验室在Si(111)衬底上MOCVD法生长的芯片尺寸为400 μm×600μm功率型绿光LED的光电性能进行研究.带有银反射镜的LED在20 mA的电流下正向工作电压为3.59 V,主波长518 nm,输出光功率为7.3 mW,90 mA下达到28.2 mW,发光功率效率为7.5%,光输出饱和电流高达600 mA.在200 mA电流下加速老化216 h,有银反射镜的LED光衰小于尤银反射镜的LED,把这一现象归结于Ag反射镜在提高出光效率的同时,降低了芯片奉身的温度.本器件有良好的发光效率,光衰和光输出饱和电流等综合特性表明,Si衬底GaN基绿光LED具有诱人的发展前景.     

电流主动导引结构倒装AlGaInP LED

设计并制备了一种带有电流导引结构的新型倒装AlGaInP LED。实验结果表明,在20mA直流电流注入下,器件的电压为2.19V,输出光功率与普通倒装器件相比提高了17.33%。通过电流导引结构,使得器件注入电流被主动引导到电极以外部分,有效增大了上电极以外部分有源区中用于发光的有效载流子数目的比例,同时减轻了电流密度过大现象,大大提高了器件的出光效率。     

电极结构优化对大功率GaN基发光二极管性能的影响

在台面结构的GaN基发光二极管(LED)里，电流要侧向传输，当尺寸与电流密度加大之后，由于n型GaN层和下限制层的横向电阻不能忽略，造成了横向电流分布不均匀.通过优化电极结构，以减小电流横向传输距离，制作出两种不同电极结构的大功率GaN基倒装LED.通过比较这两种不同电极结构的GaN基倒装大功率LED的电、光性能，发现在350mA正向电流下，插指电极结构的倒装大功率GaN基LED的正向电压为3.35V，比环形插指电极结构的倒装大功率GaN基LED高0.15V.尽管环形插指电极结构GaN基LED的发光面积略小于插指电极结构GaN基LED，但在大电流下，环形插指电极结构倒装GaN基LED的光输出功率比插指电极结构的倒装大功率LED的光输出功率大.并且在大电流下，环形插指电极结构的倒装大功率LED光输出功率饱和速度慢，而插指电极结构的倒装大功率LED光输出功率饱和明显.这说明优化电极结构能提高电流扩展均匀性，减小焦耳热的产生，改善GaN基LED的性能.     

温度和电流对白光LED发光效率的影响

对大功率白光LED发光效率进行了研究,得出温度和电流对LED发光效率的影响:随着温度的升高,势阱中辐射复合几率降低,从而降低了发光效率;电流的升高,使更多的非平衡载流子穿过势垒,降低了发光效率。LED工作时,过高的工作温度或者过大的工作电流都会产生明显的光衰:如果LED工作温度超过芯片的承载温度,这将会使LED的发光效率快速降低,产生明显的光衰,并且对LED造成永久性破坏;如果LED的工作电流超过芯片的饱和电流,也会使LED发光效率快速降低,产生明显的光衰。并且LED所能承载的温度与饱和电流有一定关系,散热良好的装置可以使LED工作温度相对降低些,饱和电流也可以更大,LED也就可以在相对较大的电流下工作。     

不同表面结构的半导体发光二极管的效率与寿命的研究

对GaAs基AlGaInP系半导体发光二极管（light emitting diode,LED）提取效率低导致器件发热而寿命缩短等问题进行了分析,提出了一种新型表面结构的LED,在与普通LED相同的外延生长条件下,通过后工艺引入了表面图形并腐蚀出凹凸不平的表面以改变光子传输方向,同时制备了导电光增透层,既增强了电流的扩展同时使得更多的光子能够发射到体外,在相同的注入电流下,新型表面增透结构LED的轴向光强平均是普通LED的15倍,由于光提取效率高,更多的光子能够发射到体外,发热减少,饱和电流更高,达到1 关键词： 表面增透结构 轴向光强 光效 寿命     

大功率倒装LED芯片陶瓷封装器件顶面微区发光均匀性

高功率密度的陶瓷封装LED器件在大电流工作时,其顶面发光均匀性是该类器件的关键指标。本文在3.5 mm×3.5 mm的氮化铝陶瓷基板上金锡共晶了1.905 mm×1.830 mm(75 mil×72 mil)的LED倒装蓝光大功率芯片,然后分别制作成蓝光器件和白光器件,并分别对器件顶面的微区发光均匀性进行了研究。结果表明,蓝光器件在电流3 A时,其顶面光强分布均匀,均匀性受N电极孔和电极间隙的影响较小;在4～8 A电流时,蓝光器件顶面光强分布不均匀,贯穿N电极孔测试区的光强大于电极孔之间测试区的光强,电极间隙区光强最低,离N电极孔越远的测试点光强越低;蓝光器件在8 A时整体光强达到饱和,而不同微区的光饱和程度及峰值波长随电流的变化有所不同;白光器件在0～4 A电流时,其顶面光强分布均匀。     

高速高饱和单行载流子光探测器的设计与分析

设计了一种In P基的背入射台面结构的单行载流子光探测器.通过在吸收层中采取高斯型掺杂界面及引入合适厚度和掺杂浓度的崖层,使得光探测器同时具备了高速和高饱和电流特性.理论分析表明,在光敏面为14μm2、反向偏压为2 V条件下,该器件的3 d B带宽可达58 GHz,直流饱和电流高达158 m A.在大功率光注入条件下,详细分析了光探测器带宽降低和电流饱和现象,得出能带偏移和电场坍塌是其根本原因的结论.     

具有电流阻挡层的不同GaN基LED的光电特性(英文)

研究对比了InGaN/GaN多量子阱发光二极管中p电极下的不同SiO2电流阻挡层的光电特性。6种样品被分为3组:普通表面、表面粗化、表面粗化+边墙腐蚀。每组都有两种结构,一种具有电流阻挡层,另一种没有电流阻挡层。每组中,具有电流阻挡层的LED在20 mA下的正向电压分别为3.156,3.282,3.284 V,略高于不含电流阻挡层的样品(Vf=3.105,3.205,3.210 V).但是,具有电流阻挡层的LED的光效和光功率要优于无电流阻挡层的器件,在20 mA下的光功率分别提高了10.20%、12.19%和11.49%。这些性能的提升都要归功于电流阻挡层良好的电流扩展效应,同时电流阻挡层还可以减小p电极下的寄生光吸收。     

Effect of thickness variation of hole injection and hole blocking layers on the performance of fluorescent green organic light emitting diodes

In this paper we present the effect of thickness variation of hole injection and hole blocking layers on the performance of fluorescent green organic light emitting diodes (OLEDs). A number of OLED devices have been fabricated with combinations of hole injecting and hole blocking layers of varying thicknesses. Even though hole blocking and hole injection layers have opposite functions, yet there is a particular combination of their thicknesses when they function in conjunction and luminous efficiency and power efficiency are maximized. The optimum thickness of CuPc (Copper(II) phthalocyanine) layer, used as hole injection layer and BCP (2,9 dimethyl-4,7-diphenyl-1,10-phenanthroline) used as hole blocking layer were found to be 18 nm and 10 nm respectively. It is with this delicate adjustment of thicknesses, charge balancing is achieved and luminous efficiency and power efficiency were optimized. The maximum luminous efficiency of 3.82 cd/A at a current density of 24.45 mA/cm² and maximum power efficiency of 2.61 lm/W at a current density of 5.3 mA/cm² were achieved. We obtained luminance of 5993 cd/m² when current density was 140 mA/cm². The EL spectra was obtained for the LEDs and found that it has a peaking at 524 nm of wavelength.     

AlGaInP-Si glue bonded high performance light emitting diodes

We propose a new method of using conductive glue to agglutinate GaAs based AlGaInP light emitting diodes (LEDs) onto silicon substrate,and the absorbing GaAs layer is subsequently removed by grinding and selective wet etching.It was found that AlGaInP-Si glue agglutinated LEDs have larger saturation current and luminous intensity than the conventional LEDs working at the same injected current.The luminous intensity of the new device is as much as 1007.4 mcd at a saturation current of 125 mA without being encapsulated,while the conventional LEDs only have 266.2 mcd at a saturation current of 105 mA.The luminescence intensity is also found to increase by about 3.2% after working at 50 mA for 768 h.This means that the new structured LEDs have good reliability performance.     

ITO界面调制层对GZO电极LED器件性能的影响

采用磁控溅射制备GZO和具有ITO界面调控层的GZO(ITO/GZO)透明导电薄膜作为大功率LED的电流扩散层,对比研究界面调控层对LED器件性能的影响。研究结果表明,ITO/GZO薄膜的透过率在可见光区达80%以上,退火后的ITO/GZO薄膜有较低的电阻率(1.15×10^-3 Ω·cm)。ITO调控层的介入能够调制GZO表面粗糙度,有利于改善LED外量子效率,降低GZO/p-GaN界面的接触势垒,提高LED器件的光电性 能。通过ITO界面调控后,LED器件20 mA驱动电流下的工作电压从9.5 V降低为6.8 V,发光强度从245 mcd 升到297 mcd,提高了20%;驱动电流为35 mA时,其发光强度从340.5 mcd 升到511 mcd,提高了50%。     

GaN基LED电流扩展的有限元模型及电极结构优化

针对目前蓝宝石衬底上外延生长制备的GaN基半导体发光二极管(LED)器件存在电流分布不均匀的问题,建立了LED的电流扩展模型,提出了定量评价其特性的参数和标准。通过用有限元方法计算LED中电流的三维空间分布,对不同的电极结构进行了定量的比较,给出了优化的电极结构。计算结果显示,在相同工艺参数下,采用插指型电极结构的LED与采用传统型电极结构和扩展正极型电极结构的LED相比,电流扩展更均匀,串联电阻更小。在此基础上,对插指型电极结构作了进一步的参数优化,得出了使LED的串联电阻取最小值时的插指型电极的结构参数。根据优化得到的参数制作了相应的LED样品,并与采用扩展正极型电极结构的LED做了对比实验。实验结果表明,计算得出的结果与实验结果符合得很好。采用了优化后的插指型电极结构的LED与采用扩展正极型电极结构的LED相比,前者的串联电阻仅为后者的44.4%。     

GaN-based LEDs for light communication

Rapid improvement in the efficiency of GaN-based LEDs not only speed up its applications for general illumination, but offer the possibilities for data transmission. This review is to provide an overview of current progresses of GaN-based LEDs for light communications. The modulation bandwidth of GaN-based LEDs has been first improved by optimizing the LED epilayer structures and the modulation bandwidth of 73 MHz was achieved at the driving current density of 40 A/cm² by changing the multi-quantum well structures. After that, in order to increase the current density tolerance, different parallel flip-chip micro-LED arrays were fabricated. With a high injected current density of ～7900 A/cm², a maximum modulation bandwidth of ～227 MHz was obtained with optical power greater than 30 mW. Besides the increase of carrier concentrations, the radiative recombination coefficient B was also enhanced by modifying the photon surrounding environment based on some novel nanostructures such as resonant cavity, surface plasmon, and photonic crystals. The optical 3 dB modulation bandwidth of GaN-based nanostructure LEDs with Ag nanoparticles was enhanced by 2 times compared with GaN-based nanostructure LEDs without Ag nanoparticles. Our results demonstrate that using the QW-SP coupling can effectively help to enhance the carrier spontaneous emission rate and also increase the modulation bandwidth for LEDs, especially for LEDs with high intrinsic IQE. In addition, we discuss the progress of the faster color conversion stimulated by GaN-based LEDs.     

Large-scale SiO2 photonic crystal for high efficiency GaN LEDs by nanospherical-lens lithography

Wafer-scale SiO2 photonic crystal （PhC） patterns （SiO2 air-hole PhC, SiO2-pillar PhC） on indium tin oxide （ITO） layer of GaN-based light-emitting diode （LED） are fabricated via novel nanospherical-lens lithography. Nanoscale polystyrene spheres are self-assembled into a hexagonal closed-packed monolayer array acting as convex lens for expo- sure using conventional lithography instrument. The light output power is enhanced by as great as 40.5% and 61% over those of as-grown LEDs, for SiO2-hole PhC and SiO2-pillar PhC LEDs, respectively. No degradation to LED electrical properties is found due to the fact that SiO2 PhC structures are fabricated on ITO current spreading electrode. For SiO2- pillar PhC LEDs, which have the largest light output power in all LEDs, no dry etching, which would introduce etching damage, was involved. Our method is demonstrated to be a simple, low cost, and high-yield technique for fabricating the PhC LEDs. Furthermore, the finite difference time domain simulation is also performed to further reveal the emission characteristics of LEDs with PhC structures.     

Electrochemically deposited poly(3-methylthiophene) performance in single layer photovoltaic devices

Photovoltaic devices based on electrochemically synthesized poly(3-methylthiophene) PMeT were constructed and characterized. The charge mobility for positive carriers of this polymer is quite high, 4 x 10^-4 cm²/Vs, being attractive for optoelectronic devices. In single layer photovoltaic devices with PMeT active layer electrochemically deposited onto indium-tin oxide substrate with aluminum as top electrode we have obtained short-circuit current density of 0.31 A/m², open-circuit voltage of 1 V and power conversion efficiency of 0.14% at 100 W/m² white light irradiance.Received: 17 October 2003PACS: 73.50.Pz Photoconduction and photovoltaic effects - 73.61.Ph Polymers; organic compounds - 73.50.Gr Charge carriers: generation, recombination, lifetime, trapping, mean free paths - 73.40.Sx Metal-semiconductor-metal structures     

The advantage of blue InGaN multiple quantum wells light-emitting diodes with p-AlInN electron blocking layer

InGaN based light-emitting diodes (LEDs) with different electron blocking layers have been numerically investigated using the APSYS simulation software. It is found that the structure with a p-AlInN electron blocking layer showes improved light output power, lower current leakage, and smaller efficiency droop. Based on numerical simulation and analysis, these improvements of the electrical and optical characteristics are mainly attributed to the efficient electron blocking in the InGaN/GaN multiple quantum wells (MQWs).     

The beneficial effects of a p-type GaInN spacer layer on the efficiency of GaInN/GaN light-emitting diodes

Light-emitting diodes (LEDs) with a Mg-doped p-type Ga_1−xIn_xN (0 ≤ x ≤ 0.07) spacer layer located between an undoped GaN spacer layer and the electron blocking layer are investigated. The LEDs are found to have comparable peak efficiency but less efficiency droop when the crystal quality of the p-type Ga_1−xIn_xN spacer layer is well-controlled by lowering the growth temperature and by using a suitable In composition and Mg doping concentration. All LED samples with the p-type spacer layer show a smaller efficiency droop compared to a reference LED having an undoped GaN spacer. Among the sample sets investigated, an optical power enhancement of 12% at 111 A/cm² is obtained when inserting a 5 nm-thick p-type Ga_0.97In_0.03N spacer layer. The results support that carrier transport is the key factor in the efficiency droop observed in GaN-based LEDs.