热丝化学气相沉积金刚石薄膜空间场的数值分析

由于热丝化学气相沉积(HFCVD)金刚石薄膜的反应气体利用率较低，生长速率慢，生长不均匀，从而限制了金刚石薄膜的大规模应用。因此，人们从实验和理论方面研究其生长工艺。实验能反映热丝化学气相沉积金刚石薄膜的真实情况，但实验受到许多因素的影响和制约而不能获得较全面信息，数值计算能弥补实验的不足。     

热丝辅助双偏压氢等离子体制造金刚石锥状表面研究

利用热丝辅助双偏压氢等离子体对化学气相沉积金刚石薄膜进行了纳米尺度上的表面改装,制造出锥状金刚石列阵.金刚石薄膜内在的柱状结构使氢离子在刻蚀薄膜时产生非均匀的刻蚀速率,对锥状表面的形成起着重要作用.另一方面,溅射出的含碳粒子会发生二次沉积,最终的特征表面形貌取决于刻蚀与含碳基团再沉积之间的相互竞争.栅极的使用影响基底区域放电的伏安特性,改变栅极电流可以对形成的金刚石特征表面结构进行有效调节.在处理过程中少量掺入甲烷,提高了金刚石表面附近的含碳基团浓度,促进二次成核,进而诱发均匀分布的锥状列阵. 关键词： 等离子体 表面 金刚石薄膜     

立方氮化硼薄膜研究的新进展

低压下沉积ｃ－ＢＮ薄膜是近年来凝聚态物理和材料科学研究的热门课题之一．我们应用热丝辅助射频等离子体化学气相沉积技术，在多种衬底上沉积了ＢＮ薄膜，并系统研究了热丝温度、衬底温度和射频电压等工艺参数对ＢＮ薄膜中立方相含量的影响．     

大面积均匀纳米金刚石薄膜制备研究

报道了一种利用偏压恒流等离子辅助热丝化学气相沉积城硅基板上制备大面积均匀纳米金刚石薄膜的新工艺，在不同沉积条件下研究了纳米金刚石薄膜的成核和生长过程，并通过扫描电镜、拉曼光谱和表面粗糙度测试仪观察了纳米金刚石薄膜的结构特征。最后成功制备了直径100mm、平均晶粒尺寸10nm的光滑纳米金刚石薄膜。     

BC_2N薄膜的柱状生长及生长机理

应用热丝辅助等离子体化学气相沉积法 (CVD)合成了表面呈柱状的BC2 N薄膜 ,X射线、红外及X射线电子能谱分析表明 ,薄膜的化学组分主要为BC2 N ,B ,C和N原子间互相结合成键 .扫描电镜观察到 ,薄膜表面形貌呈排列整齐、取向一致的柱体 ,并且发现这种生长方式与沉积参数密切相关 .最后从结合能方面讨论了柱状BC2 N的生长机理 .     

采用热丝辅助的新型微波电子回旋共振法制备高质量的氢化非晶硅薄膜

采用热丝辅助的新型微波电子回旋共振法制备了高质量的氢化非晶硅薄膜。在制备过程中，热丝对改进薄膜微结构，提高稳定性及光电特性方面起到了重要的作用。实验结果表明：在薄膜的微结构中，硅氢二键含量显著减少并出现了少量微晶相，其有利于改善薄膜的稳定性；在薄膜的光电特性方面，薄膜的沉积速率及光敏性分别达到了2.0nm/s和4.71*105以上。     

热丝化学气相沉积技术低温制备多晶硅薄膜的结构与光电特性

以金属W和Ta为热丝，采用热丝化学气相沉积 ，在250℃玻璃衬底上沉积多晶硅薄膜.研究了热丝温度、沉积气压、热丝与衬底间距等沉积参数对硅薄膜结构和光电特性的影响，在优化条件下获得晶态比X_c＞90%，暗电导率σ_d=10^-7—10-6Ω ^-1cm^-1，激活能E_a=0.5eV，光能隙E_opt≤1.3 eV的多晶硅薄膜. 关键词： 多晶硅薄膜 热丝化学气相沉积 光电特性     

氮气氛下(100)织构金刚石薄膜的成核与生长研究

利用热丝化学气相沉积法研究了氮气浓度对金刚石薄膜成核和生长的影响.实验发现氮气的 加入对金刚石成核密度影响不大,但促进了已形成的金刚石核的长大.适量的氮气不仅使金 刚石生长速率得到很大的提高,而且稳定了金刚石薄膜(100)面的生长,使金刚石薄膜具有 更好的(100)织构.利用原位光发射谱对衬底附近的化学基团进行了研究.研究表明,氮气的 引入使得金刚石生长的气相化学和表面化学性质发生了很大变化.含氮基团的萃取作用提高 了金刚石表面氢原子的脱附速率,从而提高了金刚石膜的生长速率.而含氮基团的选择吸附 使金刚石 关键词： 氮气 金刚石薄膜 织构 原位光发射谱     

微波化学气相沉积中气压对金刚石薄膜生长速率和质量的影响

研究了微波化学气相沉积中沉积气压对金刚石薄膜生长速率和质量的影响.研究表明，金刚石薄膜的生长速率随沉积气压的提高而增大，生长速率与沉积气压为线性关系.在高沉积气压下生长的金刚石薄膜晶形完整，拉曼谱测量可得到锐利的金刚石相的峰，但电压-电流测量表明，随着制备时沉积气压的提高，金刚石薄膜的暗电流增大，膜的电学质量下降. 关键词： 金刚石薄膜 生长速率 沉积气压     

β-C_3N_4的制备及若干问题探讨

采用热丝辅助反应溅射和等离子体增强热丝化学气相沉积（ＣＶＤ）的制备方法，获得了含有β－Ｃ３Ｎ４结晶相的ＣＮｘ薄膜．文章将重点介绍制备参数与ＣＮｘ薄膜结构的关系，并进一步讨论与β－Ｃ３Ｎ４结晶相择优生长有关的主要问题     

动力学晶格蒙特卡洛方法模拟Cu薄膜生长

利用动力学晶格蒙特卡洛方法模拟了Cu薄膜在Cu(100)面上的三维生长过程。模型中考虑了四个动力学过程:原子沉积、增原子迁移、双原子迁移和台阶边缘原子迁移,各动力学过程发生的概率由多体势函数确定。讨论了基底温度、沉积速率及原子覆盖率对Cu原子迁移、成核和表面岛生长等微观生长机制的影响;获得了Cu薄膜的表面形貌图并计算了表面粗糙度。模拟结果表明,随基底温度升高或沉积速率下降,岛的平均尺寸增大,数目减少,形状更加规则。低温时,Cu薄膜表现为分形的离散生长,高温时,Cu原子迁移能力增强形成密集的岛。Cu薄膜表面粗糙度随着基底温度的升高而迅速减小;当基底温度低于某一临界温度时,表面粗糙度随原子覆盖率或沉积速率的增大而增大;当基底温度超过临界温度时,表面粗糙度随原子覆盖率或沉积速率的变化很小,基本趋于稳定。     

掺溴非晶碳梯度薄膜的制备与分析

 采用低压等离子增强化学气相沉积法用溴乙烷、氢气制备了掺溴的非晶碳梯度薄膜。通过样品的XPS能谱分析研究了薄膜沉积速率与氢气流量、溴元素原子分数与溴乙烷流量以及溴元素原子分数与刻蚀时间之间的关系，得出了溴乙烷流量、刻蚀时间对薄膜的主要键态含量、C元素sp²/sp³键态杂化比和薄膜硬度的影响。结果表明：薄膜沉积速率随氢气流量的增加而线性减小，溴元素含量随溴乙烷流量的增加先增加后降低，刻蚀时间越长，溴乙烷流量越小，薄膜越硬     

二氧化钛薄膜表面粗糙度研究

为了探究二氧化钛(TiO₂)薄膜表面粗糙度的影响因素, 利用离子束辅助沉积电子束热蒸发技术对不同基底粗糙度以及相同基底粗糙度的K9玻璃完成二氧化钛(TiO₂)光学薄膜的沉积。采用TalySurf CCI非接触式表面轮廓仪分别对镀制前基底表面粗糙度和镀制后薄膜表面粗糙度进行测量。实验表明, TiO₂薄膜表面粗糙度随着基底表面的增大而增大, 但始终小于基底表面粗糙度, 说明TiO₂薄膜具有平滑基地表面粗糙的作用; 随着沉积速率的增大, 薄膜表面粗糙度先降低后趋于平缓; 对于粗糙度为2 nm的基底, 离子束能量大小的改变影响不大, 薄膜表面粗糙度均在1.5 nm左右; 随着膜层厚度的增大, 薄膜表面粗糙度先下降后升高。     

埋点靶中CH薄膜的制备工艺研究

 CH薄膜的制备是埋点靶制备的关键技术之一,本文主要研究了钨丝辅助裂解制备CH薄膜的制备工艺。研究表明蒸发舟温度和衬底温度对沉积速率影响较大,而衬底距离对沉积速率影响较小;红外光谱和质谱分析表明薄膜的主要成分是聚对二甲苯。     

Influences of Process Parameters on 111-Oriented CVD Diamond Film Growth Under Two-Step Method

The growth of 111-oriented CVD diamond film under a two-step model was simulated at atomic scale by using revised KMC method. The simulation was conducted at various substrate temperatures (1100 K-1400 K) and CH3 radical concentration (0.01 that: (1) The 111-oriented CVD diamond film growth under the two-step model is superior to that under corresponding single-step model, which is in good agreement with the experimental results. (2) Substrate temperature (T _s) and the concentration of CH₃ ([CH₃]) can produce important effects on the film deposition rate, surface roughness and the concentration of atom H embedded in the film. However, both the T _s and [H] should be controlled to a proper range for high quality films.     

沉积速率对甚高频等离子体增强化学气相沉积制备微晶硅薄膜生长标度行为的影响

本文采用甚高频等离子体增强化学气相沉积技术制备了沉积速率系列不同生长阶段的微晶硅薄膜,通过椭圆偏振技术研究了生长过程中微晶硅薄膜表面粗糙度的演化.实验结果表明:沉积速率为0.08和0.24nm/s的低速沉积时,硅薄膜表面粗糙度接近,生长指数分别为β=0.21和β=0.20,对应有限扩散生长模式,此时沉积速率对硅薄膜生长影响不大,原因是低速沉积时成膜先驱物有足够时间迁移到能量低的位置;当沉积速率增加到0.66nm/s时,硅薄膜表面粗糙度明显增加,生长指数β=0.81,大于0.5,出现了异常标度行为,与低速沉积的生长模式明显不同,原因是高速沉积时成膜前驱物来不及扩散就被下一层前驱物覆盖,降低了成膜前驱物在薄膜表面的扩散,使表面粗糙度增加和生长指数β增大.β大于0.5的异常标度行为与阴影效应有关.     

不同氧分压下直流反应溅射ZnO薄膜的结构和光学特性

在室温,不同氧分压条件下,采用Zn靶直流反应溅射在石英衬底上制备了具有纤锌矿结构(002)择优取向的ZnO薄膜。薄膜的生长速率随氧分压的增大而减小,在20%-30%之间存在一个拐点,在此点之前,溅射产额减小的速率很快,而在此点之后,溅射产额减小的速率减慢了很多,当氧分压在30%以上时,溅射过程中Zn的氧化在靶表面就已经完成。通过单振子模型分析了薄膜的光学特性,采用X射线衍射的方法对薄膜的晶粒尺寸和应力进行分析。研究结果表明在氧分压20%以上时,薄膜在可见光波段具有较好的光学透明性和很高的电阻率。薄膜的光学折射率、晶面间距和内部应力均随着氧分压的增大而增大。并从薄膜生长机理上给出了理论解释。     

Surface roughness analysis and magnetic property studies of nickel thin films electrodeposited onto rotating disc electrodes

Ni films were electrodeposited onto polycrystalline gold substrates mounted on a rotating disc electrode. The effects of rotation speed, film thickness and current density on the kinetic roughening and magnetic properties of the films were investigated. The film surface roughness was imaged using an atomic force microscope (AFM). The results indicate that the film roughness increases as the film thickness or deposition current density increases. We found that the electrodeposited Ni films exhibit anomalous scaling since both local and large-scale roughnesses show a power-law dependence on the film thickness. The effect of electrode rotation speed on the film surface roughness was also investigated. Scanning electron microscopy studies (SEM) had a good agreement with the AFM results. The average crystalline size of the film surfaces is also calculated from X-ray line broadening using (220) peak and Debye–Scherrer formula. The obtained results agree with that of AFM and SEM. The Ni thin films which are grown at different deposition current densities and rotation speeds exhibit in-plane magnetization with coercivities less than 110 Oe.     

Effect of deposition power and pressure on rate deposition and resistivity of titanium thin films grown by DC magnetron sputtering

ABSTRACT

Based on magnetron sputtering deposition technology, titanium (Ti) thin films are deposited on silicon (Si) substrate using different preparation conditions such as sputtering power and pressure. The influence of altering these conditions on deposition rate and microstructure is studied. The results show that sputtering power significantly affects the rate of deposition and the resistivity. The deposition rate of the Ti thin film increases when the resistivity decreases under sputtering powers of 150–225?W with a pressure of 0.8?Pa and Argon (Ar) flux of 80 sccm. As sputtering power was increased further (from 225 to 250?W), the deposition rate reduced and the resistivity augmented. Pressure also has influence on the deposition rate and resistivity – when pressure increases from 0.6 to 0.8?Pa, the deposition rate escalates while the resistivity reduces; when the pressure is raised from 0.8 to 1.0?Pa with Ar flux of 100 sccm, the deposition rate decreases and resistivity increases. The surface chemical compositions and the structures of the Ti film were studied by using X-ray photoelectron spectroscopy (XPS) and X-ray diffractometer (XRD). Observing the cross-section of the thin-film samples produced by scanning electron microscope (SEM) reveals the influence of the preparation conditions used on the microstructure and confirms the influence of sputtering power and pressure on the resistivity.     

Dependence of the optical properties of UHV deposited silver thin films on the deposition parameters and their relation to the nanostructure of the films

Silver films were deposited on glass substrates under different deposition conditions, i.e. different film thicknesses, deposition rates and deposition angles. Their optical properties were measured by spectrophotometry in the spectral range of 185–3300 nm. The Kramers–Kronig method was used to analyze the reflectivity curves of the silver films to obtain their optical constants. The influence of substrate temperature on the microstructure of thin metallic films, the structure zone model (SZM), is well established, whereas there has been some previous work on the influence of film thickness and morphology, deposition rate and deposition angle on the microstructure and morphology of thin films. An effective medium approximation (EMA) analysis was used to establish the relationship between the atomic force microscopy results, SZM predictions and EMA results, and hence the optical properties of silver thin films. The predictions of the Drude free-electron theory are compared with experimental results for dielectric functions of Ag films produced under different deposition conditions. The real part of the dielectric constant increases with film thickness and decreases with increasing deposition rate and with increasing incidence angle, whereas the imaginary part of the dielectric constant decreases with increasing film thickness and deposition rate and with decreasing incidence angle over the whole energy range measured, including the interaband and interband regions.