共查询到18条相似文献,搜索用时 437 毫秒
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《电子元件与材料》2016,(9):24-28
为了提高LED的散热性能,基于烟囱效应原理,对比了LED梳状散热器和太阳花散热器的散热效果。通过Solidworks建立实体模型,通过其插件Flow Simulation对建立的模型进行热仿真。在保持散热器质量不变的前提下,研究了不同烟囱高度对配备梳状散热器和太阳花散热器的LED芯片最高温度的影响。并对烟囱高度为40 mm的太阳花散热器进行了实验验证,经实验测量,此时LED芯片的最高温度为81℃,与模拟结果只相差1.28℃,证实了模拟的正确性。仿真表明:在烟囱效应下,LED太阳花散热器的散热效果要强于梳状散热器,并且当烟囱高度大于45 mm时,二者的温度差随着烟囱高度的增加不断扩大。 相似文献
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提出了大功率LED 片式CO B光源夹持式的散热方案。采用正交试验法分析了片式光源散热器的六个形状尺寸对片式CO B光源结温和成本(以散热器体积表征)的影响。采用极差分析法得出了不同散热器参数对片式CO B光源结温的影响程度大小为:翅片片数>翅片高度>翅片长度>翅片厚度>翅片间距>基底厚度,对成本(散热器体积)的影响程度大小为:翅片片数>翅片长度>翅片厚度>基底厚度>翅片高度>翅片间距。综合考虑光源结温和成本,得到15W 片式光源模组散热器的最优尺寸。提出在散热器基底中央位置加导热筋的散热方案对前片式光源模组存在的热集中现象进行了改进。根据“烟囱效应”,提出了在散热器中合理设计流道来增强片式CO B光源模组自然对流强度的方法。 相似文献
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唐帆郭震宁 《激光与光电子学进展》2017,(9):336-343
为了提高发光二极管(LED)的散热能力,基于烟囱效应,在传统太阳花散热器外侧加装圆筒壁,形成特殊的烟囱结构。运用Solidworks软件构建三维模型,用其插件Flow Simulation进行热仿真,并以散热器翅片数12个、最大直径70mm、高度40mm为基础模型参数,进行优化研究。研究表明,在翅片数为20个、最大直径为85mm、高度为65mm时,LED圆筒太阳花散热器的散热效果最好。此时,LED的最高温度为48.98℃,比优化前降低了13.05℃。当功率为8,12,16,19W时,LED芯片的最高温度都满足LED工作的安全要求。对功率为8W的LED散热器样品的实验测试结果表明,4个监测点的实际温度与仿真所得温度的平均误差为4.8%,在允许范围内,验证了研究的正确性。在功率为32 W时,配备圆筒太阳花散热器的芯片最高温度仍满足低于125℃的技术要求,并比配备传统太阳花散热器的芯片温度低6.44℃。所设计的LED圆筒太阳花散热器为解决大功率LED散热问题提供了一个新的途径。 相似文献
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应用ANSYS有限元分析软件,在散热器重量不变的情况下,成功模拟分析了梳形截面散热器的散热效果和散热器长度变化的关系,得到了热阻核心温度随齿长变化的云图和散热器长度优化曲线。通过综合分析,得出了优化的设计结果。该模型可以作为相关散热器设计时的参考,其方法可以作为同类问题的参考方法。所得的最优解可以应用到生产中。 相似文献
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为减轻无人机机翼结构的质量,从而提升无人机性能和飞行效率,文章考虑应用变截面铺层优化设计方法从结构尺寸和铺层设计两方面对机翼结构进行结构-材料一体化优化设计。首先,对某三梁多肋式机翼结构进行了仿真分析,确定了优化方向。其次,结合优化区域,采用变截面铺层优化方案,确定了变截面尺寸结构和变截面最优铺层方案。最后,对优化前后的机翼结构仿真结果对比分析,发现机翼质量降低了30.43%,最大应力降低了27.61%、失效指数降低了54.72%,翼尖最大变形量增大了15.48%,且远满足设计要求。 相似文献
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大功率LED路灯散热器自然对流的数值研究 总被引:3,自引:0,他引:3
采用CFD软件对常规型大功率LED路灯散热器建立了三维数值模型,在大空间中进行了耦合数值传热计算,并用实验验证了数值计算的可靠性。研究了自然对流散热过程中散热器的温度场和周围扰流空气的速度矢量场分布。针对散热器散热过程中,扰流空气不能进入散热器肋片中间让肋片充分发挥自然对流冷却效果,提出了一种新的结构设计,通过数值计算得到了较理想的结构。在同等功率下散热器基板底面最高温度比原模型低了5℃,肋片平均换热系数提高了17.6%,显著提高了大功率LED路灯散热器的散热能力。 相似文献
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为了满足照明需求,有时需要将LED灯具设计成照射角度可调的结构,采用有限元软件分析了三款搭配常见散热器的大功率LED筒灯在不同照射角度下的散热性能,结果发现搭配辐射状散热器的LED筒灯在低于30°照射角下散热效果较佳;搭配平板状散热器的LED筒灯绕不同方向转动照射时散热效果不同,在绕文中所示X轴方向转动时散热效果较好,适合多角度照射;搭配柱状散热器的LED筒灯在多角度照射情况下都具有较好的散热效果。研究结果为以后的筒灯设计提供了参考依据。 相似文献
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Hongming An Nauwelaers B.K.J.C. Van de Capelle A.R. 《Antennas and Propagation, IEEE Transactions on》1994,42(12):1612-1619
This paper deals with the design of broadband active microstrip antennas where the amplifier is integrated with the radiator. Theoretically sound definitions for gain and noise figure of the active antenna are introduced, and their relationships with the definitions for the composing circuit and radiator parts are explained. A sequential design procedure is presented that allows the straightforward and optimal design of transmitting and receiving antennas with multiple active stages, taking into account input and output matching, the gain-versus-frequency curve as well as the noise performance. The theoretical concepts are illustrated with two examples: one of a transmitting active antenna and one of a receiving antenna. The former one is a two-stage design that achieves nearly 25% of bandwidth with regard to gain and matching and 24 dB gain improvement as compared to the matched passive antenna. The second one is a receiving antenna (one stage) with a measured noise figure of 1.2 dB in a bandwidth of over 17% and a gain improvement of 11.9 dB over the corresponding passive antenna. Finally co- and cross-polar radiation patterns in E- and H-plane prove that the antennas also have favorable radiation characteristics in a wide bandwidth (at least 18%) 相似文献
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CPU热柱散热器实验研究与温度场数值模拟 总被引:1,自引:0,他引:1
对CPU热柱散热器的散热性能进行了实验研究,测试加热功率、风速等主要工况不同时发热电子元件表面的温度,比较并分析了测试结果。运用有限元分析软件ANSYS对该散热器进行了温度场数值模拟分析。研究在风冷条件下,同等尺寸的普通铜柱CPU散热器和热柱散热器的温度分布。结果表明,热柱散热器具有良好的散热性能,在较低风速下也能有效地降低CPU的温度。 相似文献
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To reduce the weight and production costs of light-emitting diode (LED) lamps,we applied the principle of the chimney effect to design a cylindrical LED substrate without a radiator.We built a 3D model by using Solidworks software and applied the flow simulation plug-in to conduct model simulation,thereby optimizing the heat source distribution and substrate thickness.The results indicate that the design achieved optimal cooling with a substrate with an upper extension length of 35 mm,a lower extension length of 8 mm,and a thickness of 1 mm.For a substrate of those dimensions,the highest LED chip temperature was 64.78 ℃,the weight of the substrate was 35.09 g,and Rjb =7.00 K/W.If the substrate is powered at 8,10,and 12 W,its temperature meets LED safety requirements.In physical tests,the highest temperature for a physical 8 W cylindrical LED substrate was 66 ℃,which differed by only 1.22 ℃ from the simulation results,verifying the validity of the simulation.The designed cylindrical LED substrate can be used in high-power LED lamps that do not require radiators.This design is not only excellent for heat dissipation,but also for its low weight,low cost,and simplicity of manufacture. 相似文献
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To keep the thermally induced average telescope deformations within 15 μm, a thermal design goal has been set which limits the temperature difference between all locations in the panels, backing structure and subframe to 1°C. Temperature gradients are caused by non-homogeneous exposure and by difference in response to a changing exposure for elements with different time constants. Thermal model simulations are used to identify the critical elements in the thermal design of telescope and enclosure. It is shown that an enclosure with a highly reflective paint with high infrared emissivity on the outside surface and an inside zinc coating with low infrared emissivity works as a highly effective radiation shield. A sprayed aluminium coating on the telescope makes free convection the dominant heat transfer mechanism. An enclosure with louvres works as a chimney forcing the inside air temperature to follow the ambient temperature to within a few degrees. The resulting temperature stratification in the area where the telescope reflector is located does not exceed 1.5°C. Structural analysis shows that temperature gradients in the subframe cause reflector surface deformations with a regular pattern, like gravitational deformations, which means that an error budget summation based on independent rms values is not necessarily valid. Knowing the structural analysis coefficients for differential thermal expansion one can decide which time constants in backing structure and subframe have to be matched to achieve optimal performance. 相似文献