Formation and thermal stability of Ca–Mg–Zn and Ca–Mg–Zn–Cu bulk metallic glasses

Several Ca–Mg–Zn and Ca–Mg–Zn–Cu bulk metallic glasses were produced by copper mold casting method. The alloy compositions were selected using specific criteria recently identified by the authors. The glass transition temperature, crystallization temperature, temperature interval of the supercooled region, melting temperature as well as heats of crystallization, and melting are reported for these alloys.     

Biodegradable Zn–3Cu and Zn–3Cu–0.2Ti alloys with ultrahigh ductility and antibacterial ability for orthopedic applications

Zinc(Zn) and its alloys have been proposed as biodegradable implant materials due to their unique combination of biodegradability, biocompatibility, and biofunctionality. However, the insufficient mechanical properties of pure Zn greatly limit its clinical application. Here, we report on the microstructure, mechanical properties, friction and wear behavior, corrosion and degradation properties, hemocompatibility, and cytocompatibility of Zn–3 Cu and Zn–3 Cu–0.2 Ti alloys under three different conditions of as-cast(AC),hot-rolling(HR), and hot-rolling plus cold-rolling(HR + CR). The HR + CR Zn–3 Cu–0.2 Ti exhibited the best set of comprehensive properties among all the alloy samples, with yield strength of 211.0 MPa, ultimate strength of 271.1 MPa, and elongation of 72.1 %. Immersion tests of the Zn–3 Cu and Zn–3 Cu–0.2 Ti alloys in Hanks’ solution for 3 months indicated that the AC samples showed the lowest degradation rate,followed by the HR samples, and then the HR + CR samples, while the HR + CR Zn–3 Cu exhibited the highest degradation rate of 23.9 m/a. Friction and wear testing of the Zn–3 Cu and Zn–3 Cu–0.2 Ti alloys in Hanks’ solution indicated that the AC samples showed the highest wear resistance, followed by the HR samples, and then the HR + CR samples, while the AC Zn–3 Cu–0.2 Ti showed the highest wear resistance.The diluted extracts of HR + CR Zn–3 Cu and Zn–3 Cu–0.2 Ti at a concentration of ≤25 % exhibited noncytotoxicity. Furthermore, both the HR + CR Zn–3 Cu and Zn–3 Cu–0.2 Ti exhibited effective antibacterial properties against S. aureus.     

Microstructure and magnetic studies of Mg–Ni–Zn–Cu ferrites

Soft Mg–Ni–Zn–Cu spinel ferrites having general chemical formula Ni_xMg_0.5−xCu_0.1Zn_0.4Fe₂O₄ (where x = 0.1, 0.2, 0.3, 0.4 and 0.5) were prepared by standard double sintering ceramic method. The samples were characterized by X-ray diffraction at room temperature. The X-ray diffraction (XRD) study revealed that lattice parameter decreases with increase in Ni content, resulting in a reduction in lattice strain. The electrical and magnetic properties of the synthesized ferrites have been investigated as a function of temperature. The variation of initial permeability and AC susceptibility with temperature exhibits normal ferrimagnetic behavior. The variation of initial permeability with frequency is studied. The Curie temperature (T_C) in the present work was determined from initial permeability and AC susceptibility. The Curie temperature increases with Ni content.     

Reliability studies of Sn–9Zn/Cu and Sn–9Zn–0.3Ag/Cu soldered joints with aging treatment

In this study, the interfacial reactions and joint reliabilities of Sn–9Zn/Cu and Sn–9Zn–0.3Ag/Cu were investigated during isothermal aging at 150 °C for aging times of up to 1,000 h. Cu₅Zn₈ IMCs layer is formed at the as-soldered Sn–9Zn/Cu interface. Adding 0.3wt.% Ag results in the adsorption of AgZn₃ on the Cu₅Zn₈ IMCs layer. The as-soldered Sn–9Zn/Cu and Sn–9Zn–0.3Ag/Cu joints have sufficient pull strength. The thickness of the IMCs layer formed at the interface of Sn–9Zn/Cu and Sn–9Zn–0.3Ag/Cu both increase with increasing aging time. Correspondingly, both the pull forces of the Sn–9Zn and Sn–9Zn–0.3Ag soldered joints gradually decrease as the aging time prolonged. However, the thickness of the IMCs layer of Sn–9Zn–0.3Ag/Cu increases much slower than that of Sn–9Zn/Cu and the pull force of Sn–9Zn–0.3Ag soldered joint decreases much slower than that of Sn–9Zn soldered joint. After aging for 1,000 h, some Cu–Sn IMCs form between the Cu₅Zn₈ IMC and the Cu substrate, many voids form at the interface between the Cu₅Zn₈ layer and solder alloy, and some cracks form in the Cu₅Zn₈ IMCs layer of Sn–9Zn/Cu. The pull force Sn–9Zn soldered joint decreases by 53.1% compared to the pull force measured after as-soldered. Fracture of Sn–9Zn/Cu occurred on the IMCs layer on the whole and the fracture micrograph implies a brittle fracture. While the pull force of Sn–9Zn–0.3Ag soldered joint decreases by 51.7% after aging at 150 °C for 1,000 h. The fracture mode of Sn–9Zn–0.3Ag soldered joint is partially brittle at the IMCs layer, and partially ductile at the outer ring of the solder.     

Microstructure and tensile properties of squeeze cast Al–Zn–Mg–Cu alloy

Abstract

It is well known that wrought aluminium alloys have tensile properties superior to those of the cast products. Wrought grade alloys cannot usually be produced by conventional casting processes to attain the same level of tensile properties. However, progress in casting methods in recent years has made it possible to produce wrought alloys by means of squeeze casting techniques. In the present study an Al–Zn–Mg–Cu alloy has been produced by squeeze casting. Tensile properties close to those of wrought products have been achieved by controlling the microstructure, pressure, and other processing parameters.     

Extrusion of AI–Zn–Mg–Cu–Zr alloys

Abstract

Four aluminium alloys of different zinc/magnesium ratio have been studied under various extrusion conditions. The alloys were cast in steel book moulds and subjected to initial thermomechanical treatments. Studies were made of hot extrusions and cold hydrostatic extrusions and in each case the changes in the extrusion parameters were analysed. An attempt has been made to explain some of the extrusion defects which appeared in various extruded sections. The extrusion speed was found to be crucial, since sections developed surface cracks at higher speeds. The extrusion speed was also found to vary inversely with the extrusion ratio, with higher speeds at low ratios. A well defined solute–depleted weld zone was observed on each of the four faces of a square tube extruded using a porthole die. Thermal treatment was not found to improve this weak weld zone. Tubes extruded using a floating-mandrel die withstood pressure testing up to 550 MPa.

MST/43     

Synthesis of Cu2ZnSnS4 films from sequentially electrodeposited Cu–Sn–Zn precursors and their structural and optical properties

The Cu₂ZnSnS₄ (CZTS) films are successfully prepared using a process of sequentially electrodeposited Cu–Sn–Zn precursors by a novel electrolyte formula and optimized parameters on Mo substrate, succeeded by annealing in saturated sulfur atmosphere. The results show that the Cu/Sn/Zn precursor sequence is strict, and optimized electro-deposition parameters are as follows: ?0.6 V, 5 min for Cu, ?1.2 V, 2 min for Sn, and ?1.35 V, 10 min for Zn. Layered precursors firstly alloy into Cu₆Sn₅ and CuZn binary phases under low annealing temperature. Then Cu₆Sn₅ and CuZn alloys decompose in sulfur atmosphere, and form CuS, SnS and ZnS binary phases. Cu₂SnS₃ ternary phase forms through reaction between CuS and SnS with increasing the temperature. Finally, the CZTS film is synthesized through reaction among binary and ternary sulfides. The photoluminescence peak from the CZTS films synthesized at 550 °C for 1 h is about at 1.49 eV.     

Bulk magnetic studies on Cu–Mg–Zn ferrites

The ferrite compositions of Cu(0.5-x)MgxZn0.5Fe2O4 were synthesized by thermal decomposition of the solid solution of oxalate complexes obtained by the coprecipitation technique using oxalate precursors. X-ray diffraction (XRD) patterns of all the samples showed a single spinel phase with no detectable impurity phases. The magnetization values were measured by the superconducting quantum interference device (SQUID) technique and the observed variation in magnetization values is attributed to porosity present in these ferrite compositions. The saturation magnetization (Ms) versus temperature curves revealed the curve to be of type Q. The variation of saturation magnetization (Ms) with temperature (T) for composition x=0.25 and x=0.40 exhibited a type Q-curve at a higher field of 1000 G. The monotonic increase in Hc with grain diameter for ferrite compositions under investigation leads to HcD-1. Saturation magnetization (Ms) values of end ferrites sintered at 1000 °C are higher than those of oxalate complexes decomposed at 600 °C. © 1998 Kluwer Academic Publishers     

Structural and optical properties of sulfurized Cu2ZnSnS4 thin films from Cu–Zn–Sn alloy precursors

This study reports the preparation of Cu₂ZnSnS₄ (CZTS) thin films by magnetron sputtering deposition with a Cu–Zn–Sn ternary alloy target and sequential sulfurization. The effects of substrate temperatures on the structural, morphological, compositional as well as optical and electrical properties were characterized. The results showed the CZTS thin films prepared by sulfurization at substrate temperature of 570 °C yielded secondary phases along with CZTS compound. The relatively good properties of CZTS thin film were obtained after sulfurization at substrate temperature of 550 °C. This CZTS film showed compact structure with large grain size of 900 nm, direct optical band gap of 1.47 eV, optical absorption coefficient over 10⁴ cm^?1, resistivity of 4.05 Ω cm, carrier concentration of 8.22 × 10¹⁸ cm^?3, and mobility of 43.38 cm² V^?1 S^?1.     

Non-isothermal aging of a high-Zn-containing Al–Zn–Mg–Cu alloy: microstructure and mechanical properties

The non-isothermal aging behaviour of a newly developed Al–Zn–Mg–Cu alloy containing 17?wt-% Zn was investigated. Hardness and shear punch tests demonstrated that during non-isothermal aging, the mechanical properties of the alloy first increased and then decreased. The best properties were obtained in a sample which was non-isothermally aged upto 250°C with heating rate of 20°C?min^?1, due to the presence of η′/η (MgZn₂) phases. This was confirmed by differential scanning calorimetery. After homogenisation, residual eutectic phases remained at triple junctions or in a spherical form. During aging, these phases transformed into rodlike S (Al₂CuMg)-phase at 400°C, with sizes ranging from 50 to 250?nm. The precipitation sequence in this high-Zn alloy was similar to that for conventional Al–Zn–Mg–Cu alloys.     

Effect of multi-directional forging and ageing on fracture toughness of Al–Zn–Mg–Cu alloys

Strength, ductility and fracture toughness are the most important mechanical properties of engineering materials. In this work, an Al–Zn–Mg–Cu alloy was subjected to multi-directional forging (MF) and ageing treatment. Microstructural evolution was studied by optical and electron microscopy and strength, ductility and fracture toughness were researched. After MF, the dislocation density was increased and the microstructure was refined. The strength and fracture toughness were increased, while the ductility was decreased sharply. Without compromising the strength, the ductility was improved significantly after ageing. The fracture toughness was increased further. The coarse and discontinuously distributed grain boundary precipitates were found to be responsible for higher fracture toughness of the fine-grained structure Al–Zn–Mg–Cu alloy.     

Interfacial reaction of Sn–2.0Ag–2.5Zn solder on Cu and Ni–W substrates

The interfacial reactions of Sn–2.0Ag–2.5Zn solder on Cu and Ni–W substrates after soldering and subsequent aging have been investigated in this study. Ni–W alloy layers with tungsten content of 3.0 and 10.0 at.% were electrodeposited on copper substrate. The interfacial micrographs of solder joints prepared at 250 °C for 15 s and aged at 150 °C for 24, 96 and 216 h are shown. Double-layer IMC composed of Cu₅Zn₈ and Ag₃Sn was observed at the interface of Sn–2Ag–2.5Zn and Cu couple, which was compact and acted as a barrier layer to confine the further growth of Cu–Sn IMC. On Ni–W barrier layer, a thin Ni₃Sn₄ film appeared between the solder and Ni–W layer, whose thickness decreases with the increase of W content. During the aging process, a thin layer of the Ni–W substrate transforms into an amorphous bright layer, and the thickness of amorphous layer increased as aging time extended. Referring to the elemental line-distribution and the thickness of different layers at the interface, the formation of the bright layer is caused by the fast diffusion of Sn into Ni–W layer.     

Microstructural evolution during extrusion and ECAP of a spray-deposited Al–Zn–Mg–Cu–Sc–Zr alloy

The microstructural evolution of an Al–Zn–Mg–Cu–Sc–Zr alloy prepared by spray deposition via extrusion and equal-channel angular pressing (ECAP) was investigated in this study. Deformation route A for Al–11.5 wt% Zn–2 wt% Mg–1.5 wt% Cu–0.2 wt% Sc–0.15% Zr super-strength alloy was carried out at 573 K by ECAP. The microstructures of extruded and ECAP samples were investigated by means of Electron Backscatter Diffraction (EBSD), Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM). A large amount of dislocation tangles were formed inside grains during ECAP, which further evolved into sub-boundaries and high angle grain boundaries. Microstructure analyses showed that the grain size was refined to 800 nm after 8 passes ECAP from earlier 3.5 μm of sprayed and extruded alloy. A few finer MgZn₂ and Al₃(Sc,Zr) were dispersed uniformly after ECAP. The textures of 8 passes ECAPed sample were dominated by the strong Cu orientation and relatively weak S orientation.     

High-pressure homogenization treatment of Al–Zn–Mg–Cu aluminum alloy

Absract The microstructures and aging hardening response of Al–12Zn–3.5Mg–3.0Cu–0.14Zr aluminum alloy after a high-pressure homogenization treatment at 750 °C for 45 min under 5 GPa were investigated. The results showed that the constituent phases dissolved completely and formed α-Al single-phase solid solution comparable to that formed after ambient-pressure homogenization at 450 °C/96 h + 460 °C/128 h. The complete dissolution of the constituent phases increased the solubility of the alloying elements, as well with the over-burning temperature and aging hardness.     

Microstructural evolution of Al–Zn–Mg–Cu alloy during homogenization

In this study, the microstructural evolution of an as-cast Al–Zn–Mg–Cu alloy (AA7085) during various homogenization schemes is investigated. It is found that in a single-stage homogenization scheme, some of the primary eutectic gets transformed into the Al₂CuMg phase at 400 °C, and the primary eutectic and Al₂Cu phase gradually dissolve into the alloy matrix at 450 °C. The Al₃Zr particles are mainly precipitated at the center of the grain because Zr is peritectic. However, the homogeneous distribution of the Al₃Zr particles improves and the fraction of Al₃Zr particles increases in two-stage homogenization scheme. At the first low-temperature (e.g., 400 °C) stage, the Al₃Zr particles are homogeneously precipitated at the center of the grain by homogeneous nucleation and may be heterogeneously nucleated on the residual second-phase particles at the grain boundary regions. At the second elevated-temperature (e.g., 470 °C) stage, the Al₃Zr nuclei become larger. A suitable two-stage homogenization scheme for the present 7085-type Al alloy is 400 °C/12 h + 470 °C/12 h.     

Precipitation in Cu–Ni–Si–Zn alloy for lead frame

The aging of Cu–Ni–Si–Zn alloy for lead frame is investigated. The results showed that the peak of hardening effect occurs after aging for about 1 h and the electrical conductivity increases continuously with aging times. The hardness of the alloy reached a peak at 430–460 °C for 2 h and electrical conductivity reached a peak at 500–550 °C and continuously decreased afterwards. The cold rolling prior to the aging treatment was used to increase the precipitation rate. The precipitates responsible for the age-hardening effect are disc-shaped δ-Ni₂Si, which has an orthorhombic structure.     

Influence of sulphur on the microstructure and properties of Ag–Cu–Zn brazing filler metal

Abstract

The effect of sulphur on the microstructure and properties of Ag45–Cu30–Zn25 brazing filler metal was investigated. Under the given experimental conditions, the sulphuration products mainly consisted of CuS, ZnS, Ag₂S, Cu₂S and Ag₃CuS₂. These sulphides not only distributed on the surface but also diffused into the interior of the filler metal and cut apart the matrix thereby significantly damaging the tensile strength of the filler metal from 658 to 283 MPa. The corresponding fracture characterisation turned from ductile fracture to brittle fracture. The sulphides existed as solid particles, which hinder the spreading of the liquid filler metal and the spreading area dramatically decreased from 317?09 to 18?55 mm², which indicates that the filler metal rarely wets the base metal.     

Wetting properties and interfacial microstructures of Sn–Zn–xGa solders on Cu substrate

The wetting properties and interfacial microstructures of Sn–9Zn–xGa lead-free solders with Cu substrate were investigated. The wetting property is improved remarkably with the increase of Ga content in the Sn–9Zn lead-free solder. The lower surface tension, which results from the decrease of the oxidation of the Zn atoms owing to the formation of the Ga-rich protective film covered on the liquid solder, is the key reason for the better wettability. During soldering, the Cu₅Zn₈ compounds layer form at the interface of Sn–9Zn/Cu and the IMCs formed at the solder/Cu surface become much thicker when the Ga content is from 0.1 wt.% to 3 wt.%. However, neither Cu–Sn compounds nor Ga-rich phases are observed at the solder/Cu surface.     

Influence of retrogression and re-aging treatment on corrosion behaviour of an Al–Zn–Mg–Cu alloy

Influence of retrogression and re-aging treatment on the microstructure, strength, exfoliation corrosion, inter-granular corrosion and stress corrosion cracking of an Al–Zn–Mg–Cu alloy has been investigated by means of optical microscope (OM), transmission electron microscope (TEM) and electrochemical impedance spectroscopy (EIS). The results show that retrogression and re-aging treatment can increase the size and the distribution discontinuity of the grain boundary precipitates, and lead to the increase of the corrosion resistance without the loss of strength and ductility. In addition, the analysis of electrochemical impedance spectroscopy shows that retrogression and re-aging treatment can enhance the resistance to exfoliation corrosion.