共查询到16条相似文献,搜索用时 125 毫秒
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综述了用于LED封装材料的有机硅改性环氧树脂类和有机硅树脂材料的研究进展,介绍了有机硅改性环氧树脂的物理共混和化学共聚方法,以及使用有机硅树脂为LED封装材料的特色优势,有机硅树脂产品的制造工艺特点和目前现状,并展望了有机硅封装材料的未来可能的研究方向。 相似文献
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LED封装用透明环氧树脂的改性 总被引:8,自引:0,他引:8
选用不同种类的光稳定剂对发光二极管(LED)封装用透明环氧树脂进行改性,研究了光稳定剂对环氧树脂透光率和耐紫外线老化性能的影响。所选用的光稳定剂与环氧树脂都具有良好的相容性.采用苯并三唑类光稳定剂UV-329改性环氧树脂和受阻胺类光稳定剂HS-508改性环氧树脂封装的LED比采用普通环氧树脂EP-400封装的LED寿命分别提高59%和73%。HS-508与UV-329共同使用具有协同作用,采用最优条件改性环氧树脂封装的LED的寿命比用EP-400封装的LED提高了170%。 相似文献
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Xiongfa Yang Qian Shao Linlin Yang Xiaobiao Zhu Xilin Hua Qunliang Zheng Guangxin Song Guoqiao Lai 《应用聚合物科学杂志》2013,127(3):1717-1724
A novel high refractive index and highly transparent silicone resin‐type material for the packaging of high‐power light‐emitting diodes (LEDs) is introduced, which was synthesized by hydrosilylation of vinyl end‐capped methylphenyl silicone resin and methylphenyl hydrosilicone oil catalyzed by Karstedt's catalyst. The vinyl end‐capped methylphenyl silicone resins were prepared by hydrolysis?polycondensation method from methylphenyl diethoxysilane (MePhSi(OEt)2), phenyl triethoxysilane (PhSi(OEt)3), and vinyl dimethylethoxy silane (Me2ViSiOEt) in toluene/water mixture catalyzed by cation‐exchange resin. The vinyl end‐capped methylphenyl silicone resins were characterized by 1H‐NMR and Fourier‐transform infrared. The performances of the cured silicone resin‐type materials for LED packaging have been examined in detail. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013 相似文献
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采用低黏度的混合胺类固化剂和环氧活性稀释剂,并以聚氨酯为增韧剂制得了改性环氧树脂灌封胶,研究了各组分对灌封胶的力学性能和透光性能的影响。该灌封胶黏度低,透光性好,适宜用于LED的灌封。 相似文献
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Chaoyun Luo Jianqing Zhao Yanchao Yuan Jiandong Zuo Xuechun Lin Ying Zhao 《Polymer Bulletin》2012,69(3):337-345
High refractive index of epoxy resins used as encapsulant in light-emitting diode (LED) is essential in improving the light extraction efficiency, reducing heat and prolonging the service life of LED packages. In this study, diglycidyl ether of thiodibenzenethiol (DGETDBT), an epoxy resin with high refractive index, was synthesized via a novel method and its chemical structure was characterized with Fourier-transform infrared (FTIR) spectrometer and 1H NMR spectrometer. Using m-xylylenediamine (MXDA) as curing agent, the curing behavior of DGETDBT was studied by differential scanning calorimetry (DSC) and was compared with that of diglycidyl ether of bisphenol A (DGEBA), a generally used encapsulant in LED. The thermal behavior and optical performance of these two resins were investigated with thermogravimetric analyses, UV?CVis scanning spectrophotometer, and Abbe refractometer, respectively. The results showed that DGETDBT/MXDA resin demonstrated similar curing and thermal behavior to DGEBA/MXDA resin. But its refractive index reaches 1.698, which is significantly higher than that of DGEBA/MXDA resin (1.604). Comparatively, DGETDBT resin can be expected to be a more effective encapsulant of LED. 相似文献
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SeungCheol Yang Joon‐Soo Kim JungHo Jin Seung‐Yeon Kwak Byeong‐Soo Bae 《应用聚合物科学杂志》2010,117(4):2140-2145
Cycloaliphatic epoxy hybrimer bulk was successfully fabricated by thermal curing of cycloaliphatic epoxy oligosiloxane resin synthesized by a sol‐gel condensation reaction with methylhexahydrophthalic anhydride (MHHPA) and tetrabutylphosphonium methanesulfonate (TBPM). The composition of MHHPA and TBPM in the resin was optimized to minimize yellowness of the cycloaliphatic epoxy hybrimer bulk. The sample with the optimized composition showed little discoloration upon thermal aging at 120°C for 360 h under an air atmosphere. On the basis of its high thermal stability with appropriate hardness and a high refractive index of 1.55, cycloaliphatic epoxy hybrimer bulk can be used as a LED encapsulant for white LEDs. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010 相似文献
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Jiyoung Seo Sunil Kim Yurian Kim Fauzia lqbal Hyungsun Kim 《Journal of the American Ceramic Society》2014,97(9):2789-2793
Light‐emitting‐diode (LED) encapsulants, such as epoxy and silicone resin, have a lower refractive index than YAG:Ce phosphor, and this is usually one of the major causes of LED inefficiency. To improve LED performance, a glass encapsulant is considered. In this study, the SiO2–B2O3–ZnO glass system containing La2O3 and WO3 was investigated as an encapsulant to minimize total internal reflection and to increase the light extraction efficiency of LED packages. The characterization of glass encapsulants was performed using a differential scanning calorimeter, a pycnometer, a prism coupler, X‐ray photoelectron spectroscopy, and integrating spheres. The refractive index increased linearly with increasing molar volume of glass because La2O3 and WO3 act as modifiers in the glass, creating more nonbridging oxygen. The refractive index of glass increases with the content of La2O3 and WO3, which is attributed to the increase in polarizability of oxide ions in the glass. When the refractive index between glass and phosphor matched, light extraction efficiency was maximized because total internal reflection decreased. 相似文献
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以苯基乙烯基硅树脂、苯基乙烯基硅油、含氢硅油、增粘剂等为原料,制成了双组分加成型高折射率LED封装胶。研究了原料对其耐高低温冲击性能的影响。结果表明:在苯基乙烯基硅树脂中引入5%的γ-环氧丙氧基丙基三甲氧基硅烷、配胶时将黏度为5000mPa·s和300mPa·S的苯基乙烯基硅油按10:2的质量比混合使用、交联剂采用活性氢质量分数为0.43%的苯基含氢硅油、增粘剂含环氧基和氢基的预聚物的质量分数为1%,按此配方配成的LED封装胶用于5050、5730灯架进行测试,完全固化后先过3次回流焊,然后在-40-+100℃的冷热冲击测试试验机中进行测试,经过500个循环后,封装胶无裂胶、胶脱底和胶片脱落、死灯等现象。 相似文献