Swift heavy ion irradiation induced texturing in NiO thin films

NiO thin films grown on Si(1 0 0) substrate by electron beam evaporation and sintered at 500 and 700 °C were irradiated with 120 MeV Au⁹⁺ ions. The FCC structure of the sintered films was retained up to the highest fluence (3 × 10¹³ ions cm⁻²) of irradiation. In the low fluence (?1 × 10¹³ ions cm⁻²) regime however, the evolution of the XRD pattern with fluence showed a wide variation, critically depending upon their initial microstructure. Though irradiation is known to induce disorder in the structure, we observe improvement in crystallization and texturing at intermediate fluences of irradiation.     

Ion induced segregation in gold nanostructured thin films on silicon

We report a direct observation of segregation of gold atoms to the near surface regime due to 1.5 MeV Au²⁺ ion impact on isolated gold nanostructures deposited on silicon. Irradiation at fluences of 6 × 10¹³, 1 × 10¹⁴ and 5 × 10¹⁴ ions cm⁻² at a high beam flux of 6.3 × 10¹² ions cm⁻² s⁻¹ show a maximum transported distance of gold atoms into the silicon substrate to be 60, 45 and 23 nm, respectively. At a lower fluence (6 × 10¹³ ions cm⁻²) transport has been found to be associated with the formation of gold silicide (Au₅Si₂). At a high fluence value of 5 × 10¹⁴ ions cm⁻², disassociation of gold silicide and out-diffusion lead to the segregation of gold to defect - rich surface and interface regions.     

Grain growth and crack formation in NiO thin films by swift heavy ion irradiation

NiO thin films grown on Si(1 0 0) substrates by electron beam evaporation and sintered at 700 °C, were irradiated by 120 MeV Au⁹⁺ ions. Though irradiation is known to induce lattice disorder and suppression of crystallinity, we observe grain growth at some fluences of irradiation. Associated with the growth of grains, the films develop cracks at a fluence of 3 × 10¹² ions cm⁻². The width of the cracks increased at higher fluences. Swift heavy ion irradiation induced atomic diffusion and strain relaxation in nanoparticle thin films, which are not in thermodynamic equilibrium, seem to be responsible for the observed grain growth. This phenomenon along with the tensile stress induced surface instability lead to crack formation in the NiO thin films.     

Electrical properties of silicon diodes with pn junctions irradiated with Au swift heavy ions

Electrical properties of silicon diodes with p⁺n junctions irradiated with ¹⁹⁷Au⁺²⁶ swift heavy ions (energy E = 350 MeV, fluences of 10⁷ cm⁻² and 10⁸ cm⁻²) and silicon diodes irradiated with electrons (energy E = 3.5 MeV, fluences of 10¹⁵ cm⁻², 5 × 10¹⁵ cm⁻² and 10¹⁶ cm⁻²) have been investigated. Frequency dependences of the impedance, current-voltage characteristics and switching characteristics of these devices have been studied. Irradiation of the diodes with ¹⁹⁷Au⁺²⁶ ions at a fluence of 10⁸ cm⁻² leads to the formation of a quasi-continuous layer of irradiation-induced defects that enable a combination of characteristics such as a reverse resistance recovery time and direct voltage drop that are better than those for electron-irradiated diodes. Still, the irradiation of high-energy ions results in an increase in recombination currents that are larger than those obtained with electron irradiation, and causes more complicated frequency dispersion of the diode parameters.     

The interdiffusion and solid-state reaction of low-energy copper ions implanted in silicon

At room temperature, single-crystal silicon was implanted with Cu⁺ ions at an energy of 80 keV using two doses of 5 × 10¹⁵ and 1 × 10¹⁷ Cu⁺ cm⁻². The samples were heat treated by conventional thermal annealing at different temperatures: 200 °C, 230 °C, 350 °C, 450 °C and 500 °C. The interdiffusion and solid-state reactions between the as-implanted samples and the as-annealed samples were investigated by means of Rutherford backscattering spectrometry (RBS) and X-ray diffraction (XRD). After annealing at 230 °C, the XRD results of the samples (subject to two different doses) showed formation of Cu₃Si. According to RBS, the interdiffusion between Cu and Si atoms after annealing was very insignificant. The reason may be that the formation of Cu₃Si after annealing at 230 °C suppressed further interdiffusion between Si and Cu atoms.     

Effects of ion irradiation on the structural transformation of sol-gel derived TEOS/MTES thin films

Ion beam processing of organic/inorganic thin films has been shown to be an effective means in converting polymeric films into their final ceramic-like state. In this study, hybrid sol-gel derived thin films based on TEOS (tetraethylorthosilicate) Si(OC₂H₅)₄ and MTES (methyltriethoxysilane) CH₃Si(OC₂H₅)₃ were prepared and deposited on Si substrates by spin coating. After the films were allowed to air dry, they were heat treated at 300 °C for 10 min. Ion irradiation was performed at room temperature using 125 keV H⁺ and 250 keV N²⁺ ions with fluences ranging from 1 × 10¹⁴ to 5 × 10¹⁶ ions/cm². FT-IR and Raman spectroscopies were used to quantify the chemical structural transformations which occurred including the evolution of the organic components, the cross-linking of silica clusters, and the clustering of carbon.     

Structural studies of Ge nanocrystals embedded in SiO2 matrix

Germanium nanoparticles embedded in SiO₂ matrix were prepared by atom beam sputtering on a p-type Si substrate. The as-deposited films were annealed at temperatures of 973 and 1073 K under Ar + H₂ atmosphere. The as-deposited and annealed films were characterized by Raman, X-ray diffraction and Fourier transform infrared spectroscopy (FTIR). Rutherford backscattering spectrometry was used to quantify the concentration of Ge in the SiO₂ matrix of the composite thin films. The formation of Ge nanoparticles were observed from the enhanced intensity of the Ge mode in the Raman spectra as a function of annealing, the appearance of Ge(3 1 1) peaks in the X-ray diffraction data and the Ge vibrational mode in the FTIR spectra. We have irradiated the films using 100 MeV Au⁸⁺ ions with a fluence of 1 × 10¹³ ions/cm² and subsequently studied them by Raman and FTIR. The results are compared with the ones obtained by annealing.     

Formation of silicon hydride using hyperthermal negative hydrogen ions (H) extracted from an argon-seeded hydrogen sheet plasma source

An E × B probe (a modified Wien filter) is constructed to function both as a mass spectrometer and ion implanter. The device, given the acronym EXBII selects negative hydrogen ions (H⁻) from a premixed 10% argon-seeded hydrogen sheet plasma. With a vacuum background of 1.0 × 10⁻⁶ Torr, H⁻ extraction ensues at a total gas feed of 1.8 mTorr, 0.5 A plasma discharge. The EXBII is positioned 3 cm distance from the sheet core as this is the region densely populated by cold electrons (T_e ∼ 2 eV, N_e ∼ 3.4 × 10¹¹ cm⁻³) best suited for H⁻ formation. The extracted H⁻ ions of flux density ∼0.26 A/m² are segregated, accelerated to hyperthermal range (<100 eV) and subsequently deposited into a palladium-coated 1.1 × 1.1 cm², n-type Si (1 0 0) substrate held at the rear end of the EXBII, placed in lieu of its Faraday cup. The palladium membrane plays the role of a catalyst initiating the reaction between Si atoms and H⁻ ions simultaneously capping the sample from oxidation and other undesirable adsorbents. AFM and FTIR characterization tests confirm the formation of SiH₂. Absorbance peaks between 900-970 cm⁻¹ (bending modes) and 2050-2260 cm⁻¹ (stretching modes) are observed in the FTIR spectra of the processed samples. It is found that varying hydrogen exposure time results in the shifting of wavenumbers which may be interpreted as changes in the frequencies of vibration for SiH₂. These are manifestations of chemical changes accompanying alterations in the force constant of the molecule. The sample with longer exposure time exhibits an additional peak at 2036 cm⁻¹ which are hydrides of nano-crystalline silicon.     

Effect of ion beam irradiation on magnetic and structural properties of Pt/Cr/Co multilayers

This paper discusses the effect of ion beam irradiation on the magnetic and structural properties of Pt/Cr/Co multilayers. We observe Co-Cr-Pt ternary alloy phase formation in 1 MeV N⁺ ion irradiated [Pt (2.5 nm)/Cr (0.8 nm)/Co (3.0 nm)]_×6/Si multilayers for a fluence of 1 × 10¹⁶ ions cm⁻² and beyond. The observed phase formation is accompanied by an enhancement in the average grain size, surface roughness and coercivity. Monte Carlo simulation has been performed to study ion-induced defect evolution and atomic displacements to correlate the above observed effects.     

Ion beam induced modifications in electron beam evaporated aluminum oxide thin films

Al₂O₃ thin films find wide applications in optoelectronics, sensors, tribology etc. In the present work, Al₂O₃ films prepared by electron beam evaporation technique are irradiated with 100 MeV swift Si⁷⁺ ions for the fluence in the range 1 × 10¹² to 1 × 10¹³ ions cm⁻² and the structural properties are studied by glancing angle X-ray diffraction. It shows a single diffraction peak at 38.2° which indicates the γ-phase of Al₂O₃. Further, it is observed that as the fluence increases up to 1 × 10¹³ ions cm⁻² the diffraction peak intensity decreases indicating amorphization. Surface morphology studies by atomic force microscopy show mean surface roughness of 34.73 nm and it decreases with increase in ion fluence. A strong photoluminescence (PL) emission with peak at 442 nm along with shoulder at 420 nm is observed when the samples are excited with 326 nm light. The PL emission is found to increase with increase in ion fluence and the results are discussed in detail.     

Tailoring optical and electrical properties of MgO thin films by 1.5 MeV H implantation to fluences

Thin films of magnesia (MgO) with (1 0 0) dominant orientations were implanted with 1.5 MeV H⁺ ions at room temperature to various fluences of 10¹³, 10¹⁴ and 10¹⁵ ions/cm². X-ray analysis unambiguously showed crystallinity even after a peak damage fluence of 10¹⁵ ions/cm². Rutherford backscattering spectrometry combined with ion channeling (RBS/C) was used to analyze radiation damages and defect distributions. Optical absorption band observed at 5.7 eV in implanted films was assigned to the anion vacancies and the defect was completely disappeared on annealing at 450 °C. Number of F-type defects estimated was 9.42 × 10¹⁵ cm⁻² for the film implanted with 10¹⁵ ions/cm². DC electrical conductivity of 4.02 × 10⁻⁴ S cm⁻¹ was observed in the implanted region which was three orders higher than the as-deposited films. In unison, film surface was modified as a result of the formation of aggregates caused by the atomic mixing of native matrix atoms (Mg and O) and precipitated hydrogen.     

Sub-surface retention of Pb atoms in silicon after low-energy ion implantation and electron beam annealing

Low-energy Pb ion implantation into (1 0 0) Si and subsequent high-vacuum electron beam annealing was used to study the potential of sub-surface retention of Pb atoms after applying a high temperature annealing process. 7 keV Pb⁺ ions were implanted into p-type (1 0 0) Si at room temperature with a fluence of 4 × 10¹⁵ ions cm⁻². The implantation results in a Pb depth distribution that has a calculated Pb peak concentration of 23.9 at.% at a depth of 8.0 nm. The Pb implanted Si substrates were annealed with a high-current 20 keV electron beam at 200-700 °C for 15 s. The Pb loss by out-diffusion was measured with RBS. Key results are: (i) minimal Pb loss in samples annealed up to 400 °C, (ii) emerging out-diffusion above 400 °C, (iii) retention of Pb atoms in the near-surface region in samples annealed up to 700 °C. Comparison of the RBS data with the calculated evaporation rate of Pb under similar conditions reveals two distinctive temperature ranges in which the measured Pb loss of the implanted samples disagrees with the calculated Pb loss: (1) Pb atoms diffused out of the samples at a higher rate in the temperature range up to 400 °C and (2) the Pb atoms diffused out of the samples at a much slower rate above 450 °C. Both phenomena are attributed to the ion implantation process.     

A systematic study on analysis-induced radiation damage in silicon during channeling Rutherford backscattering spectrometry analysis

Channeling Rutherford backscattering spectrometry (RBS) is an essential analysis technique in materials science. However, the accuracy of RBS can be significantly affected by disorders in materials induced by the analyzing ion beam even under channeling mode. We have studied RBS analysis-induced radiation damage in silicon. A 140-keV H⁺ ion beam was incident along 〈1 0 0〉 Si axis at room temperature to a fluence ranging from 1.6 × 10¹⁶ cm⁻² to 7.0 × 10¹⁶ cm⁻². The evolution of the aligned yields versus fluences has been examined and found to agree well with a model proposed by us.     

Observation of K- and L-REC in 200 MeV/u Xe-N2 collisions at HIRFL-CSR

The 200 MeV/u Xe⁵⁴⁺ ions were utilized to collide with N₂ molecules and the K- and L-REC, as well as the Lyman lines of Xe⁵³⁺ were observed. After electron cooling, the ion beam momentum spread ΔP/P ≈ 2.2 × 10⁻⁵ was achieved and the target thickness was stabilized at about 10¹³ atom/cm². As the first atomic experiment at HIRFL-CSR with the internal target, its feasibility and stability were verified.     

Ion-beam irradiation effects on reactively sputtered CrN thin films

The present study deals with CrN/Si bilayers irradiated at room temperature (RT) with 120 keV Ar ions. The CrN layers were deposited by d.c. reactive sputtering on Si(1 0 0) wafers, at different nitrogen partial pressures (2 × 10⁻⁴, 3.5 × 10⁻⁴ and 5 × 10⁻⁴ mbar), to a total thickness of 240-280 nm. The substrates were held at room temperature (RT) or 150 °C during deposition. After deposition the CrN/Si bilayers were irradiated up to fluences of 1 × 10¹⁵ and 1 × 10¹⁶ ions/cm². Structural characterization was performed with Rutherford backscattering spectroscopy (RBS), cross-sectional transmission electron microscopy (XTEM) and grazing angle X-ray diffraction (XRD). For the highest nitrogen pressure (5 × 10⁻⁴ mbar) a pure stoichiometric CrN phase was achieved. The results showed that Ar ion irradiation resulted in the variation of the lattice constants, micro-strain and mean grain size of the CrN layers. The observed microstructural changes are due to the formation of the high density damage region in the CrN thin film structure.     

Ferromagnetic modification of ZnO film by Fe ions implantation

The ZnO-based diluted magnetic semiconductors (DMSs) were achieved by ion implantation. Eighty kilo-electron-volt Fe⁺ ions were implanted into n-type ZnO films at room temperature with doses ranging from 1 × 10¹⁶ cm⁻² to 8 × 10¹⁶ cm⁻² and subsequently annealed at 700 °C for 1 h in air ambient. PIXE was employed to determine the Fe-implanted content. The magnetic property was measured by the Quantum Design MPMS SQUID magnetometer. No secondary phases or clusters were detected within the sensitivity of XRD. Raman spectrum measurement showed that the Fe ions incorporated into the crystal lattice positions of ZnO through substitution of Zn atoms. Apparent ferromagnetic hysteresis loops measured at 10 K were presented. The relationships between the Fe-implanted content and the ferromagnetic property are discussed.     

Effect of swift heavy ion irradiation on structural, optical and electrical properties of Cd2SnO4 thin films

Transparent conducting cadmium stannate thin films were prepared by spray pyrolysis method on Corning substrate at a temperature of 525 °C. The prepared films are irradiated using 120 MeV swift Ag⁹⁺ ions for the fluence in the range 1 × 10¹² to 1 × 10¹³ ions cm⁻² and the structural, optical and electrical properties were studied. The intensity of the film decreases with increasing ion fluence and amorphization takes place at higher fluence (1 × 10¹³ ions cm⁻²). The transmittance of the films decreases with increasing ion fluence and also the band gap value decreases with increasing ion fluence. The resistivity of the film increased from 2.66 × 10⁻³ Ω cm (pristine) to 5.57 × 10⁻³ Ω cm for the film irradiated with 1 × 10¹³ ions cm⁻². The mobility of the film decreased from 31 to 12 cm²/V s for the film irradiated with the fluence of 1 × 10¹³ ions cm⁻².     

AFM and photoluminescence studies of swift heavy ion induced nanostructured aluminum oxide thin films

E-beam evaporated aluminum oxide films were irradiated with 120 MeV swift Au⁹⁺ ions in order to induced nanostructure formation. Atomic force microscope (AFM) results showed the formation of nanostructures for films irradiated with a fluence of 1 × 10¹³ ions cm⁻². The particle size estimated by section analysis of the irradiated film was in the range 25-30 nm. Glancing angle X-ray diffraction (GAXRD) revealed the amorphous nature of the films. Two strong Photoluminescence (PL) emission bands with peaks at ∼430 nm and ∼645 nm besides a shoulder at ∼540 nm were observed in all irradiated samples. The PL intensity is found to increase with increase of ion fluence.     

Thickness and MeV Si ions bombardment effects on the thermoelectric properties of Ce3Sb10 thin films

The three single layer Ce₃Sb₁₀ thin films were grown on silicon dioxide and quartz (suprasil) substrates with thicknesses of 297, 269 and 70 nm using ion beam assisted deposition (IBAD) technique. The high-energy cross plane Si ion bombardments with constant energy of 5 MeV have been performed with varying fluence from 1 × 10¹², 1 × 10¹³, 1 × 10¹⁴, 1 × 10¹⁵ ions/cm². The Si ions bombardment modified the thermoelectric properties of films as expected. The fluence and temperature dependence of cross plane thermoelectric parameters that are Seebeck coefficient, electrical and thermal conductivities were determined to evaluate the dimensionless figure of merit, ZT. Rutherford backscattering spectrometry (RBS) enabled us to determine the elemental composition of the deposited materials and layer thickness of each film.     

Ion bombardment induced changes in the optical and electrical properties of polycarbonate

The changes in the optical and electrical properties of polycarbonate (PC) films, bombarded with He and Ar ion beams, have been studied. The PC films were divided into two groups where the first group was bombarded with 130 keV He ions of fluences ranged from 1 × 10¹⁴ cm⁻² to 2 × 10¹⁶ cm⁻², while the second one was bombarded with 320 keV Ar of fluences (1 × 10¹³ cm⁻² and 1 × 10¹⁵ cm⁻²). The surface morphology of the unirradiated and irradiated PC films was studied using scanning electron microscopy (SEM) technique. The optical properties of the two groups have been carried out using UV-Vis spectrophotometer and the direct current (DC) electrical conductivity was also performed. The obtained results showed a decrease in the optical energy gap, the optical activation energy and the electrical activation energy with increasing the fluence of both He and Ar ions. Meanwhile, an increase in the DC conductivity was obtained with increasing the fluence of the ions. The bombardment of the PC films with He and Ar ion beams induced formation of carbon clusters near the polymer surface and, also, resulted in scission in the polymer chains.