Si、Cu和热处理工艺对Al-Si合金电导率的影响

通过电导率测量、金相观察、扫描电镜分析和X射线衍射分析,研究了Si含量、Cu含量和热处理工艺对Al-Si系铸造合金晶格常数和电性能的影响规律。结果表明:Si和Cu元素的添加会减小合金的电导率;当Si含量超过固溶极限后,Si含量的变化对晶格畸变程度影响不大,合金的电导率受Si相的体积百分数控制;而Cu在固溶极限内时,随其含量的增加,晶格畸变程度增大,合金的电导率可根据铝基体晶格常数的偏离量来评估;经过450℃,5 h+250,2 h热处理工艺,晶格畸变程度明显降低,合金的电导率有明显提高,增幅最高可达32%。     

T6热处理对SiCp/Al复合材料摩擦磨损性能的影响

采用粉末冶金法制备出不同SiC颗粒体积分数(30%、35%和40%)的SiCp/Al复合材料。采用MMU-5GA微机控制真空高温摩擦磨损试验机对比研究SiCp/Al复合材料在不同体积分数以及T6热处理前后情况下平均摩擦因数和磨损率的变化,通过扫描电镜分析了SiCp/Al复合材料表面磨损形貌,探讨了摩擦磨损机理。试验结果表明,SiC颗粒体积分数在30%~40%变化时,随其体积分数增加耐磨性下降。SiC颗粒体积分数在30%~35%范围内,SiC颗粒与基体结合较好,SiC颗粒作为硬质点起到抵抗磨损和限制基体合金塑性变形产生磨损的双重作用;但SiC含量过多时,颗粒与基体的结合不紧密,磨损时颗粒极易脱落,复合材料耐磨性降低;T6热处理后复合材料的平均摩擦因数和磨损率均降低,这是由于热处理后试样强度及硬度提高,从而提高了试样的耐磨性;常温下复合材料在磨损初期的磨损机理主要以磨粒磨损为主,而在磨损期则为磨粒磨损与剥落磨损共存。     

Si含量对7050铝合金显微组织和抗应力腐蚀开裂的影响

分别研究Si含量为0．094％、0．134％和0．261％的3种T7651态7050铝合金的组织和应力腐蚀开裂敏感性。结果表明：随着Si含量从0．094％增加到0．261％,Mg2Si相的面积分数从0．16％增加到1．48％,并且尺寸粗化;而其它粗大相（包括Al2CuMg、Mg（Al3Cu,Zn）2和Al7Cu2Fe）的面积分数从2．42％减小到0．78％。合金的电导率随Si含量的增加而增加。合金在空气中进行慢应变速率拉伸时,抗拉强度和伸长率随Si含量的增加而降低;而在3．5％NaCl溶液中进行慢应变速率拉伸时,随Si含量增加,合金应力腐蚀开裂敏感性降低。     

TiB2颗粒TiB晶须混杂增强铜基复合材料导电率有限元模拟

本文建立了TiBw/Cu、(TiB2p+TiBw)/Cu、TiB2p /Cu复合材料的三维细观结构有限元模型,基于ABAQUS非耦合的热电分析理论,通过有限元数值模拟方法揭示了复合材料微观结构特征参量与宏观导电性能之间的定量关系。结果表明:TiB2颗粒体积分数为导电率主要影响因素,随体积分数增大导电率逐步减小,颗粒粒径大小对导电率影响不显著;TiB晶须体积分数和晶须取向角为导电率主要影响因素,晶须取向角平行于电流方向时导电率最好,垂直于电流方向时的导电率最差。在颗粒晶须混杂增强复合材料中,增强体体积分数和晶须取向角为导电率的主要影响因素,增强体种类对导电率影响较小。本文为颗粒晶须混杂增强铜基复合材料导电率计算提供了新的思路和方法,对颗粒和晶须增强复合材料混杂设计提供依据。     

铸造ZL101A／SiCp复合材料的研究

采用真空搅拌复合工艺制备了铸造ZL101A／SiC复合材料,研究了变质和细化处理对复合材料组织的影响。结果表明：变质和细化处理铸造 ZL101A／SiC复合材料制备工艺的重要处理措施,可明显改善复合材料的组织。利用透射电镜对AL／SiC界面特征及界面反应进行分析,同时对该复合材料的铸造性能（熔体合金流动性能、线收缩、体收缩和热裂倾向）以及力学和物理性能进行了测试。     

SiC_p/2024Al铝基复合材料的耐蚀性

用电化学方法和浸泡试验研究了SiC颗粒粒度和体积分数对SiCp/ 2 0 2 4Al铝基复合材料在 3.5 %NaCl水溶液中耐蚀性的影响 ,作为比较对 2 0 2 4Al的耐蚀性也进行了研究。结果表明 ,与基体相比 ,SiCp/ 2 0 2 4Al复合材料并不增加点蚀敏感性 ,其抗蚀性与SiC体积分数和粒度有关 ,SiC颗粒体积分数低或粒度高的复合材料 ,其抗蚀性往往大。     

SiCw和纳米SiCp混杂增强铝基复合材料的制备与评价

采用湿成型法制备了体积分数可以调节的碳化硅晶须与纳米碳化硅颗粒混杂的预制块,确定了挤压铸造法制备混杂增强铝基复合材料的工艺参数.通过扫描电镜和透射电镜分析发现:复合材料中晶须与纳米颗粒分布均匀,并与基体合金的界面结合良好,无界面反应物和孔洞;与基体合金相比,混杂增强复合材料的抗拉强度和弹性模量明显增高,延伸率降低;在晶须体积分数一定时,随纳米SiC颗粒体积分数的增加,复合材料的抗拉强度升高.     

金刚石–SiC/Al复合材料的构型设计与导热性能

以SiC和镀钨金刚石增强体为原料制备预制体,通过气压浸渗技术在800 ℃,5 MPa条件下制备金刚石–SiC/Al复合材料。利用扫描电镜、红外热成像仪、激光导热仪等对复合材料性能进行分析,研究SiC和金刚石的含量与粒径比对复合材料构型的影响,从而优化复合材料导热性能。结果表明:在相同的SiC粒径下,金刚石体积分数的增加将使复合材料的导热性能明显提升。当金刚石体积分数为30%时,含F100 SiC的复合材料导热性能最佳,其热导率为344 W/(m?K)。当金刚石体积分数相同,粒径比从0.07增大到0.65时,复合材料导热性能依次提升;且在金刚石体积分数为15%时,复合材料的热导率增幅最大,从174 W/(m?K)增大到274 W/(m?K),增长了57%。通过改善金刚石–SiC/Al复合材料中增强体的含量和粒径比可以调控复合材料构型,充分发挥复合材料的导热潜力。      

高温高压烧结金刚石-铜复合材料的研究

采用高温高压烧结工艺制备了金刚石体积分数为80%的金刚石-铜复合材料。研究了金刚石颗粒大小、烧结温度、烧结时间等因素对复合材料成分、界面状态和热导率的影响。结果表明:金刚石颗粒直径为80μm时,在高温高压条件下可获得热导率高达639 W.m-1.K-1的金刚石-铜复合材料。当金刚石体积分数一定时,存在一临界粒径,随金刚石颗粒直径增大复合材料热导率先增大后减小。恰当的烧结温度和时间有助于获得黏结良好的界面和高热导率。     

Metallic Glass Nano-composite Thin Films for High-performance Functional Applications

Metallic glass nanocomposite thin films were synthesized for an immiscible Ag-Cu alloy system by magnetron sputtering. The structure of the films was unique, consisting of homogeneously dispersed nanocrystallites in an amorphous matrix. The size and volume fraction of the nanocrystallites increased with increasing film thickness resulting in increased elastic modulus and hardness. The high electrical conductivity of the nanocomposite films was examined by a valence-band study, which showed that exchange interaction between Ag and Cu in the nanocomposite structure resulted in enhanced charge carrier concentration. The inverse correlation between electrical conductivity and film thickness was explained by surface and interface scattering of electrons with increasing volume fraction of nanocrystallites. The small temperature dependence of conductivity was attributed to the distorted Fermi surface of the nanocomposite films resulting in a greater contribution from structure scattering, which is temperature-independent.     

Si含量对Al-Si电子封装材料组织和性能的影响

采用热压成形工艺制备了Al-50Si、Al-60Si、Al-70Si合金电子封装材料,研究Si含量对材料组织和性能的影响。结果表明,Si含量对Al-xSi高Si铝合金有很大影响,Si含量为50%时,Al基体形成连续网络结构,但存在大量细小的孔隙。当Si含量增加到60%,Al基体呈连续网络状分布,内部孔洞减少。当Si含量达到70%,Si颗粒相互依存长大的几率更大,Si相尺寸明显长大。Al-60Si合金性能最佳,热导率为128.0W/(m·K),室温到150℃合金的热膨胀系数为9.92×10^-6℃^-1,密度为2.462g/cm^3。     

Influence of Fe addition on microstructure and properties of Cu-Ag composite

We investigated the effects of Fe content on microstructure and properties in as-cast and as-drawn Cu-(5.1-x) vol%Ag-x vol%Fe alloys. In microscale, increasing Fe content first refined and then coarsened Cu dendrites. In nanoscale, the size and length of Ag precipitates in Fe-doped alloys were smaller than the size and length of Ag precipitates in Fe-free alloy, and the γ-Fe precipitates in Cu-2.9 vol%Ag-2.4 vol%Fe alloy were finer than the γ-Fe precipitates in Cu-5.1 vol%Fe alloy. The maximum hardness in as-cast Cu-Ag-Fe alloys was found in the Cu-2.9 vol%Ag-2.4 vol%Fe alloy. With increasing drawing strain, both ultimate tensile strength and hardness of Cu-Ag-Fe composites were increased. Simulation data among the relative volume fractions of Fe, hardness and electrical conductivity showed that, as the relative value approached 40%, the Cu-Ag-Fe composite displayed greater hardness than other samples. As a small amount of Ag was replaced by Fe, the electrical conductivity decreased significantly with a descending slope of approximately 3%IACS (International Annealed Copper Standard) per vol% Fe. As 47 vol%Ag was replaced by Fe, however, the electrical conductivity decreased by 51% and remained almost invariable with further increasing Fe content. After annealing at 450 °C for 4 h, the electrical conductivity of the Cu-2.9 vol%Ag-2.4 vol%Fe composite was elevated up to 68.3%IACS from 38.5%IACS.     

粉煤灰/铝-镁合金复合材料的微观组织及摩擦磨损性能

采用粉末冶金法制得粉煤灰/Al-25%Mg复合材料,研究不同粉煤灰含量对复合材料微观组织、硬度和摩擦磨损性能的影响,采用扫描电子显微镜观察复合材料的磨损表面形貌,并对其磨损机制进行探讨。结果表明:随着粉煤灰含量的增加,复合材料的硬度呈现先增大而后减小的趋势;在较低粉煤灰含量和较低载荷下,该复合材料的摩擦因数均低于基体铝合金的,并且随粉煤灰含量的增加复合材料的耐磨性有所提高,复合材料的磨损机制主要为粘着磨损和磨粒磨损;在较高粉煤灰含量和较高载荷下,该复合材料的磨损机制转化为以剥层磨损和磨粒磨损为主。     

Quantitative study on the precipitation behavior of dispersoids in DC-cast AA3003 alloy during heating and homogenization

The precipitation behavior of dispersoids in DC-cast AA3003 billet during heating and homogenization at 600 °C has been studied by means of TEM, electrical conductivity measurement and image analysis. The orientation relationship between the dispersoids and matrix has been determined. The size, size distribution, number density and Mn/Fe ratio of dispersoids, and the area fraction of PFZ have been measured. The evolution of dispersoids during heat treatment is controlled by nucleation, growth, dissolution and coarsening. A method is proposed to measure the volume fraction of dispersoids from TEM images. The volume fraction of dispersoids precipitated during heating measured from TEM images is in good agreement with that calculated from electrical conductivity data.     

镀TiC金刚石/铝复合材料的界面及热膨胀性能

采用气压浸渗法制备高体积分数的镀TiC金刚石/铝复合材料,通过SEM和EDS等手段对复合材料的断口形貌进行分析,并研究TiC镀层对复合材料界面和热膨胀性能的影响。结果表明:TiC镀层改善金刚石颗粒与铝合金基体之间的选择性粘结现象,断裂方式以基体断裂为主。部分TiC会被氧化成TiO2并与铝合金基体反应生成Al2O3,从而实现金刚石颗粒与铝合金基体之间良好的界面结合;TiC镀层有效地降低复合材料的热膨胀系数(CTE),增强复合材料热膨胀性能的稳定性。在体积分数相同的情况下,CTE随金刚石颗粒尺寸的减小而减小。     

Si含量对Si/Al复合材料组织及性能的影响(英文)

采用放电等离子烧结(SPS)技术制备不同Si含量的电子封装用Si/Al复合材料,测试复合材料的性能,包括密度、热导率、热膨胀系数及弯曲强度;进行成分及断口分析,研究Si含量对Si/Al复合材料微观组织及热、力学性能的影响规律。结果表明:Si/Al复合材料由Si、Al组成,Al均匀分布于Si晶粒之间;随着Si含量的降低,Si/Al复合材料的相对密度不断增大,当Si含量为50%(体积分数)时,复合材料的相对密度达到98.0%;复合材料的热导率、热膨胀系数及弯曲强度均随着Si含量的增加而减小,当Si含量为60%(体积分数)时,复合材料具有最佳的热导率、热膨胀系数及强度匹配。     

电子封装用Al/Si/SiC复合材料的显微组织与性能(英文)

采用气压浸渗法制备中体积分数电子封装用 Al/Si/SiC 复合材料。在保证加工性能的前提下,用与 Si 颗粒相同尺寸(13 μm)的 SiC 替代相同体积分数的硅颗粒制得复合材料,并研究其显微组织与性能。结果显示,颗粒分布均匀,未发现明显的孔洞。随着 SiC 的加入,强度和热导率将得到明显提高,但热膨胀系数变化较小,对使用影响也不大。讨论几种用于预测材料热学性能的模型。新的当量有效热导被引入后,H-J 模型将适用于混杂和多颗粒尺寸分布的情况。     

Electrical resistivity of metal matrix composites

Theoretical models for predicting the electrical resistivity of metal matrix composites reinforced with continuous fibers, short fibers, and particulates were developed by integrating thin slices of composite cells. The experimental electrical resistivity of aluminum, copper, and silver matrix composites was measured and compared with theoretical values derived from the models. Experimental resistivity of composites followed the trend of theoretical prediction, increasing with increasing volume fraction and decreasing size of reinforcement. Deformation regions containing residual stresses and dislocations formed around the reinforcement and raised the resistivity of composites. The magnitude of residual stresses and the dislocation density were found to depend on the type, size and shape of reinforcement, as well as the matrix type. The effective size of the deformation regions varied due to their overlapping and better fitted the calculated curves through empirical modification. Theoretical prediction of resistivity that takes into account the effect of residual stresses and dislocations, and the overlapping of deformation regions agreed reasonably well with experimental results.     

Yield strength prediction of rolled Al−(1.44−12.40)Si−0.7Mg alloy sheets under T4 condition

The effects of Si content on the microstructure and yield strength of Al−(1.44−12.40)Si−0.7Mg (wt.%) alloy sheets under the T4 condition were systematically studied via laser scanning confocal microscopy (LSCM), DSC, TEM and tensile tests. The results show that the recrystallization grain of the alloy sheets becomes more refined with an increase in Si content. When the Si content increases from 1.44 to 12.4 wt.%, the grain size of the alloy sheets decreases from approximately 47 to 10 μm. Further, with an increase in Si content, the volume fraction of the GP zones in the matrix increases slightly. Based on the existing model, a yield strength model for alloy sheets was proposed. The predicted results are in good agreement with the actual experimental results and reveal the strengthening mechanisms of the Al−(1.44−12.40)Si−0.7Mg alloy sheets under the T4 condition and how they are influenced by the Si content.     

Tensile flow properties of Al-based matrix composites reinforced with a random planar network of continuous metallic fibres

Squeeze casting was used for processing two new types of composites: pure Al matrix composites reinforced with fibres of Inconel 601, and AS13 (Al–12% Si) matrix composites reinforced with fibres of Inconel 601 or stainless steel 316L. The fibres are continuous with a diameter of 12 μm and their volume fraction in the composites varied from 20 to 80%. The processing conditions were such that no trace of interfacial reaction compound or of matrix precipitate resulting from the dissolution of elements of the fibres could be detected. The quality of the process was attested by Young's modulus and electrical conductivity measurements. Tensile tests were carried out from room temperature up to 300°C. The composites with the pure Al matrix present a remarkable tensile ductility. They thus constitute convenient materials for assessing continuum plasticity models for composites. Properties of composites with the AS13 matrix are much affected by interface adhesion strength.