A high-performance δ-dopedGaAs/InxGa1-xAs pseudomorphic high electronmobility transistor utilizing a graded InxGa1-xAschannel

A δ-doped GaAs/InGaAs/GaAs pseudomorphic high electron mobility transistor (HEMT) utilizing a graded In composition InGaAs channel grown by low-pressure metalorganic chemical vapor deposition was demonstrated. This structure had an extrinsic transconductance as high as 175 (245) mS/mm and a saturation current density a high as 500 (690) mA/mm at 300 (77) K for a gate length of 2 μm. The maximum transconductance versus gate bias extended over a broad and flat region of more than 2 V at 300 K. A low gate leakage current (<10 μA at -7 V) at 300 K was obtained     

High-performance InGaP/InxGa1-xAs HEMT withan inverted delta-doped V-shaped channel structure

This letter reports a new and high-performance InGaP/In_xGa_1-xAs high electron mobility transistor (HEMT) with an inverted delta-doped V-shaped channel. Due to the presence of V-shaped inverted delta-doped InGaP/In_xGa_1-x As structure, good carrier confinement and a flat and wide transconductance operation regime are expected. Experimentally, the fabricated device (1×100 μm²) shows a high gate-to-drain breakdown voltage of 30 V and a high output drain saturation current density of 826 mA/mm at V_GS=2.5 V. The high transconductance expands over a very broad operation range with the maximum value of 201 mS/mm at 300 K. Meanwhile, the studied device exhibits a good microwave frequency linearity     

An anisotype GaAs/InxGa1-xAs heterojunctionfield-effect transistor for digital logic applications

An anisotype heterojunction field-effect transistor (A-HJFET) for GaAs digital integrated circuit applications is proposed. A thin, highly doped, strained In_xGa_1-xAs (x⩽0.2) n-channel is employed for improved transconductance while a p⁺-GaAs cap is used to enhance the dynamic gate voltage range of the device. Prototype devices with 5-μm gate lengths show a maximum transconductance of 80 mS/mm at V_ds=2 V and a forward gate bias voltage of up to +2 V without significant leakage current     

Strained layer InxGa1-xAs/GaAs and InxGa1-xAs/InyGa1-yPmultiple-quantum-well optical modulators grown by gas-source MBE

The first results on low-power p-i-n diode modulator structures using strained multiple quantum wells (MQW's) of InGaAs/InGaP grown by gas-source molecular beam epitaxy (MBE) on GaAs are presented. A comparison of transmission, reflection, and photocurrent spectra for these nonresonant devices with those fabricated from InGaAs/GaAs indicates larger modulation, with a maximum change in reflection of >42% observed at 5-V bias at a wavelength of 0.96 μm     

60-GHz noise performance of ion-implanted InxGa1-xAs MESFET's

The authors report the 60-GHz noise performance of low-noise ion-implanted In_xGa_1-xAs MESFETs with 0.25 μm T-shaped gates and amplifiers using these devices. The device noise figure was 2.8 dB with an associated gain of 5.6 dB at 60 GHz. A hybrid two-state amplifier using these ion-implanted In_xGa_1-x As MESFETs achieved a noise figure of 4.6 dB with an associated gain of 10.1 dB at 60 GHz. When this amplifier was biased at 100% I _dss, it achieved 11.5-dB gain at 60 GHz. These results, achieved using low-cost ion-implantation techniques, are the best reported noise figures for ion-implanted MESFETs     

High-speed InGaP/GaAs HBTs with a strained InxGa1-xAs base

A self-aligned InGaP/GaAs heterojunction bipolar transistor with a compositionally graded In_xGa_1-xAs base has been demonstrated with f_T=83 GHz and f_max=197 GHz. To our knowledge, these results are the highest reported for both parameters in InGaP/GaAs HBT's. The graded base, which improves electron transport through the base, results in a DC current gain and a cutoff frequency which are 100% and 20% higher, respectively, than that achieved by an identical device with a nongraded base. The high f_max results from a heavily doped base, self-aligned base contacts, and a self-aligned collector etch. These results demonstrate the applicability of InGaP/GaAs HBT's in high-speed microwave applications     

Annealing behavior of a proton irradiated AlxGa1-xN/GaN high electron mobility transistor grown by MBE

The influence of proton irradiation (1.8 MeV, 1×10¹⁴ cm^-2) on the properties of an Al_xGa_1-x N/GaN high electron mobility transistor (HEMT) is studied from current-voltage (I-V) and Raman scattering measurements as a function of rapid thermal annealing (RTA) temperature after irradiation. The I-V curves show that the saturation current (I_ds) and the transconductance (g_m) of the HEMT were seriously reduced by the irradiation. However, the dc characteristics of the HEMT could be mostly recovered by RTA at over 800°C     

Wide-band transimpedance amplifiers using AlGaAs/InxGa1-xAs pseudomorphic 2-DEG FET's

Monolithic wide-band amplifiers have been demonstrated using AlGaAs/In_xGa_1-xAs/GaAs pseudomorphic two-dimensional electron-gas field-effect transistors. The amplifiers have yielded an 18.0 GHz bandwidth and a 41.8 dBΩ transimpedance gain with a feedback resistance of 100 Ω. In addition, the dependence of In mole fraction for an In_xGa_1-xAs channel layer on device and amplifier performance has been also investigated. The g_m and the f_T in a device, along with the bandwidth, the gain, and the noise performance in an amplifier, have improved as the In mole fraction is varied from 0 to 0.25     

Dislocation scattering in n-type modulation dopedAl0.3Ga0.7As/InxGa1-xAs/Al0.3Ga0.7As quantum wells

The mobility due to misfit dislocation scattering in n-type modulation doped Al_0.3Ga_0.7As/In_xGa_1-xAs/Al _0.3Ga_0.7As quantum wells is discussed. Initially, the dislocations are modeled as an array of orthogonal charged lines. The scattering potential is introduced, including both the coulombic and piezoelectric components. The expression for the mobility limited by dislocation scattering is established, and the anisotropic characteristics of mobility and its variation with various material and device parameters are presented and discussed     

Observation of the multiple negative-differential-resistance ofmetal-insulator-semiconductor-like structure with step-compositioned InxGa1-xAs quantum wells

An interesting multiple negative-differential-resistance (MNDR) device, based on an AlGaAs-InGaAs-GaAs metal-insulator-semiconductor (MIS)-like structure, has been fabricated and demonstrated. Three and six switching phenomena have been observed at room temperature and -105°C, respectively. The impressive MNDR behaviors are believed to be caused by the sequential accumulation process of carriers at In_x Ga_1-xAs subwells and the successive barrier lowering and potential redistribution effects. These effects yield the step by step enhancement of tunneling through the “insulated” AlGaAs barrier. It is known that, from experimental results, the temperature variation plays an important role on carriers transport and experimental current-voltage (I-V) characteristics     

Design and growth investigations of strainedInxGa1-xAs/InAlAs/InP heterostructures for highelectron mobility transistor application

Strained In_xGa_1-xAs/InAlAs modulation-doped heterostructures on InP have been studied theoretically and experimentally. Simulations based on self-consistently solving the Schrodinger-Poisson equations have been performed to investigate the influeuce of the design parameters, namely the layer thicknesses and the doping level in the barrier layer, on the carrier concentration n, in the channel. Modulation-doped heterostructures with a 100 Å strained indium-rich channel have been grown by molecular beam epitaxy for different indium compositions and growth temperatures. The highest performances in terms of n,×μ parameter, have been obtained for an indium concentration of 75% in the channel, at a growth temperature of 500°C. For higher indium concentration, the mobility drops sharply, which correlates with formation of misfit dislocations in the channel, observed on transmission electron microscopy micrographs of these structures. For an indium concentration of 75%, the mobility has been improved, first, by using a low V/III beam equivalent pressure ratio, that produces a close to stoichiometry material, second by using interface growth interruption under cation stabilization to reduce the interface roughness. HEMT devices have been processed on these heterostructures. The static I-V characteristics of 2×150 μm ² transistors revealed a 66% increase of the transconductance when the channel indium concentration is increased from 53% to 75%     

Fabrication of high-performance AlxGa1-xAs/InyGa1-yAs/GaAs resonant tunneling diodes using amicrowave-compatible technology

A microwave-compatible process for fabricating planar integrated resonant tunneling diodes (RTDs) is described. High-performance RTDs have been fabricated using Al_xGa_1-xAs/In_y Ga_1-yAs/GaAs strained layers. Peak-to-valley current ratios (PVRs) of 4.8:1 with simultaneous peak current densities of 4×10⁴ A/cm² have been achieved at room temperature for diodes of area 9 μm². Accurate measurements of reflection gain versus frequency between 1.5 and 26.5 GHz in the negative differential region indicate that the present technology is promising for millimeter-wave integrated circuits including self-oscillating mixers, frequency multipliers, and detectors     

微微秒Al_xGa_(1-x)As双异质结激光器

用宽度为300微微秒的电脉冲驱动质子轰击条形的Al_xGa_(1-x)As双异质结激光器,产生12微微秒光脉冲。并已经用来检测快速光电二极管的响应速率。     

Short pulse transfer characteristics of AlxGa1-xAs/GaAs andAlxGa1-xAs/InyGa1-yAsmodulation-doped heterojunction FET's

Short-pulse drain current versus gate voltage transfer characteristics measured for modulation-doped HFETs (MODFETs) with four donor-layer-channel-layer combinations-(1) Al_0.3Ga_0.7 As-GaAs, (2) Al_0.2Ga_0.8As-GaAs, (3) Al_0.3Ga_0.7As-In_0.2Ga_0.8As, and (4) Al_0.2Ga_0.8As-In_0.2 a_0.8 As-are compared with the DC transfer characteristics. The measurements are relevant to high-speed switching in HFET circuits. Significant shifts in threshold voltage are observed between the DC and short-pulse characteristics for the structures with n⁺-Al_0.3Ga_0.7As donor layers, while the corresponding shifts for structures with n⁺-Al_0.2Ga_0.8As donor layers are relatively small or virtually nonexistent     

Modeling of short-pulse threshold voltage shifts due to DX centersin AlxGa1-xAs/GaAs and AlxGa1-xAs/InyGa1-yAs MODFET's

The DX-center-related short-pulse threshold voltage shifts (SPTVS) in Al_xGa_1-xAs-based MODFETs is modeled using CBAND, a simulator that solves Poisson equations self-consistently with Schrodinger equations and donor statistics. Using values given in the literature for the DX energy level in Al_xGa_1-xAs this technique gives good agreement between measured and simulated SPTVS for Al_0.3Ga_0.7As/GaAs and Al_0.3Ga_0.7As/In_0.2Ga_0.8As MODFETs. Both simulation and experiment show that the use of Al_0.2 Ga_0.8As in the donor layer reduces the SPTVS relative to the structures using Al_0.3Ga_0.7As. However, the measured shifts at this composition are considerably lower than the simulated values, indicating a DX energy level that may be higher than the value extrapolated from the literature, possibly due to the existence of multiple trap levels. Despite this discrepancy, these results support the use of strained-channel layers and lower Al_x Ga_1-xAs compositions in MODFETs for digital and other large-signal applications requiring good threshold stability     

High-quality two-dimensional electron gas inAlxGa1-xAs/GaAs heterostructures by LP-OMVPE

A combination of high mobility and high sheet carrier density in Al_xGa_1-xAs/GaAs two-dimensional electron gas (2DEG) elements was obtained by low-pressure organometallic vapor phase epitaxy (OMVPE). The sheet charge densities (n_s) and mobilities (μ) at 77 K are 1.2×10¹²/cm² and 90000 cm²/V-s for single-channel, and 2.0× 10¹²/cm² and 64500 cm²/V-s for double-channel elements, respectively. Strong correlations between the photoluminescence spectrum of the Al_xGa_1-xAs layers and the 2DEG mobility were found. The 2DEG elements were used as mixers and detectors at millimeter wavelengths. Mixing at 94 GHz with a 1.7-GHz IF bandwidth and detection of signals as high as 238 GHz under a magnetic field were achieved with these devices     

InxGa1-xAs-AlyGa1-yAs-GaAs strained-layer quantum-well heterostructure circular ringlasers

The growth, processing, and optical characterization of a single Y-junction In_xGa_1-xAs-Al_yGa_1-y As-GaAs strained-layer quantum-well heterostructure circular ring laser (6 μm width, 11~251 μm outer radius) are described. The circular ring lasers have been grown by metalorganic chemical vapor deposition, etched by SiCl₄ reactive ion etching, and planarized by polyimide. The dependences of laser threshold current density and peak emission wavelength (950~1015 nm) on outer radius are presented. The emission spectra show that the circular ring lasers lase mainly in high-order whispering gallery modes, with smaller outer radius ring lasers operating in low-order whispering gallery modes     

High peak-to-valley current ratioIn0.22Ga0.78As/AlAs RTDs on GaAs using relaxed InxGa1-x buffers

The authors have grown In_0.22Ga_0.78As/AlAs resonant tunnelling diodes (RTDs) on relaxed In_xGa_1-x As buffers on GaAs substrates, which show the largest peak-to-valley current ratio (PVCR), 13:1, ever reported for GaAs-based RTDs. X-ray diffraction and photoluminescence (PL) studies confirm the composition and relaxation of the buffers. The intrinsic device performance is excellent despite the presence of some dislocations in the active layers. However, it appears that the relaxed buffers do add series resistance to the intrinsic device     

衬底温度和生长速率对MBE自组织生长InxGa1-xAs/GaAs QD的影响

研究GaAs基In