MOSFET1/f噪声相似性的子波鉴别方法

基于傅里叶分析的功率谱密度只能反映1/f噪声的整体频率特性,子波变换模极大值能够反映1/f噪声的奇异性和非规整性,而后者才是1/f噪声最本质的特征所在.本文将这一特性用于MOSFET 1/f噪声的相似性分析.从子波变换模极大值匹配原理出发,定义了一个1/f噪声的相似系数,利用它对不同形成机制、不同微观缺陷状态、不同偏置应力作用下的MOSFET 1/f噪声进行了相似性分析,发现它可作为鉴别1/f噪声的物理起源,分析1/f噪声的微观动力学机制,筛选有潜在缺陷或损伤的MOS器件的有效手段.     

一种新的晶圆级1/f噪声测量方法

引言 MOSFET在模拟和射频电路中得到了广泛的应用.但是,MOSFET中的低频噪声,尤其是较高频率的1/f噪声,是模拟和射频电路应用中人们关注的重要因素.此外,随着器件特征尺寸的缩小,1/f噪声会大大增加[参考文献].因此,在测量1/f噪声时设计一套可靠的、重复性好的、精确的测量方法和系统是非常必要的.     

近室温3～5μm 碲镉汞光导探测器噪声频谱的测试

光导探测器的噪声包括:热噪声、产生复合噪声和1/f噪声。其中热噪声和产生复合噪声取决于制备器件所用材料本身的一些基本参数(如:φ_v,τ,n_o等)。而影响1/f噪声的因素较多,诸如制备探测器时的表面工艺,材料参数,以及电极的结构形式等等,在一定的频率范围内(低频),1/f噪声与频率的倒数成正比。因而在使用器件时,选择合适的工作频率,尽量避开1/f噪声的影响,使器件尽可能地工作在产生复合噪声范围,这样     

MOSFET表面1/f噪声的研究

本文从表面载流子数涨落机构出发,对MOSFET的1/f噪声性质作了较全面的理论和实验研究。将MOSFET的表面1/f噪声理论推广到了所有的偏置区,包括沟道均匀区,线性区和饱和区。对MOSFET的等效输入噪声电压的频率特性、偏置特性和几何特性等进行了实验测试,结果表明与理论规律符合良好。     

MOSFET 1/f噪声的相关积分分析方法

文章将相关积分方法用于MOSFET 1/f噪声分析,发现器件的1/f噪声与RTS叠加模型产生的1/f噪声相关积分极其相似.通过对MOSFET噪声物理模型的分析和讨论,证明n-MOSFET的1/f噪声以载流子数涨落模型为主,p-MOSFET的1/f噪声以迁移率涨落模型为主结论的正确性.研究表明,相关积分方法可用于鉴别电子器件测量噪声所属的模型类型.     

一种深亚微米MOSFET高频噪声模型

基于深亚微米MOSFET的短沟道效应(迁移率退化、热载流子效应、体电荷效应、沟道长度调制效应等),提出了一种高频沟道噪声分析模型.该分析模型不仅具有较高的精确性,而且只包括MOSFET的工艺参数和电学参数,不含有微积分和拟合参数,较大地提高了MOSFET高频噪声模型的易用性.根据MOSFET的高频等效电路,得出了MOSFET的噪声系数模型.实验结果证明,提出的深亚微米MOSFET高频噪声模型的仿真结果与测试结果的平均误差不到0.4 dB,并与其他高频沟道噪声分析模型进行了比较.     

MOSFET抗辐照能力预测方法

基于金属-氧化物-半导体场效应晶体管(MOSFET)噪声的载流子数涨落和迁移率涨落理论,建立起MOSFET抗辐照能力预测模型.利用该模型,可较好地通过辐照前的1/f噪声参量,预测辐照后分别由氧化层陷阱和界面陷阱诱使阈值电压漂移的情况.模型模拟结果与实际测量结果符合良好,验证了预测模型的正确性,并为工程应用提供MOSFET抗辐照能力预测方法.     

MOSFET抗辐照能力预测方法

基于金属-氧化物-半导体场效应晶体管(MOSFET)噪声的载流子数涨落和迁移率涨落理论,建立起MOSFET抗辐照能力预测模型.利用该模型,可较好地通过辐照前的1/f噪声参量,预测辐照后分别由氧化层陷阱和界面陷阱诱使阈值电压漂移的情况.模型模拟结果与实际测量结果符合良好,验证了预测模型的正确性,并为工程应用提供MOSFET抗辐照能力预测方法.     

55 nm SONOS闪存单元的1/f噪声特性研究

基于55 nm ULP CMOS工艺来制备SONOS闪存单元,并通过1/f噪声测试等方式对测试单元的器件特性进行表征。基于1/f噪声表征和转移特性,分析了编程态和擦除态下SONOS闪存单元内部缺陷水平的变化规律与机制。针对1/f噪声与亚阈值特性的缺陷水平出现矛盾的现象,引入NBTI中的双阶段模型进行阐述,进一步分析1/f噪声测试环节对SONOS器件的影响。     

多晶硅导电材料的1/f噪声模型研究

在多晶硅导电材料的1/f噪声迁移率涨落、载流子数涨落机制和模型的基础上,修正了基于迁移率涨落机制的噪声模型。通过分析材料中载流子输运的实际物理过程,论证了产生1/f噪声的两种机制同时存在于多晶硅材料中,提出建立多晶硅导电材料1/f噪声双机制不同掺杂浓度统一模型的思路。     

一种敏感的MOSFET ESD潜在损伤检测方法

MOSFET ESD潜在损伤的有效检测一直是一个难以解决的问题.实验对比发现,MOSFET沟道电流的1/f噪声比传统的电参数更能敏感地反映栅氧化层中ESD潜在损伤的情况.在相同的静电应力条件下,1/f噪声的变化要比常规电参数敏感的多,其功率谱幅度的相对变化量比跨导的最大相对退化量大6倍以上,因此可以作为 MOSFET ESD潜在损伤的一种敏感的检测方法.在给出实验结果的同时,对这一敏感性的机理进行了较深入的分析.     

Statistical BSIM model for MOSFET 1/f noise

A statistical model for MOSFET 1/f noise implemented as an extension to BSIM and integrated into a process design kit is presented. Excellent model to hardware correlation is shown on measured noise statistics from over 200 devices. The statistical model enables circuit designers to run Monte Carlo and corner noise simulations, and captures the device area and bias dependence of noise variance.     

1/f noise model of fully overlapped lightly doped drain MOSFET

This paper presents an analytical 1/f noise model of fully overlapped lightly doped drain MOSFET incorporating the voltage drop in the n^- region due to the parasitic resistance. The FOLD structure has lesser noise effect than LDD MOSFET and the predicted results are verified with experimental data     

Impact of post-oxidation annealing on low-frequency noise, threshold voltage, and subthreshold swing of p-channel MOSFETs

The impact of post-oxidation annealing on the low-frequency noise, threshold voltage, and subthreshold swing of p-channel MOSFET is reported. The low-frequency noise is improved significantly with post-oxidation annealing and a modest V/sub T/ and S reduction is observed. Oxide traps are primarily extracted from measured noise. They are also extracted from threshold voltage and subthreshold slope shift. The contribution of oxide traps to threshold voltage shift and 1/f noise is analyzed through quantitative approach in the light of correlated fluctuation theory. Analysis on experimental results shed light on the well-known controversy about the origin of low-frequency noise, suggesting that experimental results are in agreement with mobility fluctuation theory whereas correlated number fluctuation theory explains the result assuming only a fraction of total oxide charge at a given energy level participates in the generation of low-frequency noise.     

Low-frequency noise in near-fully-depleted TFSOI MOSFETs

Low-frequency (1/f) noise in near-fully-depleted Thin-Film Silicon-On-Insulator (TFSOI) CMOS transistors designed for sub-l-V applications is investigated in the subthreshold region, linear region, and saturation region of operation for the first time. The noise in these surface-channel devices is composed of a bias invariant 1/f component and a bias dependent generation-recombination (G/R) component that becomes enhanced in the subthreshold region of operation for both n- and p-channel MOSFETs. Results presented in this letter are consistent with the noise being dominated by a number fluctuation model. These results demonstrate that the bias independent 1/f noise spectrum of the n-channel TFSOI MOSFET is comparable to the 1/f noise level found in conventional bulk silicon submicron CMOS fabrication processes     

Criteria for setting the width of CCD front end transistor to reachminimum pixel noise

The paper gives the criteria to calculate the width of the front end transistor integrated next to the charge sensing electrode of CCDs or, in general, of semiconductor detectors, in order to reach the minimum noise in the readout of the signal charge. It accounts for white, series and parallel, and 1/f noise contributions. In addition, it points out two different design criteria depending whether a JFET or a MOSFET is used. The attention given to the JFET is due to a lower 1/f noise component, which makes these transistors more appealing as input devices in very high resolution detectors. The paper shows that there is a characteristic width of the FET gate that practically does not depend on the noise sources but depends only on the capacitance seen by the charge sensing electrode of the detector, making possible the optimum design of the transistor prior to knowledge of the real values of the spectral density of the noise sources, which are usually precisely known only at the end of the fabrication process. The paper shows that the pixel noise raises sharply as the transistor gate width departs from its optimum value     

DC应力n-MOSFET热载流子退化的1/f噪声特性

研究了DC应力n.MOSFET热载流子退化的Sfγ噪声参量.提出了用噪声参数和Sfγ表征高、中、低三种栅应力下n-MOSFET抗热载流子损伤能力的方法.进行了高、中、低三种栅压DC应力下热载流子退化实验.实验结果和本文模型符合较好.     

Time-Domain Modeling of Low-Frequency Noise in Deep-Submicrometer MOSFET

$1/f$ noise and random telegraph signal (RTS) noise are increasingly dominant sources of low-frequency noise as the MOSFET enters the nanoscale regime. In this study, $1/f$ noise and RTS noise in the n-channel MOSFET are modelled in the time domain for efficient implementation in transient circuit simulation. A technique based on sum-of-sinusoids models $1/f$ noise while a Monte Carlo based technique is used to generate RTS noise. Low-frequency noise generated using these models exhibits the correct form of noise characteristics as predicted by theory, with noise parameters from standard 0.35-$mu$m and 35-nm CMOS technology. Implementation of the time-domain model in SPICE shows the utility of the noisy MOSFET model in simulating the effect of low-frequency noise on the operation of deep-submicrometer analog integrated circuits.      

RF and 1/f noise investigations on MESFETs and circuitstransplanted by epitaxial lift off

In this paper, we present the results of RF and noise measurements of MESFETs transplanted by epitaxial lift off (ELO). ELO is a technology by which epitaxially grown layers are lifted off from their growth substrate and subsequently reattached to a new host substrate. In the experiments described here a 800 mm thick GaAs film containing MESFETs or complete microwave circuits is transplanted onto semi-insulating InP. Gate leakage current, RF characteristics, and noise performance of MESFETs and GaAs circuits are compared before and after ELO. Special attention was given to low-frequency (1/f) noise, 1/f noise is believed to be caused by surface as well as bulk effects. An increase in 1/f noise could have been predicted since a new surface is exposed during the transplantation process. The mechanical stress during the transplantation could cause crystal damage creating additional traps which could also result in an increase in 1/f noise