低Al组分In1-xAlxSb薄膜的MBE生长和优化

采用分子束外延的方法进行了低Al组分In1-xAlxSb薄膜的生长和优化。通过在InSb(100)衬底上外延生长一系列不同条件的In1-xAlxSb薄膜,分析总结了衬底的热脱氧特征以及InAlSb薄膜低Al组分(2%左右)的控制,探讨了退火和InSb缓冲层的优化等参数对In1-xAlxSb外延薄膜表面形貌和质量的影响。测试结果表明薄膜质量得到极大改进。     

GSMBE生长SiGe/Si材料的原位掺杂控制技术

在特定温控下对掺杂气体分子的状态和活性进行控制 ,建立了一套具有自主知识产权的气源分子束外延工艺生长 Si Ge/Si材料的原位掺杂控制技术。采用该技术生长的 Si Ge/Si HBT外延材料 ,可将硼杂质较好地限制在 Si Ge合金基区内 ,并能有效地提高磷烷对 N型掺杂的浓度和外延硅层的生长速率 ,获得了理想 N、P型杂质分布的 Si Ge/Si HBT外延材料     

固态源分子束外延生长碳掺杂InGaAs材料研究

采用固态源分子束外延系统(SSMBE),以四溴化碳(CBr4)作为碳掺杂源,系统研究了半绝缘InP衬底上碳掺杂InGaAs材料的外延工艺.为得到高质量高浓度P型掺杂InGaAs材料,分别对外延过程中的脱膜工艺、P/As切换工艺以及生长温度等关键参数进行研究.通过扫描透射电子显微镜(STEM)测量衬底表面氧化膜厚度,量化...     

Te掺杂的GaSb材料载流子特性研究

非故意掺杂的GaSb材料呈现p型导电,限制了GaSb材料在InAs/GaSb超晶格红外探测器等领域的应用。探究N型GaSb薄膜电学特性对估算超晶格载流子浓度以及制备超晶格衬底、缓冲层、电极接触层等提供了一定的理论依据。Te掺杂能够以抑制GaSb本征缺陷的方式实现N型GaSb薄膜的制备,利用分子束外延(Molecular Beam Epitaxy,MBE)技术,设置GaTe源温分别为420℃、450℃、480℃,分别在GaSb衬底与GaAs衬底上生长不同GaTe源温度下掺杂的GaSb薄膜,通过霍尔测试探究GaSb薄膜的电学特性。在77 K的霍尔测试中,发现在GaAs衬底上生长的GaSb薄膜均显示为N型半导体,载流子浓度随源温升高而增加。与非故意掺杂的GaSb相比,源温为420℃、450℃时由于载流子浓度增加而导致的杂质散射,迁移率大幅提高,且随温度升高而增加,但在480℃时,由于缺陷密度减小,迁移率大大减小。在GaSb衬底上生长7000  Be掺杂的GaSb缓冲层,再生长5000  Te掺杂的GaSb薄膜。结果发现,由于P型缓冲层的存在,当源温为420℃时,薄膜显示为P型半导体,空穴载流子的存在导致薄膜整体载流子浓度增加,且空穴和电子的补偿作用使迁移率大幅降低。源温为450℃、480℃时,薄膜仍为N型半导体,载流子浓度随温度增加,且为GaAs衬底上生长的GaSb薄膜载流子浓度的2～3倍;迁移率在450℃时最高,480℃时减小。设置GaTe源温为450℃时GaSb薄膜的载流子浓度较高且迁移率较高,参与超晶格材料的制备能够使整个材料的效果最佳。     

MBE生长的InSb和InASxSb1—x的载流子浓度剖面分布

在(111)InSb 和(100)GaAs 衬底上,用分子束外延技术生长了 InSb 和 InAs_xSb_(1-x)外延层。用自动电化学 C—V 法测量了外延层的载流子浓度剖面分布。结果表明:(1)外延层呈 P 型;(2)InSb/GaAs 异质外延层的载流子浓度为(1～2)×10~(16)cm~(-3),比相应的同质外延层 InSb/InSb 的(1～2)×10~(17)cm~(-3)小一个数量级;(3)生长层的载流子浓度剖面分布和质量取决于衬底表面的制备。讨论了有关问题。     

分子束外延中的掺硼工艺

我们在硅分子束外延中利用共蒸发B_2O_3的方法在硅中进行硼掺杂,掺杂浓度可控制在4×10~(17)cm~(-3)至4.2×10~(19)cm~(-3)之间,这说明不需要利用离子注入或高温掺杂炉,也可以在硅外延层中实现有效的P型硼掺杂.我们还对掺杂外延层的质量进行了初步分析:外延层剖面均匀、没有明显的偏析现象;当硅源速率在 2A/s时,外延层中氧含量与衬底相同.     

采用改进型钝化层的红外光电二极管及传感器列阵

美国专利US7544532 (2009年6月9日授权)本发明提供采用改进型钝化层的InSb红外光电二极管及传感器列阵,同时还提供了其制作方法。该方法的具体步骤如下:在n型衬底中形成光电二极管探测器区之前,用分子束外延技术在n型InSb衬底上沉积一层AlInSb钝化层;直接通过该AlInSb钝化层注入一种合适的P~+掺杂剂,以形成光电二极管探测器区;有选择地去除AlInSb钝化层,使InSb衬底的第一区暴露出来,然后在InSb衬底第一区形成栅接点;在光电二极管     

InSb缓冲层的波纹结构及其对InSb/GaAs外延薄膜电学性能的影响

采用分子束外延方法在GaAs(001)衬底上生长了InSb外延薄膜,其中采用"二步法"制备了不同厚度的低温InSb缓冲层结构.利用Mullins扩散模型对缓冲层的生长过程进行了具体演化.结合扩散模型的计算结果,通过原子力显微镜以及透射电子显微镜研究了InSb缓冲层表面的波纹结构对后续InSb薄膜生长的影响规律.研究表明,适"-3的缓冲层厚度有利于InSb薄膜的外延生长,缓冲层厚度超过60nm后,InSb薄膜表面的粗糙度明显增加,引入了大量位错导致外延薄膜的电性能下降,采用"二步法"生长30-50nm厚的InSb缓冲层比较合适.     

用分子束外延法在CdTe上生长InSb膜

研究了用分子束外延在(001)取向CdTe衬底上异质外延生长InSb。用双晶x-射线衍射法和俄歇电子光谱法证明在225-275℃的生长温度下InSb单晶层几乎可以互相密合地生长在衬底上而没有界面反应。     

高Al组分In1-xAlx Sb/InSb的MBE生长研究

高Al(10%~15%)组分的In1-xAlx Sb层可作为势垒层以抑制隧穿暗电流、提高器件工作温度而显得很重要。采用分子束外延的方法对InSb(100)衬底高Al组分的In1-xAlx Sb/InSb外延生长进行了实验探索,确定出了Al组分(约12.5%)并讨论了Al组分梯度递变的In1-xAlx Sb缓冲层和生长温度对外延薄膜质量的影响。     

Fundamental materials studies of undoped, In-doped, and As-doped Hg1−xCdxTe

Variable magnetic-field Hall and transient photoconductance-lifetime measurements were performed on a series of undoped, In-doped, and As-doped HgCdTe samples grown by molecular beam epitaxy (MBE). Use of quantitative mobility-spectrum analysis (QMSA) combined with multiple carrier-fitting (MCF) techniques indicates that the majority of samples contain an interfacial n-type layer that significantly influences the interpretation of the electrical measurements. This n-type layer completely masks the high-quality electrical properties of undoped or low n-type In-doped HgCdTe, as well as complicating the interpretation of activation in As-doped p-type HgCdTe. Introduction of an intentional n-type background, typically created through doping with In to “recover” high mobility, is actually shown to increase the “bulk” layer conductivity to a level comparable to the interface layer conductivity. Photoconductance-lifetime measurements suggest that In-doping may introduce Shockley-Read-Hall (SRH) recombination centers. Variable-field Hall analysis is shown to be essential for characterizing p-type material. Photoconductance-lifetime measurements suggest that trapping states may be introduced during the incorporation and activation of As. Two distinctly different types of temperature dependencies were observed for the lifetimes of As-doped samples.     

Low-temperature activation of As in Hg<Subscript>1−x</Subscript>Cd<Subscript>x</Subscript>Te(211) grown on Si by molecular beam epitaxy

The HgCdTe infrared detectors and test structures based on dual or multicolor HgCdTe are desirable for various applications. It is important to control both p-and n-type extrinsic doping in these photovoltaic structures. This paper addresses the issue of activating arsenic as a p-type dopant at temperatures sufficiently low that they will not compromise the integrity of p-n junctions. Midwavelength infrared (MWIR) HgCdTe epilayers were grown by molecular beam epitaxy (MBE) using an In-free type of mounting. The doping was performed by coevaporating arsenic from an elemental solid source during the growth. During postgrowth treatments, we employed a two-step annealing process. During both steps, we used temperatures (300°C, 275°C, and 250°C) that are well below the current standard annealing temperatures. The results suggest that the energy barrier for As transfer from Hg to Te sites can be overcome at 250°C; hence, p doping can be achieved at the temperature of 250°C. The temperature-dependent Hall effect characteristics of the grown samples were measured by the van der Pauw technique with magnetic fields up to 0.4 T.     

Precipitation of arsenic in doped GaAs

Precipitation processes in the p-type, n-type, and intrinsic GaAs layers grown by molecular beam epitaxy at a low temperature were studied by transmission electron microscopy. The average spacing, average diameter, and volume fraction of precipitates were measured as a function of the annealing time for the annealing temperature of 700°C. Volume fractions of precipitates are nearly constant in each layer over the period of annealing, implying that the precipitation process has reached the coarsening stage in the annealing times used in the study. The volume fraction of precipitates in the n-type layer is about a half of those in the p-type and intrinsic layers, suggesting that the incorporation rate of excess As into the n-type layer during the growth is lower than those into the p-type and intrinsic layers. Despite a large difference of amounts of excess As in as-grown n-type, p-type, and intrinsic layers, the average spacings and, hence, number densities of precipitates in three layers are nearly identical for each of the annealing conditions.     

抑制In元素在CdTe中的退火扩散

分子束外延HgCdTe/InSb 材料需要阻止 In 元素在 HgCdTe 中的不受控扩散。我们使用 CdTe缓冲层作为阻挡层,以期控制 In 的扩散。为研究 In 元素在 CdTe 材料中的扩散,我们使用分子束外延方法获得CdTe/InSb样品。考虑到在退火时In 元素可能通过环境扩散污染材料,我们使用 SiO2 作为钝化层,通过对比试验发现 In 元素通过环境扩散污染表面的证据,为控制 In 元素的扩散提供新的思路。     

InAs-based p-n homojunction diodes: Doping effects and impact of doping on device parameters

InAs heterojunction bipolar transistors (HBTs) are promising candidates for low power and high frequency (THz) device applications due to their small bandgap, high electron mobility, and high saturation drift velocity. However, doping limits such as the trade-off between desired low intentional n-type concentrations and unintentional doping, and the realization of high p-type concentrations, must still be considered in device design and synthesis. In order to observe the impact of intentional and unintentional n-type doping on diode electrical properties, InAs-based homojunction diodes have been grown on InAs substrates by solid-source molecular beam epitaxy (SSMBE) and were subsequently fabricated and characterized.     

Accurate measurement of composition, carrier concentration, and photoconductive lifetime in Hg1−xCdxTe grown by molecular beam epitaxy

Variable magnetic field Hall and transient photoconductance lifetime measurements were performed on a series of undoped, In-doped, and As-doped HgCdTe samples grown by molecular beam epitaxy and metalorganic chemical vapor deposition. Temperature variation and, in the case of Hall, magnetic-field variation are needed to give a more complete picture of the mechanisms that control lifetimes in HgCdTe samples. Recent predictions of recombination lifetimes from full band structure calculations were compared to experimental lifetimes at various doping levels at long-wave infrared (LWIR) and mid-wave infrared (MWIR) compositions. For n-type material, lifetimes from low doping levels fall well below the predictions, implying that Shockley-Read-Hall (SRH) recombination is still dominant. MWIR samples have a lifetime that increases somewhat with carrier concentration, suggesting that In doping passivates the SRH defects for that composition. Lifetimes in p-type MWIR material appear to be well-explained by recent theoretical calculations. In p-type material, trapping states may be introduced during the incorporation and activation of As, since some samples with unusually long lifetimes had a distinctly different type of temperature dependence.     

1.3-μm InAsP modulation-doped MQW lasers

The effect of both n-type and p-type modulation doping on multiple-quantum-well (MQW) laser performances was studied using gas-source molecular beam epitaxy (MBE) with the object of the further improvement of long-wavelength strained MQW lasers. The obtained threshold current density was as low as 250 A/cm² for 1200-μm-long devices in n-type modulation-doped MQW (MD-MQW) lasers. A very low CW threshold current of 0.9 mA was obtained in 1.3-μm InAsP n-type MD-MQW lasers at room temperature, which is the lowest ever reported for long-wavelength lasers using n-type modulation doping, and the lowest value for lasers grown by all kinds of MBE in the long-wavelength region. Both a reduction of the threshold current and the carrier lifetime in n-type MD MQW lasers caused the reduction of the turn-on delay time by about 30%. The 1.3-μm InAsP strained MQW lasers using n-type modulation doping with very low power consumption and small turn-on delay time are very attractive for laser array applications in high-density parallel optical interconnection systems. On the other hand, the differential gain was confirmed to increase by a factor of 1.34 for p-type MD MQW lasers (N_A=5×10¹⁸ cm ^-3) as compared with undoped MQW lasers, and the turn-on delay time was reduced by about 20% as compared with undoped MQW lasers. These results indicate that p-type modulation doping is suitable for high-speed lasers     

Field-enhanced tunneling and barrier lowering in Al—n+GaAs—nGaAs Schottky contacts grown by MBE

A thin, highly Si-doped (n-type) interfacial layer is used for controlled barrier lowering in n-type GaAs. The thickness and the doping density of the interfacial n+ layer in the range of 50-100 Å, are extracted from the measured electrical characteristics of Schottky contacts. A model for field-enhanced tunneling current in metal--nGaAs Schottky structures is presented and the experimental results for Al-n+ GaAs devices fabricated using molecular beam epitaxy (MBE) show good agreement.     

Gallium nitride materials - progress, status, and potential roadblocks

Metal-organic vapor phase epitaxy (MOVPE) and molecular beam epitaxy (MBE) are the principal techniques for the growth and n-type (Si) and p-type (Mg) doping of III-nitride thin films on sapphire and silicon carbide substrates as well as previously grown GaN films. Lateral and pendeoepitaxy via MOVPE reduce significantly the dislocation density and residual strain in GaN and AlGaN films. However tilt and coalescence boundaries are produced in the laterally growing material. Very high electron mobilities in the nitrides have been realized in radio-frequency plasma-assisted MBE GaN films and in two-dimensional electron gases in the AlGaN/GaN system grown on MOVPE-derived GaN substrates at the crossover from the intermediate growth regime to the droplet regime. State-of-the-art Mg doping profiles and transport properties have been achieved in MBE-derived p-type GaN. The Mg-memory effect, and heterogeneous growth, substrate uniformity, and flux control are significant challenges for MOVPE and MBE, respectively. Photoluminescence (PL) of MOVPE-derived unintentionally doped (UID) heteroepitaxial GaN films show sharp lines near 3.478 eV due to recombination processes associated with the annihilation of free-excitons (FEs) and excitons bound to a neutral shallow donor (D/spl deg/X).     

Influence of arsenic incorporation on surface morphology and Si doping in GaAs(110) homoepitaxy

We have studied the relationship between the arsenic incorporation kinetics and the surface morphology and Si doping behaviour in GaAs(110) films grown by molecular beam epitaxy (MBE). The homoepitaxial growth of GaAs(110) requires low substrate temperatures and high As/Ga flux ratios to obtain films with good surface morphology, and under these conditions Si doped layers exhibit n-type behaviour. At higher growth temperatures and lower As/Ga flux ratios, the epitaxial films are highly faceted and the Si doped layers are p-type. We show that this growth related site switching behaviour and variation in surface morphology is due to a decrease in the As coverage arising from a small and temperature dependent incorporation coefficient of arsenic on this surface.