Cu-2.8Ni-0.7Si-0.15Mg合金的时效性能

对不同变形量的Cu-Ni-Si-Mg合金进行时效处理,研究了变形量、时效温度及时效时间对合金性能的影响。结果表明,时效前的预冷变形能够促进合金在时效过程中第二相的析出,从而提高合金的显微硬度和导电率。当合金经60%的冷变形,在450℃时效1 h,能获得较高的显微硬度与导电率,分别达到242 HV0.2和35.5%IACS。同时建立了该合金在450℃下,关于时效时间的相变动力学方程和导电率方程。     

热轧态Cu-Ni-Si-Mg合金的时效动力学

对经过连铸连轧处理的Cu-Ni-Si-Mg合金进行时效,研究了时效温度和时效时间对该合金组织和性能的影响,并对该合金在不同温度下的时效动力学进行了分析。结果表明:合金在450℃时效2 h时能够获得较好的综合性能,其显微硬度和导电率分别为230 HV和35%IACS;通过对合金在时效过程中导电率的变化规律的分析,推导出合金在不同温度下时效的相变动力学方程和导电率方程,在此基础上做出了动力学"S"曲线和导电率方程曲线,该导电率方程与试验值吻合。     

时效对Cu-Fe-P合金显微硬度及导电率的影响

研究了热处理工艺对Cu-Fe-P合金显微硬度及导电率的影响。结果表明，采用常规时效处理工艺其导电率很难达到性能要求，而对冷变形后的合金予以分级时效则可以满足要求，其中导电率可达66．1％IACS,硬度可达119HV。     

双级时效制度对6156铝合金组织和性能的影响

采用拉伸力学性能测试、电导率测定、晶间腐蚀实验及透射电镜分析等手段研究双级时效处理条件下6156铝合金的力学性能、电导率、晶间腐蚀和显微组织结构,采用正交实验优化双级时效工艺。结果表明:在本研究范围内,6156铝合金双级时效的四因素中第一级时效制度对合金的力学性能和电导率影响不大,第二级时效温度和时间是影响合金最终性能的主要因素。对于6156铝合金,最佳双级时效工艺为(175℃,6 h)+(210℃,5 h),相对于T6态,合金强度稍有降低,电导率上升,腐蚀类型也由晶间腐蚀转变为点蚀,腐蚀深度明显变浅。电镜观察结果表明:双级时效处理后,晶内析出大量的Q′相,晶界析出相球化且析出相之间的间距增大,呈断续分布,无沉淀析出带(PFZ)变宽,这种微观结构能有效提高6156合金的电导率和腐蚀性能,同时使合金具有较高的强度。     

热处理工艺对ITER级CuCrZr合金性能的影响

研究了同溶温度、时效温度和时间对ITER级Cu-0.8Cr-0.1Zr合金强化规律的影响和不同工艺下的金相组织,分析了合金导电率随时效温度的变化规律.结果表明:Cu-0.8Cr-0.1Zr合金硬度均随同溶温度、时效温度和时间的增加而呈现出峰值.在950℃同溶、480℃时效3 h后获得最佳硬化效果,硬度值为138 HV0.2.合金经同溶处理后的相对导电率仅为34%IACS,随时效温度的升高,导电率增加,480℃时效处理3 h,导电率达最大值74%IACS.     

Al-Er-Cu合金架空导线的导电性能

通过导电率、硬度测试方法研究了Al-Er-Cu合金在等时时效与等温时效过程中的性能变化规律,利用透射电镜(TEM)、能谱分析(EDS)观察了合金析出相的析出及生长规律。结果表明:随着时效温度升高,整体上同一合金的导电率与硬度峰值出现时间均提前;300 ℃时效时,Al-Er-0.22Cu合金已经析出大量纳米级弥散相,析出强化了合金强度,提高了导电率,时效2 h时达到导电率峰值60.15%IACS,10 h达到硬度峰值43.1 HV0.05,Al-Er-0.22Cu合金在拥有高导电率的同时保持了较好的硬度。     

冷轧Cu-Cr-Zr-Co-Si合金的时效行为

通过测量Cu-Cr-Zr-Co-Si冷轧合金在等温时效过程中导电率的动态变化,基于合金导电性能与析出相转化率间的近似线性关系,建立了不同冷变形量下合金时效析出过程的动力学Avrami方程及曲线,在此基础上分析了再结晶与时效析出的相互影响。结果表明:Cu-Cr-Zr-Co-Si合金形变时效过程中,随变形量和时效时间的增加,导电率及析出相转化率均增加,这是时效过程中再结晶与时效析出相互影响、共同作用的结果。随冷变形量增加,强化相析出进程明显加快,但时效析出没有明显阻止或延缓再结晶软化过程的发生,因此大冷变形+短时时效使合金获得更高的硬度峰值,但无法同时获得最优的导电性能。只有在时效析出提前于再结晶启动,且形成的第二相对再结晶存在明显阻碍的前提下,采用冷变形+时效工艺,时效强化型铜合金才能达到最佳效果。     

Cu-Cr合金强化机制研究及其对导电性能的影响

采用真空铸造-固溶处理-冷轧-时效处理工艺制备了Cu-0．8％Cr合金。利用金相显微镜、透射电镜、选取电子衍射、硬度和电导率测试等手段考察了合金在不同处理状态下的组织和性能，定量分析了不同强化方式对合金硬度及导电性能的影响。结果表明：与固溶强化相比，析出强化方法更能有效强化合金，对导电性能影响也更小；形变强化能显著提高合金硬度，但对导电性能几乎无影响；大预变形、短时时效是合金获得较高综合性能的有效手段。     

热处理工艺对6063铝合金强度和导电率的影响

研究了热处理工艺参数(如时效温度、时间等)对6063铝合金的强度和导电率的影响。结果表明，低温长时间和高温短时间都可以提高强度，而随着时效温度的提高和时效时间的延长，6063铝合金的导电率呈上升趋势。     

Age hardening characteristics of Cu-Ag-Zr alloy

Cu-Ag-Zr alloy is a newly developed copper alloy material which has an excellent combination of high mechanical strength and high electrical conductivity. By means of vacuum induction melting, Cu-Ag-Zr alloy was produced. The effects of aging processes on the microhardness and electrical conductivity characteristics of Cu-Ag-Zr alloy were studied. After aging at 450 °C for 4h, the alloy showed an excellent combination of microhardness and electrical conductivity: the microhardness and electrical conductivity reach 126 HV and 84%IACS, respectively. The precipitates responsible for the age-hardening effect are the fine and dispersed Cu₅Zr, which has a face center cubic structure. Cu₅Zr precipitates are fully coherent with the Cu matrix and give the Cu-Ag-Zr alloy higher microhardness and higher electrical conductivity.     

固溶时效工艺对Cu-Ni-Co-Si合金组织和性能的影响

通过硬度和导电率的测量、光学显微镜和透射电镜(TEM),研究了固溶时效工艺对Cu-Ni-Co-Si合金组织和性能的影响。结果表明:经过950 ℃×30 min水淬+500 ℃×480 min随炉冷却后,Cu-Ni-Co-Si 合金得到良好的综合性能:硬度为243.55 HV3,导电率为42.24%IACS;添加少量的V有利于提高二次时效后合金的导电率,并且进行适当的一次时效对提高合金的导电率和硬度是有利的,可以使二次时效试样迅速获得良好的综合性能;Cu-Ni-Co-Si合金的主要强化相为盘状正交结构的δ-(Co,Ni)₂Si,过饱和固溶体析出的沉淀物均匀分布,但位错缠结始终存在,其中基体与析出相的位向关系为[001]_m//[110]_p, (010)_m //(001)_p。     

室温停留对7475铝合金人工时效动力学的影响

人工时效前的室温停留,会对7475铝合金的人工时效产生一定的影响。通过电导率的测量,说明自然时效时由于GP区的弥散析出,导致样品的电导率持续下降;长时间室温停留后再进行人工时效时,由于GP区的形成,夺取一部分空位,使溶质原子扩散的驱动力减小,析出反应的表观激活能变大,电导率始终低于淬火后直接进行人工时效的样品。通过JMAK方程处理了所得数据,计算出重要的时效动力学参数tC和n,并说明了各自的影响因素。     

Effect of different quenching processes following solid-solution treatment on properties and precipitation behaviors of 7050 alloy

The effects of quenching in different ways following solid-solution treatment on properties and precipitation behaviors of 7050 alloy were investigated by transmission electron microscopy (TEM), scanning electron microscopy (SEM), selected area electron diffraction (SAED), hardness and electrical conductivity tests. Results show that after quenching in different ways, electrical conductivity of the alloy decreases rapidly in the first 48 h of natural aging. The electrical conductivity of 7050 alloy in natural aging state is determined by the size and density of GP zones, and the size of GP zones is the main factor. After natural aging for 70 d, the size of GP zones is 1.8–2.6 nm in matrix of the immersion quenched sample and it is 1.4–1.8 nm in matrix of both water mist and forced air quenched samples. After natural and artificial peak aging, the hardness of the water mist quenched sample is HV 193.6 and its electrical conductivity is 30.5% (IACS) which are both higher than those of the immersion quenched sample. Therefore, water mist quenching is an ideal quenching method for 7050 alloy sheets after solid-solution treatment.     

镁与热处理对Al-4Si-(xMg)合金导电性及力学性能的影响

利用SEM、XRD、EDS、硬度计及电阻率测试仪等方法分析Mg元素和不同热处理对Al-4Si-(xMg)(x=0~1.5%,质量分数)系列合金导电率及硬度的影响。结果表明:随Mg添加量增加,铸态合金的导电率和硬度先增后减,最佳添加量为1.1%。Mg使铸态合金硬度显著增加,但恶化了其导电率。Al-4Si-(xMg) 合金经不同热处理后,合金导电率大幅提高,硬度略有降低。其中,固溶时效对合金导电率的提高最显著,硬度降低幅度最小,使Al-4Si-1.1Mg合金导电率和硬度匹配关系最好。通过Mg元素和固溶时效的协同作用,可使铸态Al-4Si合金导电率由43.3%IACS提高至50.9%IACS,硬度由41.5 HV0.5增加至84.3 HV0.5。     

Effect of temperature and moisture on electrical conductivity in polyaniline/polyurethane (PANI/PU) blends

Miscible blend of conductive polyaniline/polyurethane (PANI/PU) showed preferable electrical property at low percolation threshold compared to immiscible blend of PANI/polystyrene-isoprene-copolymer (PANI/SIS) and carbon black/PU composite (CB/PU). The time dependence of the electrical conductivity was investigated with these samples aged under different humidity and temperatures. The electrical conductivity of PANI/PU (11.5/88.5, v/v) decreased with aging time and the morphology changed with time in the coexistence of high moisture and high temperature. After the aging treatment, the film of the miscible blend was re-dissolved and re-cast. The morphology and electrical conductivity were found to recover to the same state as the original film. In addition, the recovery mechanism of the morphology and the conductivity was also proposed here.     

Aging Behavior of Cu-Cr-Zr-Ce Alloy

The aging properties of Cu-0.35Cr-0.038Zr-0.055Ce alloy are studied. The results show that can obtain higher electrical conductivity and microhardness after solutioned at 920℃ for lh, and aged at 500℃. The process of precipitation of the secondary phase can be accelerated with cold deformation before aging, so properties of the alloy are improved.Upon aging at 500℃ for 30 minutes after 60% cold deformation, the values of electrical conductivity and microhardness are 69.0%IACS and 152HV respectively, but they are only 66.2%IACS and 136HV upon directly aging after solution. With the addition of a trace of rare earth element Ce, the value of microhardness of Cu-0.35Cr-0.038Zr alloy increases 18～25HV,while the value of electrical conductivity drops a little.     

Cu-Ag-Zr合金的时效性能

采用真空熔炼的方法制备了Cu-Ag-Zr合金,通过显微硬度测试、电导率测试、TEM分析,研究了Cu-Ag-Zr合金经不同冷变形后在不同时效温度和时效时间下的时效性能.结果表明,Cu-Ag-Zr合金经450℃时效4 h具有较好的显微硬度和电导率,其显微硬度和电导率分别达到126 HV和84.4%IACS;时效前的冷变形能够促进相的析出,改善Cu-Ag-Zr合金的性能;经80%冷变形后在450℃时效0.5 h,Cu-Ag-Zr合金的显微硬度和电导率能分别达到134 HV和84.6%IACS.     

Aging characteristic of Cu-0.6Cr-0.15Zr-0.05Mg-0.02Si alloy containing trace rare earth yttrium

The aging characteristic of Cu-0.6Cr-0.15Zr-0.05Mg-0.02Si alloy containing trace rare earth yttrium was investigated. The results showed that Cu-0.6Cr-0.15Zr-0.05Mg-0.02Si alloy obtained good comprehensive performance after 80% rolling and then aging at 480℃ for 1 h; the hardness and electrical conductivity reached HV 150 and 85.5% IACS, respectively. Increasing aging temperature accelerated aging precipitation. The time for attaining peak hardness was postponed, the precipitates were finer (2-4 nm), and the interparticle spacing was shorter due to yttrium addition. The hardness and electrical conductivity of the Y-containing alloy after 80% deformation and then aging at 480℃ for 45 min reached HV 174 and 82.1% IACS, respectively.     

Cu-Zr和Cu-Zr-Si的时效析出特性及冷变形对时效析出的影响

测定了Cu-Zr和Cu-Zr-Si时效后硬度、电导率的变化。分析了影响电导率的因素。认为Si可以细化析出物、提高材料的抗软化能力。对形变后时效时材料性能的改善及变形度的影响进行了讨论。     

高强高导电CuCrZr合金时效过程中析出相的演化规律

对固溶态CuCrZr合金经不同温度时效后的析出相进行显微观察,并对其电导率进行了测试。结果表明:450 ℃时效30 min的析出相为5 nm以下的单质Cr相,并且与基体呈cube-on-cube取向关系。450 ℃峰值时效120 min时析出相为CrCu₂Zr相和Cr相,尺寸为10nm左右,且与基体共格;600 ℃和800 ℃过时效30 min后析出相主要演变为球状的Cr相和棒状的Cu₄Zr相。在600 ℃时效处理后部分棒状析出相已显著长大至50 μm左右,而800 ℃时效处理后几乎看不到细小的析出相,其中棒状Cu₄Zr析出相长大至200 μm以上,球状纯Cr析出相也接近50 μm。CuCrZr合金在450 ℃时效时导电率随时效时间的延长不断增高,在120 min后达到最大值且几乎不再变化。根据析出相转化率与导电率的线性关系,建立了合金在400、450、500和600 ℃下的析出动力学方程。