Structure and viscoelastic properties of epoxy resins prepared from four-nuclei novolacs

The relation between the structure and the viscoelastic properties of seven kinds of epoxy resins was studied. Seven tetraglycidylethers were synthesized from four-nuclei novolacs in which the positions of methylene linkage or number of kind of substituents were different. These epoxy compounds were cured with diaminodiphenylmethane as a hardener. From the viscoelastic properties of the fully cured resins with the hardener, characteristic properties such as glass transition temperature (T_g), average molecular weight between crosslinking points (M̄_c), and front factor (ϕ) were obtained. It was concluded that higher linearity in the main chain of epoxy resins gave a cured resin with a higher T_g, a smaller M̄_c, and a larger ϕ.     

Synthesis and properties of urethane elastomer-modified epoxy resin having hydroxymethyl group

Synthesis and properties of urethane elastomer-modified epoxy resins were studied. The urethane elastomer-modified epoxy resins were synthesized by the reaction of a 4-cresol type epoxy compound having hydroxymethyl groups (EPCDA) with isocyanate prepolymer. The structure was identified by IR, ¹H NMR and GPC. These epoxy resins (EPCDATDI) were mixed with a commercial epoxy resin (DGEBA) in various ratios. The mixed epoxy resins were cured with a mixture of 4,4′-diaminodiphenylmethane and 3-phenylenediamine (molar ratio 6:4) as a hardener. The curing behaviour of these epoxy resins was studied by DSC. The higher the concentration of EPCDATDI, the higher the onset temperature and the smaller the rate constant (k) of the exothermic cure reaction were. It was considered that the ratio of hydroxymethyl group to epoxide group was very small and the molecular weight of EPCDATDI was large. Therefore, the accelerating effect of the hydroxymethyl group on the epoxide–amine reaction was cancelled by the retardant effect of increased molecular weight and viscosity, and decreased molecular motion. Toughness was estimated by Izod impact strength and fracture toughness (K_1C). On addition of 10 wt% EPCDATDI with low molecular weight (M?_n 6710, estimated by GPC using polystyrene standard samples), Izod impact strength and K_1C increased by 70% and 60%, respectively, compared with unmodified epoxy resin. Glass transition temperatures (T_g) for the cured epoxy resins mixed with EPCDATDI measured by dynamic mechanical spectrometry were the same as those of unmodified epoxy resin. The storage modulus (E′) at room temperature decreased with increasing concentration of EPCDATDI. Toughness and dynamic mechnical behaviour of cured epoxy resin systems were studied based on the morphology.     

Structure and viscoelastic properties of epoxy resins prepared from o-cresol novolacs

The relation between the structure and viscoelastic properties of the epoxy resins prepared from o-cresol novolacs was studied. Our model epoxy resins were two kinds of epoxy compounds synthesized from three-nuclei and four-nuclei o-cresol novolacs. In addition to these models, a commercially available o-cresol novolac-type epoxy resin was also studied. Each of the three epoxy compounds was cured with one of three kinds of novolacs, which were starting materials of the above-mentioned epoxy resins. Characteristic properties of the cured resins, such as glass transition temperature (T_g), average molecular weight between crosslinking points (M¯_c), and front factor (?) were obtained. It was concluded that the number of functional groups contained in the curing system almost dominated the viscoelastic properties of the cured resins.     

Curing behavior of epoxy resin having hydroxymethyl group

A new type of epoxy resin having hydroxymethyl group was synthesized. This epoxy resin was mixed with commercial epoxy resin in various ratios. The mixed epoxy resins were cured with a mixture of 4,4′-diaminodiphenylmethane and m-phenylenediamine (molar ratio, 6 : 4) as a hardener. Curing behavior of the epoxy resin systems with the hardener was examined by DSC and TG-DSC, and parameters of cure reaction were obtained. Viscoelastic properties of cured resin were studied by dynamic mechanical analyzer. It was found that the higher the amount of epoxy resin having hydroxymethyl group, the lower the activation energy (Ea) and the higher the rate constant (k) were. It was also found that the higher the amount of the epoxy resin having hydroxymethyl group, the better heat resistance the fully-cured resin had. These results were explained as follows: Hydroxymethyl group accelerated an epoxideamine reaction. The crosslinking density of the cured resin was increased because in the hydroxymethyl group occurred a condensation reaction above 200°C.     

Phase separation of poly(ether sulfone imide) modified epoxy resin

Poly(ether sulfone imide)s (PEI) with molecular weight M_n ∼ 10⁴ were synthesized from 3,3′,4,4′-benzophenone tetracarboxylic dianhydride and amine terminated poly(ether sulfone) having molecular weights ranging from M_n ∼ 400 to M_n ∼ 4000. Thus, the PEIs had the same molecular weight but various imide and ether sulfone contents. The PEIs were mixed with a stoichiometric mixture of diglycidyl ether bis-phenol-A (DGEBA)/diamino diphenyl sulfone (DDS). The effect of PEI on the curing reaction of DGEBA/DDS and the morphology of the polymer blend were studied by differential scanning calorimetry (DSC) and optical microscopy. In the DGEBA/DDS/PEI blend with a fixed PEI molecular weight and PEI concentration but with various imide content, the experimental data revealed the PEI with a higher content of ether sulfone had a lower T_g and a better compatibility with solvents and epoxy resins; the curing reaction rate of DGEBA/DDS/PEI was faster for PEI with a higher imide content; the DSC data of cured DGEBA/DDS/PEI showed two T_gs, indicating phase separation between PEI and cured epoxy resins; and the data of optical microscopy showed that the compatibility of PEI with epoxy resins increased with the content of ether sulfone in PEI. © 1996 John Wiley & Sons, Inc.     

Synthesis and properties of copolymer epoxy resins prepared from copolymerization of bisphenol A,epichlorohydrin, and liquefied Dendrocalamus latiflorus

Dendrocalamus latiflorus Munro (ma bamboo) was liquefied in phenol and polyhydric alcohol (polyethylene glycol/glycerol cosolvent) with H₂SO₄ as catalyst. Liquefied bamboos reacted with bisphenol A and epichlorohydrin were then employed to prepare copolymer epoxy resins. The curing property and thermal property of copolymer epoxy resins were investigated. The results showed that copolymer epoxy resins could cure at room temperature after the hardener was added, and its curing process was an exothermic reaction. Comparison showed that copolymer epoxy resins prepared with phenol‐liquefied bamboo as raw material had higher heat released than those prepared with polyhydric alcohol‐liquefied bamboo during curing. The DSC analysis showed that heat treatment could enhance the crosslinking of copolymer epoxy resins cured at room temperature. However, resins prepared with polyhydric alcohol‐liquefied bamboo had a lower glass transition temperature. The TGA analysis showed that resins prepared with phenol‐liquefied bamboo had better thermal stability. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Low-stress encapsulants by vinylsiloxane modification

Dispersed silicone rubbers were used to reduce the stress of cresol–formaldehyde novolac epoxy resin cured with phenolic novolac resin for electronic encapsulation application. The effects of structure, molecular weight, and contents of the vinylsiloxane oligomer on reducing the stress of the encapsulant were investigated. Morphology and dynamic mechanical behavior of rubber-modified epoxy resins were also studied. The dispersed silicone rubbers effectively reduce the stress of cured epoxy resins by reducing flexural modulus and the coefficient of thermal expansion (CTE), whereas the glass transition temperature (T_g) was hardly depressed. Electronic devices encapsulated with the dispersed silicone rubber modified epoxy molding compounds have exhibited excellent resistance to the thermal shock cycling test and have resulted in an extended device use life. © 1994 John Wiley & Sons, Inc.     

Thermal and Flame Retardation Properties of Melamine Phosphate-Modified Epoxy Resins

We have synthesized a series of epoxy resins containing melamine phosphate (MP) and investigated their thermal and flame retardation properties. MP functions as a hardener and a flame retardant or as an additive of the cured epoxy resin to enhance flame retardation properties of epoxy resins. The reactions of DGEBA cured in the presence of MP were monitored by NMR and FTIR. Our results show that in both reactive and additive modes, MP is effective in increasing limiting oxide index (LOI) and the char yields of epoxy resins at lower phosphorous content. We observed that flame retardation by MP in its reactive mode is better than in its additive mode; the same phenomenon was found also for the glass-transition temperature (T _g). Thermogravimetric analysis (TGA) demonstrated that epoxy resins containing MP decompose at relatively lower temperatures than those lacking MP; this decomposition results in a protective layer forming that prevents the epoxy resins from decomposing further by combustion.     

Synthesis of bio-based epoxy resin from gallic acid with various epoxy equivalent weights and its effects on coating properties

The bio-based epoxy resins for coating application were synthesized from gallic acid (GA) in various molar ratios with epichlorohydrin (ECH). The reaction was carried out in the presence of sodium hydroxide (NaOH) and phase-transfer catalyst tetrabutylammonium bromide. The reaction progress rate at various molar ratios as 1:8, 1:12, and 1:16 with respect to time was monitored by calculating the epoxy content. The epoxy content value increases in the product as the molar ratio of GA to ECH increases. Epoxy equivalent weight of products was evaluated by physiochemical method and structure illustrated by Fourier transform infrared and ¹H-nuclear magnetic resonance spectroscopy. This bio-based epoxy resin was cured with polyamide hardener, and the coating properties such as mechanical, chemical, and solvent resistance were studied. The cured films have been evaluated for glass transition temperature (T _g) and thermal behavior by a differential scanning calorimeter and thermogravimetric analysis, respectively. The bio-based epoxy coatings show interesting mechanical, chemical, and thermal properties as compared to the conventional epoxy resin. The gel and water absorption of polyamide-cured coatings has also been evaluated.     

Synthesis of curing agent for epoxy resin based on halogenophosphazene

Epoxy resins are, due to their excellent properties (such as chemical resistance, dimensional stability, and heat resistence), widely used in practice. The basic principle of curing epoxy resins with a hardener containing multiple amino groups is the crosslinking reaction between active hydrogen atoms in the hardener and the oxirane groups in the epoxy resin. This study deals with the synthesis and characterization of hexachloro‐cyclo‐triphosphazene derivative and its subsequent use for curing epoxy resins. The new hardener was prepared from hexachloro‐cyclo‐triphosphazene by nucleophilic substitution with isophorone diamine and its curing capability was compared with original isophorone diamine. The prepared derivative hexaisophorone diamino‐cyclo‐triphosphazene (HICTP) provided advantages over conventional curing system, as it improved mechanical properties as well as the flame resistance. Testing of the cured epoxy resin during burning was carried out using dual cone calorimeter, which enables more extensive monitoring of parameters in comparison with testing using oxygen index that has been used in many publications. The epoxy resin cured with the prepared phosphorus containing HICTP exhibits lower values for total heat release, amount of smoke released and oxygen consumed, which may cause a slower flame spread. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 42917.     

Epoxidized soybean oil modified using fatty acids as tougheners for thermosetting epoxy resins: Part 2—Effect of curing agent and epoxy molecular weight

A series of bio-rubber (BR) tougheners for thermosetting epoxy resins was prepared by grafting renewable fatty acids with different chain lengths onto epoxidized soybean oil at varying molar ratios. BR-toughened samples were prepared by blending BRs with diglycidyl ether of bisphenol A resins, Epon 828 and Epon 1001F, at different weight fractions and stoichiometrically cured using an amine curing agent, 4, 4′-methylene biscyclohexanamine (PACM). Fracture toughness properties of the unmodified and BR toughened polymer samples—including critical strain energy release rate (G_Ic), and critical stress intensity factor (K_Ic)—were measured to investigate the toughening effect of prepared BRs. It was found that the degree of phase separation and toughening were more controllable relative to similar polymers cured using the aromatic curing agent Epikure W, and the use of higher molecular epoxy resins produces a synergistic effect increasing the toughness much more than similar polymers made with lower molecular weight epoxy resins. Average BR domain sizes ranging from 200 to 900 nm were observed, and formulations with G_Ic, values K_Ic as high as 1.0 kJ/m² and 1.4 MPa m^1/2 were attained respectively for epoxy systems with T_g greater than 130°C.     

A study of sub-Tg heat flow transition of cured epoxy resin

The physical aging behavior of fully and partially cured epoxy resins based on diglycidyl ether of bisphenol A(DGEBA) has been investigated by differential scanning calorimetry (DSC). A sub-T_g heat flow transition (T_g1) could not be attributed to the phase separation or dynamic mechanical relaxation, as reported in the literature. In both fully and partially cured epoxy resins, it occurs only when the cooling rate is higher than that having the lowest T_g in the DSC scan. Therefore, it could be attributed to the motion of the internal stress-relaxed molecular chain.     

Effect of cobalt on the electrical conductive property of epoxy resins

Cobalt acrylate (CoA₂) has been treated with bisphenol‐A and epichlorohydrin to modify epoxy resins. It was cured with p‐acetylbenzilidene triphenyl arsonium ylide. The properties such as epoxide equivalent weight (equiv/100 g), molecular weight, hydrolyzable chlorine content increases whereas hydroxyl content, refractive index decreases in the presence of CoA₂. The cured epoxy resins shows improve electrical conductivity due to the incorporation of CoA₂ with epoxy resins. The influence of complex formation of CoA₂ with either linkage of epoxy resins were investigated by spectroscopy. The decrease in T_g from differential scanning calorimetry support the improve in flexibility. The dispersion of cobalt in epoxy resins matrix was confirmed by scanning electron microscope. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Novel cycloaliphatic epoxy resins. II. Curing reaction with BF3MEA and its cured properties

The BF₃MEA curing reaction and the cured properties of novel cycloaliphatic epoxy resins (CE-resins), which were derived from an octadienyl compound, were studied. Gelation time and the DSC scan of the CE resins, with BF₃MEA hardener, proved that the reactivity of the CE resins is intermediate among the reactivities of the conventional resins; it was found that the CE resins react faster than DGEBA, but slower than the conventional cycloaliphatic epoxy resins. The pot life of the CE- (III) resin with BF₃MEA hardener proved to be over 30 days at a temperature of 20°C. The thermal properties are affected by the amount of BF₃MEA used and the curing conditions. CE-(III) showed the highest HDT of over 200°C with 2–3 phr of BF₃MEA. The flexural properties of CE-(I) proved to be flexible and tough. CE-(II) exhibited the highest strength and elongation, while CE-(III) had the same flexural properties as DGEBA. Furthermore, the blending of CE-(II) with DGEBA produced greater flexural strength and greater elongation than each original resin had. The thermal stability at elevated temperature and the water resistance of the cured CE resins proved to be inferior to those of DGEBA and novolac epoxy resin, probably due to the use of BF₃MEA. These results suggest the CE resin will provide a new application for a one-component curing system for composites. © 1993 John Wiley & Sons, Inc.     

Blended hybrids based on silsesquioxane–OH and epoxy resins

Blended hybrids based on silsesquioxane cyclohexyl trisilanol [STOH; i.e., (c‐C₆H₁₁)₇Si₇O₉(OH)₃] and epoxy resin 4,5‐epoxyhexyl‐1,2‐dimethyl acid diglycidyl ester (TDE‐85) were prepared with good compatibility of STOH up to 5 wt % with TDE‐85. The blended hybrid resins, with various STOH additions, were cured by 4,4′‐diaminodiphenylsulfone, and the curing reactions were investigated with differential scanning calorimetry. The incorporation of STOH increased the curing reaction of TDE‐85 for three active hydrogens existing in the STOH molecule. The storage moduli and glass‐transition temperatures of the cured hybrid resins were studied with dynamic mechanical analysis. The cured hybrids had higher storage moduli than the pure epoxy resins at lower temperatures and increased slightly even when the temperature was above the glass‐transition temperature. Two peaks appearing in tan δ curves indicated the block copolymer structure and two different glass‐transition temperatures of the cured hybrid resins. The thermal stability and flame retardancy of the cured hybrid resins were investigated with thermogravimetric analysis and limited oxygen index values, respectively. The results showed that introducing silsesquioxane–OH units into epoxy resins could improve the thermal stability and flame retardancy of the resins. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

双酚F环硫-环氧树脂固化物的性能研究

以甲基六氢邻苯二甲酸酐(MeHHPA)为固化剂,N．N-二甲基苄胺为固化促进剂．在一定的固化条件下,对双酚F环硫-环氧树脂进行固化实验,探讨了固化机理。并对双酚F环硫-环氧树脂固化物的吸水性、拉伸强度、剥离强度和玻璃化温度进行分析测试,结果表明,与双酚F环氧树脂相比,相应的双酚F环硫-环氧树脂具有更高的拉伸强度、剥离强度和玻璃化温度以及较低的吸水性。     

Preparation and epoxy curing of novel dicyclopentadiene‐derived Mannich amines

Phenol/dicyclopentadiene (DCPD) adducts were prepared from the BF₃‐catalyzed reaction of p‐nonylphenol and dicyclopentadiene at molar ratios of 2 : 1 and 3 : 2. The phenol‐terminating adducts were consequently reacted with diethylenetriamine and formaldehyde using Mannich reaction conditions. These products containing phenol, amine and tricyclodecane functionalities in the same molecule can be used as epoxy curing agents. The diethylenetriamine was add to the phenol via Mannich reaction at approximately 50% theoretical equivalent. The multiple N H groups in amines and the O H groups in phenols provide crosslinking sites for epoxy resins. The cured epoxy resins show improvement in tensile strength and elongation in comparison with those cured by the poly(oxypropylene) diamine (400 molecular weight) or diethylenetriamine. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 71: 2129–2139, 1999     

Novel phosphorus‐containing hardeners with tailored chemical structures for epoxy resins: Synthesis and cured resin properties

A comparative evaluation of systematically tailored chemical structures of various phosphorus‐containing aminic hardeners for epoxy resins was carried out. In particular, the effect of the oxidation state of the phosphorus in the hardener molecule on the curing behavior, the mechanical, thermomechanical, and hot‐wet properties of a cured bifunctional bisphenol‐A based thermoset is discussed. Particular attention is paid to the comparative pyrolysis of neat cured epoxy resins containing phosphine oxide, phosphinate, phosphonate, and phosphate (with a phosphorus content of about 2.6 wt %) and of the fire behavior of their corresponding carbon fiber‐reinforced composites. Comparatively faster curing thermosetting system with an enhanced flame retardancy and adequate processing behavior can be formulated by taking advantage of the higher reactivity of the phosphorus‐modified hardeners. For example, a combination of the high reactivity and of induced secondary crosslinking reactions leads to a comparatively high T_g when curing the epoxy using a substoichiometric amount of the phosphinate‐based hardener. The overall mechanical performance of the materials cured with the phosphorus‐containing hardeners is comparable to that of a 4,4′‐DDS‐cured reference system. While the various phosphorus‐containing hardeners in general provide the epoxy‐based matrix with enhanced flame retardancy properties, it is the flame inhibition in the gas phase especially that determines the improvement in fire retardancy of carbon fiber‐reinforced composites. In summary, the present study provides an important contribution towards developing a better understanding of the potential use of such phosphorus‐containing compounds to provide the composite matrix with sufficient flame retardancy while simultaneously maintaining its overall mechanical performance on a suitable level. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Synthesis of liquefied corn barn-based epoxy resins and their thermodynamic properties

The liquefied corn barn-based epoxy resin (LCBER) was synthesized through the glycidyl etherification reaction from liquefied corn barn (LCB), which has groups of bound phenol, and epichlorohydrin under alkali conditions. The average molecular weights of LCB and LCBER in various liquefaction conditions were examined. The thermodynamic properties of thermosetting resin cured by polyamide-650 (PA-650) were evaluated. It was found that the macromolecular chain and epoxy function of the resins would be a dominant factor for crosslinking density and properties of the cured LCBER. The cured liquefied CB-based epoxy resin (LCBER-30) using the corresponding LCB at 30 min (LCB-30) as raw materials had much macromolecular exhibited higher glass-transition and decomposition temperatures at 5% weight loss (T_d), but worse shear strength in comparison with the other LCBER ones. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Synthesis and properties of trifluoromethyl groups containing epoxy resins cured with amine for low Dk materials

The study synthesized a trifluoromethyl (CF₃) groups with a modified epoxy resin, diglycidyl ether of bisphenol F (DGEBF), using environmental friendly methods. The epoxy resin was cured with 4,4′‐diaminodiphenyl‐methane (DDM). For comparison, this study also investigated curing of commercially available diglycidyl ether of bisphenol A (DGEBA) with the same curing agent by varying the ratios of DGEBF. The structure and physical properties of the epoxy resins were characterized to investigate the effect of injecting fluorinated groups into epoxy resin structures. Regarding the thermal behaviors of the specimens, the glass transition temperatures (T_g) of 50–160°C and the thermal decomposition temperatures of 200–350 °C at 5% weight loss (T_d5%) in nitrogen decreased as amount of DGEBF increased. The different ratios of cured epoxy resins showed reduced dielectric constants (D_k) (2.03–3.80 at 1 MHz) that were lower than those of pure DGEBA epoxy resins. Reduced dielectric constant is related to high electrronegativity and large free volume of fluorine atoms. In the presence of hydrophobic CF₃ groups, the epoxy resins exhibited low moisture absorption and higher contact angles. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012