一种Tb/s量级带宽的光电混合路由交换系统的结构

提出一种采用光互连网络作为大容量路由器中的信息传输载体,以VCSEI/PIN作为光电、电光转换收发接口,用高速IC芯片来处理信息的光电混合太比特量级的大容量路由交换系统方案.通过采用高速分组交换芯片、可扩展的交换结构与共享储存排队方法,实现了交换机构规模可扩展到1024×1024,端口速率为2.5 Gb/s,信元丢失率小于l0-9的新型的光电混合路由交换核心模块.     

3Com ONcore集成系统中的高功能交换解决方案

一、ONcore SwichModule交换模块系列 3Com公司的ONcore集成系统为企业网络提供可扩展的交换式LAN和ATM升级方案。SwitchModule系列能提供最大的可扩展性、灵活性和最强的功能。SwitchModule模块是以3Com公司的多协议集成交换控制器(ISC)4000ASIC芯片为基础,支持极高性能的以太网和FDDI交换,并具有向未来的ATM过渡的手段。     

基于CSIX-L1接口协议的通用交换芯片设计

在原有ATM交换芯片设计成果的基础上,设计了一款具有CSIX-L1接口的通用交换芯片。本文主要介绍该芯片的设计方案。首先简要介绍CSIX-L1协议的基本内容,然后具体说明如何直接采用ATM交换芯片的空分交换结构来实现传递交换CSIX-L1协议帧内容,并指出CSIX-L1接口扩展是该芯片的设计关键,最后介绍如何采用B it-slice技术来实现CSIX-L1接口扩展。     

CUBIT-3(TXC-05804)原理及其在ATM综合交换设备中的应用

本文介绍了ATM交换芯片CUBIT-3(05804)的功能原理，并结合ATM综合交换设备的具体实现给出了该芯片在嵌入式平台下与MPC8260微处理器接口应用的实例，介绍了该芯片的配置方法和软件驱动流程。     

编者的话

中国的电子工业正处在迅速发展和积极变革之中.电子工业部胡启立部长日前在全国电子行业会议上做了重要报告,回顾了电子工业一年来的发展,并对今后的战略目标、改革措施及具体任务作了全面论述.本期就此发表了署名文章.此外还编发了有关日本、台湾、东南亚等国家地区电子工业近况的文章,可供读者参考.ATM交换技术将成为未来信息高速公路的一个重要组成部分.一个新技术的出现,会遇到许多这样那样的问题,ATM有许多竞争对手,其他技术也都在发展中.采用ATM技术后,用户原有的设备能否实现从一种技术向另一种技术的平稳过渡,能否保留用户原有的投资.这些都是生产厂商和用户不得不考虑的问题.本期以专题的形式介绍了ATM技术的发展动向,更提供了制造ATM交换及相关设备IC芯片的厂商,还专门提供了ATM网络术语浅释.相信将对欲采用ATM技术的用户有很大帮助.     

APON系统中交叉连接的研究与实现

介绍了一种用于通信网络的APON无源光网络系统,该系统通过ATM交换模块实现信号的转换与传输,主要讨论了ATM交换的原理、交换单元的结构以及APON系统中交叉连接的实现。     

ATM交换芯片CUBIT05801的原理及应用

介绍了ATM交换芯片CUBIT05801的主要特点和工作原理,详细描述了该芯片的基本功能,并给出了由CUBIT05801组成的ATM交换网络的电路结构和主要的初始化程序流程图。     

APON系统中交叉连接的研究与实现

介绍了一种用于通信网络的APON无源光网络系统，该系统通过ATM交换模块实现信号的转换与传输，主要讨论了ATM交换的原理、交换单元的结构以及APON系统中交叉连接的实现。     

通信卫星光电混合交换技术研究

星上交换已成为卫星通信发展的趋势之一.星上ATM交换在发展过程中存在着电子瓶颈,星上光交换是未来宽带多媒体卫星的必然发展方向.提出了一种光电混合星上交换技术方案,对星上光交换的方式进行了分析,讨论了光电混合星上交换技术涉及的关键技术,对未来星上交换技术的发展进行了总结.     

RNC设备多路复用控制板的实现

模块接入控制板是TD-SCDMA系统RNC设备中接入子系统和业务处理子系统的关键组成部分,它基于ATM异步传输模式实现接入模块和业务处理模块中数据流的复用/解复用功能以及局部业务交换功能.以ATLANTA公司的APC ATM处理器的强大功能为依托,阐述了多路复用控制板的原理和功能实现.     

4×4 OEIC switch module using GaAs substrate

A compact 4×4 optical switch module consisting of a monolithic 4-channel OEIC receiver chip, a 4×4 GaAs IC chip, and a 4-channel OEIC transmitter chip has been developed for the first time. The module offers good performance, without an optical loss, a bandwidth of more than 600 MHz, and a crosstalk between neighboring channels of less than -20 dB. It has a good switching and distributive performance for high speed optical input signals of 560 Mbit/s. The switch module is attractive for use in high data-rate optical communication systems, particularly in local area networks, CATV systems, and intra-office links     

Reconfigurable Optical Add‐Drop Multiplexer Using a Polymer Integrated Photonic Lightwave Circuit

We have developed a fully functional reconfigurable optical add‐drop multiplexer (ROADM) switch module using a polymer integrated photonic lightwave circuit technology. The polymer variable optical attenuator (VOA) array and digital optical switch array are integrated into one polymer PLC chip and packaged to form a 10‐channel VOA integrated optical switch module. Four of these optical switch modules are used in the ROADM switch module to execute 40‐channel switching and power equalization. As a wavelength division multiplexer (WDM) filter device, two C‐band 40‐channel athermal arrayed waveguide grating WDMs are used in the ROADM module. Optical power monitoring of each channel is carried out using a 5% tap PD. A controller and firmware having the functions of a 40‐channel switch and VOA control, optical power monitoring, as well as TEC temperature control, and data communication interfaces are also developed in this study.     

Monolithically integrated 40-gb/s switchable wavelength converter

An all-optical switchable wavelength-converting module at 40 Gb/s line rate is demonstrated in a fully integrated InP chip. The device combines a semiconductor optical amplifier-based wavelength converter and a fast-tunable multifrequency laser. Sub-nanosecond switching among the eight channels of the integrated laser is shown, and error-free operation of the wavelength conversion process at 40 Gb/s for each wavelength is demonstrated. The applications of fast switching wavelength conversion for optical switching and packet routing are discussed.     

并联双晶体高速削波快脉冲源的设计

设计了一种并联双晶体高速快脉冲源,用于激光物理实验中预脉冲的高速削波。该削波脉冲源采用升压工作模式,由光电转换模块、高压电源模块、开关器件及电路等部分组成。光电转换模块将光信号转变为开关通断信号,用于控制高压脉冲输出;集成的高压电源模块和开关器件简化了电路设计,增加了该电源的可靠性;设计合理的开关电路和元件参数,保证稳定输出符合要求的高压脉冲波形。该快脉冲源的输出脉冲幅度大于4 000 V,下降沿小于10 ns,时间抖动小于1 ns,已成功用于激光物理实验预脉冲的削波。     

Silica-based 8×8 optical matrix switch module with hybridintegrated driving circuits and its system application

A compact, low-crosstalk 8×8 optical matrix switch module has been developed. A thermooptic switch chip and driving circuits with TTL interfaces are integrated on a 100-mm² ceramic substrate. It achieved a low insertion loss of 10.0 dB, a low crosstalk level of -25.9 dB, and had excellent stability in practical operation. A photonic intermodule connector for electronic switching systems in the near future is also demonstrated through the use of these optical switch modules     

Novel Optical Coupling Technique for Enhancing the Performance of Integrated 8-Input/1-Output SOA Gate-Switch Module

We developed 8-input/1-output (8:1) optical gate- switch module that is compact and reliable by proposing and developing a novel lens coupling scheme suitable for an 8:1 integrated SOA device for a multigate semiconductor optical amplifier (MG-SOA) switch system. We first designed special lenses that collect the tilted SOA beams and simultaneously magnify the pitch and beam size, and we fabricated a highly reliable optical module with hermetic sealing and laser-welded joints. The module exhibits low-loss coupling (~ 3.1 dB), high channel crosstalk (~ - 50 dB), high extinction ratio (>81 dB), and high-speed switching (~ 2.5 ns), confirming that this module is applicable to MG-SOA switching systems.     

8×8 symmetric nonblocking integrated acoustooptic spaceswitch module on LiNbO3

An 8×8 symmetric nonblocking integrated acoustooptic space switch module has been realized on a Y-cut LiNbO₃ substrate, 1.0×10.0×37.0 mm in size. The switch module consists of a new hybrid beam expanding-collimating lens, a large aperture focusing lens, and a pair of four-element tilted surface acoustic wave (SAW) transducer arrays in a titanium-in-diffused channel-planar-channel composite waveguide. Experimental results of point-to-point nonblocking switching at the optical wavelength of 0.6328 μm, including an average crosstalk of -12.2 dB, optical switching efficiency of 25% at 125 mW RF drive power, carrier frequency increment of 13.5 MHz for switching between adjacent output channels and reconfiguration time of 0.4 μs have been obtained     

Description and evaluation of the FAST-Net smart pixel-basedoptical interconnection prototype

The design, packaging approach, and experimental evaluation of the free-space accelerator for switching terabit networks (FAST-Net) smart-pixel-based optical interconnection prototype are described. FAST-Net is a high-throughput data-switching concept that uses a reflective optical system to globally interconnect a multichip array of smart pixel devices. The three-dimensional optical system links each chip directly to every other with a dedicated bidirectional parallel data path. in the experiments, several prototype smart-pixel devices were packaged on a common multichip module (MCM) with interchip registration accuracies of 5-10 μm. The smart-pixel arrays (SPAs) consist of clusters of oxide-confined vertical-cavity surface-emitting lasers and photodetectors that are solder bump-bonded to Si integrated circuits. The optoelectronic elements are arranged within each cluster on a checkerboard pattern with 125-μm pitch. The experimental global optical interconnection module consists of a mirror and lens array that are precisely aligned to achieve the required interchip parallel connections between up to 16 SPAs. Five prototype SPAs were placed on the MCM to allow the evaluation of a variety of interchip links. Measurements verified the global link pattern across several devices on the MCM with high optical resolution and registration. No crosstalk between adjacent channels was observed after alignment. The I/O density and efficiency results suggest that a multi-terabit switch module that incorporates global optical interconnection to overcome conventional interconnection bottlenecks is feasible     

Multichip optical hybrid integration technique with planarlightwave circuit platform

A two-step bonding technique for optical device assembly on a planar lightwave circuit platform was developed, which consists of a chip-by-chip thermo-compression prebonding step and a simultaneous reflow bonding step. The technique was used to realize multichip optical integration on the platform. The characteristics of the bonding technique were examined by investigating its strength and accuracy. The bonding accuracies in the horizontal and vertical directions were 1.1 and 0.8 μm, respectively, with high bonding strength. The technique was first applied to a 3 chip integrated transceiver module and the 136 fabricated modules exhibited good performance. The average coupling loss between the laser diodes and the waveguide was estimated to be 4.1 dB and stable characteristics were observed during 1200 cycle thermal shock tests between -40 and 85°C. Next, the two-step bonding technique was used for a 4 channel laser diode module on which 8 optical device chips were integrated and a low coupling loss was achieved of better than 4.2 dB which is as good as that of the 3 chip integrated optical modules