PVC/EVA/SBS共混体系研究

利用溶液成膜法制备了PVC/SBS薄膜 ,对其表观形态、力学性能进行了研究 ,并讨论了EVA对体系的增容作用。发现EVA在一定浓度范围内能增加PVC与SBS的相容性 ,提高断裂伸长率 .测量了溶液的相对粘度 ,得出了相反转浓度点。     

海藻酸钠/羧甲基淀粉共混膜

用溶液共混法成功制备出海藻酸钠／羧甲基淀粉共混膜，IR、XRD、SEM结构表征以及力学性能、吸水性和水蒸汽透过率测定结果表明：共混膜中海藻酸钠和羧甲基淀粉间存在强烈的分子间氢键等相互作用及良好的相容性；随羧甲基淀粉含量的增加，共混膜的吸水率显著降低；当羧甲基淀粉含量(wCMS)=0．20时，共混膜的抗张强度和断裂伸长率分别为53．1MPa和5．3％，比海藻酸钠膜分别提高了97．4％和60．6％，水蒸汽透过率达最小值，是一种具有潜在应用前景的可食性包装膜材料。     

sPS/PET/SsPS-H共混体系的研究

以自制间规聚苯乙烯(sPS)功能化合成的磺化间规聚苯乙烯（SsPS-H)作相容剂,研究其对sPS/PET共混物微相结构与性能的影响,发现SsPS-H能够有效地改善二者的相容性,当sPS/PET/SsPS-H为85／15／2（重量比）时,冲击强度达到11．4kJ/m^2,为纯sPS的3倍,此时材料的弯曲强度为39．1MPa,下降约8％;DMA结果表明,随SsPS-H用量的增加,共混物的Tg逐渐提高;DSC分析结果表明,共混体系中sPS的熔点不受SsPS-H含量的影响,而PET的熔点在加入6份SpPS-H时明显降低。sPS在达到最大结晶速率的温度均随SsPS-H用量的增加先提而后下降。SEM观察到加入SsPS-H后,PET分散相的尺寸减小,且均匀程度增加,共混物室温下冲击断裂显著地由脆性转变为韧性,当加入6份SsPS-H后,冲击断裂又出现脆性。     

聚丙烯/丁基橡胶共混体系的研究

本文研究了丁基橡胶(IIR)对等规聚丙烯(IPP)结晶行为的影响以及IPP/IIR共混物的形态与性能的关系。IIR对IPP的熔点、结晶度、结晶温度均无明显影响,但能抑制IPP球晶的增长,少量IIR是IPP的有效成核剂。IIR用量超过30份时,共混物的抗冲击强度迅速增加,但其抗张强度随IIR用量的增加而降低。在130℃热处理2小时,IPP/IIR(100/20)的抗冲击强度提高了近4倍。     

聚乳酸/聚氨酯共混体系相容性研究

采用热塑性聚氨酯弹性体(TPU)作为改性剂来增韧聚乳酸(PLA),通过溶度参数法、聚合物混合焓变法预测了TPU和PLA的相容性,并且通过稀溶液粘度法、动态热机械分析(DMA)及扫描电镜(SEM)对两者相容性进行表征,结果显示PLA和TPU为部分相容体系.共混溶液的粘度与组成含量的变化呈非线性关系;PLA/TPU共混膜的...     

聚苯乙烯/聚乙烯的反应性挤出共混

多官能团单体;聚苯乙烯/聚乙烯的反应性挤出共混     

胶粉/热塑性塑料共混材料的研究

以胶粉及通用塑料PP和LLDPE为原料,研究了原料种类、相容剂等对胶粉/热塑性塑料共混材料性能的影响,制得了性能较好的共混材料。通过热分析和扫描电镜对制得的共混材料进行分析表征,表明胶粉和LLDPE有较好的相容性及较强的结合力。     

聚丙烯/聚乙烯醇缩丁醛共混相容性研究

聚乙烯醇缩丁醛(PVB)分子结构上含有大量羟基,可用于改进聚丙烯的非极性。本文采用不同结构的聚乙烯醇缩丁醛(B-98、B-76、B-72)与抗冲聚丙烯(ICPP)按5/95进行共混,并测试了共混物的相结构(SEM)、结晶过程(POM)、热性能(DSC)和力学性能。SEM测试结果表明,PVB和ICPP表现出一定的相容性,其中B-98相容性最好;DSC和POM测试结果表明,PVB对ICPP的结晶有抑制作用;力学测试结果表明,B-98改性ICPP后的综合力学性能效果优于B-76和B-72。B-98和聚丙烯较好的相容性主要和其较小的分子量有关。     

环氧树脂/聚氨酯共混体系相行为研究

利用小角光散射 (SALS)技术实时记录了环氧树脂 聚氨酯共混体系在固化过程中的相行为发展情况 ,得到了表征共混体系相区结构尺寸大小的相关距离ac 和表征体系均匀程度的均方介电常数涨落 η2 ,讨论了等温固化条件下 ,环氧树脂 聚氨酯共混体系的相区大小随时间的变化规律 .实验结果表明 ,环氧树脂 聚氨酯共混体系的固化过程是典型的反应诱导相分离的过程 .相分离初期 ,符合Cahn的线性理论 ;随着固化时间的延长 ,相区由小变大 ,约至反应开始后 3 2 1 0s,相分离趋于平衡态 ,相区尺寸趋于稳定     

热塑性/热固性聚合物共混体系研究——乙炔端基砜/聚砜共混物的动态固化动力学

近年来,半互穿聚合物网络(SIPN)概念被用来研制能结合热塑性聚合物的加工性和热固性聚合物的高温性能的大分子体系,用于复合材料耐高温树脂基体。例如:乙炔端基酰亚胺低聚物与热塑性聚酰亚胺基SIPN,线性聚酰亚胺与热固性双马来酰亚胺基SIPN以及热塑性树脂与双腈基SIPN已有报道。研究结果表明共混物起到协同作用,易于加工并具有优异的性能。乙炔端基砜(ATS)树脂具有与聚砜树脂相类似的结构,被认为在将来代替环氧用于高性能粘合剂和复合材料树脂基体的候选者之一。其另     

THE MECHANISM OF CURE REACTION OF 4,4''''-DIAMINODIPHENYL METHANE WITH TETRAGLYCIDYL 4,4''''-DIAMINODIPHENYL METHANE EPOXY

The cure reaction of tetraglycidyl 4,4'-diaminodiphenyl methane (TGDDM) epoxy resin with 4,4'-diaminodiphenyl methane (DDM) has been studied by using DSC. Instead of one exothermic peak, two exothermic peaks, indicative of a complex reaction mechanism, are shown in the DSC curve of TGDDM-DDM mixtures in nonisothermal cure experiments when the content of DDM is lower than stoichiometric ratio. The result of the kinetic analysis of the cure reaction shows that the activation energy of the lower temperature exotherm peak is about 56 kJ/mol and that of the higher temperature exotherm peak is about 136 kJ/mol. The lower temperature cure reaction peak can be attributed to the primary amine-epoxide and secondary amine-epoxide reactions, and the higher temperature cure reaction peak can be attributed to the epoxide-hydroxy reaction under catalysis of tertiary amine in the TGDDM epoxy resin. Because the network density of the cured epoxy resin is determined by these two reactions, the content of DDM has little effect on the glass transition temperature of cured epoxy resin.     

The microwave radiation effect on the polymerization of styrene

Styrene was cured by microwave radiation at two different powers: 300 and 500 W. The temperature profile of the sample during the microwave curing process was determined to select a suitable temperature for comparison with the conventional method of cure. The results indicate a similar comparable temperature of about 80°C irrespective of the microwave power used. The percentage conversion of the cure was followed by Fourier transform infrared (FTIR) spectroscopy. The thermal polymerization at 79(±1)°C displayed a gradual increase in the rate of reaction at the gel effect from about 30 to 50% conversion of the reaction. The microwave cure at 300 and 500 W displayed a large and sharp gel effect from about 20 to 69 and 64% conversion of the reaction, respectively. The limiting conversion decreased with increase in microwave power which was also observed in the polymerization of methyl methacrylate (MMA). Based on similarity in temperature and reaction conditions, the 500 W cure was found to show a reaction rate enhancement of 190% and the 300 W cure 120%. A comparison of microwave induced reactions with thermal methods, therefore, must also specify the microwave power used. © 1996 John Wiley & Sons, Inc.     

Influence of surface modified graphene oxide on the mechanical performance and curing kinetics of epoxy resin

In this study, the hyperbranched polyester were successfully grafted onto graphene oxide (GO). The mechanical performance and curing kinetics of epoxy resin (EP), EP/ graphene oxide (EP/GO), and EP/ hyperbranched polyester grafted GO (EP/GO‐B) were investigated by means of mechanical tests and differential scanning calorimetry (DSC). Results revealed that the presence of GO lowered the cure temperature and accelerated the curing of EP, and the addition of GO‐B exhibited a stronger effect in accelerating the cure of EP compared with GO. Activation energies were calculated using Kissinger approach, and Ozawa approach, respectively. Results revealed lowered activation energy after the addition of GO or GO‐B at low degrees of cure, indicating that GO had a large effect on the curing reaction. The presence of GO facilitated the curing reaction, especially the initial epoxy‐amine reaction. Moreover, GO‐B exhibited better performance. Related mechanism was proposed.     

双酚-S环氧树脂与琥珀酸酐固化反应动力学

用差示扫描量热法（ＤＳＣ）研究了双酚－Ｓ环氧树脂（ＢＰＳＥＲ）与琥珀酸酐固化反应的历程。实验结果表明,固化反应主要分两个阶段,前期由化学动力学控制,服从自催化机理。实验数据利用Ｋａｍａｌ方程处理得到两个速率常数ｋ、、ｋ２及两个反应级数ｍ、ｎ、ｋ１、ｋ２的值随反应温度的升高呈增大的趋势,总反应级数ｍ＋ｎ在２～２．５之间,当转化率达到４０％左右后,由于交联程度增加,分子量迅速增长,分子间扩散较慢,进入     

On the structure and cure acceleration of phenol-urea-formaldehyde resins with different catalysts

Phenol-urea-formaldehyde (PUF) resins with different catalysts [calcium oxide (CaO), sodium carbonate (Na₂CO₃), zinc oxide (ZnO), and magnesium oxide (MgO)] were prepared to accelerate the cure of the resin at low temperature. The cure-acceleration effects of catalysts on chemical structure and cure characteristics of PUF resins were investigated by using both liquid ¹³C nuclear magnetic resonance (NMR) and differential scanning calorimetry (DSC). The liquid ¹³C NMR analysis indicated that the catalyst such as CaO seemed to present a retarded effect on the polycondensation reaction of phenolic components with urea units, while the Na₂CO₃ appeared to promote the self-condensation reaction of phenolic methylol groups at para position toward the formation of para-para methylene linkage. Both ZnO and MgO in PUF resins promoted self-condensation reaction of para methylol groups and condensation reaction of ortho methylol groups with para methylol groups. The catalysts such as Na₂CO₃, ZnO, and MgO can make PUF resins cure at a low temperature. Among these catalysts, the MgO had the most significant accelerating effect on polycondensation and cure reaction of PUF resin.     

DSC study of cure kinetics of DGEBA-based epoxy resin with poly(oxypropylene) diamine

Summary A kinetic study of cure kinetics of epoxy resin based on a diglycidyl ether of bisphenol A (DGEBA), with poly(oxypropylene) diamine (Jeffamine D230) as a curing agent, was performed by means of differential scanning calorimetry (DSC). Isothermal and dynamic DSC characterizations of stoichiometric and sub-stoichiometric mixtures were performed. The kinetics of cure was described successfully by empirical models in wide temperature range. System with sub-stoichiometric content of amine showed evidence of two separate reactions, second of which was presumed to be etherification reaction. Catalytic influence of hydroxyl groups formed by epoxy-amine addition was determined.     

环氧树脂/氧化石墨纳米复合物的等温固化行为研究

用示差扫描分析仪(DSC)研究了氧化石墨(GO)对N,N,N',N'-四缩水甘油基-4,4'-二氨基二苯基甲烷环氧树脂(TGDDM)/4,4'-二氨基二苯基砜(DDS)体系的等温固化反应的影响,用X射线光电子能谱仪(XPS)和傅里叶变换红外光谱仪(FTIR)研究了GO上存在的官能团及其对TGDDM/DDS体系固化行为的影响,用热失重分析仪(TGA)研究了天然石墨和GO的热力学稳定性.XPS、FTIR和TGA结果表明,GO上存在的大量羟基、羧基、环氧基等官能团能够影响环氧树脂的固化行为.DSC研究发现,环氧树脂/氧化石墨纳米复合物的固化反应属于自催化类型,随着GO含量的增加,达到最大反应速率的时间不断减小,初始反应速率不断增大,这说明GO对环氧树脂的固化反应有促进作用.Kamal模型计算得到的结果表明,随着GO含量的增加自催化反应初期阶段表观活化能E1先减小再增大,而自催化反应结束后表观活化能E2略微减小.经Kamal模型扩散控制函数修正后,整个固化过程中拟合得到的结果与实验数据相当吻合.以上结果说明,少量的GO对TGDDM/DDS体系的固化反应起着催化作用.     

Study on thermal cure and heat-resistant properties of N-(3-acetylenephenyl)maleimide monomer

N-(3-acetylenephenyl)maleimide (3-APMI), was synthesized by reacting 3-aminophenylacetylene (3-APA) with maleic anhydride by the usual two-step procedure that included ring-opening addition to give maleamic acid, followed by cyclodehydration to maleimide. Structure of the monomer was confirmed by Fourier transform infrared spectroscopy (FTIR), proton nuclear magnetic resonance (¹H NMR), elemental analysis (EA) and mass spectrum (MS). Thermal cure of the monomer was investigated by differential scanning calorimetry (DSC) and FTIR, then processing parameters and cure kinetics parameters were determined. The results showed that the monomer possesses excellent reactivity, whose cure peak temperature was 197.9 °C and cure reaction was almost complete after 4 h cure at 200 °C. Thermal properties of the cured monomer were determined by dynamic mechanical analysis (DMA) and the results show that glass transition temperature (represented by onset temperature of storage modulus) is high up to 460 °C. The results of thermogravimetry analysis (TGA) reveal that the cured monomer possessed excellent thermal stability, whose 10% weight loss temperature (T_10%) is 515.6 °C and char yield at 800 °C is 59.1%. All these characteristics make the 3-APMI monomer be an ideal candidate for matrix of thermo-resistant composites.     

DSC study on the effect of isocyanates and catalysts on the HTPB cure reaction

The urethane forming cure reactions of hydroxyl terminated polybutadiene (HTPB) binder with three different isocyanate curatives, viz., toluene diisocyanate (TDI), isophorone diisocyanate (IPDI) and 4,4-methylene bis(cyclohexyl isocyanate) (MCHI), were investigated by differential scanning calorimetry (DSC). The effect of two cure catalysts, viz., dibutyl tin dilaurate (DBTDL) and ferrric tris-acetylacetonate (FeAA) on the cure reactions was also studied. Cure kinetics was evaluated using the multiple heating rate Ozawa method. The reactivities of the three isocyanates and catalytic efficiencies were compared based on the DSC reaction temperatures, activation energies and rate constants. Viscosity build-up in these systems at isothermal temperature was also studied and compared with the results from DSC.