Effect of tip clearance on the cooling performance of a microchannel heat sink

In this paper, the effect of tip clearance on the cooling performance of the microchannel heat sink is presented under the fixed pumping power condition. The thermal resistance of a microchannel heat sink is defined for evaluating its cooling performance. The effect of tip clearance is numerically investigated by increasing tip clearance from zero under the fixed pumping power condition. From the numerical results, the optimized tip clearance is determined, for which the thermal resistance has a minimum value. Finally, we show that the presence of tip clearance can improve the cooling performance of a microchannel heat sink when tip clearance is smaller than a channel width.     

Numerical Analysis of Flow and Thermal Performance of Liquid-Cooling Microchannel Heat Sinks with Bifurcation

Single-phase liquid-cooling microchannels have received great attention to remove the gradually increased heat loads of heat sinks. Proper changes of the flow path and/or heat transfer surface can result in much better thermal performance of microchannel heat sinks. In this study, a kind of rectangular straight microchannel heat sink with bifurcation flow arrangement has been designed, and the corresponding laminar flow and heat transfer have been investigated numerically. Four different configurations are considered. The effects of the bifurcation ratio (the initial channel number over the bifurcating channel number) and length ratio (the channel length before bifurcation over the bifurcation channel length) on laminar heat transfer, pressure drop, and thermal resistance are considered and compared with those of the traditional straight microchannel heat sink without bifurcation flow. The overall thermal resistances subjected to inlet Reynolds number and pumping power are compared for the five microchannel heat sinks. Results show that the thermal performance of the microchannel heat sink with bifurcation flow is better than that of the corresponding straight microchannel heat sink. The heat sinks with larger bifurcation ratio and length ratio provide much better thermal performance. It is suggested to employ bifurcation flow path in the liquid-cooling microchannel heat sinks to improve the overall thermal performance by proper design of the bifurcation position and number of channels.     

Numerical Analysis of Constructal Water-Cooled Microchannel Heat Sinks with Multiple Bifurcations in the Entrance Region

The Constructal Theory is applied to obtain better thermal performance from a type of microchannel heat sink. Based on a smooth, straight, rectangular microchannel heat sink (Case 1), three different configurations of constructal multiple bifurcation are designed for the entrance region of each microchannel. These types are one bifurcation (Case 2), two bifurcations with the second placed in the front part (Case 3), and two bifurcations with the second bifurcation placed in the front part (Case 4). The corresponding laminar flow and heat transfer fields are investigated numerically by means of computational fluid dynamics. The effects of the bifurcation number and length ratio on pressure drop and overall thermal resistance are observed. The overall thermal resistance for the four microchannel heat sinks is compared when subjected to pumping power. It is found that designing one or two bifurcations (Cases 2, 3, 4) in the entrance region can improve thermal performance effectively. It is also recommended to place the second bifurcation in the back part (Case 4) of the microchannel heat sinks to obtain good overall thermal performance by proper design of the bifurcation position and number of channels.     

Numerical simulation and multiobjective optimization of a microchannel heat sink with arc-shaped grooves and ribs

ABSTRACT

In order to obtain the optimal structure size of a microchannel heat sink (MCHS) with arc-shaped grooves and ribs according to the actual demand, multiple parameters that influence the performance of the microchannel are analyzed by combining the multi-objective evolutionary algorithm (MOEA) with computational fluid dynamics (CFD). The design variables include the relative groove height, relative rib height and relative rib width, and the two objective functions are to minimize the total thermal resistance and pumping power in constant volume flow rate. The influences of the design variables on the two objective functions are analyzed by CFD firstly. The results show that each design variable has a different impact on the two functions. The competitive relationship between the two objective functions is depicted in plots of the Pareto front obtained by MOEA. Pareto sensitivity analysis is carried out to find that the relative rib height has the most significant impact on the two objective functions.     

Conjugate heat transfer in fractal-shaped microchannel network heat sink for integrated microelectronic cooling application

The hydrodynamic and thermal characteristics of fractal-shaped microchannel network heat sinks are investigated numerically by solving three-dimensional N–S equations and energy equation, taking into consideration the conjugate heat transfer in microchannel walls. It is found that due to the structural limitation of right-angled fractal-shaped microchannel network, hotspots may appear on the bottom wall of the heat sink where the microchannels are sparsely distributed. With slight modifications in the fractal-shaped structure of microchannels network, great improvements on hydrodynamic and thermal performance of heat sink can be achieved. A comparison of the performance of modified fractal-shaped microchannel network heat sink with parallel microchannels heat sink is also conducted numerically based on the same heat sink dimensions. It is found that the modified fractal-shaped microchannel network is much better in terms of thermal resistance and temperature uniformity under the conditions of the same pressure drop or pumping power. Therefore, the modified fractal-shaped microchannel network heat sink appears promising to be used for microelectronic cooling in the future.     

Constructal design and thermal analysis of microchannel heat sinks with multistage bifurcations in single-phase liquid flow

Based on constructal theory, five different cases with multistage bifurcations are designed as well as one case without bifurcations, and the corresponding laminar fluid flow and thermal performance have been investigated numerically. All laminar fluid flow and heat transfer results are obtained using computation fluid dynamics, and a uniform wall heat flux thermal boundary condition is applied all heated surfaces. The inlet velocity ranges from 0.66 m/s to 1.6 m/s with the corresponding Reynolds number ranging from 230 to 560. The pressure, velocity, temperature distributions and averaged Nusselt number are presented. The overall thermal resistances versus inlet Reynolds number or pumping power are evaluated and compared for the six microchannel heat sinks. Numerical results show that the thermal performance of the microchannel heat sink with multistage bifurcation flow is better than that of the corresponding straight microchannel heat sink. The heat sink with a long bifurcation length in the first stage (Case 1A) is superior. The usage of multistage bifurcated plates in microchannel heat sink can reduce the overall thermal resistance and make the temperature of the heated surface more uniform (Case 3). It is suggested that proper design of the multistage bifurcations could be employed to improve the overall thermal performance of microchannel heat sinks and the maximum number of stages of bifurcations is recommended to be two. The study complements and extends previous works.     

Effects of tapered-channel design on thermal performance of microchannel heat sink

A channel with a height- or width-tapered variation is designed to improve the thermal performance of a microchannel heat sink (MCHS). To this end, a three-dimensional MCHS model is constructed to analyze the effects of the height- and width-tapered ratios on the thermal performance of the MCHS. The thermal resistance and temperature distribution are taken as the thermal performance indicators. Numerical predictions show that the relationship between the thermal resistance and the width-tapered ratio is not monotonic at the fixed pumping power. The thermal resistance first decreases and then increases. A similar behavior is also exhibited by the height-tapered ratio. However, the height-tapered ratio effects can be negligible. It is also found that the width-tapered-channel design has a lower and a relatively uniform temperature distribution compared to parallel or height-tapered channel design. Moreover, the MCHS with width-tapered channel design showed a maximum enhancement in thermal performance of around 16.7% over that of the parallel-channel design when the pumping power is larger than 0.4 W.     

Analysis of heat transfer characteristics of double-layered microchannel heat sink

Numerical analysis is performed to examine the heat transfer characteristics of a double-layered microchannel heat sink. The three-dimensional governing equations are solved by the finite volume method. The effects of substrate materials, coolants, and geometric parameters such as channel number, channel width ratio, channel aspect ratio, substrate thickness, and pumping power on the temperature distribution, pressure drop, and thermal resistance are discussed. Predictions show that the heat transfer performance of the heat sink is improved for a system with substrate materials having a higher thermal conductivity ratio. A coolant with high thermal conductivity and low dynamic viscosity also enhances the heat transfer performance. The pressure drop decreases with the channel aspect ratio and channel width ratio. Further, the thermal resistance of the microchannel heat sink can be minimized by optimizing the geometric parameters. Finally, the results show that for the same geometric dimensions, the thermal performance of the double-layered microchannel heat sink is better than that of the single-layered one, by an average of 6.3%.     

Cooling performance of a microchannel heat sink with nanofluids

In this paper, the cooling performance of a microchannel heat sink with nanoparticle–fluid suspensions (“nanofluids”) is numerically investigated. By using a theoretical model of thermal conductivity of nanofluids that accounts for the fundamental role of Brownian motion, we investigate the temperature contours and thermal resistance of a microchannel heat sink with nanofluids such as 6 nm copper-in-water and 2 nm diamond-in-water. The results show that the cooling performance of a microchannel heat sink with water-based nanofluids containing diamond (1 vol.%, 2 nm) at the fixed pumping power of 2.25 W is enhanced by about 10% compared with that of a microchannel heat sink with water. Nanofluids reduce both the thermal resistance and the temperature difference between the heated microchannel wall and the coolant. Finally, the potential of deploying a combined microchannel heat sink with nanofluids as the next generation cooling devices for removing ultra-high heat flux is shown.     

Enhanced multi-objective optimization of a microchannel heat sink through evolutionary algorithm coupled with multiple surrogate models

A liquid flow microchannel heat sink has been optimized with the help of three-dimensional numerical analysis and multiple surrogate methods. Two objective functions, thermal resistance and pumping power have been selected to assess the performance of the microchannel heat sink. The design variables related to the width of the microchannel at the top and bottom, depth of the microchannel, and width of fin, which contribute to objective functions, have been identified and a three-level full factorial design was selected to exploit the design space. The numerical solutions obtained at these design points were utilized to construct surrogate models, namely Response Surface Approximations, Kriging and Radial Basis Neural Network. A hybrid multi-objective evolutionary algorithm coupled with surrogate models is applied to find out global Pareto-optimal solutions. The accuracy of the surrogate models has been discussed in view of their predictions and trade-off analysis was performed in view of conflicting nature of the two objectives. The Pareto-optimal sensitivity of the design variables has been found out to economically compromise with the design variables. The application of the multiple surrogate methods not only improves quality of multi-objective optimization but also gives the feedback of the fidelity of the optimization model.     

Optimization of heat sink geometries for impingement air-cooling of LSI packages

This paper describes the use of our previous study's prediction procedures for calculating thermal resistance and pressure drop. The procedures are used in the optimization of heat sink geometries for impingement air-cooling of LSI packages. Two types of heat sinks are considered: ones with longitudinal fins and ones with pin fins. We optimized the heat sink geometries by evaluating 16 parameters simultaneously. The parameters included fin thickness, spacing, and height. For the longitudinal fins, the optimal fin thicknesses were found to be between 0.12 and 0.15 mm, depending on which of the four types of fans were used. For pin fins, the optimal pin diameters were between 0.39 and 0.40 mm. Under constant pumping power, the optimal thermal resistance of the longitudinal fins was about 60% that of the pin fins. For both types of heat sinks, the optimal thermal resistance for four off-the-shelf fans was only slightly (maximum about 1%) higher than the theoretical optimum for the same pumping power. When manufacturing cost performance is considered, the most economical fin thickness and diameter are about 5 to 10 times higher than the optimal values calculated without respect for manufacturing costs. These values almost correspond to the actual limits of extrusion and press heat-sink manufacturing processes. © 1999 Scripta Technica, Heat Trans Asian Res, 28(2): 138–151, 1999     

An experimental investigation of forced convective cooling performance of a microchannel heat sink with Al2O3/water nanofluid

Experiments were conducted to investigate forced convective cooling performance of a copper microchannel heat sink with Al₂O₃/water nanofluid as the coolant. The microchannel heat sink fabricated consists of 25 parallel rectangular microchannels of length 50 mm with a cross-sectional area of 283 μm in width by 800 μm in height for each microchannel. Hydraulic and thermal performances of the nanofluid-cooled microchannel heat sink have been assessed from the results obtained for the friction factor, the pumping power, the averaged heat transfer coefficient, the thermal resistance, and the maximum wall temperature, with the Reynolds number ranging from 226 to 1676. Results show that the nanofluid-cooled heat sink outperforms the water-cooled one, having significantly higher average heat transfer coefficient and thereby markedly lower thermal resistance and wall temperature at high pumping power, in particular. Despite the marked increase in dynamic viscosity due to dispersing the alumina nanoparticles in water, the friction factor for the nanofluid-cooled heat sink was found slightly increased only.     

Analysis and optimization of electrokinetic microchannel heat sink

A mixed (electroosmotic and pressure-driven) flow microchannel heat sink has been studied and optimized with the help of three-dimensional numerical analysis, surrogate methods, and the multi-objective evolutionary algorithm. Two design variables; the ratio of the microchannel width-to-depth and the ratio of fin width-to-depth of the microchannel are selected as the design variables while design points are selected through a four-level full factorial design. The single-objective optimization is performed taking overall thermal resistance as the objective function and Radial Basis Neural Network as the surrogate model while for multi-objective optimization pumping power is considered as the objective function along with the thermal resistance. It is observed that the optimum design shifted towards the lower values of the ratio of the channel width-to-depth and the higher values of the ratio of fin width-to-depth of channel with increase of the driving source. The trade-off between the two conflicting objectives has been found and discussed in detail in light of the distribution of Pareto-optimal solutions in the design space. The ratio of channel width-to-depth is found to be higher Pareto-sensitive (sensitivity along the Pareto-optimal front) than the ratio of fin width-to-depth of the channel.     

Optimization of a Microchannel Heat Sink with Varying Channel Heights and Widths

The optimal tapered channel design of a microchannel heat sink is obtained by a combined optimization procedure that includes a model of a three-dimensional microchannel heat sink and a simplified conjugate-gradient method. The objective function to be minimized is the overall thermal resistance with the number of channels N, channel-width ratio β, height-tapered ratio Λ _y , and width-tapered ratio Λ _z as the design parameters. It is shown that the thermal resistance in all its relationships with the individual parameters exhibits a decrease followed by an increase. The thermal resistance is sensitive to the variations in the channel number, channel-width ratio, or width-tapered ratio while less sensitive to the height-tapered ratio. Optimization results show that for a given pumping power (0.5 W), the optimal design variables are N = 78, β = 0.78, Λ _z  = 0.59, and Λ _y  = 0.81 with a corresponding minimum overall thermal resistance of 0.087 K W^?1. These optimal design variables produce a 37.6% decrement in thermal resistance compared to the initial parallel-channel design estimate (N = 71, β = 0.85, Λ _z  = 0.99, and Λ _y  = 0.99). Additionally, as the pumping power increases, the optimal thermal resistance decreases and the corresponding optimal values of N increase; whereas, β, Λ _z , and Λ _y decrease.     

Optimal thermal design of microchannel heat sinks with different geometric configurations

In this study, three-dimensional models of microchannel heat sinks (MCHSs) with different geometric configurations (such as single-layered- (SL), double-layered- (DL) or tapered-(T)-channels) are constructed by an optimization procedure. This procedure integrates a direct problem solver with a simplified conjugate-gradient method as the optimizer. The overall thermal resistance of an MCHS is the objective function to be minimized with respect to geometric parameters, such as the number of channels, channel width ratio, channel aspect ratio and tapered ratios, as the search variables. The optimal thermal resistance is found to decrease in the following order: the initial guess parallel channel (IGP channel), SL-, DL- and T-channel designs. In addition, the T-channel design has the minimum temperature difference and the most uniform temperature distribution, followed by the DL-, SL- and IGP-channel designs. Moreover, the optimal thermal resistance reduces with the pumping power for the various channel configuration designs, and the lowest thermal resistance corresponds to the T-channel design. The larger the pumping power, the larger the decrement in thermal resistance. Therefore, the optimal T-channel is the best MCHS design when considering thermal resistance and temperature distribution uniformity.     

Optimum thermal performance of microchannel heat sink by adjusting channel width and height

A three-dimensional numerical model of the microchannel heat sink is presented to study the effects of heat transfer characteristics due to various channel heights and widths. Based on the theory of a fully developed flow, the pressure drop in the microchannel is derived under the requirement of the flow power for a single channel. The effects of two design variables representing the channel width and height on the thermal resistance are investigated. In addition, the constraint of the same flow cross section is carried out to find the optimum dimension. Finally, the minimum thermal resistance and optimal channel width with various flow powers and channel heights are obtained by using the simulated annealing method.     

Analytical analysis of heat transfer and pumping power of laminar nanofluid developing flow in microchannels

Thermal management issues are limiting barriers to high density electronics packaging and miniaturization. Liquid cooling using micro and mini channels is an attractive alternative to large and bulky aluminum or copper heat sinks. These channels can be integrated directly into a chip or a heat spreader, and cooling can be further enhanced using nanofluids (liquid solutions with dispersed nanometer-sized particles) due to their enhanced heat transfer effects reported in literature. The goals of this study are to evaluate heat transfer improvement of a nanofluid heat sink with developing laminar flow forced convection, taking into account the pumping power penalty. The phrase heat transfer enhancement ratio (HTR) is used to denote the ratio of average heat transfer coefficient of nanofluid to water at the same pumping power. The proposed model uses semi-empirical correlations to calculate nanofluid thermophysical properties. The predictions of the model are found to be in good agreement with experimental studies. The validated model is used to identify important design variables (Reynolds number, volume fraction and particle size) related to thermal and flow characteristics of the microchannel heat sink with nanofluids. Statistical analysis of the model showed that the volume fraction is the most significant factor impacting the HTR, followed by the particle diameter. The impact of the Reynolds number and other interaction terms is relatively weak. The HTR is maximized at smallest possible particle diameter (since smaller particles improve heat transfer but do not impact pumping power). Then, for a given Reynolds number, an optimal value of volume fraction can be obtained to maximize HTR. The overall aim is to present results that would be useful for understanding and optimal design of microchannel heat sinks with nanofluid flow.     

Enhancement of thermal performance in double-layered microchannel heat sink with nanofluids

A three-dimensional analysis aimed at enhancing the thermal performance of a double-layered microchannel heat sink by using a nanofluid and varying the geometric parameters has been conducted. A system of fully elliptic equations that govern the flow and thermal fields are solved using the finite volume method. The analysis indicates that the dominant factors determining the thermal resistance of the channel include the type of nanofluid; particle volume fraction; geometric parameters of the channel, such as the channel number, channel width ratio, channel aspect ratio; and pumping power. The results indicate that the greatest enhancement in channel cooling can be expected when an Al₂O₃–water nanofluid is used. The thermal resistance of the channel can be minimized by properly adjusting the particle volume fraction under various pumping powers; the minimum thermal resistance depends on the geometric parameters. The study also reveals that the relationship between the thermal resistance and channel number, channel width ratio, or channel aspect ratio exhibits a decrease followed by an increase. The thermal performance of the channel can usually be improved by decreasing the channel number or channel aspect ratio, or increasing the channel width ratio. Finally, increasing the pumping power reduces the overall thermal resistance. An Al₂O₃ (1%)–water nanofluid shows an average improvement in thermal performance of 26% over that of pure water for a given pumping power. However, the design’s effectiveness declines significantly under high pumping power. In particular, the thermal resistance obtained by employing nanofluids was not necessarily lower than that of water under all pumping powers, but it can be reduced by properly adjusting the geometric parameters under optimal conditions.     

Optimum thermal design of microchannel heat sinks by the simulated annealing method

By adopting the simulated annealing method, a three-dimensional numerical simulation is executed to minimize the thermal resistance of the microchannel heat sink corresponding to the optimum specification under the fixed flow power. The depths of the microchannel heat sink in this study are fixed at either 1 cm or 2 cm. Based on the theory of the fully developed flow, the pressure drop between the inlet and exit in each single channel can be analytically derived if the flow power and the associated specification of the microchannel heat sink are fixed in advance. Then, this pressure drop will be used as the input condition to calculate the temperature distribution of the microchannel heat sink. For the first part of the optimum analysis, the fin width, and channel width are chosen as the design variables to find their optimum sizes. As to the second part of the present analysis, three design variables including channel height, fin width and channel width are individually prescribed as a suitable range to search for their optimum geometric configuration when the other specifications of the microchannel heat sink are fixed as 24 different cases.     

Optimization of thermal performances and pressure drop of rectangular microchannel heat sink using aqueous carbon nanotubes based nanofluid

The present work focuses on analytical optimization of a rectangular microchannel heat sink using aqueous carbon nanotubes based nanofluid as coolant. The particles weight concentration used in this study is 0.01%. The density, the thermal conductivity and the rheological behavior of the nanofluid are experimentally investigated in order to evaluate the thermal resistance and the pumping power in microchannel under laminar flow. An analytical approach of optimization scheme was applied; it is compiled from a systematic thermal resistance model as an analysis method and the elitist non-dominated sorting genetic algorithm (NSGA2). The effects of the temperature, the channel aspect ratio, the channel wall ratio and the use of aqueous carbon nanotubes based nanofluid on the thermal resistance and the pumping power are investigated. The optimized results showed that use of the nanofluid as a working fluid reduce the total thermal resistance and can enhance significantly the thermal performances of the working fluid at high temperatures.