Synthesis and properties of methyl hexahydrophthalic anhydride‐cured fluorinated epoxy resin 2,2‐bisphenol hexafluoropropane diglycidyl ether

The fluorinated epoxy resin, 2,2‐bisphenol hexafluoropropane diglycidyl ether (DGEBHF) was synthesized through a two‐step procedure, and the chemical structure was confirmed by ¹H n uclear magnetic resonance (NMR), ¹³C NMR, and Fourier transform infrared (FTIR) spectra. Moreover, DGEBHF was thermally cured with methyl hexahydrophthalic anhydride (MHHPA). The results clearly indicated that the cured DGEBHF/MHHPA exhibited higher glass transition temperature (T_g 147°C) and thermal decomposition temperature at 5% weight loss (T₅ 372°C) than those (T_g 131.2°C; T₅ 362°C) of diglycidyl ether of bisphenol A (DGEBA)/MHHPA. In addition, the incorporation of bis‐trifluoromethyl groups led to enhanced dielectric properties with lower dielectric constant (D_k 2.93) of DGEBHF/MHHPA compared with cured DGEBA resins (D_k 3.25). The cured fluorinated epoxy resin also gave lower water absorption measured in two methods relative to its nonfluorinated counterparts. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 2801–2808, 2013     

Preparation and properties of bio‐based epoxy montomorillonite nanocomposites derived from polyglycerol polyglycidyl ether and ε‐polylysine

Glycerol polyglycidyl ether (GPE) and polyglycerol polyglycidyl ether (PGPE) were cured with ε‐poly(L ‐lysine) (PL) using epoxy/amine ratios of 1 : 1 and 2 : 1 to create bio‐based epoxy cross‐linked resins. When PGPE was used as an epoxy resin and the epoxy/amine ratio was 1 : 1, the cured neat resin showed the greatest glass transition temperature (T_g), as measured by differential scanning calorimetry. Next, the mixture of PGPE, PL, and montomorillonite (MMT) at an epoxy/amine ratio of 1 : 1 in water was dried and cured finally at 110°C to create PGPE‐PL/MMT composites. The X‐ray diffraction and transmission electron microscopy measurements revealed that the composites with MMT content 7–15 wt % were exfoliated nanocomposites and the composite with MMT content 20 wt % was an intercalated nanocomposite. The T_g and storage modulus at 50–100°C for the PGPE‐PL/MMT composites measured by DMA increased with increasing MMT content until 15 wt % and decreased at 20 wt %. The tensile strength and modulus of the PGPE‐PL/MMT composites (MMT content 15 wt %: 42 and 5300 MPa) were much greater than those of the cured PGPE‐PL resin (4 and 6 MPa). Aerobic biodegradability of the PGPE‐PL in an aqueous medium was ～ 4% after 90 days, and the PGPE‐PL/MMT nanocomposites with MMT content 7–15 wt % showed lower biodegradability. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Nano‐AlN functionalization by silane modification for the preparation of covalent‐integrated epoxy/poly(ether imide) nanocomposites

Aluminum nitride nanoparticle (nano‐AlN) organically modified with the silane‐containing epoxide groups (3‐glycidoxypropyltrimethoxy silane, GPTMS) was incorporated into a mixture of poly(ether imide) (PEI), and methyl hexahydrophthalic anhydride‐cured bisphenol A diglycidyl ether grafted by GPTMS was prepared for nanocomposite. Scanning electron microscopy, transmission electron microscopy, and atomic force microscopy were used to investigate the microscopic structures of nanocomposites. According to experimental results, it was shown that addition of nano‐AlN and PEI into the modified epoxy could lead to the improvement of the impact and bend strengths. When the concentrations of nano‐AlN and PEI were 20 and 10 pbw, respectively, the toughness/stiffness balance could be achieved. Dynamic mechanical analysis (DMA) results displayed that two glass transition temperatures (T_g) found in the nanocomposites were assigned to the modified epoxy phase and PEI phase, respectively. As nano‐AlN concentration increased, T_g value of epoxy phase had gradually increased, and the storage modulus of the nanocomposite at the ambient temperature displayed an increasing tendency. Additionally, thermal stability of the nanocomposite was apparently improved. The macroscopic properties of nanocomposites were found to be strongly dependent on their components, concentrations, dispersion, and resulted morphological structures. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Effects of high nano‐SiO2 contents on properties of epoxy‐modified polybenzoxazine

High‐performance nanosilica composites based on epoxy‐modified polybenzoxazine matrices are developed. Chemorheological study of benzoxazine–epoxy resin mixtures reveals that processing window of the benzoxazine resin (BA‐a) is substantially broadened with an addition of the liquid epoxy. Glass transition temperature (T _g) of the BA‐a copolymerized with epoxy resin shows a synergistic behavior with a maximum T _g value (174°C) at the benzoxazine–epoxy mass ratio of 80:20. The copolymer at this composition is also used as a matrix for nano‐SiO₂ composites. A very low melt viscosity of the benzoxazine–epoxy mixtures promotes good processability with the maximum attainable nano‐SiO₂ loading up to 35 wt%. From scanning electron microscopy investigation, fracture surface of the 35 wt% nano‐SiO₂‐filled benzoxazine–epoxy composite reveals relatively homogeneous distribution of the nano‐SiO₂ in the copolymer with good particle wet‐out. In addition, very high reinforcing effect was also observed in such high content of the nano‐SiO₂, i.e., about 2.5 times in modulus improvement. This improvement is attributed to the strong bonding between the copolymer matrix and the nano‐SiO₂ through ether linkage as confirmed by Fourier‐transform infrared investigation. POLYM. COMPOS., 38:2261–2271, 2017. © 2015 Society of Plastics Engineers     

Rubber‐like thermosetting epoxy asphalt composites exhibiting atypical yielding behaviors

Rubber‐like thermosetting epoxy asphalt composites (REACs) were prepared by curing epoxy resin (diglycidyl ether of bisphenol A) with curing agents system made up of maleated petroleum asphalt, adipic acid, and methylhexahydrophthalic anhydride. REACs' glass transition temperatures (T_g) and mechanics performances were investigated by differential scanning calorimetry (DSC) and universal tester, respectively. DSC results indicated that REACs had homogeneous phase structures, and their T_g were lower than room temperature. Large elongation at break (ε_b), as high as 150–286%, and atypical yielding behaviors similar to so‐called “hard elastic” thermoplastics were observed simultaneously for the first time as to thermosetting epoxy composites at room temperature. The striking characteristics of REACs were ascribed to the formation of unique asphalt‐filled bimodal networks, consisting of simultaneous cured maleated asphalt short‐chain and dicarboxylic acid long‐chain interpenetrating bimodal networks and wherewith filled unmaleated asphalt. The experimental results suggest that these inexpensive REACs may find promising applications in many engineering fields. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Highly reversible and repeatable PTCR characteristics of PMMA/Ag‐coated glass bead composites based on CTE mismatch phenomena

Positive temperature coefficient of resistivity (PTCR) behavior of poly(methyl methacrylate) PMMA/silver (Ag)‐coated glass bead composites has been investigated with reference to the conventional PMMA/carbon black (CB) composites. The PMMA/CB composites showed a sudden rise in resistivity (PTC trip) at 115°C, close to the glass transition temperature (T _g, 113°C) of the PMMA. However, the PTC trip temperature (92°C) of PMMA/Ag‐coated glass bead composites was appeared well below the T _g of PMMA. The room temperature resistivity and PTC trip temperature of the composites were also very much stable upon thermal cycling. Addition of 1 phr of nanoclay increased the PTC trip temperature of PMMA/CB composites to 120°C, close to the T _g (118°C) of PMMA/clay nanocomposites, while PMMA/clay/Ag‐coated glass bead nanocomposites showed the PTC trip at 98°C. We proposed that the mismatch in coefficient of thermal expansion (CTE) between PMMA and glass beads played a key role that led to a disruption in continuous network structure of Ag‐coated glass beads even at a temperature well below the T _g of PMMA. The decrease in dielectric permittivity of PMMA/Ag‐coated glass bead composites on increasing frequency indicated possible use of the PTC composites as dielectric material. POLYM. ENG. SCI., 2011. © 2011 Society of Plastics Engineers     

Thermal and mechanical properties of tetra‐functional mesogenic type epoxy resin cured with aromatic amine

A novel tetra‐functional epoxy monomer with mesogenic groups was synthesized and characterized by ¹H‐NMR and FTIR. The synthesized epoxy monomer was cured with aromatic amine to improve the thermal property of epoxy/amine cured system. The glass transition temperature (T_g) and coefficient of thermal expansion (CTE) of the cured system were investigated by dynamic mechanical analysis and thermal mechanical analysis. The properties of the cured system were compared with the conventional bisphenol‐A type epoxy and mesogenic type epoxy system. The storage modulus of the tetra‐functional mesogenic epoxy cured systems showed the value of 0.96 GPa at 250 °C, and T_g‐less behavior was clearly observed. The cured system also showed a low CTE at temperatures above 150 °C without incorporation of inorganic components. These phenomena were achieved by suppression of the thermal motion of network chains by introduction of both mesogenic groups and branched structure to increase the cross linking density. The temperature dependency of the tensile property and thermal conductivity of the cured system was also investigated. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46181.     

Curing of epoxy systems at sub‐glass transition temperature

Three epoxy‐amine thermoset systems were cured at a low ambient temperature. Evolution of the reaction kinetics and molecular structure during cure at the sub‐glass transition temperature was followed by DSC and chemorheology experiments. The effect of vitrification and the reaction exotherm on curing and final mechanical properties of the epoxy thermosets was determined. Thermomechanical properties of the low‐temperature cured systems depend on the reaction kinetics and volume of the reaction mixture. Curing of the fast‐reacting system in a large volume (12‐mm thick layer) resulted in the material with T_g exceeding the cure temperature by 70–80°C because of an exothermal temperature rise. However, the reaction in a too large volume (50‐mm layer) led to thermal degradation of the network. In contrast, thin layers (1.5 mm) were severely undercured. Well‐cured epoxy thermosets could be prepared at sub‐T_g temperatures by optimizing reaction conditions. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 99: 3669–3676, 2006     

Study of dynamically cured PP/MAH‐g‐PP/talc/epoxy composites

In the present study, an epoxy resin was dynamically cured in a polypropylene (PP)/maleic anhydride–grafted PP (MAH‐g‐PP)/talc matrix to prepare dynamically cured PP/MAH‐g‐PP/talc/epoxy composites. An increase in the torque at equilibrium showed that epoxy resin in the PP/MAH‐g‐PP/talc composites had been cured by 2‐ethylene‐4‐methane‐imidazole. Scanning electron microscopy analysis showed that MAH‐g‐PP and an epoxy resin had effectively increased the interaction adhesion between PP and the talc in the PP/talc composites. Dynamic curing of the epoxy resin further increased the interaction adhesion. The dynamically cured PP/MAH‐g‐PP/talc/epoxy composites had higher crystallization peaks than did the PP/talc composites. Thermogravimetric analysis showed that the addition of MAH‐g‐PP and the epoxy resin into the PP/talc composites caused an obvious improvement in the thermal stability. The dynamically cured PP/MAH‐g‐PP/talc/epoxy composites had the best thermal stability of all the PP/talc composites. The PP/MAH‐g‐PP/talc/epoxy composites had better mechanical properties than did the PP/MAH‐g‐PP/talc composites, and the dynamically cured PP/MAH‐g‐PP/talc/epoxy composites had the best mechanical properties of all the PP/talc composites, which can be attributed to the better interaction adhesion between the PP and the talc. The suitable content of epoxy resin in the composites was about 5 wt %. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci, 2006     

Intercalation and exfoliation of clay nanoplatelets in epoxy‐based nanocomposites: TEM and XRD observations

Diglycidyl ether of bisphenol A (DGEBA) and diglycidyl ether of bisphenol F (DGEBF) reinforced with organo‐montmorillonite clay nanoplatelets were investigated using anhydride‐ and amine‐curing agents. The sonication technique was used to process epoxy/clay nanocomposites. The basal spacing of clay nanoplatelets was observed by wide‐angle X‐ray scattering (WAXS), small‐angle X‐ray scattering (SAXS) techniques, and transmission electron microscopy. It was found that the basal spacing of clay nanoplatelets in epoxy matrix was expanded after mixing with either DGEBA/DGEBF or methyltetrahydrophthalic‐anhydride (MTHPA) curing agent. The sonication technique provided larger d‐spacing of clay nanoplatelets. Because of the different curing temperatures, MTHPA‐cured epoxy/clay nanocomposites produced more expanded d‐spacing of clay nanoplatelets modified with methyl, tallow, bis(2‐hydroxyethyl) quaternary ammonium (MT2EtOH) than triethylenetetramine‐cured nanocomposites. Depending on the selection of curing agent and organic modification for clay nanoplatelets, the d‐spacing was expanded to be up to 8.72 nm. POLYM. ENG. SCI., 46:452–463, 2006. © 2006 Society of Plastics Engineers     

Aging of anhydride‐hardened epoxies in lubricants at elevated temperatures

In automotive under‐the‐hood applications, electronics respectively their packaging materials come in contact with automotive fluids. The effect of automatic transmission fluid (ATF) on an anhydride‐cured epoxy was investigated at temperatures up to 180 °C for up to 1000 h. This study has shown that ATF retards the oxidative aging of the epoxy, presumably due to oxygen consumption. Whereas in air the material underwent a thermo‐oxidative aging with a mass loss of up to 4% and a strong broadening of T_g to higher temperatures, in ATF a temperature dependent distinctive drop of T_g from 142 to 126 °C after 1000 h aging at 180 °C, and a mass loss of maximum 1% was observed which might be a thermal decomposition of the epoxy material. A slight broadening of the damping factors might indicate an intrusion of ATF components. A color change of the samples could be observed after aging in air and ATF, with the discoloration in air being more intense. An explanation for the color change might be either a minor amount of oxygen causing an oxidative discoloration reaction or the intrusion of colored ATF degradation products. While the oxidation‐kinetics in air exhibited Arrhenius temperature‐dependence the mechanism in ATF changed above 165 °C. An acceleration of aging tests at temperatures beyond 150 °C is, therefore, not possible. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44877.     

Effect of the filler size and content on the thermomechanical properties of particulate aluminum nitride filled epoxy composites

Polymer matrix composites based on brominated epoxy as the matrix and aluminum nitride (AlN) particles as the filler were prepared. The influences of the size, content, and size distribution of AlN on the thermomechanical properties, including the glass‐transition temperature (T_g), coefficient of thermal expansion (CTE), dynamic storage modulus (E′), dynamic loss modulus (E″), and loss factor (tan δ), of the composites were investigated by thermomechanical analysis and dynamic mechanical analysis. There was a total change trend for T_g; that is, T_g of the composites containing nano‐aluminum nitride (nano‐AlN; 50 nm) was lower than that of the micro‐aluminum nitride (micro‐AlN; 2.3 μm) filled composites, especially at high nano‐AlN contents. The T_g depression of the composites containing nano‐AlN was related to the aggregation of nano‐AlN and voids in the composites. On the other hand, the crosslink density of the epoxy matrix decreased for nano‐AlN‐filled composites, which also resulted in a T_g depression. The results also show that E′ and E″ increased, whereas tan δ and CTE of the composites decreased, with increasing the AlN content or increasing nano‐AlN fraction at the same AlN content. These results indicate that increasing the interfacial areas between AlN and the epoxy matrix effectively enhanced the dynamic modulus and decreased CTE. In addition, at a fixed AlN content of 10 wt %, a low E′ of pre‐T_g (before T_g temperature) and high T_g were observed at the smaller weight ratio of nano‐AlN when combinations of nano‐AlN plus micro‐AlN were used as the filler. This may have been related to the best packing efficiency at that weight ratio when the bimodal filler was used. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Preparation and dynamic mechanical properties of poly(styrene‐b‐butadiene)‐modified clay nanocomposites

Polybutyl acrylate (PBA) was intercalated into clay by the method of multistep exchange reactions and diffusion polymerization. The clay interlayer surface is modified, and obtaining the modified clay. The structures of the clay‐PBA, clay‐GA (glutamic acid), and the clay‐DMSO (dimethyl sulfoxide) were characterized using X‐ray diffraction (XRD). The new hybrid nanocomposite thermoplastic elastomers were prepared by the clay‐PBA with poly(styrene‐b‐butadiene) block copolymer (SBS) through direct melt intercalation. The dynamic mechanical analysis (DMA) curves of the SBS/modified clay nanocomposites show that partial polystyrene segments of the SBS have intercalated into the modified clay interlayer and exhibited a new glass transition at about 157°C (T_g3). The glass transition temperature of polybutadiene segments (T_g1) and polystyrene segments out of the modified clay interlayer (T_g2) are about ?76 and 94°C, respectively, comparied with about ?79 and 100°C of the neat SBS, and they are basically unchanged. The T_g2 intensity of the SBS‐modified clay decreases with increasing the amounts of the modified clay, and the T_g3 intensity of the SBS‐modified clay decreases with increasing the amounts of the modified clay up to about 8.0 wt %. When the contents of the modified clay are less than about 8.0 wt %, the SBS‐modified clay nanocomposites are homogeneous and transparent. The T_gb and T_gs of the SBS‐clay (mass ratio = 98.0/2.0) are ?78.39 and 98.29°C, respectively. This result shows that the unmodified clay does not essentially affect the T_gb and T_gs of the SBS, and no interactions occur between the SBS and the unmodified clay. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 1499–1503, 2002; DOI 10.1002/app.10353     

Thermal,mechanical, and dielectric studies on the DGEBA epoxy blends by using liquid oxidized poly(1,2‐butadiene) as a reactive component

Liquid oxidized poly(1,2‐butadiene) (LOPB) with multi epoxy groups is synthesized to modify diglycidyl end‐caped poly(bisphenol A‐co‐epichlorohydrin) (DGEBA) cured by 4,4′‐diaminodiphenyl sulfone (DDS). FTIR spectra shows that DGEBA and LOPB can be effectively cured by DDS, and the epoxide rubber particles are evenly distributed in the composites till their addition up to 20 wt % of DGEBA as seen from the scanning electron microscope (SEM). Their decomposition temperatures (Td) increase with the increase in LOPB addition at around 10 wt % of DGEBA while the Td for the composite containing 20 wt % LOPB of DGEBA is lower than that of the neat epoxy. The addition of LOPB improves their storage moduli and especially these values at temperatures higher above 150 °C; all the composites exhibit higher glass transition temperature (T_g) than that of the neat epoxy, and the maximum T_g reaches up to 255 °C for the composite containing 15 wt % LOPB of DGEBA. The incorporation of LOPB effectively decreases their dielectric constants and the composite with 10 wt % LOPB of DGEBA possesses the lowest one. The synergic improvements in their various properties are attributed to the networks formation via covalent linkage between the two phases in these reactive blends. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44689.     

Synthesis and characterization of bis(4‐cyanato‐3,5‐dimethylphenyl)anisylmethane/epoxy/glass fiber composites

Bis(4‐cyanato‐3,5‐dimethylphenyl)anisylmethane was prepared by treating CNBr with bis(4‐hydroxy‐3,5‐dimethylphenyl)anisylmethane and blended with commercial epoxy resin in different ratios and cured at 120°C for 2 h, 180°C for 1 h, and postcured at 220°C for 1 h using diamino diphenyl methane as curing agent. Castings of neat resin and blends were prepared and characterized. The composite laminates were also fabricated with glass fiber using the same composition. The tensile strength of the composites increased with increase in cyanate content (3, 6, and 9%) from 322 to 355 MPa. The fracture toughness values also increased from 0.7671 kJ/m², for neat epoxy resin, to 0.8615 kJ/m², for 9% cyanate ester‐modified epoxy system. The 10% weight loss temperature of pure epoxy (358°C) was increased to 390°C by the incorporation of cyanate ester resin. The incorporation of cyanate ester up to 9% in the epoxy resin increases the T_g from 143 to 147°C. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

High‐performance thermosetting films based on an amino‐functionalized poly(ether sulfone)

We have developed a sequence‐dependent synthesis of the amino‐functionalized poly(ether sulfone) P2 . The amino groups of P2 act as reactive sites toward epoxy resins. After curing P2 with diglycidyl ether of bisphenol A (DGEBA) and cresol novolac epoxy (CNE), we obtained the flexible, light‐yellow, transparent, epoxy thermosetting films P2 /DGEBA, and P2 /CNE, respectively, having glass transition temperatures (T_g) of 258 and 274°C, respectively. In addition, we also prepared a flexible film after condensation of the amino groups of P2 with the anhydride groups of 4,4′‐oxydiphthalic anhydride (ODPA); after imidization at 300°C for 1 h, the resulting P2 /ODPA thermosetting film possessed a value of T_g of 340°C. These three thermosetting films also exhibited flame retardancy with a UL‐94 VTM‐0 grade. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40980.     

Morphologies and properties of cured epoxy/brominated‐phenoxy blends

Morphologies of cured epoxy/brominated‐phenoxy blends were observed by scanning transmission electron microscopy (STEM) and energy dispersive X‐ray fluorescence spectroscopy (EDX). When brominated‐phenoxy content was 30 wt %, cocontinuous phase structures between cured epoxy and brominated‐phenoxy were found. Since every loss tangent (tan δ) curve as a function of temperature on dynamic mechanical analysis (DMA) showed 2 peaks at 128°C and 155°C respectively, cured epoxy phases and brominated‐phenoxy phases were incompatible together and T_gs of cured epoxy phases were not decreased. Tensile strength and tensile elongation of the cured blends were increased together. T‐peel adhesion strength and the lap‐shear adhesion strength were also increased together. These phenomena could be due to the cocontinuous structures consisted by the rigid cured epoxy phases of thermosets and ductile the brominated‐phenoxy phases of thermoplastics. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 1702–1713, 2007     

Preparation and characterizations of RTV epoxy blends using amide maleic anhydride‐g‐liquid polybutadience as both reactive toughening and curing components

Amide maleic anhydride‐g‐liquid polybutadience (AMALPB) was synthesized using maleic anhydride‐g‐liquid polybutadience (MALPB) with ethylenediamine (EDA), and its structure was confirmed by FTIR and ¹H‐nuclear magnetic resonance spectra, respectively. It was then used as a reactive toughening agent to make blends with diglycidyl end‐capped poly(bisphenol‐A‐co‐epichlorohydrin epoxy cured at room temperature. Their thermal decomposing behaviors did not show much difference because both EDA and AMALPB possessed similar aliphatic groups. All their glass transition temperatures (T_g) increased more than 10 °C than that of the neat epoxy, and with the addition of AMALPB, the blends were greatly strengthened upon heating as show from their storage moduli. When AMALPB was added at 10 wt %, its elongation at break increases to a maximum of 8.8% which was about two times higher than that of the neat epoxy, and its tensile strength also increased. However, the excessive addition of AMALPB resulted in an apparent decline in their tensile strength at content above 20%. The simultaneous improvements in both tensile strength and strain were attributed to the existence of well‐dispersed rubber particles in the continuous matrices performing plastic deformation that resulted from the chemical bonds of interfaces among the rubber particles and matrix, and meanwhile, inducing the deflection of the cracks. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 45985.     

Development of high‐performance epoxy/clay nanocomposites by incorporating novel phosphonium modified montmorillonite

Novel organoclays were synthesized by several kinds of phosphonium cations to improve the dispersibility in matrix resin of composites and accelerate the curing of matrix resin. The possibility of the application for epoxy/clay nanocomposites and the thermal, mechanical, and adhesive properties were investigated. Furthermore, the structures and morphologies of the epoxy/clay nanocomposites were evaluated by transmission electron microscopy. Consequently, the corporation of organoclays with different types of phosphonium cations into the epoxy matrix led to different morphologies of the organoclay particles, and then the distribution changes of silicate layers in the epoxy resin influenced the physical properties of the nanocomposites. When high‐reactive phosphonium cations with epoxy groups were adopted, the clay particles were well exfoliated and dispersed. The epoxy/clay nanocomposite realized the high glass‐transition temperature (T_g) and low coefficient of thermal expansion (CTE) in comparison with those of neat epoxy resin. On the other hand, in the case of low‐reactive phoshonium cations, the dispersion states of clay particles were intercalated but not exfoliated. The intercalated clay did not influence the T_g and CTE of the nanocomposite. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

PTCR characteristics of poly(styrene‐co‐acrylonitrile) copolymer/stainless steel powder composites

Positive temperature coefficient of resistivity (PTCR) characteristics of poly(styrene‐co‐acrylonitrile) copolymer (SAN)/stainless steel (SS) powder (80 wt %) composites prepared by melt‐mixing method has been investigated with reference to SAN/carbon black (CB) composites. The SAN/CB (10 wt %) composites showed a sudden rise in resistivity (PTC trip) at 125°C, above the glass transition temperature (T_g) of SAN (T_g ≈ 107°C). However, the PTC trip temperature of SAN/SS (80 wt %) composites appeared at 94°C, well below the T_g of SAN. Addition of 1 phr of nanoclay increased the PTC trip temperature of SAN/CB (10 wt %) composites to 130°C, while SAN/SS (80 wt %)/clay (1 phr) nanocomposites showed the PTC trip at 101°C. We proposed that the mismatch in coefficient of thermal expansion (CTE) between SAN and SS played a key role that led to a disruption in continuous network structure of SS even at a temperature below the T_g of SAN. The dielectric properties study of SAN/SS (80 wt %) composites indicated possible use of the PTC composites as dielectric material. DMA results showed higher storage modulus of SAN/SS composites than the SAN/CB composites. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012