A low voltage CMOS RF front-end for IEEE 802.11b WLAN transceiver

A low voltage CMOS RF front-end for IEEE 802.11b WLAN transceiver is presented. The problems to implement the low voltage design and the on-chip input/output impedance matching are considered, and some improved circuits are presented to overcome the problems. Especially, a single-end input, differential output double balanced mixer with an on-chip bias loop is analyzed in detail to show its advantages over other mixers. The transceiver RF front-end has been implemented in 0.18 um CMOS process, the measured results show that the Rx front-end achieves 5.23 dB noise figure, 12.7 dB power gain (50 ohm load), −18 dBm input 1 dB compression point (ICP) and −7 dBm IIP3, and the Tx front-end could output +2.1 dBm power into 50 ohm load with 23.8 dB power gain. The transceiver RF front-end draws 13.6 mA current from a supply voltage of 1.8 V in receive mode and 27.6 mA current in transmit mode. The transceiver RF front-end could satisfy the performance requirements of IEEE802.11b WLAN standard. Supported by the National Natural Science Foundation of China, No. 90407006 and No. 60475018.     

A 0.13 μm CMOS UWB RF Transmitter with an On‐Chip T/R Switch

This paper presents a fully integrated 0.13 μm CMOS MB‐OFDM UWB transmitter chain (mode 1). The proposed transmitter consists of a low‐pass filter, a variable gain amplifier, a voltage‐to‐current converter, an I/Q up‐mixer, a differential‐to‐single‐ended converter, a driver amplifier, and a transmit/receive (T/R) switch. The proposed T/R switch shows an insertion loss of less than 1.5 dB and a Tx/Rx port isolation of more than 27 dB over a 3 GHz to 5 GHz frequency range. All RF/analog circuits have been designed to achieve high linearity and wide bandwidth. The proposed transmitter is implemented using IBM 0.13 μm CMOS technology. The fabricated transmitter shows a ?3 dB bandwidth of 550 MHz at each sub‐band center frequency with gain flatness less than 1.5 dB. It also shows a power gain of 0.5 dB, a maximum output power level of 0 dBm, and output IP3 of +9.3 dBm. It consumes a total of 54 mA from a 1.5 V supply.     

一种基于OFDM的新型低功耗RF收发器设计

为实现低功耗信号传输,提出一种基于OFDM的IEEE 802.15.4g低功耗无线电频率（RF）收发器。该新型RF收发器电路由Tx BBA（基带模拟）、片上RF开关前端、Rx BBA及锁相环（PLL）构成,采用0.18?m CMOS技术制作,满足了IEEE 802.15.4g OFDM系统低功耗信号传输的需要。实际测试结果显示,相比传统的RF收发器,提出的RF收发器具有较低的功耗和良好的灵敏度,当电源电压为1.8 V时,Tx模式下会消耗14.7mA,Rx模式下会消耗15.7mA。     

A Single Transistor‐Level Direct‐Conversion Mixer for Low‐Voltage Low‐Power Multi‐band Radios

A CMOS direct‐conversion mixer with a single transistor‐level topology is proposed in this paper. Since the single transistor‐level topology needs smaller supply voltage than the conventional Gilbert‐cell topology, the proposed mixer structure is suitable for a low power and highly integrated RF system‐on‐a‐chip (SoC). The proposed direct‐conversion mixer is designed for the multi‐band ultra‐wideband (UWB) system covering from 3 to 7 GHz. The conversion gain and input P1dB of the mixer are about 3 dB and ?10 dBm, respectively, with multi‐band RF signals. The mixer consumes 4.3 mA under a 1.8 V supply voltage.     

一种用于900MHz射频识别(RFID)读写器芯片的1.8VCMOS直接变频接收机

设计了针对解决900MHz RFID读写器收发机芯片中本地载波干扰问题而优化的直接变频接收机,并在0.18μm 1P6M混合信号CMOS工艺上实现验证.设计中使用了一种串联反馈结构的基带放大器以达到同时实现无源混频器输出缓冲,直流消除以及信号放大的功能.实际测量显示,该接收机的输入1dB压缩点为-4dBm,当中频信号解调信噪比要求为10dB时,可达到的灵敏度为-70dBm.该接收机与整个收发机集成在同一块芯片中,使用1.8V电源电压,工作时静态电流为90mA.     

A monolithic 3.1-4.8 GHz MB-OFDM UWB transceiver in 0.18-μm CMOS

A monolithic RF transceiver for an MB-OFDM UWB system in 3.1-4.8 GHz is presented.The transceiver adopts direct-conversion architecture and integrates all building blocks including a gain controllable wideband LNA,a I/Q merged quadrature mixer,a fifth-order Gm-C bi-quad Chebyshev LPF/VGA,a fast-settling frequency synthesizer with a poly-phase filter,a linear broadband up-conversion quadrature modulator,an active D2S converter and a variablegain power amplifier.The ESD protected transceiver is fabricated in Jazz Semiconductor's 0.18-μm RF CMOS with an area of 6.1 mm2 and draws a total current of 221 mA from 1.8-V supply.The receiver achieves a maximum voltage gain of 68 dB with a control range of 42 dB in 6 dB/Step,noise figures of 5.5-8.8 dB for three sub-bands,and an inband/out-band IIP3 better than-4 dBm/+9 dBm.The transmitter achieves an output power ranging from-10.7 to-3dBm with gain control,an output P1dB better than-7.7 dBm,a sideband rejection about 32.4 dBc,and LO suppression of 31.1 dBc.The hopping time among sub-bands is less than 2.05 ns.     

A switch‐controlled multimode narrowband receiver RF front‐end

This work illustrates a flexible and convenient method to build a multimode narrowband receiver RF front‐end by means of controlled switches, switched capacitors, and switched inductors. The front‐end comprises a dual‐gain‐mode narrowband low‐noise amplifier (LNA) and a dual‐linearity‐mode mixer. A four‐mode receiver RF front‐end constructed with the dual‐gain‐mode LNA and the dual‐linearity‐mode mixer operating in frequency band range from 1800 to 2050 MHz was demonstrated with an IBM 90‐nm CMOS process. The front‐end achieves a 1/1.6 dB noise figure, 30/20 dB power gain, and 16/?10 dBm third‐order input intercept point while draws a 5.9/3.6 mA current from a 1.8‐V supply voltage at the low noise mode and high linearity mode, respectively. The proposed technique can be employed to build an intelligent mobile system.     

用于IEEE802．11b／g WLAN直接下变频接收机的射频前端设计

介绍了一种应用于IEEE802．11b／g无线局域网接收机射频前端的设计。基于直接下变频的系统架构。接收机集成了低噪声放大器、I／Q下变频器、去直流偏移滤波器、基带放大器和信道选择滤波器。电路采用TSMC0．18μm CMOS工艺设计,工作在2．4GHz ISM（工业、科学和医疗）频段,实现的低噪声放大器噪声系数为0．84dB,增益为16dB,S11低于-15dB,功耗为13mW;I／Q下变频器电压增益为2dB,输入1dB压缩点为-1 dBm,噪声系数为13dB,功耗低于10mw。整个接收机射频前端仿真得到的噪声系数为3．5dB,IIP3为-8dBm,IP2大于30dBm,电压增益为31dB,功耗为32mW。     

470-MHz–698-MHz IEEE 802.15.4m Compliant RF CMOS Transceiver

This paper proposes an IEEE 802.15.4m compliant TV white-space orthogonal frequency-division multiplexing (TVWS)-(OFDM) radio frequency (RF) transceiver that can be adopted in advanced metering infrastructures, universal remote controllers, smart factories, consumer electronics, and other areas. The proposed TVWS-OFDM RF transceiver consists of a receiver, a transmitter, a 25% duty-cycle local oscillator generator, and a delta-sigma fractional-N phase-locked loop. In the TV band from 470 MHz to 698 MHz, the highly linear RF transmitter protects the occupied TV signals, and the high-Q filtering RF receiver is tolerable to in-band interferers as strong as −20 dBm at a 3-MHz offset. The proposed TVWS-OFDM RF transceiver is fabricated using a 0.13-μm CMOS process, and consumes 47 mA in the Tx mode and 35 mA in the Rx mode. The fabricated chip shows a Tx average power of 0 dBm with an error-vector-magnitude of < 3%, and a sensitivity level of −103 dBm with a packet-error-rate of < 3%. Using the implemented TVWS-OFDM modules, a public demonstration of electricity metering was successfully carried out.     

应用于S波段AESA的射频收发前端设计

采用0．18μm Si RFCMOS工艺设计了应用于s波段AESA的高集成度射频收发前端芯片。系统由发射与接收前端组成,包括低噪声放大器、混频器、可变增益放大器、驱动放大器和带隙基准电路。后仿真结果表明,在3．3V电源电压下,发射前端工作电流为85mA,输出ldB压缩点为5．0dBm,射频输出在2～3．5GHz频带内电压增益为6．3～9．2dB,噪声系数小于14．5dB;接收前端工作电流为50mA,输入1dB压缩点为-5．6dBm,射频输入在2～3．5GHz频带内电压增益为12—14．5dB,噪声系数小于11dB;所有端口电压驻波比均小于1．8：芯片面积1．8×2．6mm0。     

A low noise CMOS RF front-end for UWB 6-9 GHz applications

An integrated fully differential ultra-wideband CMOS RF front-end for 6-9 GHz is presented.A resistive feedback low noise amplifier and a gain controllable IQ merged folded quadrature mixer are integrated as the RF front-end. The ESD protected chip is fabricated in a TSMC 0.13μm RF CMOS process and achieves a maximum voltage gain of 23-26 dB and a minimum voltage gain of 16-19 dB,an averaged total noise figure of 3.3-4.6 dB while operating in the high gain mode and an in-band IIP3 of-12.6 dBm while in th...     

A Dual‐Mode 2.4‐GHz CMOS Transceiver for High‐Rate Bluetooth Systems

This paper reports on our development of a dual‐mode transceiver for a CMOS high‐rate Bluetooth system‐on‐chip solution. The transceiver includes most of the radio building blocks such as an active complex filter, a Gaussian frequency shift keying (GFSK) demodulator, a variable gain amplifier (VGA), a dc offset cancellation circuit, a quadrature local oscillator (LO) generator, and an RF front‐end. It is designed for both the normal‐rate Bluetooth with an instantaneous bit rate of 1 Mb/s and the high‐rate Bluetooth of up to 12 Mb/s. The receiver employs a dualconversion combined with a baseband dual‐path architecture for resolving many problems such as flicker noise, dc offset, and power consumption of the dual‐mode system. The transceiver requires none of the external image‐rejection and intermediate frequency (IF) channel filters by using an LO of 1.6 GHz and the fifth order on‐chip filters. The chip is fabricated on a 6.5‐mm² die using a standard 0.25‐μm CMOS technology. Experimental results show an in‐band image‐rejection ratio of 40 dB, an IIP3 of ?5 dBm, and a sensitivity of ?77 dBm for the Bluetooth mode when the losses from the external components are compensated. It consumes 42 mA in receive π/4‐diffrential quadrature phase‐shift keying (π/4‐DQPSK) mode of 8 Mb/s, 35 mA in receive GFSK mode of 1 Mb/s, and 32 mA in transmit mode from a 2.5‐V supply. These results indicate that the architecture and circuits are adaptable to the implementation of a low‐cost, multi‐mode, high‐speed wireless personal area network.     

应用于IEEE 802.11b无线局域网系统的2.4GHzCMOS单片收发机射频前端

实现了一个应用于IEEE 802.11b无线局域网系统的2.4GHz CMOS单片收发机射频前端,它的接收机和发射机都采用了性能优良的超外差结构.该射频前端由五个模块组成:低噪声放大器、下变频器、上变频器、末前级和LO缓冲器.除了下变频器的输出采用了开漏级输出外,各模块的输入、输出端都在片匹配到50Ω.该射频前端已经采用0.18μm CMOS工艺实现.当低噪声放大器和下变频器直接级联时,测量到的噪声系数约为5.2dB,功率增益为12.5dB,输入1dB压缩点约为-18dBm,输入三阶交调点约为-7dBm.当上变频器和末前级直接级联时,测量到的噪声系数约为12.4dB,功率增益约为23.8dB,输出1dB压缩点约为1.5dBm,输出三阶交调点约为16dBm.接收机射频前端和发射机射频前端都采用1.8V电源,消耗的电流分别为13.6和27.6mA.     

A single-chip tri-band (2100, 1900, 850/800 MHz) WCDMA/HSDPA cellular transceiver

This paper describes the design and performance of the first tri-band (2100, 1900, 800/850 MHz) single-chip 3G cellular transceiver IC for worldwide use. The transceiver has been designed to meet all narrowband blocker, newly proposed Adjacent Channel II, and Category 10 HSDPA (High Speed Downlink Packet Access) requirements. The design is part of a reconfigurable reference platform for multi-band, multi-mode (GSM/EDGE + WCDMA) radios. The zero-IF receiver is comprised of a novel multi-band quadrature mixer, seventh-order baseband filtering, and a novel DC offset correction scheme, which exhibits no settling time or peak switching transients after gain steps. The receiver lineup is designed to optimize HSDPA throughput and minimize sensitivity to analog baseband filter bandwidth variations. The direct-launch transmitter is made up of a third-order baseband filter, an I/Q modulator with variable gain, an integrated transformer, an RF variable gain amplifier, and a power amplifier driver. At +9.5-dBm output power, the transmitter achieves an error vector magnitude (EVM) of 4%. Fractional-N synthesizers achieve fast lock times of 50 /spl mu/s (150 /spl mu/s) within 20 ppm (0.1 ppm). Automatically calibrated, integrated VCOs achieve a 1.6-GHz tuning range to facilitate coverage over all six 3GPP frequency bands. The IC draws 34 mA in receive (18-mA receiver plus 16-mA fractional-N PLL/VCO) and 50 to 62 mA in transmit (-76 dBm to +9.5 dBm), including PLL/VCO, using a 2.775-V supply voltage. The RF transceiver is integrated with the baseband signal processing and associated passives in a 165-pad package, resulting in the first tri-band 3G radio transceiver with a digital interface which requires no external components.     

A Single-Chip CMOS Transceiver for UHF Mobile RFID Reader

This paper describes a single-antenna low-power single-chip radio frequency identification (RFID) reader for mobile phone applications. The reader integrates an RF transceiver, data converters, a digital baseband modem, an MPU, memory, and host interfaces. The direct conversion RF receiver architecture with the highly linear RF front-end circuit and DC offset cancellation circuit is used to give good immunity to the large transmitter leakage. It is suitable for a mobile phone reader with single-antenna architecture and low-power reader solution. The transmitter is implemented in the direct I/Q up-conversion architecture. The frequency synthesizer based on a fractional-N phase-locked-loop topology offering 900 MHz quadrature LO signals is also integrated with the RF transceiver. The reader is fabricated in a 0.18 mum CMOS technology, and its die size is 4.5 mm times 5.3 mm including electrostatic discharge I/O pads. The reader consumes a total current of 89 mA apart from the external power amplifier with 1.8 V supply voltage. It achieves an 8 dBm P1dB, an 18.5 dBm IIP3, and a maximum transmitter output power of 4 dBm.     

Cost Effective Silica‐Based 100 G DP‐QPSK Coherent Receiver

We present a cost‐effective dual polarization quadrature phase‐shift coherent receiver module using a silica planar lightwave circuit (PLC) hybrid assembly. Two polarization beam splitters and two 90° optical hybrids are monolithically integrated in one silica PLC chip with an index contrast of 2%‐Δ. Two four‐channel spot‐size converter integrated waveguide‐photodetector (PD) arrays are bonded on PD carriers for transverse‐electric/transverse‐magnetic polarization, and butt‐coupled to a polished facet of the PLC using a simple chip‐to‐chip bonding method. Instead of a ceramic sub‐mount, a low‐cost printed circuit board is applied in the module. A stepped CuW block is used to dissipate the heat generated from trans‐impedance amplifiers and to vertically align RF transmission lines. The fabricated coherent receiver shows a 3‐dB bandwidth of 26 GHz and a common mode rejection ratio of 16 dB at 22 GHz for a local oscillator optical input. A bit error rate of is achieved at a 112‐Gbps back‐to‐back transmission with off‐line digital signal processing.     

A 2.5-GHz BiCMOS transceiver for wireless LAN's

A BiCMOS transceiver intended for spread spectrum applications in the 2.4-2.5 GHz band is described. The IC contains a low-noise amplifier (LNA) with 14 dB gain and 2.2 dB NF in its high-gain mode, a downconversion mixer with 8 dB gain and 11 dB NF, and an upconversion mixer with 17 dB gain and P_{-1 dB} of +3 dBm out. An on-chip local oscillator (LO) buffer accepts LO drive of -10 dBm with a half-frequency option allowed by an on-chip frequency doubler. Power consumption from a single 3-V supply is 34 mA in transmit mode, 21 mA in receive mode, and 1 μA in sleep mode     

A low power direct conversion receiver RF front-end with high in-band IIP2/IIP3 and low 1/f noise

A low power direct-conversion receiver RF front-end with high in-band IIP2/IIP3 and low 1/f noise is presented. The front-end includes the differential low noise amplifier, the down-conversion mixer, the LO buffer, the IF buffer and the bandgap reference. A modified common source topology is used as the input stages of the down-conversion mixer (and the LNA) to improve IIP2 of the receiver RF front-end while maintaining high IIP3. A shunt LC network is inserted into the common-source node of the switching pairs in the down-conversion mixer to absorb the parasitic capacitance and thus improve IIP2 and lower down the 1/f noise of the down-conversion mixer. The direct-conversion receiver RF front-end has been implemented in 0.18 μm CMOS process. The measured results show that the 2 GHz receiver RF front-end achieves +33 dBm in-band IIP2, 21 dB power gain, 6.2 dB NF and −2.3 dBm in-band IIP3 while only drawing 6.7 mA current from a 1.8 V power supply.     

一种高性能CMOS单片中频接收机

研制了一种CM O S低压低功耗中频接收机芯片,它包含混频器、限幅放大器、解调器以及场强指示、消音控制等模块,可用于短距离的FM/FSK信号的接收和解调。该接收机采用1st s ilicon 0.25μm CM O S工艺,芯片的测试结果表明整机接收灵敏度为-103 dBm,最高输入射频频率可以达到100 MH z,解调器的线性解调范围为±10 kH z,典型鉴频灵敏度为40 mV/kH z,输入FM信号(调频指数3,信号频率1 kH z)时解调信号的SFDR为41.3 dB。芯片的工作电源电压范围为2~4 V,工作电流3 mA,有效面积0.25 mm2。     

A 1.2-V RF front-end with on-chip VCO for PCS 1900 direct conversion receiver in 0.13-/spl mu/m CMOS

In this paper, a 1.2-V RF front-end realized for the personal communications services (PCS) direct conversion receiver is presented. The RF front-end comprises a low-noise amplifier (LNA), quadrature mixers, and active RC low-pass filters with gain control. Quadrature local oscillator (LO) signals are generated on chip by a double-frequency voltage-controlled oscillator (VCO) and frequency divider. A current-mode interface between the downconversion mixer output and analog baseband input together with a dynamic matching technique simultaneously improves the mixer linearity, allows the reduction of flicker noise due to the mixer switches, and minimizes the noise contribution of the analog baseband. The dynamic matching technique is employed to suppress the flicker noise of the common-mode feedback (CMFB) circuit utilized at the mixer output, which otherwise would dominate the low-frequency noise of the mixer. Various low-voltage circuit techniques are employed to enhance both the mixer second- and third-order linearity, and to lower the flicker noise. The RF front-end is fabricated in a 0.13-/spl mu/m CMOS process utilizing only standard process options. The RF front-end achieves a voltage gain of 50 dB, noise figure of 3.9 dB when integrated from 100 Hz to 135 kHz, IIP3 of -9 dBm, and at least IIP2 of +30dBm without calibration. The 4-GHz VCO meets the PCS 1900 phase noise specifications and has a phase noise of -132dBc/Hz at 3-MHz offset.