Criteria for versatile GaN MOVPE tool: high growth rate GaN by atmosphericpressure growth

Growth rate has a direct impact on the productivity of nitride LED production. Atmospheric pressure growth of GaN with a growth rate as high as 10 μm/h and also Al_0.1Ga_0.9N growth of 1 μm/h by using 4 inch by 11 production scale MOVPE are described. XRD of (002) and (102) direction was 200 arcsec and 250 arcsec, respectively. Impact of the growth rate on productivity is discussed.     

Model development of GaN MOVPE growth chemistry for reactor design

The metalorganic vapor phase epitaxy of GaN is complicated by the extensive and pervasive complex gas phase chemistry within the growth system. This gas phase chemistry leads to the high sensitivity of the material properties on the detailed fluid dynamics within the system. Computational fluid dynamics (CFD) based reactor modeling combined with gas phase kinetics studies was used to determine the transport and reaction behavior within a high performance vertical MOVPE reactor. The complexity of the growth chemistry model was increased in a step-wise fashion. At each step, the concentration profiles were determined using available recent kinetic data. The high gas flow rate typically employed in GaN MOVPE results in a very thin high-temperature flow sheet above the growth front, leading to an extremely high thermal gradient. Within this thin high-temperature flow sheet, a stratified chemical structure is formed as a result of the unique thermal fluid environment. This stratified structure is closely related to the transport and reaction behavior within GaN MOVPE processes and forms part of the engineering guidelines for GaN MOVPE reactor design.     

GaN/GaAs(001)外延薄膜的湿法腐蚀特性

对在GaAs (001) 衬底上用金属有机物气相外延(MOVPE)方法生长的GaN薄膜的湿法腐蚀特性进行了研究.所用腐蚀液包括HCl、H3PO4、KOH水溶液以及熔融KOH,腐蚀温度为90～300℃.实验发现不同的腐蚀液在样品表面腐蚀出不同形状的腐蚀坑.KOH溶液腐蚀出长方形的坑,长边平行于(111)A面,表明沿相互垂直的〈110〉晶向的腐蚀特性不同.用不同晶面相对反应性的差别定性解释了腐蚀的这种非对称性.此外,还发现KOH水溶液更有可能用于显示立方相GaN外延层中的层错.     

GaN/GaAs(001)外延薄膜的湿法腐蚀特性

对在GaAs (001) 衬底上用金属有机物气相外延(MOVPE)方法生长的GaN薄膜的湿法腐蚀特性进行了研究.所用腐蚀液包括HCl、H3PO4、KOH水溶液以及熔融KOH,腐蚀温度为90～300℃.实验发现不同的腐蚀液在样品表面腐蚀出不同形状的腐蚀坑.KOH溶液腐蚀出长方形的坑,长边平行于(111)A面,表明沿相互垂直的〈110〉晶向的腐蚀特性不同.用不同晶面相对反应性的差别定性解释了腐蚀的这种非对称性.此外,还发现KOH水溶液更有可能用于显示立方相GaN外延层中的层错.     

In-situ monitoring of surface stoichiometry and growth kinetics study of GaN (0001) in MOVPE by spectroscopic ellipsometry

GaN surface stoichiometry and growth kinetics in MOVPE were studied by in-situ spectroscopic ellipsometry. The effect of MOVPE conditions on both the surface stoichiometry and growth kinetics was investigated. The surface stoichiometry, such as N-rich, Ga-rich and Ga-excess surfaces, was monitored, and was drastically changed by the variation of the NH₃ partial pressure. When the TMG supply was interrupted during the growth, the layer-by-layer decomposition/revaporation was observed in H₂/NH₃ ambient. The decomposition rate was measured as a function of the NH₃ flow rate at the conventional epilayer growth temperatures (1050–1140 C). The decomposition rate was decreased with the increase in the N coverage on the GaN surface. it was found that the surface stoichiometry is a very important parameter for the control of the MOVPE growth kinetics.     

Seeded growth of GaN at high N2 pressure on (0 0 0 1) polar surfaces of GaN single crystalline substrates

GaN single crystals obtained by the high nitrogen pressure solution method without an intentional seeding, show strong growth anisotropy which results in their platelet shape. The attempts to enhance the growth into (0 0 0 1) directions by the increase of the integral supercooling in the solution, often lead to the growth instabilities on both Ga-polar and N-polar (0 0 0 1) surfaces. This can be avoided only by the precise control of the growth conditions at the crystallization front on the particular surface.The results of the seeded growth on both Ga- and N-polar (0 0 0 1) surfaces in configuration enabling such a control is reported. It is shown that dominating mechanisms of the unstable growth such as the cellular growth or edge nucleation can be suppressed. Differences in nucleation and growth in dependence on surface polarity are discussed.     

MOVPE production reactors for high temperature electronics

For the fabrication of epitaxial films of silicon carbide or the Group III nitrides, high growth temperatures (up to 1700°C) and fast heating and cooling of the growth environment have been found to be necessary. A range of production systems meeting these requirements has been designed with different loading capacities. In this paper, we present results from various machines showing the high quality and excellent homogeneity obtainable for 3C-SiC on Si and on 6H-SiC, as well as GaN on sapphire.     

MOVPE生长的GaN基蓝色与绿色LED

报道用自行研制的LP－MOVPE设备,在蓝宝石（α－Al2O3)衬底上生长出以InGaN为有源区的蓝光和绿光InGaN/AlGsN双异质结构以及InGaN/GaN量子阱结构的LED,其发射波长分别为430－450nm和520－540nm。     

Gate-structure optimization for high frequency power AlGaN/GaN HEMTs

The influence of gate-head and gate-source-spacing on the performance of AlGaN/GaN HEMTs was studied.Suggestions are then made to improve the performance of high frequency power AlGaN/GaN HEMTs by optimizing the gate-structure.Reducing the field-plate length can effectively enhance gain,current gain cutoff frequency and maximum frequency of oscillation.By reducing the field-plate length,devices with 0.35 μm gate length have exhibited a current gain cutoff frequency of 30 GHz and a maximum frequency of oscillation of 80 GHz.The maximum frequency of oscillation can be further optimized either by increasing the gate-metal thickness,or by using a t-shape gate (the gate where the gate-head tends to the source side).Reducing the gate-source spacing can enhance the maximum drain-current and breakdown voltage,which is beneficial in enhancing the maximum output power of AlGaN/GaN HEMTs.     

高频功率AlGaN/GaN HEMT 的栅结构优化

本文研究了栅帽、栅源间距对AlGaN/GaN HEMT性能的影响。基于研究结果得出了优化高频功率AlGaN/GaN HEMT栅结构的方法。缩小栅场板可以有效提高器件的增益、截止频率（ft）、最大震荡频率（fmax）。通过减小栅场板长度,栅长0.35 器件的ft达到了30GHz、fmax达到了80GHz。采用tao型栅（栅帽偏向源侧）或者增加栅金属厚度还可以进一步优化 。缩小栅源的距离可以提高饱和漏电流和击穿电压,从而提高器件的输出功率。     

GaN材料的高速生长对其C污染以及光致发光光谱的影响

利用金属有机化学气相沉积对GaN的高速生长进行了研究.结果表明,随着GaN生长速率的提高,其非故意掺杂的C含量也在提高,并且呈现出良好的线性关系.当生长速率由2μm/h增加至7.2μm/h时,利用SIMS测量发现其GaN中的C含量由2.9×1017增加至5.7×1018 cm-3 .研究表明,N空位的存在与C浓度之间存在紧密的联系。在高氨气分压生长条件下,N空位的浓度也在急剧下降。此时,与具有相近生长速率的常规样品相比,其C含量几乎下降了一个数量级。.光致发光光谱表明,黄带以及蓝带的强度与C污染存在线性关系.这个结果也证实了与C相关的缺陷是导致黄带以及蓝带发光的主要来源。     

Device advantage of the dislocation-free pressure grown GaN substrates

The process of GaN crystallization from solutions under high pressure will be described. The formation of point defects and their distribution in the crystals will be discussed. The results of the use of the pressure grown crystals for quantum epitaxial structures and blue laser devices will be used to demonstrate the advantage of dislocation-free substrates.     

应用于大功率MMIC开关的AlGaN背势垒GaN HEMT

报道了应用于大功率开关的AlGaN背势垒0.25μm GaN HEMT。通过引入AlGaN背势垒,MOCVD淀积在3英寸SiC衬底上的AlGaN/GaN异质结材料缓冲层的击穿电压获得了大幅度的提升,相比于普通GaN缓冲层和掺Fe GaN缓冲层击穿电压提升幅度分别为4倍和2倍。采用具有AlGaN背势垒AlGaN/GaN 外延材料研制的GaN HEMT开关管在源漏间距为2μm、2.5μm、3μm、3.5μm和4μm时,估算得到的关态功率承受能力分别为25.0W、46.2W、64.0W、79.2W和88.4W。基于源漏间距为2.5μm的GaN HEMT开关管设计了DC-12GHz的单刀双掷MMIC开关。该开关采用了反射式串-并-并结构,整个带内插入损耗最大1.0dB、隔离度最小30dB,10GHz下连续波测试得到其功率承受能力达44.1dBm。     

AlGaN/GaN high electron mobility transistors with selective area grown p-GaN gates

We report a selective area growth (SAG) method to define the p-GaN gate of AlGaN/GaN high electron mobility transistors (HEMTs) by metal-organic chemical vapor deposition. Compared with Schottky gate HEMTs, the SAG p-GaN gate HEMTs show more positive threshold voltage (V_th) and better gate control ability. The influence of Cp₂Mg flux of SAG p-GaN gate on the AlGaN/GaN HEMTs has also been studied. With the increasing Cp₂Mg from 0.16 μmol/min to 0.20 μmol/min, the V_th raises from -67 V to -37 V. The maximum transconductance of the SAG HEMT at a drain voltage of 10 V is 113.9 mS/mm while that value of the Schottky HEMT is 51.6 mS/mm. The SAG method paves a promising way for achieving p-GaN gate normally-off AlGaN/GaN HEMTs without dry etching damage.     

Optimal growth interrupts for very high quality InGaAs(P)/InP superlattices grown by MOVPE

The effects of different growth interrupt schemes at the compositional interfaces in 30 period InGaAs(P)/InP superlattices grown by metal-organic vapor phase epitaxy have been studied for quarternary compositions λ = 1.35 and 1.52 μm as well as for the ternary case λ = 1.67 μm. The best full width at half maximum of the photoluminescence peaks at 4 K are 7–8 meV for the InGaAsP/InP and 4.6 meV for the InGaAs/InP superlattices indicating extremely high optical quality and vertical homogenity of the samples. However, strong memory effects relating to both the presence and the absence of arsenic are evident from x-ray diffraction measurements. Reactor purging as a remedy is limited by the surface roughening and defect formation induced by a non-equilibrium vapor phase composition. Optimal growth interrupts must therefore be determined considering both the interface smoothness and abruptness and will in general be composition dependent.     

Electrical and photo-luminescence properties of ZnSe epitaxial layers grown on GaAs (100) by atmospheric pressure MOVPE: The role of substrate temperature

Epitaxial layers of ZnSe ranging in thickness from 5μm to 30 μm have been grown on GaAs (100) substrates over the temperature range 240° C to 340° C by atmospheric pressure MOVPE employing dimethylzinc and hydrogen selenide. An optimum growth temperature of 280 ± 5° C has been identified and when grown at this temperature the ZnSe epitaxial layers exhibit low resistivity (ρ_{298 K} ≤ 10 ohm · cm), a low compensation ratio (θ_{298 K} = 0.27), a carrier mobility (μ_{298 K}) of 250 ±10 cm²V^-1s^-1) and aren-type (n _{298 K} = 8.0 × 10¹⁴ cm^-3). The ratio of photoluminescence intensity measured at 298K and at 12 K is high (10⁴) and is dominated by a sharp emission due to excitons bound to neutral donors at 2.7956 eV. Mass spectrometric investigations of the chemical reactions occurring inside the reactor in the presence of the GaAs substrate indicate significant surface-controlled reactivity in the region of 280° C.     

An 8 GHz high power AlGaN/GaN HEMT VCO

A high power X-band hybrid microwave integrated voltage controlled oscillator(VCO) based on Al-GaN /GaN HEMT is presented.The oscillator design utilizes a common-gate negative resistance structure with open and short-circuit stub microstrip lines as the main resonator for a high Q factor.The VCO operating at 20 V drain bias and-1.9 V gate bias exhibits an output power of 28 dBm at the center frequency of 8.15 GHz with an efficiency of 21%.Phase noise is estimated to be -85 dBc/Hz at 100 kHz offset and -1...     

一个8GHz高功率AlGaN/GaN HEMT VCO

基于中科院微电子所的AlGaN/GaN HEMT工艺研制了一个X波段高功率混合集成压控振荡器（VCO）。电路采用源端调谐的负阻型结构,主谐振腔由开路微带和短路微带并联构成,实现高Q值设计。在偏置条件为VD=20V, VG=-1.9V, ID=150mA时,VCO在中心频率8.15 GHz处输出功率达到28 dBm,效率21%,相位噪声-85 dBc/Hz@100 KHz,-128 dBc/Hz@1 MHz。调谐电压0~5V时,调谐范围50 MHz。分析了器件闪烁噪声对GaN HEMT基振荡器相位噪声性能的主导作用。测试结果显示了AlGaN/GaN HEMT工艺在高功率低噪声微波频率源中的应用前景。     

多栅指AlGaN/GaN HEMT器件自热效应研究

Self-heating in multi-finger AlGaN/GaN high-electron-mobility transistors(HEMTs) is investigated by measurements and modeling of device junction temperature under steady-state operation.Measurements are carried out using micro-Raman scattering to obtain the detailed and accurate temperature distribution of the device.The device peak temperature corresponds to the high field region at the drain side of gate edge.The channel temperature of the device is modeled using a combined electro-thermal model considering 2DEG transport characteristics and the Joule heating power distribution.The results reveal excellent correlation to the micro-Raman measurements, validating our model for the design of better cooled structures.Furthermore,the influence of layout design on the channel temperature of multi-finger AlGaN/GaN HEMTs is studied using the proposed electro-thermal model, allowing for device optimization.     

MOVPE growth of GaAsN: surface study by AFM and optical properties

We report on the growth of GaAs_1−xN_x thin films on GaAs substrates (2° off) by metalorganic vapor-phase epitaxy, in the temperature range 500–600°C. A mixture of N₂ and H₂ was used as the carrier gas. Using dimethylhydrazine as nitrogen source, we incorporated up to 3.5% of nitrogen, at 530°C. The growth condition dependence of nitrogen content was studied, and it reveals a distribution coefficient 350 times lower for nitrogen than for arsine at 530°C. Nitrogen incorporation is controlled by surface kinetics. The evolution of surface morphology has been investigated by atomic force microscopy as a function of the nitrogen composition and of growth temperature. For nitrogen content up to 2%, the GaAsN vicinal surface is characterized by a step–terrace structure with bunched steps, and the step edges straighten when increasing the growth temperature. For higher nitrogen content terraces are no longer observed and, above 3%, widely-spaced cross-hatch lines, characteristic of a partial relaxation of strain in the epilayers, appear. Optical properties were studied by low (7 K) and room-temperature photoluminescence and photoreflectance. As usual for this material, a degradation of optical characteristics is observed with increasing N content along with the evolution of surface morphology.