| PBGA封装回流焊翘曲变形仿真与验证 |
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| 引用本文： | 王晓锋,何小琦,尧彬. PBGA封装回流焊翘曲变形仿真与验证[J]. 广东工业大学学报, 2020, 37(2): 94-101. DOI: 10.12052/gdutxb.190047 |
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| 作者姓名： | 王晓锋 何小琦 尧彬 |
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| 作者单位： | 1. 广东工业大学 材料与能源学院, 广东 广州 510006;2. 工业和信息化部电子第五研究所 电子元器件可靠性物理及其应用技术重点实验室, 广东 广州 510610 |
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| 基金项目： | 国防科工局技术基础资助项目（JSZL2016610B001） |
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| 摘 要： | 回流焊温变过程中，由于不同材料热膨胀系数（Coefficient of Thermal Expansion，CTE）的不匹配，塑料焊球阵列（plastic ball grid array，PBGA）封装会发生翘曲变形现象。本文采用有限元法对PBGA封装的翘曲变形及应力应变进行仿真分析，并用阴影云纹法对翘曲变形的模拟分析结果进行测试验证。结果表明：PBGA封装翘曲值的模拟值与实测值非常接近，分别为35.9 μm和36 μm；模拟回流焊过程中，翘曲值的模拟值与实测值的变化趋势具有一致性。回流焊过程中，PBGA封装的热应力应变最大值都在基板靠近粘接层的位置，该位置是PBGA封装出现热可靠性问题的最大风险点。PBGA封装边角处的翘曲量最大，因而边角处的焊点也最容易出现开路、虚焊等装联缺陷。
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| 关 键 词： | 塑料球栅阵列封装 翘曲变形 热应力应变 有限元仿真 阴影云纹法 |
| 收稿时间： | 2019-04-01 |
Simulation and Verification of Warpage Deformation of PBGA Package Reflow Soldering |
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| Wang Xiao-feng,He Xiao-qi,Yao Bin. Simulation and Verification of Warpage Deformation of PBGA Package Reflow Soldering[J]. Journal of Guangdong University of Technology, 2020, 37(2): 94-101. DOI: 10.12052/gdutxb.190047 |
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| Authors: | Wang Xiao-feng He Xiao-qi Yao Bin |
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| Affiliation: | 1. School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, China;2. Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, CEPR EI, Guangzhou 510610, China |
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| Abstract: | During the temperature change of reflow soldering, warpage deformation occurs in the plastic ball grid array package due to the mismatch of thermal expansion coefficients of different materials. A finite element method is used to simulate the warpage deformation behavior and stress strain of PBGA package, and the simulation results of warpage deformation are tested by shadow moiré method. The results show that the simulated values of the PBGA package warpage are very close to the measured values, which are respectively 35.9 μm and 36 μm. During the simulated reflow, the measured values of the warpage are consistent with the simulated values. During the reflow, the maximum thermal stress strain of the PBGA package is at the position of the substrate near the bonding layer, which is the biggest risk point for the thermal reliability of the PBGA package. The amount of warpage at the corners of the PBGA package is the largest, so the solder joints at the corners are also most prone to open-circuit, solder joint and other assembly defects. |
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| Keywords: | plastic ball grid array package warpage deformation thermal stress-strain finite element simulation shadow moire method |
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